Abstract
A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure; a through cavity extending vertically through the stack delimited by sidewalls; and an electrically insulating coating material covering part of both opposing main surfaces of the stack and at least part of the sidewalls of the through cavity of the stack. Along at least one main planar direction of the cavity a change of the cavity width is provided at an intermediate portion of at least one sidewall with respect to the, preferably straight, remaining extension of the respective sidewall. There is also described a method of manufacturing a component carrier.
Claims
1. A component carrier, comprising: a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; a through cavity extending vertically through the stack delimited by sidewalls; and an electrically insulating coating material covering part of both opposing main surfaces of the stack and at least part of the sidewalls of the through cavity of the stack, wherein along at least one main planar direction of the through cavity a change of the cavity width is provided at an intermediate portion of at least one sidewall with respect to the remaining extension of the respective sidewall.
2. The component carrier according to claim 1, wherein the change of the cavity width comprises at least one recess arranged at at least one sidewall of the through cavity of the stack, wherein at least a part of the electrically insulating coating material is partially filled in the recess.
3. The component carrier according to claim 2, wherein the recess is directed away from the center of the through cavity, wherein the recess defines a part of the profile of the through cavity in a plan view on at least one of the main surfaces of the stack, wherein the recess has a rectangular shape in a plan view on at least one of the main surfaces of the stack.
4. The component carrier according to claim 2, wherein the recess comprises at least two portions one larger than the other defining a stepped recess.
5. The component carrier according to claim 4, wherein a first portion of the stepped recess is situated in the intermediate portion adjacent to the remaining extension of the sidewall and a second portion of the recess, which is smaller than the first portion, is situated adjacent to the side of the first portion which opposes the center of the through cavity, wherein the first portion and the second portion are connected with each other.
6. The component carrier according to claim 2, wherein the recess comprises a length defined along the main planar direction of the through cavity, wherein the length is distributed symmetrically with respect to a middle axis of the through cavity in the main planar direction.
7. The component carrier according to claim 1, wherein the through cavity has at least one sidewall at least partially slanted with respect to a stack direction of the stack.
8. The component carrier according to claim 1, wherein the change of the cavity width comprises a gradient change of the cavity width along the main planar direction, the gradient of the cavity width at the intermediate portion different from the respective gradient along the remaining portions of the sidewall.
9. The component carrier according to claim 1, wherein the through cavity comprises a shape defining at least one planar development along a main planar direction, wherein a second main planar direction is perpendicular to a first main planar direction, wherein the length and the height of square or rectangular shaped recess or more complex shapes where the cavity width is defined by the distance of two opposed sidewalls, wherein the electrically insulating coating material defines a more straight lateral final profile than the profile of the through cavity without the electrically insulating coating material with a resulting coated cavity width of the final profile between two opposed sidewalls coated by the insulating coating material having a deviation of at most +/10.
10. The component carrier according to claim 1, wherein the through cavity comprises rounded or slanted vertexes.
11. The component carrier according to claim 1, wherein the electrically insulating coating material defines a more regular shape, more aligned with the main planar direction(s) than the shape of the through cavity.
12. The component carrier according to claim 1, wherein the electrically insulating coating material coating at least one of the sidewalls of the through cavity defines a final profile of the through cavity, wherein the final profile is smaller than the profile of the through cavity without the electrically insulating coating material, wherein the distance between the final profile and the profile of the through cavity without the electrically insulating coating material is larger in the intermediate portion of at least one sidewall with respect to the remaining extension of the respective sidewall.
13. The component carrier according to claim 1, wherein the electrically insulating coating material defines a more homogeneous lateral final profile than the profile of the through cavity without the electrically insulating coating material with a deviation of the final profile along a main planar direction of the sidewall defined by the electrically insulating coating material within a range +/5%.
14. The component carrier according to claim 1, wherein the thickness of the electrically insulating coating material changes in a circumferential direction around the through cavity, wherein the thickness of the electrically insulating coating material at the intermediate portion of the sidewall is larger than at the remaining extension of the respective sidewall.
15. The component carrier according to claim 2, wherein the electrically insulating coating material fills at least one recess of at least one of the sidewalls completely and/or wherein the electrically insulating coating material coating the at least one sidewall compensates the width of at least one recess of a sidewall in a plan view on at least one of the main surfaces of the stack; further comprising at least one of the following features: wherein the mirrored changes of the cavity width have the same size and the same position on the corresponding opposing sidewalls; wherein the cavity width changes along four sidewalls surrounding the through cavity; wherein the change of the cavity width has the same size and the same position on the corresponding opposing sidewalls.
