APPLYING INERT ION BEAM ETCHING FOR IMPROVING A PROFILE AND REPAIRING SIDEWALL DAMAGE FOR PHASE CHANGE MEMORY DEVICES

Abstract

A process of improving a profile and repairing sidewall damage for phase change memory devices. The process includes applying inert ion beam etching to trim a sidewall of a layer of phase change memory material in a phase change memory device, where the sidewall has been damaged in reactive ion etching using halogens. In the process, the inert ion beam etching is with low energy. In the process, applying the inert ion beam etching to trim the sidewall is at a predetermined low temperature. In the process, applying the inert ion beam etching to trim the sidewall is at a predetermined small angle between an inert ion beam and a surface tangent of the sidewall.

Claims

1. A process of improving a profile and repairing sidewall damage for phase change memory devices, the process comprising: applying inert ion beam etching to trim a sidewall of a layer of phase change memory material in a phase change memory device; wherein the sidewall has been damaged in reactive ion etching using halogens; wherein the inert ion beam etching is with low energy; wherein applying the inert ion beam etching is at a predetermined low temperature; and wherein applying the inert ion beam etching is at a predetermined small angle between an inert ion beam and a surface tangent of the sidewall.

2. The process of claim 1, wherein an argon ion beam is used in the inert ion beam etching to trim the sidewall.

3. The process of claim 1, wherein a neon ion beam is used in the inert ion beam etching to trim the sidewall.

4. The process of claim 1, wherein a krypton ion beam is used in the inert ion beam etching to trim the sidewall.

5. The process of claim 1, wherein a xenon ion beam is used in the inert ion beam etching to trim the sidewall.

6. The process of claim 1, wherein the predetermined small angle is substantially 10 degrees.

7. The process of claim 1, wherein the predetermined small angle is substantially less than 10 degrees.

8. The process of claim 1, wherein the predetermined low temperature is substantially within a range from 25 degrees Celsius to 250 degrees Celsius.

9. The process of claim 1, wherein the inert ion beam etching is with energy substantially ranging from 60 volts to 200 volts.

10. The process of claim 1, wherein the phase change memory material is germanium-antimony-tellurium.

11. The process of claim 1, wherein the phase change memory material is silicon oxide doped germanium-antimony-tellurium.

12. The process of claim 1, wherein the phase change memory material is nitrogen doped germanium-antimony-tellurium.

13. The process of claim 1, wherein the phase change memory material is silicon oxide doped gallium-antimony-germanium.

14. The process of claim 1, wherein the inert ion beam etching maintains elemental composition of a bulk of phase change memory and an ovonic threshold switch and elemental composition of the sidewall.

15. The process of claim 1, wherein the inert ion beam etching removes sputter redeposition from the reactive ion etching.

16. The process of claim 1, wherein the inert ion beam etching removes metal redeposition from the reactive ion etching.

17. A phase change memory device comprising: a layer of phase change memory material with a repaired sidewall generated by applying inert ion beam etching to trim a damaged sidewall; wherein the damaged sidewall has been generated in reactive ion etching using halogens; wherein elemental composition of a bulk of phase change memory and an ovonic threshold switch in the phase change memory device is maintained in the inert ion beam etching; wherein elemental composition of the repaired sidewall is maintained in the inert ion beam etching; wherein, in the repaired sidewall, sputter redeposition from the reactive ion etching is removed by the inert ion beam etching; and wherein, in the repaired sidewall, metal redeposition from the reactive ion etching is removed by the inert ion beam etching.

18. The phase change memory device of claim 17, wherein the phase change memory material is one of germanium-antimony-tellurium, silicon oxide doped germanium-antimony-tellurium, and nitrogen doped germanium-antimony-tellurium.

19. The phase change memory device of claim 17, wherein the phase change memory material is silicon oxide doped gallium-antimony-germanium.

20. The phase change memory device of claim 17, wherein the repaired sidewall is generated by applying one of an argon ion beam, a neon ion beam, a krypton ion beam, and a xenon ion beam.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0005] FIG. 1 is a diagram illustrating a stack after patterning a soft mask, in accordance with one embodiment of the present invention.

[0006] FIG. 2 is a diagram illustrating sidewall damage of a phase change memory (PCM) material layer after reactive-ion etching (RIE), in accordance with one embodiment of the present invention.

[0007] FIG. 3 is a diagram illustrating application of inert ion beam etching for repairing an RIE damaged sidewall of a phase change memory (PCM) material layer, in accordance with one embodiment of the present invention.

[0008] FIG. 4 is a diagram illustrating a repaired sidewall of a phase change memory (PCM) material layer after applying inert ion beam etching, in accordance with one embodiment of the present invention.

