Systems and methods for fluoride ceramic phosphors for LED lighting
12402453 ยท 2025-08-26
Assignee
- Lawrence Livermore National Security, Llc (Livermore, CA)
- Current Lighting Solutions, LLC (Cleveland, OH, US)
Inventors
- Nerine Cherepy (Piedmont, CA)
- Ross Allen Osborne (Livermore, CA, US)
- Stephen PAYNE (Castro Valley, CA, US)
- Zachary Seeley (Livermore, CA, US)
- Alok Srivastava (Niskayuna, NY, US)
- William BEERS (Chesterland, OH, US)
- William COHEN (Solon, OH, US)
Cpc classification
F21Y2115/30
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/90
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V9/38
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2115/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F21K9/90
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/64
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
The present disclosure relates to a lighting component which may comprise a light emitting diode (LED) or laser diode (LD) for generating at least one of blue light or ultraviolet light. A fluoride phosphor matrix may be included, which may be consolidated into a phosphor ceramic structure including at least one of a transparent fluoride ceramic structure or a translucent fluoride ceramic structure, and positioned adjacent to the LED or LD. The phosphor ceramic structure generates at least one of red or orange light when irradiated by the light emitted from the LED or LD. The phosphor ceramic structure exhibits reduced thermal quenching relative to a fluoride particulate structure irradiated by the LED or LD.
Claims
1. A method for forming a light modifying structure, the method comprising: heating a composite powder including a fluoride powder and a phosphor powder including a plurality of distinct additional phosphor particles to a temperature within a predetermined temperature range to form a heated powder; and applying pressure to the heated composite powder within a predetermined pressure range to form a fluoride phosphor matrix including the plurality of distinct additional phosphor particles dispersed therein, a first amount of relative photon emissions of the distinct additional phosphor particles being greater than a second amount of relative photon emissions of the fluoride phosphor matrix, the fluoride phosphor matrix with the plurality of distinct additional phosphor particles defining the light modifying structure.
2. The method of claim 1, wherein the predetermined temperature range is greater than or equal to about 150 C. to less than or equal to about 400 C.
3. The method of claim 2, wherein the predetermined pressure range is greater than or equal to about 6,894 kPa to less than or equal to about 137,895 kPa.
4. The method of claim 1, wherein the method further includes preparing the composite powder, the preparation of the composite powder including contacting the fluoride powder and the phosphor powder.
5. The method of claim 4, wherein the preparation of the composite powder further includes applying a mixing force to the fluoride powder and the phosphor powder to form a homogeneous composite powder.
6. A method for forming a single-layered phosphor composite structure, the method comprising: consolidating a composite powder including a fluoride powder and a phosphor powder including a plurality of distinct additional phosphor particles to form a fluoride phosphor matrix including the plurality of distinct additional phosphor particles dispersed therein, a first amount of relative photon emissions of the distinct additional phosphor particles being greater than a second amount of relative photon emissions of the fluoride phosphor matrix, the fluoride phosphor matrix with the plurality of distinct additional phosphor particles defining the single-layered phosphor composite structure.
7. The method of claim 6, wherein the consolidating of the composite powder includes vacuum sintering, controlled atmosphere sintering, hot-pressing, spark plasma sintering, three-dimensional printing, or any combination thereof.
8. The method of claim 7, wherein the hot-pressing includes heating the composite powder to a temperature greater than room temperature and below the melting or decomposition temperature of the fluoride powder.
9. The method of claim 8, wherein the temperature is greater than or equal to about 150 C. to less than or equal to about 400 C.
10. The method of claim 8, wherein the hot-pressing includes applying a pressure to the composite powder, the pressure being greater than or equal to about greater than or equal to about 6,894 kPa to less than or equal to about 137,895 kPa.
11. The method of claim 6, wherein the method further includes preparing the composite powder, the preparation of the composite powder including contacting the fluoride powder and the phosphor powder.
12. The method of claim 11, wherein the preparation of the composite powder further includes applying a mixing force to the fluoride powder and the phosphor powder to form a homogeneous composite powder.
