POLISHING APPARATUS FOR A SUBSTRATE

Abstract

A polishing apparatus includes: a platen rotatable; a polishing pad disposed on the platen; a polishing head disposed on the polishing pad; a slurry supply disposed above the polishing pad and configured to supply slurry to the polishing pad; a conditioner disposed above the polishing pad and includes a conditioning disk for polishing a surface of the polishing pad; and a collection module disposed above the polishing pad and configured to collect polishing pad debris generated on the surface of the polishing pad. The collection module includes a collection body, and a collection portion disposed within the collection body, and the collection portion includes at least one pair of collection rollers rotatable with respect to an axis parallel to the polishing pad and an adhesive member wound around the at least one pair of collection rollers.

Claims

1. A polishing apparatus for a substrate, comprising: a platen rotatable in a direction of rotation; a polishing pad disposed on the platen; a polishing head disposed on the polishing pad and configured to rotate a wafer and cause the wafer to contact the polishing pad; a slurry supply disposed above the polishing pad and spaced apart from the polishing head in the direction of rotation and configured to supply slurry to the polishing pad; a conditioner disposed above the polishing pad and spaced apart from the slurry supply in the direction of rotation and includes a conditioning disk for polishing an upper surface of the polishing pad; and a collection module disposed adjacent to the conditioner or the polishing head above the polishing pad and configured to collect polishing pad debris generated on the upper surface of the polishing pad, wherein the collection module includes a collection body and a collection portion disposed within the collection body, and the collection portion includes at least one pair of collection rollers rotatable with respect to an axis parallel to the upper surface of the polishing pad and an adhesive member wound around the at least one pair of collection rollers.

2. The polishing apparatus of claim 1, wherein the collection body includes a groove recessed from a lower surface of the collection body toward an upper surface of the collection body, and the collection portion is disposed to overlap the groove.

3. The polishing apparatus of claim 2, wherein the collection module further includes an auxiliary roller disposed on the lower surface of the collection body and rotatable with respect to the axis parallel to the upper surface of the polishing pad, and the auxiliary roller is disposed closer to the polishing pad than it is to a lower extent of the groove of the collection body.

4. The polishing apparatus of claim 2, wherein the collection module further includes a first electrode and a second electrode having different polarities, and the first electrode and the second electrode are spaced apart from each other with the adhesive member interposed therebetween.

5. The polishing apparatus of claim 1, wherein an end of the adhesive member is disposed at the same level as that of a lower surface of the collection body or is disposed at a higher level than that of the lower surface of the collection body.

6. The polishing apparatus of claim 1, wherein the collection portion includes a plurality of collectors, and the plurality of collectors surround at least a portion of the conditioning disk.

7. The polishing apparatus of claim 6, wherein the conditioner further includes a disk holder supporting the conditioning disk, the collection body is coupled to the disk holder, and the plurality of collectors surround the conditioning disk.

8. The polishing apparatus of claim 6, wherein the collection body has an arc shape, and the plurality of collectors surround a portion of the conditioning disk.

9. The polishing apparatus of claim 8, wherein the collection module is disposed above the polishing pad and is located between the slurry supply and the conditioner based on the direction of rotation.

10. The polishing apparatus of claim 8, wherein the collection module is disposed above the polishing pad between the conditioner and the polishing head based on the direction of rotation.

11. The polishing apparatus of claim 1, wherein the collection body has an elongated bar shape in a length direction, and the collection portion includes a plurality of collectors disposed along the length direction of the collection body.

12. The polishing apparatus of claim 11, wherein the collection module is disposed above the polishing pad and is located between the conditioner and the polishing head based on the direction of rotation.

13. The polishing apparatus of claim 12, wherein the conditioner further includes a conditioner arm configured to rotate the conditioning disk, and the collection body is coupled to the conditioner arm.

14. The polishing apparatus of claim 1, wherein the adhesive member includes at least one of 3,4-dihydroxy-I-phenylalanine (Peptidyl-DOPA), Mussel Foot Protein (MFP), a hyperbranched polymer adhesive (HBPA), 3,4,5-trihydroxyphenylalanine (TOPA), polydimethylsiloxane (PMDS), and catechol.

15. The polishing apparatus of claim 1, wherein the conditioning disk includes a disk pad, a plurality of protruding portions disposed on a lower surface of the disk pad, and a coating layer coated on the lower surface of the disk pad and the plurality of protruding portions, and the coating layer includes an adhesive material.

16. A polishing apparatus for a substrate, comprising: a platen rotatable in a direction of rotation; a polishing pad disposed on the platen; a polishing head disposed on the polishing pad and configured to rotate a wafer and cause the wafer to contact the polishing pad; a slurry supply disposed above the polishing pad, spaced apart from the polishing head in the direction of rotation, and configured to supply slurry to the polishing pad; a conditioner disposed above the polishing pad, spaced apart from the slurry supply in the direction of rotation, and includes a conditioning disk for polishing a surface of the polishing pad; and a collection module disposed adjacent to the polishing head above the polishing pad and configured to collect polishing pad debris generated on the surface of the polishing pad, wherein the collection module includes a collection body and a collection portion disposed within the collection body, the collection portion includes at least one pair of collection rollers rotatable with respect to an axis parallel to the polishing pad and an adhesive member wound around the at least one pair of collection rollers, and the collection portion includes a plurality of collectors surrounding at least a portion of the polishing head.

17. The polishing apparatus of claim 16, wherein the polishing head includes a retainer ring disposed on the polishing pad and surrounding the wafer, and a polishing head main body disposed on the retainer ring, the collection body is coupled to the polishing head, and the plurality of collectors surround the polishing head.

18. The polishing apparatus of claim 16, wherein the collection body has an arc shape, and the plurality of collectors surround a portion of the polishing head.

19. The polishing apparatus of claim 18, wherein the collection module is disposed above the polishing pad and is either between the conditioner and the polishing head based on the direction of rotation or is between the polishing head and the slurry supply based on the direction of rotation.

20. A polishing apparatus for a substrate, comprising: 10 a platen rotatable in a direction of rotation; a polishing pad disposed on the platen; a polishing head disposed on the polishing pad and configured to rotate a wafer and cause the wafer to contact the polishing pad; a slurry supply disposed above the polishing pad, spaced apart from the polishing head in the direction of rotation, and configured to supply slurry to the polishing pad; a conditioner disposed above the polishing pad, spaced apart from the slurry supply in the direction of rotation, and includes a conditioning disk for polishing a surface of the polishing pad; and a collection module disposed adjacent to the conditioner above the polishing pad and configured to collect polishing pad debris generated on the surface of the polishing pad, wherein the collection module includes a collection body including a groove recessed from a lower surface thereof toward an upper surface thereof, a collection portion that includes at least one pair of collection rollers rotatable with respect to an axis parallel to the polishing pad and an adhesive member wound around the at least one pair of collection rollers and is disposed to overlap the groove of the collection body, a collection portion support portion that connects the collection body and the at least one pair of collection rollers, and an auxiliary roller disposed on the lower surface of the collection body and configured to rotate with respect to the axis parallel to the polishing pad, and the collection portion includes a plurality of collectors surrounding at least a portion of the conditioning disk.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] FIG. 1 is a plan view of a polishing apparatus for a substrate according to an embodiment.

[0013] FIG. 2 is a cross-sectional view of the polishing apparatus for a substrate according to an embodiment.

[0014] FIG. 3 is an enlarged view of a region R1 of FIG. 2.

[0015] FIG. 4 is a cross-sectional view of a collection module cut along a disposition direction of a collection portion (or a collection unit).

[0016] FIG. 5 is an enlarged view corresponding to region R1 of FIG. 2 of a cross-sectional view of a polishing apparatus for a substrate according to some 5 embodiments.

[0017] FIG. 6 is a perspective view of a conditioning disk shown in FIG. 5.

[0018] FIGS. 7, 8, and 9 are cross-sectional views of a collection module cut along a disposition direction of a collection portion (or a collection unit) according to some embodiments.

[0019] FIGS. 10, 11, 12, 13, 14, 15, 16, and 17 are plan views of a polishing apparatus for a substrate according to some embodiments.

