HEAT SINK FOR POWER ELECTRONICS DEVICES
20230164959 · 2023-05-25
Inventors
- Kiran Kumar Akula (Hyderabad, IN)
- Vijay Lakshmi Bondapalli (Hyderabad, IN)
- Zoila Malespin (Indianapolis, IN, US)
- Mohamad Nasab (Indianapolis, IN, US)
Cpc classification
H05K7/20918
ELECTRICITY
H05K7/209
ELECTRICITY
H05K7/20909
ELECTRICITY
International classification
Abstract
A heat sink for cooling at least one power electronics device in a coil unit includes a base plate having a first surface and a plurality of fins extending from the first surface. A height of the plurality of fins measured perpendicular to the first surface varies across a width of the base plate.
Claims
1. A heat sink for cooling at least one power electronics device in a coil unit comprising: a base plate having a first surface; a plurality of fins extending from the first surface, wherein a height of the plurality of fins measured perpendicular to the first surface varies across a width of the base plate.
2. The heat sink of claim 1, wherein the base plate includes a central portion and at least one end portion and the plurality of fins includes a first plurality of fins extending from the central portion and a second plurality of fins extending from the at least one end portion.
3. The heat sink of claim 2, wherein a configuration of the first plurality of fins varies from a configuration of the second plurality of fins.
4. The heat sink of claim 2, wherein the height of the first plurality of fins varies to form a curvature.
5. The heat sink of claim 4, wherein the height of the second plurality of fins varies to form the curvature.
6. The heat sink of claim 4, wherein the curvature is uniform.
7. The heat sink of claim 4, wherein the curvature is non-uniform.
8. The heat sink of claim 1, wherein the plurality of fins extends over a substantially entire length of the base plate.
9. A coil unit comprising: a heat exchanger; a fan assembly mounted to the heat exchanger; at least one power electronic device; a heat sink mounted adjacent to the at least one power electronic device, wherein the fan assembly is operable to move an airflow through the heat exchanger and across the heat sink, the heat sink further comprising: a base plate having a portion being vertically aligned with the fan assembly; a plurality of fins extending from the portion of the base plate vertically aligned with the fan assembly, wherein a height of the plurality of fins measured perpendicular to the base plate varies across a width of the base plate.
10. The coil unit of claim 9, wherein a gap is defined between the plurality of fins and the fan assembly.
11. The coil unit of claim 10, wherein the gap is uniform over the width of the base plate.
12. The coil unit of claim 10, wherein the gap varies over the width of the base plate.
13. The coil unit of claim 10, wherein the gap is at least about 5 mm.
14. The coil unit of claim 9, wherein the plurality of fins further comprises a first plurality of fins and a second plurality of fins.
15. The coil unit of claim 14, wherein the base plate includes a central portion and at least one end portion, the first plurality of fins being arranged at the central portion and the second plurality of fins being arranged at the at least one end portion.
16. The coil unit of claim 9, wherein the base plate has another portion, the another portion being disposed vertically beneath the portion vertically aligned with the fan assembly and further comprising another plurality of fins arranged at the another portion.
17. The coil unit of claim 16, wherein a configuration of the plurality of fins is different than a configuration of the another plurality of fins.
18. The coil unit of claim 16, wherein a height of the another plurality of fins varies to form an angled surface.
19. The coil unit of claim 9, wherein the heat sink is symmetrical.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The following descriptions should not be considered limiting in any way. With reference to the accompanying drawings, like elements are numbered alike:
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DETAILED DESCRIPTION
[0038] A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the Figures.
[0039] With reference now to
[0040] In the illustrated, non-limiting embodiment, the compressor 24 is a variable speed compression device having a variable speed motor driven by a variable frequency drive (VFD). The one or more power electronic devices 30 that form the variable frequency drive may be mounted within the coil unit 20, such as between two adjacent ends of the heat exchanger 22.
[0041] Because the at least one power electronic device 30 generates waste heat during operation, the coil unit 20 includes a heat sink 32 configured to remove heat from the power electronic devices 30. In an embodiment, the airflow A being driven through the coil unit 20 by the fan assembly 28 is used as a cooling fluid to remove heat from the power electronic devices 30 via the heat sink 32. However, it should be understood that the heat sink 32 as described herein may be used in combination with other means for cooling the power electronic devices 30, such as a refrigerant heat exchanger for example.