13. The method of claim 6, wherein the fluoride phosphor matrix includes a cubic or near-cubic K.sub.2PtCl.sub.6 structure type.
14. The method of claim 6, wherein the fluoride phosphor matrix comprises M.sub.2MF.sub.6, where M is selected from the group consisting of: Li, Na, K, Rb, Cs, and combinations thereof, and M is selected from the group consisting of: Si, Ge, Sn, Ti, Zr, Hf, and combinations thereof.
15. The method of claims 6, wherein the fluoride phosphor matrix comprises K.sub.2SiF.sub.6, Li.sub.2SiF.sub.6, Na.sub.2SiF.sub.6, Rb.sub.2SiF.sub.6, Cs.sub.2SiF.sub.6, K.sub.2GeF.sub.6, Li.sub.2GeF.sub.6, Na.sub.2GeF.sub.6, Rb.sub.2GeF.sub.6, Cs.sub.2GeF.sub.6, Li.sub.2SnF.sub.6, Na.sub.2SnF.sub.6, Rb.sub.2SnF.sub.6, Cs.sub.2SnF.sub.6, K.sub.2ZrF.sub.6, Li.sub.2ZrF.sub.6, Na.sub.2ZrF.sub.6, Rb.sub.2ZrF.sub.6, Cs.sub.2ZrF.sub.6, K.sub.2HfF.sub.6, Li.sub.2HfF.sub.6, Na.sub.2HfF.sub.6, Rb.sub.2HfF.sub.6, Cs.sub.2HfF.sub.6, K.sub.2TiF.sub.6, Li.sub.2TiF.sub.6, Na.sub.2TiF.sub.6, Rb.sub.2TiF.sub.6, Cs.sub.2TiF.sub.6, or any mixtures or solid solutions thereof.
16. The method of claim 6, wherein the plurality of distinct additional phosphor particles comprises an oxide phosphor, the oxide phosphor including Ce-doped (Lu,Gd,Y).sub.3(Al,Ga).sub.5O.sub.12 garnet compounds.
17. The method of claim 6, wherein the plurality of distinct additional phosphor particles comprises an oxide phosphor, a nitride phosphor, an oxynitride phosphor, a sulfide phosphor, an oxysulfide phosphor, a selenide phosphor, or any combination thereof.
18. A method for forming a fluoride phosphor matrix, the method comprising: contacting a fluoride powder and a phosphor powder to form a composite powder, the phosphor powder including a plurality of distinct additional phosphor particles; consolidating the composite powder to form the fluoride phosphor matrix, the fluoride phosphor matrix including the distinct additional phosphor particles homogeneously distribute throughout, a first amount of relative photon emissions of the distinct additional phosphor particles being greater than a second amount of relative photon emissions of the fluoride phosphor matrix.
19. The method of claim 18, wherein the consolidating of the composite powder includes heating the composite powder to a temperature is greater than or equal to about 150 C. to less than or equal to about 400 C.
20. The method of claim 18, wherein the consolidating of the composite powder includes applying a pressure to the composite powder, the pressure being greater than or equal to about 68.04 atm to less than or equal to about 1360.91 atm.
Description
DRAWINGS
(1) The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
(2) Corresponding reference numerals indicate corresponding parts throughout the several views of the drawings, in which:
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DETAILED DESCRIPTION
(13) Example embodiments will now be described more fully with reference to the accompanying drawings.
(14) Phosphor ceramics are currently employed in LED lighting, mostly based on Ce-doped garnets and are deployed in fixtures requiring high incident blue LED flux, but they lack sufficient red emission mainly at 630 nm to provide warm white light efficiently. To produce white light with a spectrum comparable to incandescent bulbs, while maximizing electrical efficiency, a red phosphor is needed with narrow band emission near 630 nm. Low flux LED packages typically employ powdered phosphors in a polymer matrix, sometimes including a combination of Ce-doped garnet powders and K.sub.2SiF.sub.6:Mn.sup.4+ (KSF) phosphor powder. The powder phosphors' performance is limited by the poor thermal conductivity, droop, and imperfect environmental stability of powders.