16. The component carrier according to claim 1, wherein the shape of the electrically insulating coating material defines rounded or slanted vertexes.
17. The component carrier according to claim 1, wherein the electrically insulating coating material covers the sidewalls defined by the through cavity.
18. The component carrier according to claim 1, further comprising at least one of the following features: wherein the electrically insulating coating material has a planar thickness along the sidewalls of the through cavity changing along the final profile of the through cavity; wherein the thickness of the electrically insulating coating material is higher in correspondence with a larger width of the through cavity within the recess; wherein electrically insulating coating material delimits further sidewalls of the stack; wherein the recess has a length defined along a main planar direction of the through cavity between 1 and 20 mm and has a width, which is perpendicular to the length, between 0.005 and 5 mm; wherein the change of the cavity width is mirrored distributed along at least one main planar direction; wherein the component carrier is a printed circuit board or a substrate.
19. A method of manufacturing a component carrier, comprising: providing a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; forming a through cavity extending vertically through the stack delimited by sidewalls, wherein along at least one main planar direction of the through cavity a change of the cavity width is provided at an intermediate portion of at least one sidewall with respect to the remaining cavity extension of the respective sidewall; and applying an electrically insulating coating material on parts of both opposing main surfaces of the stack and at least part of the sidewalls of the through cavity of the stack.
20. The method according to claim 19, comprising at least one of the following features: forming the through cavity in the stack by laser processing; applying the electrically insulating coating material on the sidewalls and on parts of the main surfaces using a roller; applying the electrically insulating coating material on the sidewalls and on parts of the main surfaces using a pair of rollers rolling along the opposing main surfaces of the stack.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0072] The aspects defined above, and further aspects of the present disclosure are apparent from the example embodiments to be described hereinafter and are explained with reference to these examples of embodiment.
[0073] FIG. 1 shows a top view of a component carrier without electrically insulating coating material, according to an example embodiment of the disclosure.
[0074] FIG. 2 shows a top view of a component carrier with electrically insulating coating material, according to an example embodiment of the disclosure.
[0075] FIG. 3 shows a top view of a component carrier without electrically insulating coating material, according to prior art.
[0076] FIG. 4 shows a top view of a component carrier with electrically insulating coating material, according to prior art.
[0077] FIG. 5 shows a top view of a component carrier without electrically insulating coating material, according to another example embodiment of the disclosure.
[0078] FIG. 6 shows a top view of a component carrier with electrically insulating coating material, according to another example embodiment of the disclosure.
[0079] FIG. 7 shows a top view of a component carrier without electrically insulating coating material, according to another example embodiment of the disclosure.
[0080] FIG. 8 shows a top view of a component carrier with electrically insulating coating material, according to another example embodiment of the disclosure.
[0081] FIG. 9 shows a top view of a component carrier without electrically insulating coating material, according to another example embodiment of the disclosure.
[0082] FIG. 10 shows a top view of a component carrier without electrically insulating coating material, according to another example embodiment of the disclosure.
[0083] FIG. 11 shows a perspective view of a component carrier without electrically insulating coating material, according to another example embodiment of the disclosure.
[0084] FIG. 12 shows a schematic, cut side view of a sidewall of a cavity, according to an example embodiment of the disclosure.
[0085] FIG. 13 shows a schematic, cut side view of a sidewall of a cavity, according to another example embodiment of the disclosure.
[0086] FIG. 14 shows a top view of a component carrier without electrically insulating coating material, according to another example embodiment of the disclosure.
DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS
[0087] The illustrations in the drawings are schematically presented. In different drawings, similar or identical elements are provided with the same reference signs.