[0020] FIG. 13 is a cross-sectional view of the polishing apparatus for the substrate shown in FIG. 12.

DETAILED DESCRIPTION

[0021] Embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings so that those skilled in the art easily implement the embodiments. The present disclosure may be modified in various different ways, all without departing from the spirit or scope of the present disclosure.

[0022] In order to clearly describe the present disclosure, parts or portions that are irrelevant to the disclosure may be omitted, and identical or similar constituent elements throughout the specification are denoted by the same reference numerals.

[0023] Further, in the drawings, the size and thickness of each element are arbitrarily illustrated for ease of description, and the present disclosure is not necessarily limited to those illustrated in the drawings. In the drawings, the thicknesses of layers, films, panels, regions, etc., are exaggerated for clarity. In the drawings, for ease of description, the thicknesses of some layers and areas are exaggerated.

[0024] It will be understood that when an element such as a layer, film, region, area, or substrate is referred to as being on or above another element, it may be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being directly on another element, there are no intervening elements present. Further, in the specification, the word on or above means disposed on or below the object portion, and does not necessarily mean disposed on the upper side of the object portion based on a gravitational direction.

[0025] In addition, unless explicitly described to the contrary, the word comprise and variations such as comprises or comprising will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.

[0026] Further, throughout the specification, the phrase in a plan view or on a plane means viewing a target portion from the top, and the phrase in a cross-sectional view or on a cross-section means viewing a cross-section formed by vertically cutting a target portion from the side.

[0027] Terms such as same, equal, etc. as used herein when referring to features such as orientation, layout, location, shapes, sizes, compositions, amounts, or other measures do not necessarily mean an exactly identical feature but is intended to encompass nearly identical features including typical variations that may occur resulting from conventional manufacturing processes. The term substantially may be used herein to emphasize this meaning.

[0028] Ordinal numbers such as first, second, third, etc. may be used simply as labels of certain elements, steps, etc., to distinguish such elements, steps, etc. from one another. Terms that are not described using first, second, etc., in the specification, may still be referred to as first or second in a claim. In addition, a term that is referenced with a particular ordinal number (e.g., first) in a particular claim may be described elsewhere with a different ordinal number (e.g., second) in the specification or another claim.

[0029] Hereinafter, a polishing apparatus for a substrate (which may be referred to hereafter as a substrate polishing apparatus 10) according to an embodiment will be described with reference to FIGS. 1 to 4.

[0030] FIG. 1 is a plan view of the polishing apparatus for the substrate according to the embodiment. FIG. 2 is a cross-sectional view of the polishing apparatus for the substrate according to an embodiment. FIG. 3 is an enlarged view of region R1 of FIG. 2. FIG. 4 is a cross-sectional view of a collection module cut along a disposition direction of a collection portion (which may be referred to as a collection unit).

[0031] Referring to FIGS. 1 to 4, the substrate polishing apparatus 10 may include a platen 100, a polishing pad PP, a polishing head 200, a slurry supply 300, a conditioner 400, and a collection module 500.

[0032] The polishing head 200, the slurry supply 300, and the conditioner 400 may be sequentially disposed along a direction of rotation D1 that is a rotation direction of the platen 100.

[0033] The substrate polishing apparatus 10 according to the embodiment may be used in a process of performing chemical mechanical polishing (CMP) on a wafer W.

[0034] The platen 100 may have a disk shape, and may include a lower surface and an upper surface facing away from each other in a vertical direction.

[0035] The platen 100 may rotate clockwise or counterclockwise around a platen rotation axis which may be coaxial with a platen rotation shaft 110 disposed on a lower surface of the platen. The platen rotation shaft 110 may receive rotational power from a driving apparatus such as a motor or the like to rotate in the direction of rotation D1 (e.g., rotate clockwise or counterclockwise about the platen rotation axis). Hereinafter, a description will be made on a premise that the platen 100 rotates counterclockwise (e.g., direction of rotation D1 is counterclockwise about the platen rotation axis).

[0036] The polishing pad PP provides a place, or surface for performing chemical mechanical polishing on the wafer W and may be attached on an upper surface of the platen 100. The polishing pad PP attached on the platen 100 may also rotate according to rotation of the platen 100.

[0037] The polishing pad PP may have a disk shape, and may include a lower surface and an upper surface facing away from each other in a vertical direction. A diameter of the polishing pad PP may be larger than a diameter of the wafer W.

[0038] The lower surface of the polishing pad PP may be in contact with the upper surface of the platen 100, and the upper surface of the polishing pad PP may be provided as a polishing surface for polishing the wafer W. The polishing pad PP may be in close contact with the wafer W to perform chemical mechanical polishing on the wafer W. The polishing pad PP may be a polyurethane pad. However, a material of the polishing pad PP is not limited thereto and may be variously changed.

[0039] The wafer W may be formed of and/or include silicon (Si). As another example, the wafer W may be formed of and/or include a semiconductor material such as germanium (Ge), or a compound semiconductor material such as silicon carbide (SiC), gallium arsenide (GaAs), indium arsenide (InAs), or indium phosphate (InP).

[0040] The polishing head 200 may chemically and mechanically polish a surface of the wafer W by rotating about a polishing head rotation axis perpendicular to the polishing pad PP. A polishing head rotation shaft 230 may be coaxial with the polishing head rotation axis supporting the polishing head 200. Additionally, the polishing head 200 may perform a reciprocating motion together with a rotational motion on the polishing pad PP.

[0041] The polishing head 200 may include a retainer ring 210, a polishing head main body 220, the polishing head rotation shaft 230, and a polishing head arm 240.

[0042] The retainer ring 210 may be disposed on or above the polishing pad PP, and may be in contact with the upper surface of the polishing pad PP or may be spaced above the polishing pad PP. The retainer ring 210 may have a ring shape on a plane and may surround an outer circumference of the wafer W (e.g., in a plan view the retainer ring 210 may have a ring shape surrounding a wafer). An inner side surface of the retainer ring 210 and a side surface of the wafer W may be spaced apart from each other, or may contact one another.

[0043] The inner side surface of the retainer ring 210 may define a space where the wafer W is loaded and may prevent the wafer W from separating from the polishing head 200 during a polishing process. The retainer ring 210 may be under pressure in a direction of pressing the upper surface of the polishing pad PP.

[0044] The polishing head main body 220 may be disposed on the retainer ring 210 and may have a disk shape on a plane. The polishing head rotation shaft 230 connected to an upper surface of the polishing head main body 220 may perform a rotational motion by receiving rotational power from a driving apparatus such as a motor or the like. The polishing head main body 220 may rotate about the polishing head rotation axis in the same direction as or a different direction from that of the polishing pad PP which rotates about the platen rotation axis.

[0045] Accordingly, the polishing head main body 220 may grip the wafer W, and may rotate the wafer W.

[0046] The wafer W may be attached to a lower surface of the polishing head main body 220 to be chemically and mechanically polished. For example, the wafer W may be attached to the lower surface of the polishing head main body 220 using vacuum, or the wafer W may be fixed to the lower surface of the polishing head main body 220 using an electrostatic force.

[0047] The polishing head main body 220 may apply a certain polishing load or force to the wafer W to contact, or press the wafer W to the polishing pad PP, and may be rotated by the polishing head rotation shaft 230 to chemically and mechanically polish a surface of the wafer W in contact with the upper surface of the polishing pad PP. Additionally, the polishing head main body 220 may apply a pressure to the retainer ring 210 in a direction of the polishing pad PP and may rotate together with the retainer ring 210.

[0048] The polishing head rotation shaft 230 may connect the polishing head main body 220 and the polishing head arm 240. The polishing head arm 240 may reciprocally move the polishing head main body 220, such as alternating left and right directions as viewed in FIG. 2, and may support the polishing head rotation shaft 230. The polishing head 200 may move in both left and right directions as viewed in FIG. 2, or more generally toward and away from the platen rotation axis, on the polishing pad PP by the polishing head arm 240.