(15) The co-inventors of the present disclosure have found that the K.sub.2SiF.sub.6:Mn.sup.4+ (KSF) phosphor may be consolidated into ceramic form, and that multicomponent phosphor ceramics including KSF with garnets may be fabricated with good transparency or translucency into the KSF portion of the phosphor body.
(16) Another example of an LED component 100 employing a phosphor ceramic structure 102 is shown in
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(18) Transparent ceramics such as the phosphor ceramic structures 10 and 102 shown in
(19) The thickness of the ceramic needed for a particular LED package is determined by the activator doping level and the absorption cross section of the phosphor ceramic at the LED emission wavelength. In most instances, however, it is anticipated that the thickness will be in the range of about 0.1 mm to 1 mm, but it will be appreciated that this range may vary considerably based on the design of a particular LED package. Use of thicker ceramics with lower Mn.sup.4+ doping throughout a volume offers advantages of a lower temperature rise (if assumed to be heat-sunk) and also reduces excited state density which is likely to minimize the amount of droop. The resulting KSF phosphor ceramic 114 exhibits comparable absorption (with optimized doping and thickness) and emission properties to the powdered KSF phosphor, as shown in
(20) In addition to the single phosphor KSF:Mn ceramic shown in
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(22) The multicomponent phosphor ceramic 10, 102, 114 or 132 described ceramic herein may have a density >80% of the single-crystal's full density of the phosphor, and more preferably reach >90% of the full density, and even more preferably being consolidated to >99% of the full density. Most generally, the invention comprises a Manganese-doped fluoride ceramic as the red-emitting component.
(23) The fluoride phosphor powder used to form the multicomponent phosphor ceramics 10 and 102 described herein preferably has a cubic structure, and more preferably the K.sub.2PtCl.sub.6 cubic structure type. The specific phosphor selected may have the chemical formula M.sub.2MF.sub.6, where M is at least one monovalent ion, and M is at least one tetravalent ion, and wherein the selected monovalent and tetravalent ions form a stable compound. The phosphor and phosphor matrix selected may, for example, be comprised of M=Li, Na, K, Rb, Cs or mixtures thereof, and M being comprised of Si, Ge, Sn, Ti, Zr, Hf or mixtures thereof. In various implementations of the phosphor ceramic structures 10 or 102, one or more of the following ceramics are used: Li.sub.2SiF.sub.6, Na.sub.2SiF.sub.6, K.sub.2SiF.sub.6, Rb.sub.2SiF.sub.6, Cs.sub.2SiF.sub.6, Li.sub.2GeF.sub.6, Na.sub.2GeF.sub.6, K.sub.2GeF.sub.6, Rb.sub.2GeF.sub.6, Cs.sub.2GeF.sub.6, Li.sub.2SnF.sub.6, Na.sub.2SnF.sub.6, K.sub.2SnF.sub.6, Rb.sub.2SnF.sub.6, Cs.sub.2SnF.sub.6, Li.sub.2ZrF.sub.6, Na.sub.2ZrF.sub.6, K.sub.2ZrF.sub.6, Rb.sub.2ZrF.sub.6, Cs.sub.2ZrF.sub.6, Li.sub.2HfF.sub.6, Na.sub.2HfF.sub.6, K.sub.2HfF.sub.6, Rb.sub.2HfF.sub.6, Cs.sub.2HfF.sub.6, Li.sub.2TiF.sub.6, Na.sub.2TiF.sub.6, K.sub.2TiF.sub.6, Rb.sub.2TiF.sub.6, and Cs.sub.2TiF.sub.6, and in some implementations two or more mixtures or solid solutions thereof are used. In one example the selected phosphor is doped with Mn.sup.4+. In one example the Mn.sup.4+ doping level is between 0.01% to 30%, and more preferably being between 0.01% to 5%.