DETAILED DESCRIPTION

[0009] In the present invention, inert ion beam etching (IBE), for example argon (Ar) ion beam etching, is applied for a damaged sidewall (about 20-25 nanometers) of a phase change memory (PCM) device, where the damaged sidewall is created during post-halogen reactive-ion etching (RIE). After the inert ion beam etching (IBE), the elemental composition of the bulk and the sidewall of the PCM device is maintained. Applying the inert ion beam etching (IBE) to trim the damaged sidewall removes sputter redeposition from the previous RIE process. Applying the inert ion beam etching (IBE) to trim the damaged sidewall helps remove redeposition of metals, for example tungsten (W), from the bottom electrode. The metal redeposition may short across the PCM and the ovonic threshold switch (OTS), and thus applying the inert ion beam etching (IBE) to trim the damaged sidewall prevents intermixing between PCM and OTS and improves adhesion of encapsulation while using highly diluted or inert RIE chemistries that minimizes PCM and OTS damage.

[0010] A process of inert ion beam etching (IBE) can be applied on a patterned substrate where one of the etching targets is a PCM material layer, for example a germanium-antimony-tellurium layer (GST) layer. Before patterning a soft mask, for example, a typical stack may include metal as the bottom electrode (BE)|˜100 nm doped GST|TiN as the top electrode (TE)|SiN as the hard mask (HM)|organic planarization layer (OPL)|low temperature oxide (LTO)|anti-reflective coating (ARC).

[0011] FIG. 1 is a diagram illustrating a stack after patterning a soft mask, in accordance with one embodiment of the present invention. As shown in FIG. 1, the stack include a layer of hard mask (HM) 10, a layer of top electrode (TE) 20, a layer of phase change memory material (PCM) 30, and a layer of bottom electrode (BE) 40. The layer of PCM 30 may be a layer of GST (e.g., Ge.sub.2Sb.sub.2Te.sub.5), a layer of silicon oxide doped GST, a layer of nitrogen doped GST, a layer if silicon oxide doped GaSbGe (gallium-antimony-germanium), or a layer of other phase change memory materials.

[0012] After patterning the soft mask and when the PCM material layer (e.g., GST) in the stack is reached, the reactive ion etching (RIE) using halogens (e.g., Cl.sub.2, CHF.sub.3, HBr, CF.sub.4, and hydrofluorocarbons) is processed. FIG. 2 is a diagram illustrating sidewall damage of a phase change memory (PCM) material layer after reactive-ion etching (RIE), in accordance with one embodiment of the present invention. As shown in FIG. 2, the stack still include a thinner layer of hard mask (HM) 10, a layer of top electrode (TE) 20, a layer of phase change memory material (PCM) 30, and a layer bottom electrode (BE) 40; Through the process of the reactive ion etching (RIE) using halogens, the sidewall of the layer of phase change memory material (PCM) 30 is damaged. FIG. 2 shows RIE damaged sidewall 50 of the layer of phase change memory material (PCM) 30.

[0013] In the present invention, inert ion beam etching (IBE) is applied for repairing damaged sidewall 50 of the layer of phase change memory material (PCM) 30. FIG. 3 is a diagram illustrating application of inert ion beam etching (IBE) for repairing RIE damaged sidewall 50 of the layer of phase change memory material (PCM) 30, in accordance with one embodiment of the present invention. The inert ion beam etching (IBE) with low energy (60-200 volts) is applied at a small glancing incidence angle. The glancing incidence angle is an angle between the inert ion beam and the surface tangent of damaged sidewall 50. The small glancing incidence angle is substantially 10 degrees (˜10°) or less than 10 degrees (<10°). The inert ion beam etching (IBE) is applied at a predetermined low temperature, ranging from 25° C. to 250° C. In one embodiment, an argon (Ar) ion beam is used in the inert ion beam etching to trim RIE damaged sidewall 50. In another embodiment, a neon (Ne) ion beam is used in the inert ion beam etching to trim RIE damaged sidewall 50. In yet another embodiment, a krypton (Kr) ion beam is used in the inert ion beam etching to trim RIE damaged sidewall 50. In yet another embodiment, a xenon (Xe) ion beam is used in the inert ion beam etching to trim RIE damaged sidewall 50.

[0014] FIG. 4 is a diagram illustrating repaired sidewall 60 of the layer of phase change memory (PCM) material layer 30 after applying inert ion beam etching (IBE), in accordance with one embodiment of the present invention. The inert ion beam etching to trim the RIE-damaged sidewall layer allows elemental composition of the PCM/OTS bulk and elemental composition of the sidewall to be maintained. The inert ion beam etching to trim the RIE-damaged sidewall layer removes sputter redeposition caused by the previous RIE process and reduces critical dimension. The inert ion beam etching to trim the RIE-damaged sidewall layer helps remove metal redeposition (e.g., tungsten (W)) from the bottom electrode; the metal redeposition may short across the PCM/OTS. The inert ion beam etching to trim the RIE-damaged sidewall layer prevents intermixing between PCM and OTS and improves adhesion of encapsulation.

[0015] Having described embodiments of applying the inert ion beam etching for improving a profile and repairing sidewall damage for phase change memory devices, it is noted that modifications and variations may be made by persons skilled in the art in light of the above teachings. It is therefore to be understood that changes may be made in the particular embodiments disclosed which are within the scope of the invention as outlined by the appended claims.