[0088] FIG. 1 shows a top view of a component carrier 100 without electrically insulating coating material 112, according to an example embodiment of the disclosure. The top view is directed to the main surface 114 of the component carrier 100. The component carrier comprises a through cavity 108 which extends vertically at least partially, preferably entirely, through the stack 102. A first main planar direction 150 is directed along the length of the cavity 108. The cavity 108 is delimited by four side walls 110. Alternatively, the cavity may be delimited by at least five, in particular six, side walls 110. Two of these sidewalls extend along the main planar direction 150. The other two sidewalls 110 are directed perpendicular to the main planar direction 150 and perpendicular to the stack thickness direction. The two side walls 110 extending in the main planar direction 150 both comprise an intermediate portion 151. At this intermediate portion 151 a change of the cavity width 155 is provided with respect to the straight remaining extension of their respective sidewalls 110. The change of the cavity width 155 is realized by providing two recesses 160 arranged at the intermediate portions 151 of the respective sidewalls 110. Thus, the cavity width 155 at the intermediate portions 151 is larger than the cavity width 155 at the end portions of the respective sidewalls 110. The shape of the cavity 108 in the top view differs from a rectangle due to the two recesses 160. In this example, the intermediate portions 151 may be located in a central portion of the respective sidewalls 110. Additionally, the intermediate portions 151 may be located in a symmetrical manner, for example the component carrier 100 comprises at least one imaginary mirror plane. Alternatively, the intermediate portions 151 may be located in a peripheral portion of the respective sidewalls 110. In another example, the intermediate portions 151 may be located in an asymmetrical manner. Optionally at least two intermediate portions 151 may be arranged at one respective sidewall 110.
[0089] FIG. 2 shows a top view of a component carrier 100 with electrically insulating coating material 112, according to an example embodiment of the disclosure. FIG. 2 shows the same component carrier 100 as FIG. 1. However, in FIG. 2 and electrically insulating coating material 112 has been applied to the component carrier 100 and the cavity 108. In the illustrated embodiment the electrically insulating coating material 112 covers all sidewalls 110 of the cavity 108. Additionally, the electrically insulating coating material 112 is located on the exposed main surface of the component carrier 100. The remaining opening of the cavity 108 after applying the electrically insulating coating material 112 is indicated as final profile 158 of the cavity 108. Due to the electrically insulating coating material 112, the coated cavity width 157 is smaller than the cavity width 155 without the coating. The final profile 158 has a very precise rectangular shape. This precise rectangular shape is achieved by the change in the cavity width 155, in particular related by the introduction of the intermediate portions 151. The electrically insulating coating material 112 fully fills the two recesses 160. Thus, the thickness of the electrically insulating coating material 112 at the intermediate portions 151 of the two sidewalls 110 extending in the main planar direction 150 is larger than its thickness at the end portions of the respective sidewalls 110. The change of the cavity width 155 at the intermediate portion 151 compensates for the variation of the thickness of the electrically insulating coating material 112 along the extension direction of the side walls 110. In an example, the electrically insulating coating material 112 comprises organic (polymeric) material, for example epoxy resin, poly (meth)acrylate, polyethylene terephthalate. In another example, the electrically insulating coating material may comprise inorganic material, in particular particles smaller than 300 m, for example glass and/or ceramic. In a preferable example, the electrically insulating coating material 112 may be applied on the sidewalls and on parts of the main surfaces by using a roller. For instance, such a roller may be a cylindrical body rotating about its central symmetry axis during operation, for instance during application of the coating. Such a roller may be moved, while rotating, longitudinally along a corresponding main surface of the stack. In a further example, the electrically insulating coating material 112 may be applied by printing, in particular screen printing or 3D printing, screen coating and/or dispensing. The electrically insulating coating material 112 may have an electrically conductivity smaller than 10.sup.10 S/m. In an example, the electrically insulating coating material 112 may be optically reflective. To ensure an optically reflectivity, the electrically insulating coating material may comprise metallic particles, in particular comprising Al, Ag, Rh.
[0090] FIG. 3 shows a top view of a component carrier 100 without electrically insulating coating material, according to prior art. FIG. 3 shows a component carrier 100 according to the state-of-the-art. The component carrier 100 comprises a cavity 108 with a rectangular shape. The cavity width 155 is constant along the extension of the side walls 110. There is no intermediate portion provided at which the cavity width 155 changes.
[0091] FIG. 4 shows a top view of a component carrier 100 with electrically insulating coating material 112, according to prior art. FIG. 4 shows the component carrier 100 of FIG. 3 after applying an electrically insulating coating material 112. The thickness of the electrically insulating coating material 112 is not constant along the (longer) extension direction of the vertical sidewalls 110. Thus, the coated cavity width 157 is also not constant along the (longer) extension direction of the vertical sidewalls 110. In prior art, the final shape of the cavity 108 differs significantly from the shape of the cavity 108 after cutting. Thus, the final shape of the cavity 108 after the coating with the electrically insulating coating material 112 is not precise and not shaped as a rectangle. It would, for example, be a problem to insert a component having a precise rectangular shape into the cavity 108 of the component carrier 100 according to the prior art shown in FIG. 4.