[0049] The slurry supply 300 may be disposed above the upper surface of the polishing pad PP and spaced apart from the polishing head 200 and the conditioner 400 in the direction of rotation D1. The slurry supply 300 may be disposed between the polishing head 200 and the conditioner 400 based on the direction of rotation D1. That is, the slurry supply 300 may be disposed to be spaced apart from a front end of the conditioner 400 with respect to the direction of rotation D1.

[0050] The slurry supply 300 may supply slurry to the polishing pad PP while the chemical mechanical polishing process is performed.

[0051] The slurry supply 300 may include at least one nozzle 310 that supplies slurry SL to the polishing pad PP and a slurry arm 320 that moves the nozzle 310 above the polishing pad PP.

[0052] As the slurry arm 320 translates clockwise or counterclockwise above the polishing pad PP based on a vertical axis with respect to the slurry arm 320, the at least one nozzle 310 connected to the slurry arm 320 may also move clockwise or counterclockwise above the polishing pad PP.

[0053] The slurry supply 300 may spray the slurry SL on a surface of the polishing pad PP through the nozzle 310. The slurry SL sprayed from the slurry supply 300 may be used to polish the surface of the wafer W, and then may be discharged to the outside of the platen 100.

[0054] The slurry SL supplied from the nozzle 310 of the slurry supply 300 may include at least one of a reactant (e.g., deionized water for oxidation polishing), a wear particle (e.g., silicon oxide for oxidation polishing), or a chemical reaction catalyst (e.g., potassium hydroxide for oxidation polishing), but the present disclosure is not limited thereto, and a material included in the slurry SL may be variously changed.

[0055] Depending on an embodiment, the slurry supply 300 may spray the slurry SL in a state in which the slurry supply 300 heats or cools the slurry SL. The slurry SL supplied from the slurry supply 300 may be used to perform the chemical mechanical polishing process by reacting with the surface of the wafer W attached to the polishing head 200.

[0056] The conditioner 400 may be disposed above the upper surface of the polishing pad PP to be spaced apart from the polishing head 200 and the slurry supply 300. In other words, the conditioner 400 may be disposed between the polishing head 200 and the slurry supply 300 based on the direction of rotation D1. That is, the conditioner 400 may be disposed to be spaced apart from a front end of the polishing head 200 with respect to the direction D1 of rotation.

[0057] The conditioner 400 may perform a conditioning process for improving a surface roughness of the polishing pad PP (e.g., smoothing the polishing pad).

[0058] The conditioner 400 may include a conditioning disk 410, a disk holder 420, a disk rotation shaft 430, and a conditioner arm 440.

[0059] The conditioning disk 410 may include a disk pad 412 having a disk shape on a plane and a plurality of protruding portions 414 attached to a lower surface of the disk pad 412.

[0060] The plurality of protruding portions 414 may protrude from the lower surface of the disk pad 412 toward the upper surface of the polishing pad PP, and each lower end of the plurality of protruding portions 414 may contact the upper surface of the polishing pad PP. For example, the plurality of protruding portions 414 may be a diamond particle with a pointed lower end. However, a shape and a material of each of the plurality of protruding portions 414 are not limited thereto and may be variously changed.

[0061] The plurality of protruding portions 414 may perform the conditioning process of fine-polishing the upper surface of the polishing pad PP while the polishing pad PP rotates. Accordingly, the upper surface of the polishing pad PP may maintain a uniform surface roughness while the chemical mechanical polishing process is performed.

[0062] The disk holder 420 may be disposed on an upper surface of the conditioning disk 410 and may support the conditioning disk 410. A lower surface of the disk holder 420 may be in contact with the upper surface of the conditioning disk 410, and an upper surface of the disk holder 420 may be connected to the disk rotation shaft 430.

[0063] The disk rotation shaft 430 may perform a rotational motion about a disk rotation axis which may be coaxial with the disk rotation shaft 430 by receiving rotational power from a driving apparatus such as a motor or the like. The disk holder 420 connected to the disk rotation shaft 430 may rotate in the same direction as or a different direction around the disk rotation axis from that of the polishing pad PP as it rotates around the platen rotation axis.

[0064] The conditioner arm 440 may be connected to the disk rotation shaft 430. The conditioner arm 440 may have a rotating connection with the disk rotation shaft 430 such that the disk rotation shaft 430 may rotate relative to the conditioner arm 440. The conditioner arm 440 or the disk rotation shaft 430 may rotate clockwise or counterclockwise above the polishing pad PP relative to a vertical axis and the disk holder 420 connected to the conditioner arm 440 through the disk rotation shaft 430 may rotate clockwise or counterclockwise above the polishing pad PP.

[0065] In an embodiment, the collection module 500 may be directly coupled to the conditioner 400. The collection module 500 may remove polishing pad debris PD remaining on the surface of the polishing pad PP. In this example, the polishing pad debris PD may be a residue or a by-product of a process of finely polishing the upper surface of the polishing pad PP.

[0066] The collection module 500 may be disposed above the upper surface of the polishing pad PP and spaced apart from the polishing head 200 and the slurry supply 300. The collection module 500 may be disposed between the polishing head 200 and the slurry supply 300 based on the direction D1 of rotation. For example, the collection module 500 may be disposed to be spaced apart from a front end of the polishing head 200 based on the direction D1 of rotation. However, a position of the collection module 500 may be variously changed above the upper surface of the polishing pad PP, and a detailed description thereof will be described later.

[0067] The collection module 500 may include a collection body 510, a collection portion (or a collection unit) 530, a collection support 520 connecting the collection body 510 and the collection portion 530, and an auxiliary roller 540.

[0068] The collection body 510 of the collection module 500 may be directly coupled to the conditioner 400.

[0069] The collection module 500 may include a lower surface 510S1 and an upper surface 510S2 that face away from each other in a vertical direction with respect to the polishing pad PP.

[0070] The collection body 510 may have substantially the same disk shape as that of the conditioning disk 410 in a plan view. However, a shape of the collection body 510 is not limited thereto and may be variously changed.

[0071] In an embodiment, the collection body 510 of the collection module 500 may surround a side surface of the disk pad 412, a portion of an upper surface and a side surface of the disk holder 420, and a portion of a side surface of the disk rotation shaft 430.

[0072] The collection body 510 of the collection module 500 may be in contact with the side surface of the disk pad 412, the portion of the upper surface and the side surface of the disk holder 420, and the portion of the side surface of the disk rotation shaft 430, and may be coupled to the conditioner 400.

[0073] The disk rotation shaft 430 may penetrate a portion of the collection body 510 to be connected to the upper surface of the disk holder 420. Because the collection body 510 is coupled to the disk holder 420 that rotates with the disk rotation shaft 430, the collection body 510 may be rotated together in linkage with the disk holder 420. That is, the collection body 510 may rotate in the same direction as that of the disk holder 420.

[0074] In FIG. 2 and FIG. 3, a portion of the collection body 510 is shown to be in contact with the side surface of the disk pad 412, a portion of the upper surface and the side surface of the disk holder 420, and a portion of the side surface of the disk rotation shaft 430. In some embodiments, the collection body 510 may be coupled to the disk holder 420 through a separate coupling portion (not shown).

[0075] In FIGS. 2 and 3, the side surface of the disk rotation shaft 430 is shown to be in contact with the collection body 510, but a disposition relationship between the disk rotation shaft 430 and the collection body 510 is not limited thereto and may be variously changed. For example, the disk rotation shaft 430 may be disposed at a predetermined distance from the collection body 510.

[0076] As another example, the disk rotation shaft 430 may be connected to the upper surface 510S2 of the collection body 510 without penetrating the collection body 510. If the disk rotation shaft 430 is connected to the upper surface 510S2 of the collection body 510, the collection body 510 of the collection module 500 may be in direct contact with the side surface and the upper surface of the disk holder 420 and may entirely cover the disk holder 420.

[0077] In addition, in embodiments in which the disk rotation shaft 430 is connected to the upper surface 510S2 of the collection body 510, the collection body 510 may be rotatable based on the disk rotation shaft 430, so that the disk holder 420 coupled to the collection body 510 is linked with the collection body 510 to be rotated together.

[0078] The lower surface 510S1 of the collection body 510 may be disposed between the lower surface of the disk pad 412 and the upper surface of the polishing pad PP. That is, the lower surface 510S1 of the collection body 510 may be disposed at a lower level than that of the lower surface of the disk pad 412.