(24) As noted above, the ceramic structures 10 and 102 and 114 may be comprised of a doped or undoped transparent or translucent ceramic matrix, with one or more additional phosphors dispersed in the matrix. If one or more additional phosphors are used, they may be consolidated into a single ceramic structure as distinct particles which form within the fluoride phosphor comprising the ceramic structure. Each one of the differing phosphors may emit at wavelengths which differ from one another. One or more of the additional phosphors may be selected from among the colors cyan, green, yellow, or further orange or red emission. One or more of the additional phosphors may comprise an oxide garnet, such as Ce-doped (Lu,Gd,Y).sub.3(Al,Ga).sub.5O.sub.12 compounds, or a nitride phosphor, or an oxynitride phosphor or a sulfide phosphor, or a selenide phosphor.
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(26) While nearly all oxide phosphors are stable in the ambient for expected device lifetimes of >30 years, fluorides and nitrides exhibit degradation in humid environments. Fluoride ceramics are more stable in ambient humidity compared to powders. Since the K.sub.2SiF.sub.6:Mn.sup.4+ phosphor is known to be susceptible to degradation due to reaction with water, this may be an important advantage afforded by KSF ceramics versus KSF powders. Water reacting with Mn.sup.4+ can turn the phosphor black, likely due to leaching of Mn out of the KSF structure and its conversion into MnO.sub.2 (a dark brown substance). To address this issue, commercial K.sub.2SiF.sub.6:Mn.sup.4+ phosphor powder is often synthesized with a shell of undoped K.sub.2SiF.sub.6 on the surface of particles, to prevent water from reacting with Mn.sup.4+ and darkening the body color of the phosphor. Even more preferably, phosphor ceramics of K.sub.2SiF.sub.6:Mn.sup.4+ can be fabricated encapsulated in a shell of undoped KSF, a polymer, glass or other material with resistance to water diffusion, for example using a >100 micron thick layer, thus providing a protective coating of even greater durability for the ceramic.
(27) While many fluoride hosts may be considered as phosphor ceramic matrix, KSF offers a particularly low refractive index of 1.34 (at 589 nm), resulting in improved light extraction compared to other polymer and ceramic host candidates due to a reduction in the amount of total internal reflection. This low refractive index permits luminescence from any phosphor suspended within it to more readily escape from the front surface of the phosphor ceramic and reduces the photon flight path length prior to escape.
(28) For the KSF phosphor, use in the form of a KSF ceramic permits lower Mn doping, since the excitation volume in a transparent or translucent ceramic can be significantly larger (e.g., >1 mm.sup.3, compared to <0.05 mm.sup.3 in a powder). Lower Mn doping reduces concentration quenching (by Auger upconversion and cross-relaxation), and thereby mitigates thermal quenching arising from these deactivation pathways. Physical clustering of Mn when doping levels are high is likely the basis for degraded emission properties with high Mn doping, and can be nearly entirely avoided by use of lower Mn concentrations, as is enabled by employment of KSF in ceramic form. Experimentally, the advantage of a transparent (or translucent) phosphor ceramic over the usual incorporation of particles in a polymer relates to larger excitation volume for more transparent phosphor ceramics, as described above, where the blue pump (i.e., excitation) light excites a larger volume (e.g., blue LED excitation light).
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(30) The teachings presented herein enable single phosphor or multicomponent phosphor powders to be consolidated into single component or multicomponent ceramic structures. The single and multicomponent phosphor ceramic structures described herein enable a tunable light emission (e.g., tunable white light emission) to be achieved from a blue pump light excitation source, with an effective low refractive index for more efficient light extraction. The embodiments of the phosphor ceramic structures described herein offer significantly improved thermal stability and thermal conductivity as compared to powdered phosphors contained in a binder.
(31) The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.
(32) Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.
(33) The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms a, an, and the may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms comprises, comprising, including, and having, are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.
(34) When an element or layer is referred to as being on, engaged to, connected to, or coupled to another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being directly on, directly engaged to, directly connected to, or directly coupled to another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., between versus directly between, adjacent versus directly adjacent, etc.). As used herein, the term and/or includes any and all combinations of one or more of the associated listed items.
(35) Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as first, second, and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
(36) Spatially relative terms, such as inner, outer, beneath, below, lower, above, upper, and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as below or beneath other elements or features would then be oriented above the other elements or features. Thus, the example term below can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
(37) The color description such as red or green are not intended to be restrictive such that red may be interpreted as orange or orange/red and for example green may be yellow/green.