[0092] FIG. 5 shows a top view of a component carrier 100 without electrically insulating coating material 112, according to another example embodiment of the disclosure. The embodiment shown in FIG. 5 is similar to the embodiment shown in FIG. 1. For elements of FIG. 5 which are also shown in FIG. 1, please see the description referring to FIG. 1. In the embodiment shown in FIG. 5 there is a change in the cavity width 155 also in a second main planar direction 152. In the embodiment of FIG. 5 all four sidewalls 110 comprise a recess 160 to change the cavity width 155 at an intermediate portion 151 of the respective sidewall 110. The change of the cavity width 155 is mirrored distributed along the first main planar direction 150 and the second main planar direction 152. In an example, the length and/or width of the recess 160 along the first main planar direction 150 may be the same as the length and/or width of the recess 160 along the second main planar direction 152. In another example, the length and/or width of the recess 160 along the first main planar direction 150 may be different to the length and/or width of the recess 160 along the second main planar direction 152. This may give the freedom to adjust the length and/or width of the recess to ensure a planar final profile 158 after applying the electrically insulating coating material 112.
[0093] FIG. 6 shows a top view of a component carrier 100 with electrically insulating coating material 112, according to another example embodiment of the disclosure. The embodiment shown in FIG. 6 is similar to the embodiment shown in FIG. 2. For elements of FIG. 6 which are also shown in FIG. 2, please see the description referring to FIG. 2. Similar to the embodiment shown in FIG. 2, the cavity 108 in FIG. 6 comprises final profile 158 which has a precise shape of a rectangle. Compared to the embodiments according to the prior art shown in FIGS. 3 and 4, the preciseness of the shape of the final profile 158 is significantly improved.
[0094] FIG. 7 shows a top view of a component carrier 100 without electrically insulating coating material 112, according to another example embodiment of the disclosure. The embodiment shown in FIG. 7 is similar to the embodiment shown in FIG. 5, please see the description referring to FIG. 5. Also, the manufacturing steps to manufacture the component carrier 100 with a cavity 108 are identical for the embodiments shown in FIGS. 5 and 7. However, the embodiment shown in FIG. 7 might be coated with electrically insulating coating material 112 with a greater thickness than in the embodiment shown in FIG. 6. FIG. 8 shows the component carrier 100 after applying electrically insulating coating material 112 with a greater thickness.
[0095] FIG. 8 shows a top view of a component carrier 100 with electrically insulating coating material 112, according to another example embodiment of the disclosure. FIG. 8 shows the component carrier 100 according to the embodiment shown in FIG. 7 after applying electrically insulating coating material 112 with a higher thickness (resulting from a larger quantity of the applied electrically insulating coating material 112) to cover all surfaces of all sidewalls 110 of the cavity 108. The electrically insulating coating material 112 with a greater thickness may be applied by, for example repeated roller treatment. A greater thickness of the electrically insulating coating material 112 may result from a greater total thickness of the component carrier 100. At a component carrier 100 with a greater total thickness the electrically insulating coating material 112 may pile up at the corner between two sidewalls due to the strain or surface tension. A greater thickness of the electrically insulating coating material 112 may also result from an increased roller pitch which leads to an increased volume of applied electrically insulating coating material 112. Such an increased volume of applied electrically insulating coating material 112, and thus a greater thickness after application, may also be achieved by an increased pressure on a roller during application. Furthermore, an increased viscosity of the applied electrically insulating coating material 112 may lead to a greater thickness after the application. The electrically insulating coating material 112 fills all the recesses 160 shown in FIG. 7. Furthermore, the electrically insulating coating material 112 fills all corners of the cavity 108 such as the final profile 158 has the shape of an (irregular) ellipse. Thus, the shape of the electrically insulating coating material 112, in particular the final profile 158, defines rounded or slanted vertexes. In the embodiment shown in FIG. 8 the coated cavity width 157 gradient varies along the first main planar direction 150 and the second main planar direction 152. As the embodiment of FIG. 8 shows, the final profile 158 of the component carrier 100 according to the disclosure can have different shapes. It is also possible to provide a component carrier 100 with the final profile 158 of the cavity 108 which has a shape of a precise ellipse, for example. Providing a change of the cavity width 155 of the cavity 108 before applying the electrically insulating coating material 112 may also provide a precise shape of a final profile 158 different from a rectangle. The desired shape of the final profile 158 depends, for example, on the shape of a component which is to be inserted into the component carrier 100.