[0079] A portion of the collection body 510 may be disposed to be spaced apart from the protruding portion 414 of the conditioning disk 410 and may cover a portion of the protruding portion 414. That is, the portion of the collection body 510 may be disposed to overlap the protruding portion 414 in a direction parallel to the polishing pad PP. However, a position of the lower surface 510S1 of the collection body 510 is not limited thereto and may be variously changed. For example, the lower surface 510S1 of the collection body 510 may be disposed at substantially the same level as that of the lower surface of the disk pad 412, or the lower surface 510S1 of the collection body 510 may be disposed at a higher level than that of the lower surface of the disk pad 412, so that the portion of the collection body 510 does not overlap the protruding portion 414 of the conditioning disk 410 in the direction parallel to the polishing pad PP. 10

[0080] The collection portion support 520 and the collection portion 530 may be disposed within the collection body 510.

[0081] In an embodiment, the collection portion support 520 may include a plurality of collection portion supports 520. The plurality of collection portion supports 520 may be spaced apart from each other in a vertical direction and may connect the collection body 510 and the collection portion 530. The plurality of collection portion supports 520 may surround the conditioner 400.

[0082] The collection portion 530 may include at least one collector. Each collector may include at least one pair of a first collection roller 532 and a second collection roller 534, and an adhesive member 536, such as an adhesive tape or adhesive strip, wound around the first collection roller 532 and the second collection roller 534. A plurality of collectors may form the collection portion 530.

[0083] The first collection roller 532 and the second collection roller 534 may be parallel and spaced apart in a direction perpendicular to the upper surface of the polishing pad PP. That is, a central axis of the first collection roller 532 and a central axis of the second collection roller 534 may be parallel and spaced apart in the direction perpendicular to the upper surface of the polishing pad PP.

[0084] The first collection roller 532 may be disposed adjacent or near to the polishing pad PP, and the second collection roller 534 may be disposed relatively far from the polishing pad PP compared with the first collection roller 532.

[0085] Each of the first collection roller 532 and the second collection roller 534 may be connected to the collection portion supports 520, which are spaced apart in a vertical direction, and may be supported by the collection portion 10 supports 520. Additionally, the first collection roller 532 and the second collection roller 534 may be connected to the collection body 510 by the collection portion support 520.

[0086] The first collection roller 532 and the second collection roller 534 may perform a rotational motion by receiving rotational power from a driving apparatus such as a motor or the like. That is, the first collection roller 532 and the second collection roller 534 may rotate clockwise or counterclockwise with respect to a central axis that is parallel to the surface of the polishing pad PP. Additionally, the first collection roller 532 and the second collection roller 534 may rotate in the same direction as one another.

[0087] The first collection roller 532 and the second collection roller 534 may rotate by receiving rotational power from a built-in motor, or the first collection roller 532 and the second collection roller 534 may rotate by receiving rotational power from an external motor (not shown) coupled to the collection rollers through a drive belt, gears, or a drive shaft.

[0088] In some embodiments, one of the first collection roller 532 and the second collection roller 534 may be a driving roller that rotates by receiving rotational power from a driving apparatus such as a motor or the like, and the other of the first collection roller 532 and the second collection roller 534 may be a driven roller that rotates by transferring a driving force to the adhesive member 536 wound around the first collection roller 532 and the second collection roller 534. For example, the first collection roller 532 may be a driven roller, and the second collection roller 534 may be a driving roller.

[0089] Although the collection portion 530 is shown as including two first collection rollers 532 and two second collection rollers 534 in the embodiment, the number of rollers included in the collection portion 530 is not limited thereto and may be variously changed.

[0090] The adhesive member 536 may be wound around the first collection roller 532 and the second collection roller 534. For example, the adhesive member 536 may be wound around the first collection roller 532 and the second collection roller 534 according to rotation directions of the first collection roller 532 and the second collection roller 534.

[0091] The adhesive member 536 may collect the polishing pad debris PD remaining on the upper surface of the polishing pad PP. That is, because the adhesive member 536 includes a material having adhesiveness, the polishing pad debris PD remaining on the upper surface of the polishing pad PP may be attached to the adhesive member 536 to be collected.

[0092] In an embodiment, as shown in FIG. 3, the adhesive member 536 may be formed of multiple layers. That is, the adhesive member 536 may include a base layer 536a and an adhesive layer 536b.

[0093] The base layer 536a may not include an adhesive material and may play a role of maintaining the adhesive layer 536b disposed on the base layer 536a in a film shape.

[0094] The adhesive layer 536b may be a double-sided tape including an adhesive material. That is, one surface of the adhesive layer 536b may contact the base layer 536a, and the other surface of the adhesive layer 536b may not contact the base layer 536a and may be exposed to the outside to form an adhesive surface.

[0095] The adhesive member 536 may be wound around the first collection roller 532 and the second collection roller 534 so that the base layer 536a is disposed toward the inside and the adhesive layer 536b is disposed toward the outside. That is, the base layer 536a and the adhesive layer 536b of the adhesive member 536 wound around the first collection roller 532 and the second collection roller 534 may be wound to be alternately disposed along a direction from the inside to the outside of the adhesive member 536.

[0096] Accordingly, the adhesive layer 536b of the adhesive member 536 may be exposed to the outside to contact the polishing pad debris PD remaining on the upper surface of the polishing pad PP.

[0097] In an embodiment, the adhesive layer 536b of the adhesive member 536 may include a wet adhesive material. For example, the adhesive layer 536b may include at least one of 3,4-dihydroxy-I-phenylalanine (Peptidyl-DOPA), Mussel Foot Protein (MFP), a hyperbranched polymer adhesive (HBPA), 3,4,5-trihydroxyphenylalanine (TOPA), polydimethylsiloxane (PMDS), or catechol. However, a material included in the adhesive layer 536b is not limited thereto and may be variously changed.

[0098] To selectively collect the polishing pad debris PD remaining on the upper surface of the polishing pad PP and the polishing pad debris PD among a slurry (SL) particle sprayed on the upper surface of the polishing pad PP in a process where the collection portion 530 collects the polishing pad debris PD, the adhesive layer 536b of the adhesive member 536 may have the same electric charge as that of the slurry (SL) particle, and may include a material having a large number of functional groups capable of hydrogen bonding with the polishing pad debris PD.

[0099] If the adhesive layer 536b of the adhesive member 536 has the same electric charge as that of the slurry (SL) particle and includes the material with the large number of functional groups capable of hydrogen bonding, a repulsive force may be generated between the adhesive layer 536b of the adhesive member 536 and the slurry (SL) particle to push each one away from one the other, and the adhesive layer 536b of the adhesive member 536 may improve adhesion through the hydrogen bonding with the polishing pad debris PD.

[0100] For example, if the slurry (SL) particle is a material with a positive electric charge, the adhesive layer 536b of the adhesive member 536 may have the positive electric charge like an amino group (NH2), and may include the material with the large number of functional groups capable of hydrogen bonding.

[0101] As another example, if the slurry (SL) particle is a material with a negative electric charge, the adhesive layer 536b of the adhesive member 536 may have the negative electric charge like a carboxyl group (COOH), a hydroxy group (OH), or the like, and may include the material with the large number of functional groups capable of hydrogen bonding. However, the above-described functional groups are examples, and types of the functional groups included in the adhesive layer 536b of the adhesive member 536 may be variously changed.

[0102] A first end of the adhesive member 536 may be wound around the first collection roller 532, and a second end opposite the first end of the adhesive member 536 may extend from the portion of the adhesive member 536 wound around the first collection roller 532 to be wound around the second collection roller 534.

[0103] Because the first collection roller 532 and the second collection roller 534 rotate with reference to an axis parallel to the polishing pad PP, the adhesive member 536 wound around each of the first collection roller 532 and the second collection roller 534 may also rotate together.