[0042] In the various embodiments of the heat sink 32 illustrated herein, the heat sink 32 includes a base plate 34 and a plurality of fins 36 extending from one or more portions of the base plate 34. The base plate 34 is formed from a thermally conductive material and is mounted at an interior of the coil unit 20, in axial alignment with at least a portion of the power electronics devices 30. The base plate 34 may be made from a single material. However, embodiments where the base plate 34 includes a plurality of different materials are also contemplated herein. For example, as best shown in
[0043] In an embodiment, all or at least a portion of the base plate 34 is also in vertical alignment, for example within the same horizontal plane, with a portion of the rotatable blades 38 of the fan assembly 28. Further, the base plate 34 may be elongated in length such that when installed relative to the coil unit 20, a first portion 40 of the base plate 34 is arranged horizontally adjacent to the fan blades 38 and a second portion 42 of the base plate 34 is disposed vertically below the fan blades 38 (see
[0044] In the illustrated, non-limiting embodiment, best shown in
[0045] The plurality of fins 36 extends from one or more surfaces of the base plate 34, such as from the first portion 40 and/or the second portion 42 at a first surface, toward an interior of the coil unit 20. Although the plurality of fins 36 is shown extending substantially perpendicularly from the base plate 34, embodiments where one or more of the fins 36 extends at another angle are also contemplated herein. The fins 36 may extend across the entire width or only a portion of the width of the base plate 34. In an embodiment, the plurality of fins 36 is located at only the central portion 44 of the base plate 34 (see
[0046] The configuration of the plurality of fins 36 may be substantially identical. Accordingly, in instances where the heat sink 32 includes a plurality of first fins 36a and a plurality of second fins 36b, the configuration of each of the first plurality of fins 36a is identical to each of the second plurality of fins 36b. However, in other embodiments, the configuration of the second plurality of fins 36b differs from the configuration of the first plurality of fins 36a. Further, the configuration of each fin within the first plurality of fins 36a and/or the second plurality of fins 36b may be substantially identical, or may vary. For example, in an embodiment best shown in
[0047] Because the plurality of fins 36a and/or 36b are positioned radially outward of the fan blades 38 (see
[0048] In an embodiment, the height of the fins 36a and/or 36b is selected to maintain a constant radius defined by the fins, or alternatively, to maintain a constant gap between the fan blades 38 and the fins 36a and/or 36b. However, in an embodiment, the gap measured parallel to the height of the fins 36a and/or 36b may vary over the width of the base plate 34. For example, the gap between the first plurality of fins 36a arranged at the middle of the central portion 44 of the base plate 34 and the fan blades 38 may be less than the gap between the first plurality of fins 36a closest to the end portions 46 or the second plurality of fins 36b at the end portions 46 of the base plate 34 and the fan blades 38. Regardless of whether the gap is constant or variable, a minimum gap between the fan blades 38 and the fins 36a and/or 36b is at least about 5 mm and in some embodiments, the gap between the fins 36a and/or 36b and the fan blades 38 may range from about 5 mm to about 10 mm, or from about 5 mm to about 12 mm.
[0049] In another embodiment, regardless of the configuration of the base plate 34, the height of the fins 36a and/or 36b may gradually increase from the end portion 46 of the base plate 34 towards the central portion 44 of the base plate 34. For example, in the non-limiting embodiment, of
[0050] The first and/or the second plurality of fins 36a, 36b may be configured to extend over the substantial entirety, or alternatively, over only a portion of a length of the base plate 34. In the illustrated, non-limiting embodiment, best shown in
[0051] Further, with reference now to
[0052] In embodiments where the heat sink 32 includes fins 36 within both the first portion 40 and the second portion 42 of the base plate 34, a fin within the second portion 42 may be vertically aligned with an adjacent fins of the first portion 40 to define an uninterrupted fluid flow path extending over an entire length of the base plate 34. However, embodiments where vertically stacked fins 36 are offset from one another are also within the scope of the disclosure.
[0053] The configuration of the base plate 34, the first plurality of fins 36a, the second plurality of fins 36b, and/or the third plurality of fins 36c may vary based on the loading of the HVAC system as well as the adjacent components within the coil unit 20. For example, in the illustrated, non-limiting embodiment of
[0054] As the fan blades 38 rotate about the fan axis, the airflow A moved by the fan assembly 28 moves over and through the plurality of fins 36 of the base plate, thereby removing heat from the fins 36 and the base plate 46 of the heat sink 32 and cooling the at least one power electronics device 30. A coil unit 20 having a heat sink 32 as illustrated and described herein will enhance the heat transfer from the power electronic devices 30, thereby increasing the efficiency of the coil unit 20.
[0055] The term “about” is intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application.
[0056] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and/or groups thereof.
[0057] While the present disclosure has been described with reference to an exemplary embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.