[0096] FIG. 9 shows a top view of a component carrier 100 without electrically insulating coating material 112, according to another example embodiment of the disclosure. The embodiment of a component carrier 100 shown in FIG. 9 is similar to the embodiment shown in FIG. 1. However, in FIG. 9 the main planar direction 150 is directed from the left to the right. The cavity 108 comprises a change of the cavity width 155 along the main planar direction 150. Each of the sidewalls 110 delimiting the cavity 108 on two opposing sides comprises a recess 160 respectively. Both recesses 160 are directed away from the center of the cavity 108. In a plan view on the main surface 114 each of the recesses 160 has a rectangular shape. The recesses may also have a quadratic or a trapezoidal shape. Each recess 160 has a length which extends along the main planar direction 150. This length of each recess 160 is distributed symmetrically with respect to a middle axis of the cavity 108, wherein this middle axis is directed vertically in FIG. 9. In the embodiment shown in FIG. 9 the ends of the recesses 160 in the main planar direction 150 comprise a chamfer which connects the recess 160 with the remaining extension of their respective sidewalls 110.
[0097] FIG. 10 shows a top view of a component carrier 100 without electrically insulating coating material 112, according to another example embodiment of the disclosure. The embodiment shown in FIG. 10 is similar to the embodiment shown in FIG. 9. For elements of FIG. 10 which are also shown in FIG. 9, please see the description referring to FIG. 9. In the embodiment shown in FIG. 10 each of the recesses 160 comprises a first portion 160a and a second portion 160b. The first portion 160a is larger than the second portion 160b. The two portions 160a, 160b together define a stepped recess 160. The first portion 160a of the recess 160 is situated in the intermediate portion 151 adjacent to the remaining extension of the respective sidewall 110 and the second portion 160b of the recess 160 is situated adjacent to the side of the first portion 160a which opposes the center of the cavity 108, wherein the two portions 160a, 160b are connected with each other. The recess 160 may also comprise more than two portions. The shape and the dimensions of the recess 160 are not limited to the embodiments shown in FIGS. 9 and 10. Furthermore, also the remaining sidewalls 110, delimiting the cavity 108 on the left side and on the right side, may comprise a recess 160 with one or more portions to provide a change in the cavity with 155 in a horizontal direction.
[0098] FIG. 11 shows a perspective view of a component carrier 100 without electrically insulating coating material 112, according to another example embodiment of the disclosure. FIG. 11 shows a component carrier 100 before the application of electrically insulating coating material 112. The component carrier 100 comprises a stack 102. This stack 102 comprises two conductive layer structures 104 and three electrically insulating layer structures 106 which are sandwiched with respect to each other. The surface directed upwards in FIG. 11 may be defined as a first main surface 114 and the surface directed downwards may be defined as a second main surface 116. A through cavity 108 is provided which extends from the first main surface 114 to the second surface 116 and penetrates the whole stack 102. The cavity 108 may be formed in stack 102 by laser processing, said cavity 108 being delimited by sidewalls 110, which are orientated perpendicular to the main surface 114. In an example, the sidewalls 110 may be inclined to the stacking direction. The cavity 108 extends from the left to the right in a first main planar direction 150 and extends from the front to the back in second main planar direction 152. The first main planar direction 150 and the second main planar direction 152 extend perpendicular to each other. In the embodiment shown in FIG. 11 a change of the cavity width 155 along the first main planar direction 150 is provided. The two opposing sidewalls 110, delimiting the cavity 108 in the front and in the back, comprise an intermediate portion 151. This intermediate portion 151 comprises a recess 160 respectively. Due to these recesses 160 the cavity width 155 in the intermediate portion 151 is larger than the cavity width 155 at the remaining extension of the respective sidewalls 110. The recesses 160 are directed away from the center of the cavity 108. The length of the recesses 160 in the first main planar direction 150 is distributed symmetrically with respect to the middle axis of the cavity 108. This middle axis extends from the front to the back referring to FIG. 11. In the embodiment shown in FIG. 11 each recess 160 has a rectangular shape in a plan view on the first main surface 114. However, the shape of the recess(es) 160 is not delimited to a rectangular shape. The shape of a recess 160 in a top view on the main surface 114, 116 may also be curved, trapezoidal, triangular, like a parallelogram or according to a combination of these shapes.