[0104] The first end of the adhesive member 536 disposed at the first collection roller 532 may rotate to be unwound according to a rotation direction of the first collection roller 532, and the second end of the adhesive member 536 disposed at the second collection roller 534 may rotate to be wound according to a rotation direction of the second collection roller 534. That is, the adhesive member 536 wound around the first collection roller 532 may be moved to the second collection roller 534 by rotations of the first collection roller 532 and the second collection roller 534.

[0105] Because the first collection roller 532 and the second collection roller 534 are disposed spaced apart in a vertical direction, the adhesive member 536 that extends by moving from the first collection roller 532 to the second collection roller 534 may have a band shape.

[0106] Accordingly, the second collection roller 534 may take up the other end of the adhesive member 536 to wind the adhesive member 536 in a process of collecting the polishing pad debris PD remaining on the upper surface of the polishing pad PP through the collection portion 530, so that a thickness of the adhesive member 536 unwound according to the rotation direction of the first collection roller 532 decreases and a thickness of the adhesive member 536 wound according to the rotation direction of the second collection roller 534 increases as the adhesive member collects polishing pad debris PD.

[0107] The adhesive layer 536b of the adhesive member 536 wound around the first collection roller 532 to be rotated may be exposed to the upper surface of the polishing pad PP, and the polishing pad debris PD remaining on the upper surface of the polishing pad PP may be collected from the upper surface of the polishing pad PP as the polishing pad debris is attached to a surface of the adhesive layer 536b of the adhesive member 536.

[0108] In addition, because the adhesive member 536 wound around the first collection roller 532 rotates, a new surface of the adhesive layer 536b of the adhesive member 536 may be continuously exposed to the upper surface of the polishing pad PP, and the adhesive layer 536b of the adhesive member 536 may attach the polishing pad debris PD to the exposed new surface.

[0109] The adhesive member 536 of the collection portion 530 may selectively collect the polishing pad debris PD remaining on the upper surface of the polishing pad PP and the polishing pad debris PD among the slurry (SL) particle. In other words, the adhesive member 536 may be disposed at a predetermined distance from the upper surface of the polishing pad PP, so that the polishing pad debris PD having a relatively larger size than that of the slurry (SL) particle is attached to the adhesive member 536 and the slurry (SL) particle having a relatively smaller size than that of the polishing pad debris PD is not attached to the adhesive member 536.

[0110] The adhesive member 536 to which the polishing pad debris PD is attached in the first collection roller 532 may be collected by moving from the first collection roller 532 to the second collection roller 534 to be wound around the second collection roller 534. In other words, the adhesive member 536 disposed at the first collection roller 532 may play a role of attaching and collecting the polishing pad debris PD, and the adhesive member 536 disposed at the second collection roller 534 may play a role of collecting the collected polishing pad debris PD.

[0111] If collection of the polishing pad debris PD is completed as the adhesive member 536 wound around the first collection roller 532 is completely unwound to be moved to the second collection roller 534 in a process of collecting the polishing pad debris PD through the collection portion 530, the adhesive member 536 wound around the second collection roller 534 may be detachable, and may be replaced with a new adhesive member 536.

[0112] One end of the replaced adhesive member 536 may be wound around the first collection roller 532, and the other end of the replaced adhesive member 536 may be wound around the second collection roller 534. Initially, a thickness of the roll of adhesive member 536 wound around the first collection roller 532 may be greater than a thickness of the roll of adhesive member 536 wound around the second collection roller 534.

[0113] In an embodiment, the collection body 510 of the collection module 500 may include a groove 510H recessed in a direction perpendicular to the polishing pad PP from the lower surface 510S1 to the upper surface 510S2. That is, some regions of the lower surface 510S1 of the collection body 510 may include the groove 510H, and because the remaining regions of the lower surface 510S1 do not include the groove 510H, the lower surface 510S1 of the collection body 510 may have a step difference.

[0114] The groove 510H of the collection body 510 may be disposed to overlap the collection portion 530 in a vertical direction. That is, the groove 510H of the collection body 510 may be disposed to overlap the first collection roller 532, the second collection roller 534, and the adhesive member 536 wound around the first collection roller 532 and the second collection roller 534.

[0115] The groove 510H of the collection body 510 may be disposed adjacent to the adhesive member 536 wound around the first collection roller 532 and may accommodate the polishing pad debris PD within the groove 510H.

[0116] Accordingly, the polishing pad debris PD accommodated within the groove 510H of the collection body 510 may be easily attached to the adhesive member 536 wound around the first collection roller 532.

[0117] FIG. 2 and FIG. 3 show that a lower end portion of the adhesive member 536 wound around the first collection roller 532 is disposed at substantially the same level as that of the lower extent of the groove 510H of the collection body 510 and the groove 510H surrounds the lower end portion of the adhesive member 536 wound around the first collection roller 532. However, a disposition relationship between the lower end portion of the adhesive member 536 wound around the first collection roller 532 and the groove 510H of the collection body 510 may be variously changed depending on a depth along the vertical direction of the groove 510H of the collection body 510, a thickness of the adhesive member 536 wound around the first collection roller 532, a position of the first collection roller 532, and a diameter of the first collection roller 532. For example, the lower end portion of the adhesive member 536 wound around the first collection roller 532 may be disposed at a level lower than that of the lower extent of the groove 510H of the collection body 510. That is, the lower end portion of the adhesive member 536 wound around the first collection roller 532 may be disposed closer to the polishing pad PP than the groove 510H of the collection body 510. As another example, the lower end portion of the adhesive member 536 wound around the first collection roller 532 may be disposed at a higher level than that of the lower extent of the groove 510H of the collection body 510. That is, the lower extent of the groove 510H of the collection body 510 may be disposed closer to the polishing pad PP than the lower end portion of the adhesive member 536 wound around the first collection roller 532.

[0118] A width of the groove 510H of the collection body 510 may be different from a width of the adhesive member 536 wound around the first collection roller 532 in a direction parallel to the axis of the first collection roller 532. For example, the width of the groove 510H of the collection body 510 may be larger than the width of the adhesive member 536 wound around the first collection roller 532 in a direction parallel to the axis of the first collection roller.

[0119] A width of the groove 510H of the collection body 510 may be different from a width of the roll of the adhesive member 536 wound around the first collection roller 532 in a direction perpendicular to the axis of the first collection roller 532. For example, the width of the groove 510H of the collection body 510 may be larger than the width of the roll of the adhesive member 536 wound around the first collection roller 532 in a direction perpendicular to the axis of the first collection roller.

[0120] Accordingly, the polishing pad debris PD collected by the adhesive member 536 wound around the first collection roller 532 may be smoothly moved to the adhesive member 536 wound around the second collection roller 534.

[0121] In an embodiment, the auxiliary roller 540 may be disposed at the lower surface 510S1 of the collection body 510 of the collection module 500.

[0122] The auxiliary roller 540 may include a plurality of auxiliary rollers 540 disposed to be spaced apart from each other with the groove 510H of the body 510 interposed therebetween on the lower surface 510S1 of the collection body 510.

[0123] In addition, the first collection roller 532, the second collection roller 534, and the adhesive member 536 wound around the first collection roller 532 and the second collection roller 534 may be disposed between the plurality of auxiliary rollers 540.

[0124] A lower end of the auxiliary roller 540 may be disposed at a lower level than that of the lower surface 510S1 of the collection body 510. That is, the auxiliary roller 540 may be disposed closer to the polishing pad PP than the collection body 510. Additionally, the lower end of the auxiliary roller 540 may be disposed at a level lower than the lower extent of the groove 510H of the collection body 510 and a lower end of the adhesive member 536 wound around the first collection roller 532.

[0125] The auxiliary roller 540 may rotate about an axis parallel to the upper surface of polishing pad PP. The auxiliary roller 540 may rotate in a direction different from that of the first collection roller 532 and the second collection roller 534. For example, the auxiliary roller 540 may rotate counterclockwise about the axis parallel to the upper surface of the polishing pad PP. The auxiliary roller 540 may rotate such that a lower end of the auxiliary roller rotates toward the groove 510H.

[0126] Because the auxiliary roller 540 is disposed closer to the upper surface of the polishing pad PP than the lower extent of the groove 510H of the collection body 510 and rotates, the polishing pad debris PD remaining on the upper surface of the polishing pad PP may be pushed into the groove 510H of the collection body 510. That is, the polishing pad debris PD may be directed to the groove 510H of the collection body 510 by the auxiliary roller 540 so that it is easily attached to the adhesive member 536 wound around the first collection roller 532.