[0099] FIG. 12 shows a schematic, cut side view of a sidewall 110 of a cavity 108, according to an example embodiment of the disclosure. FIG. 12 shows only a section of a component carrier 100 with a cavity 108. The component carrier comprises a stack 102 with several electrically insulating layer structures 106 and several electrically conductive layer structures 104. The cavity 108 is situated at the right side of the illustration. In FIG. 12 the cavity 108 is limited at its left side by a sidewall 110 which is coated with electrically insulating coating material 112. The sidewall 110 is slanted with respect to the stack direction. The stack direction is the vertical direction in FIG. 12 and directed perpendicular to the two opposing main surfaces 114 and 116 of the component carrier 100. The slanted configuration of the sidewall 110 can be achieved by laser cutting (from main surface 114 of the component carrier). The slanted orientation of the sidewall 110 increases the surface to be applied with electrically insulating coating material 112 compared to a configuration with a sidewall 110 orientated perpendicular to the main surfaces 114, 116. However, the final profile 158 of the cavity 108 with applied electrically insulating coating material 112 is directed perpendicular to the main surfaces 114, 116. The slanted orientation of the sidewall 110 improves the adhesion of the electrically insulating coating material 112 by an increased contact surface. However, the electrically insulating coating material 112 compensates for the slanted orientation of the sidewall 100 and a precise orientation of the final profile 158 perpendicular to the main surfaces 114, 116 can be achieved.
[0100] FIG. 13 shows a schematic, cut side view of a sidewall 110 of a cavity 108, according to another example embodiment of the disclosure. The embodiment shown in FIG. 13 is very similar to the embodiment shown in FIG. 12. As far as not explained explicitly different, please refer to the description of FIG. 12 also for FIG. 13. Different to FIG. 12, the embodiment in FIG. 13 has a sidewall 110 which is partly slanted into two different directions with respect to the stack direction. The upper part of the sidewall 110 is slanted to the left side and the lower part is slanted to the right side. Such a configuration can be achieved by laser cutting from two opposing sides in the vertical direction. Also, the sidewall 110 which is partly slanted into two different directions provides an increased contact surface to the electrically insulating coating material 112 and an improved adhesion thereof. As in the embodiment shown in FIG. 12, the electrically insulating coating material 112 compensates for the slanted orientation of the sidewall 100 and a precise orientation of the final profile 158 perpendicular to the main surfaces 114, 116 can be achieved.
[0101] FIG. 14 shows a top view of a component carrier 100 without electrically insulating coating material 112, according to another example embodiment of the disclosure. The embodiment shown in FIG. 14 is similar to the embodiment shown in FIG. 1. As far as not explained explicitly different, please refer to the description of FIG. 1 also for FIG. 14. Different to FIG. 1, the embodiment shown in FIG. 14 comprises a gradient change of the cavity width 155 along the main planar direction 150 different at the intermediate portion 151 than to the remaining cavity extension portions of the sidewall 110. This gradient change of the cavity width 155 is provided by two recesses 160 which have the shape of an arc, and which are situated at two opposing sidewalls 110, viewed in the top view of FIG. 14. This gradient change of the cavity width 155 leads to a very precise final profile 158 of the cavity 108 after application of the electrically insulating coating material 112 (not shown in FIG. 14). Another difference between the embodiment shown in FIG. 14 and the embodiment shown in FIG. 1 is that in the embodiment of FIG. 14 the change of the cavity width 155 is not mirrored distributed along the main planar direction 150. In FIG. 14 the change of the cavity width 155 and/or the intermediate portions 151 are not symmetrical with respect to a plane orientated perpendicular to the main surface 114 and situated in the middle of the cavity 108 in the main planar direction 150. The asymmetrical development of the cavity width 155 with a gradient in the embodiment of FIG. 14 allows to enlarge the design flexibility while at the same time ensuring an improved quality of the shape and dimensions of the final profile of the cavity.
[0102] It should be noted that the term comprising does not exclude other elements or steps and the article a or an does not exclude a plurality. Also, elements described in association with different embodiments may be combined.
[0103] Implementation of the disclosure is not limited to the illustrated embodiments shown in the figures and as described above. Instead, a multiplicity of variants is possible which variants use the solutions shown and the principle according to the disclosure even in the case of fundamentally different embodiments.
REFERENCE SIGNS
[0104] 100 component carrier [0105] 102 stack [0106] 104 electrically conductive layer structure [0107] 106 insulating layer structure [0108] 108 cavity [0109] 110 sidewall [0110] 112 electrically insulating coating material [0111] 114 main surface [0112] 116 main surface [0113] 150 main planar direction [0114] 151 intermediate portion [0115] 152 main planar direction [0116] 155 cavity width [0117] 157 coated cavity width [0118] 158 final profile [0119] 160 recess [0120] 160a portion [0121] 160b portion