[0127] In addition, if it is difficult for the polishing pad debris PD to be directly attached to the adhesive member 536 wound around the first collection roller 532 as the thickness of the adhesive member 536 wound around the first collection roller 532 decreases, the polishing pad debris PD may be directed to the groove 510H of the collection body 510 by the auxiliary roller 540 so that it is easily attached to the adhesive member 536 wound around the first collection roller 532.

[0128] According to the substrate polishing apparatus 10 according to the embodiment, during a process of finely polishing the upper surface of the polishing pad PP using the conditioner 400, the polishing pad debris PD generated on the surface of the polishing pad PP may be easily collected or removed through the collection module 500.

[0129] Accordingly, it is possible to prevent the polishing pad debris PD from entering the polishing head 200 to cause a scratch on a surface of the wafer W.

[0130] Hereinafter, a polishing apparatus for a substrate according to various embodiments will be described with reference to FIGS. 5 to 17. In the following embodiment, the same configuration described above will be referred to by the same reference numeral, and a redundant description may be omitted or simplified, and the differences from the previously described embodiments will be mainly described.

[0131] FIG. 5 is a cross-sectional view of a polishing apparatus for a substrate according to some embodiments. FIG. 6 is a perspective view of a conditioning disk shown in FIG. 5.

[0132] Specifically, FIG. 5 is an enlarged view of region R2, which corresponding to the region R1 of FIG. 2, according to some embodiments.

[0133] According to the embodiment shown in FIG. 5 and FIG. 6, unlike the embodiment shown in FIG. 3, there is a difference in that a coating layer 450 including an adhesive material is formed at the disk pad 412 and the protruding portion 414 of the conditioning disk 410.

[0134] Specifically, referring to FIG. 5 and FIG. 6, the disk pad 412 of the conditioning disk 410 may include a lower surface 412S1 and an upper surface 412S2 facing away from each other in a vertical direction.

[0135] The coating layer 450 including the adhesive material may entirely cover the lower surface 412S1 of the disk pad 412. Additionally, the coating layer 450 may entirely cover surfaces of the plurality of protruding portions 414 attached to the lower surface 412S1 of the disk pad 412.

[0136] The adhesive material included in the coating layer 450 may be substantially the same as the wet adhesive material included in the adhesive layer 536b of FIG. 3 of the above-described adhesive member 536. However, a material included in the coating layer 450 is not limited thereto and may be variously changed.

[0137] According to the embodiment shown in FIG. 5 and FIG. 6, because the lower surface 412S1 of the disk pad 412 and the plurality of protruding portions 414 are coated with the coating layer 450, a portion of the coating layer 450 may be detached during the conditioning process of finely polishing the upper surface of the polishing pad PP.

[0138] Debris 450D of the coating layer 450 detached from the conditioning disk 410 may be reabsorbed by the polishing pad debris PD remaining on the upper surface of the polishing pad PP. That is, a surface of the polishing pad debris PD may be coated with the debris 450D of the coating layer 450 detached from the conditioning disk 410.

[0139] Accordingly, the polishing pad debris PD coupled to the debris 450D of the coating layer 450 may improve adhesiveness to the adhesive member 536, and may be easily collected by the adhesive member 536 wound around the auxiliary roller 540 and the first collection roller 532.

[0140] FIGS. 7 to 9 are cross-sectional views of a collection module cut along a disposition direction of a collection portion (or a collection unit) according to some embodiments.

[0141] Unlike the collection module 500 according to the embodiment shown in FIG. 4, the auxiliary roller 540 may be omitted from a collection module 500_1 according to the embodiment shown in FIG. 7.

[0142] According to the present embodiment, the auxiliary roller 540 may be omitted compared with the embodiment shown in FIG. 3, so that the lower surface 510S1 of the collection body 510 is disposed closer to the polishing pad PP of FIG. 3. That is, a distance between the lower extent of the groove 510H of the collection body 510 and the polishing pad PP according to the present embodiment may be shorter than a distance between the lower extent of the groove 510H of the collection body 510 and the polishing pad PP shown in FIG. 3.

[0143] Accordingly, a distance between the groove 510H of the collection body 510 and the polishing pad debris PD of FIG. 3 remaining on the adhesive member 536 wound around the first collection roller 532 and the polishing pad PP be reduced, and the polishing pad debris PD may be directly accommodated within the groove 510H of the collection body 510 or may be directly attached to the adhesive member 536 wound around the first collection roller 532. Thus, the polishing pad debris PD may be easily collected.

[0144] In some embodiments, the groove 510H in the collection body 510 may be omitted. For example, unlike the collection module 500_1 according to the embodiment shown in FIG. 7, the groove 510H of the collection body 510 May be omitted from a collection module 500_2 according to the embodiment shown in FIG. 8.

[0145] According to the present embodiment, the groove 510H of the collection body 510 may be omitted compared with the embodiment shown in FIG. 7, so that a lower end of the adhesive member 536 wound around the first collection roller 532 and the lower surface 510S1 of the collection body 510 are disposed at substantially the same level. That is, a distance between the lower end of the adhesive member 536 wound around the first collection roller 532 and the polishing pad PP of FIG. 3 in the present embodiment may be shorter than a distance between the lower end of the adhesive member 536 wound around the first collection roller 532 and the polishing pad PP in the embodiment shown in FIG. 7.

[0146] Additionally, the first collection roller 532 and the second collection roller 534 in the present embodiment may be disposed relatively more adjacent to the polishing pad PP compared with the first collection roller 532 and the second collection roller 534 according to the embodiment shown in FIG. 7.

[0147] Accordingly, the distance between the lower end of the adhesive member 536 wound around the first collection roller 532 and the polishing pad PP may be relatively close compared with the embodiment shown in FIG. 7.

[0148] The distance between the lower end of the adhesive member 536 wound around the first collection roller 532 and the polishing pad PP in the embodiment shown in FIG. 8 may mean a distance enough for the polishing pad debris PD of FIG. 3 remaining on the upper surface of the polishing pad PP to be directly attached to the adhesive member 536 wound around the first collection roller 532.

[0149] Although FIG. 8 shows that the lower end of the adhesive member 536 wound around the first collection roller 532 and the lower surface 510S1 of the collection body 510 are disposed at substantially the same level, the present disclosure is not limited thereto. In other words, a disposition relationship between the lower end of the adhesive member 536 wound around the first collection roller 532 and the lower surface 510S1 of the collection body 510 may be variously changed depending on a thickness of the adhesive member 536 wound around the first collection roller 532, a position and a diameter of the first collection roller 532, and the like. For example, the lower end of the adhesive member 536 wound around the first collection roller 532 may be disposed at a level lower or higher than that of the lower surface 510S1 of the collection body 510.

[0150] According to the present embodiment, because a distance between the adhesive member 536 wound around the first collection roller 532 and the polishing pad debris PD remaining on the upper surface of the polishing pad PP is reduced, the polishing pad debris PD may be directly attached to the adhesive member 536 wound around the first collection roller 532 to easily collect the polishing pad debris PD.

[0151] In some embodiments, a collection module may further include electrodes. For example, unlike the collection module 500_1 according to the embodiment shown in FIG. 7, a collection module 500_3 according to the embodiment shown in FIG. 9 may further include a pair of a first electrode 552 and a second electrode 554 for applying an electric field to both sides of the adhesive member 536.

[0152] According to the present embodiment, the first electrode 552 and the second electrode 554 may be disposed at both sides of the adhesive member 536 wound around the first collection roller 532 and the second collection roller 534.

[0153] The first electrode 552 and the second electrode 554 may be disposed spaced apart from each other with the adhesive member 536 interposed therebetween. The first collection roller 532 and the second collection roller 534 may penetrate the first electrode 552 and the second electrode 554. However, positions of the first electrode 552 and the second electrode 554 are not limited thereto and may be variously changed. For example, the first electrode 552 and the second electrode 554 may be disposed only at both sides of the adhesive member 536 wound around the first collection roller 532.

[0154] The first electrode 552 and the second electrode 554 may have a rectangular shape with a narrow width and an elongated length. However, shapes of the first electrode 552 and the second electrode 554 are not limited thereto and may be variously changed. For example, the first electrode 552 and the second electrode 554 may have a disk shape.

[0155] Because voltages with different polarities are applied to the first electrode 552 and the second electrode 554, the first electrode 552 and the second electrode 554 may have opposite polarities. For example, the first electrode 552 may have a positive electrode, and the second electrode 554 may have a negative electrode.

[0156] Accordingly, an electric field may be formed between the first electrode 552 and the second electrode 554, and the polishing pad debris PD of FIG. 3 having an electric charge may be pulled toward the first electrode 522 or the second electrode 554 so that it is easily attached to the adhesive member 536 wound around the first collection roller 532.

[0157] The embodiments shown in FIGS. 7 to 9 may have substantially the same effect as that of the substrate polishing apparatus 10 according to the embodiment.

[0158] FIGS. 10 to 12 and 14 to 17 are plan views of a polishing apparatus for a substrate according to some embodiments. FIG. 13 is a cross-sectional view of the polishing apparatus for the substrate shown in FIG. 12 according to some embodiments.

[0159] Because the descriptions with reference to FIGS. 1 to 9 are the same or similar, and the preceding description may be applied to collection modules 500A, 500B, 500C, 500D, 500E, 500F, and 500G according to the embodiments shown in FIGS. 10 to 17, duplicative description of the same or similar items May thus be omitted hereafter. A shape of a collection body 510 of each of the collection modules 500A, 500B, 500C, 500D, 500E, 500F, and 500G, a disposition of a collection portion 530, a position of each of the collection modules 500A, 500B, 500C, 500D, 500E, 500F, and 500G, and a relationship with other components will be mainly described in relation to FIGS. 10 to 17.

[0160] According to the substrate polishing apparatuses 10A and 10B according to the embodiments shown in FIG. 10 and FIG. 11, unlike the embodiment shown in FIG. 1, there is a difference in that the positions of the collection modules 500A and 500B and the shape of the collection body 510 are different.

[0161] Referring to FIG. 10 and FIG. 11, the collection modules 500A and 500B may be disposed adjacent to a conditioner 400. However, unlike the embodiment shown in FIG. 1, the collection modules 500A and 500B according to the embodiments shown in FIG. 10 and FIG. 11 may be disposed to be spaced apart from the conditioner 400.

[0162] Unlike the embodiment shown in FIG. 1, the collection modules 500A and 500B according to the embodiments shown in FIG. 10 and FIG. 11 may further include a collection module arm 560 connected to the collection body 510.

[0163] The collection module arm 560 may support the collection body 510 and may rotate the collection body clockwise or counterclockwise above a polishing pad PP with respect to an axis perpendicular to the collection module arm 560.

[0164] In addition, although not shown in the drawings, in some embodiments, the collection body 510 may further include a rotation shaft (not shown) connecting the collection module arm 560 and the collection body 510, and the rotation shaft may receive rotational power from a driving apparatus such as a motor or the like to perform a rotational motion in a clockwise or counterclockwise direction.

[0165] Accordingly, the collection body 510 connected to the collection module arm 560 and collection portion 530 disposed within the collection body 510 may move in a clockwise or counterclockwise direction above the polishing pad PP together with the collection module arm 560. In other words, unlike the embodiment shown in FIG. 1 that rotates in linkage with the disk holder 420 of the conditioner 400, the collection modules 500A and 500B shown in FIG. 10 and FIG. 11 may move independently of the conditioner 400.

[0166] Unlike the embodiment shown in FIG. 1, the collection body 510 of each of the collection modules 500A and 500B according to the embodiments shown in FIG. 10 and FIG. 11 may have an arc shape in a plan view.

[0167] The collection body 510 of each of the collection modules 500A and 500B according to the embodiments shown in FIG. 10 and FIG. 11 may surround a portion of the disk holder 420 of the conditioner 400. That is, as shown in FIG. 10 and FIG. 11, the collection body 510 may have an arc shape extending along a portion of an outer circumference of the disk holder 420. Additionally, the collection body 510 may extend along a portion of an outer circumference of the conditioning disk 410 of FIG. 2 supported by the disk holder 420.

[0168] The collection portion 530 disposed within the collection body 510 may be disposed along the shape of the collection body 510. That is, the collection portion 530 may be disposed along the portion of the outer circumference of the conditioning disk 410 and the portion of the outer circumference of the disk holder 420 that supports the conditioning disk 410.

[0169] In the substrate polishing apparatus 10A shown in FIG. 10, the collection module 500A may be disposed above an upper surface of the polishing pad PP to be spaced apart from a slurry supply 300 and the conditioner 400 based on a direction D1 of rotation. In other words, the collection module 500A may be disposed closer to the conditioner 400 between the slurry supply 300 and the conditioner 400 based on the direction D1 of rotation. That is, the collection module 500A may be disposed to be spaced apart from a front end of the conditioner 400 based on the direction D1 of rotation.

[0170] In the substrate polishing apparatus 10B shown in FIG. 11, the collection module 500B may be disposed above an upper surface of the polishing pad PP to be spaced apart from a polishing head 200 and the conditioner 400 based on a direction D1 of rotation. That is, the collection module 500B may be disposed closer to the conditioner 400 between the conditioner 400 and the polishing head 200 based on the direction of rotation D1. In other words, the collection module 500B may be disposed to be spaced apart from a front end of the polishing head 200 based on the direction of rotation D1.

[0171] Although not shown in the drawings, cross-sections in which the collection modules 500A and 500B according to the embodiments shown in FIG. 10 and FIG. 11 are cut along a disposition direction of the collection portion 530 may be substantially the same as those of FIGS. 4 and 7 to 9. That is, the descriptions with reference to FIGS. 4 and 7 to 9 may be substantially and equally applied to the collection modules 500A and 500B according to the embodiments shown in FIG. 10 and FIG. 11, so that a detailed description thereof is omitted.

[0172] The substrate polishing apparatuses 10A and 10B according to the embodiments shown in FIG. 10 and FIG. 11 may have substantially the same effect as that of the substrate polishing apparatus 10 according to the embodiment because the collection modules 500A and 500B are disposed adjacent to the conditioner 400.

[0173] Unlike the embodiment shown in FIG. 1, in the substrate polishing apparatus 10C according to the embodiments shown in FIG. 12 and FIG. 13, the collection module 500C may be directly coupled to a polishing head 200.

[0174] Specifically, referring to FIG. 12 and FIG. 13, the collection module 500C may be directly coupled to the polishing head 200.

[0175] A collection body 510 of the collection module 500C may be directly coupled to a retainer ring 210 of the polishing head 200 and a polishing head main body 220. The collection body 510 of the collection module 500C may have a ring shape and may surround the retainer ring 210 and the polishing head main body 220 of the polishing head 200 on a plane.

[0176] The collection body 510 of the collection module 500C may be in direct contact with a portion of a side surface of the retainer ring 210 and a side surface of the polishing head main body 220. However, a disposition relationship between the collection body 510 and the polishing head 200 is not limited thereto and may be variously changed. For example, the collection body 510 may be coupled to the side surface of the polishing head main body 220. As another example, the collection body 510 may be in contact with and coupled to the side surface and an upper surface of the polishing head main body 220 and a portion of a side surface of a polishing head rotation shaft 230. As another example, the collection body 510 may be coupled to the retainer ring 210 and/or the polishing head main body 220 through a separate coupling portion (not shown).

[0177] Because the collection body 510 of the collection module 500C is coupled to the retainer ring 210 and the polishing head main body 220 that are rotatable with respect to the polishing head rotation shaft 230, the collection module 500C may rotate in linkage with the retainer ring 210 and the polishing head main body 220. That is, the collection body 510 may rotate in the same direction as those of the retainer ring 210 and the polishing head main body 220.

[0178] In the present embodiment, collection portion 530 of collection module 500C may surround the polishing head 200 on a plane. That is, the collection portion 530 of the collection module 500C may be disposed along an outer circumference of the retainer ring 210 and an outer circumference of the polishing head main body 220 on a plane. In other words, the collection portion 530 of the collection module 500C may surround the retainer ring 210 and the polishing head main body 220 in a plan view.

[0179] According to in the substrate polishing apparatus 10C according to the embodiments shown in FIG. 12 and FIG. 13, the collection module 500C may be coupled to the polishing head 200, so that the polishing pad debris PD of FIG. 3 is introduced into the polishing head 200 to prevent a scratch from occurring on a surface of the wafer W.

[0180] According to the substrate polishing apparatuses 10D and 10E according to the embodiments shown in FIG. 14 and FIG. 15, unlike the embodiments shown in FIG. 12 and FIG. 13, there is a difference in that positions of the collection modules 500D and 500E are different.

[0181] The descriptions of the collection modules 500A and 500B shown in FIG. 10 and FIG. 11 may be substantially the same as descriptions of the collection modules 500D and 500E shown in FIG. 14 and FIG. 15, so that a detailed description thereof may be omitted. A disposition relationship between the collection modules 500D and 500E and the polishing head 200 will be mainly described.

[0182] The collection modules 500D and 500E according to the embodiments shown in FIG. 14 and FIG. 15 may be disposed adjacent to the polishing head 200. Unlike the collection module 500C shown in FIG. 12 and FIG. 13, the collection modules 500D and 500E according to the embodiments shown in FIG. 14 and FIG. 15 may be spaced apart from the polishing head 200.

[0183] The collection body 510 of the collection modules 500D and 500E according to the embodiments shown in FIG. 14 and FIG. 15 may surround a portion of the polishing head main body 220 of the polishing head 200.

[0184] As shown in FIG. 14 and FIG. 15, the collection body 510 may have an arc shape extending along a portion of an outer circumference of the retainer ring 210 of FIG. 13 and a portion of an outer circumference of the polishing head main body 220.

[0185] The collection portion 530 disposed within the collection body 510 may be disposed according to a shape of the collection body 510. That is, the collection portion 530 may be disposed along the portion of the outer circumference of the retainer ring 210 and the portion of the outer circumference of the polishing head main body 220.

[0186] In the substrate polishing apparatus 10D shown in FIG. 14, the collection module 500D may be disposed above an upper surface of the polishing pad PP to be spaced apart from the polishing head 200 and the conditioner 400 based on a direction D1 of rotation. In other words, the collection module 500D may be disposed closer to the polishing head 200 between the conditioner 400 and the polishing head 200 based on the direction D1 of rotation. That is, the collection module 500D may be disposed to be spaced apart from a front end of the polishing head 200 based on the direction D1 of rotation.

[0187] In the substrate polishing apparatus 10E shown in FIG. 15, the collection module 500E may be disposed above an upper surface of the polishing pad PP to be spaced apart from the polishing head 200 and the slurry supply 300 based on a direction D1 of rotation.

[0188] The collection module 500E may be disposed closer to the polishing head 200 between the polishing head 200 and the slurry supply 300 based on the direction D1 of rotation. In other words, the collection module 500E may be disposed to be spaced apart from a front end of the slurry supply 300 based on the direction D1 of rotation.

[0189] The substrate polishing apparatuses 10D and 10E according to the embodiments shown in FIG. 14 and FIG. 15 may have substantially the same effect as that of the substrate polishing apparatus 10C according to the embodiments shown in FIG. 12 and FIG. 13.

[0190] According to the substrate polishing apparatuses 10F and 10G according to the embodiments shown in FIG. 16 and FIG. 17, unlike the embodiment shown in FIG. 11, there is a difference in that a shape of the collection body 510 of each of the collection modules 500F and 500G and a disposition of the collection portion 530 are different.

[0191] Specifically, referring to FIG. 16 and FIG. 17, the collection body 510 of the collection modules 500F and 500G may have a long bar shape. That is, the collection body 510 of each of the collection modules 500F and 500G may have a shape that extends from the outside of the polishing pad PP toward the center or interior of the polishing pad PP. A portion of the collection body 510 may be disposed above the polishing pad PP, and the remaining portion of the collection body 510 may be disposed outside the polishing pad PP.

[0192] The collection body 510 of the collection modules 500F and 500G may have a rectangular shape with a narrow width and a long length. However, the shape of the collection body 510 of the collection modules 500F and 500G is not limited thereto and may be variously changed.

[0193] The collection portion 530 of the collection modules 500F and 500G may be disposed along a length direction of the collection body 510. For example, the collection portion 530 of the collection modules 500F and 500G may be disposed spaced apart in parallel along the length direction of the collection body 510 within the collection body 510 disposed above the polishing pad PP. The collection portion 530 of the collection modules 500F and 500G may be disposed in a row within a region of the collection body 510 that overlaps the polishing pad PP in a vertical direction.

[0194] The collection modules 500F and 500G according to the embodiments shown in FIG. 16 and FIG. 17 may be disposed adjacent to the conditioner 400 above the polishing pad PP.

[0195] A length of the collection body 510 of the collection modules 500F and 500G according to the embodiments shown in FIG. 16 and FIG. 17 may be longer than a length of the conditioner arm 440. That is, an end of the collection body 510 of the collection modules 500F and 500G may be disposed to protrude further toward the inside of the polishing pad PP than an end of the conditioner arm 440.

[0196] The collection body 510 of the collection modules 500F and 500G and the collection portion 530 disposed in a row within the collection body 510 may overlap the disk holder 420 and the conditioning disk 410 of FIG. 2 supported by the disk holder 420 in a horizontal direction with respect to a direction D1 of rotation.

[0197] In the substrate polishing apparatus 10F shown in FIG. 16, the collection module 500F may be disposed by being directly coupled to the conditioner 400. The collection module 500F according to the embodiment shown in FIG. 16 may be directly coupled to the conditioner arm 440. That is, the collection body 510 of the collection module 500F may be directly coupled to the conditioner arm 440.

[0198] The collection module 500F may be disposed by being coupled to a right side of the conditioner arm 440 based on the direction D1 of rotation. However, a disposition relationship between the collection module 500F and the conditioner arm 440 is not limited thereto and may be variously changed.

[0199] Because the collection body 510 of the collection module 500F is coupled to the conditioner arm 440, the collection module 500F may rotate clockwise or counterclockwise in linkage with the conditioner 400. In other words, the collection module 500F may rotate in the same direction as that of the conditioner arm 440.

[0200] Although FIG. 16 shows that the collection body 510 of the collection module 500F is coupled to a portion of a side surface of the conditioner arm 440, a coupling relationship between the collection body 510 of the collection module 500F and the conditioner arm 440 is not limited thereto and may be variously changed. For example, the collection body 510 of the collection module 500F may be coupled to all of the side surface of the conditioner arm 440, and the collection body 510 and the conditioner arm 440 may extend in the same direction. In the substrate polishing apparatus 10G shown in FIG. 17, the

[0201] collection module 500G may be disposed above an upper surface of the polishing pad PP to be spaced apart from the polishing head 200 and the conditioner 400 based on a direction D of rotation 1. In other words, the collection module 500G may be disposed between the conditioner 400 and the polishing head 200 based on the direction of rotation D1. That is, the collection module 500G may be disposed to be spaced apart from a front end of the polishing head 200 based on the direction of rotation D1.

[0202] In the substrate polishing apparatus 10G shown in FIG. 17, the collection module 500G may be disposed closer to the conditioner 400 between the conditioner 400 and the polishing head 200 based on the direction of rotation D1. However, a position of the collection module 500G is not limited thereto and may be variously changed. For example, the collection module 500G may be disposed closer to the polishing head 200 between the conditioner 400 and the polishing head 200 based on the direction of rotation D1.

[0203] The substrate polishing apparatuses 10F and 10G according to the embodiments shown in FIG. 16 and FIG. 17 may have substantially the same effect as that of the substrate polishing apparatuses 10A and 10B according to the embodiments shown in FIG. 10 and FIG. 11.

[0204] While this disclosure has been described in connection with what is presently considered to be practical embodiments, it is to be understood that the disclosure is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.