SEMICONDUCTOR DEVICE WITH A CLAMPING DIODE

Abstract

This disclosure relates to a semiconductor device, and associated method of manufacture. The semiconductor device includes, a MOSFET integrated with a p-n junction, the p-n junction arranged as a clamping diode across a source contact and a drain contact of the MOSFET. The MOSFET defines a first breakdown voltage, and the clamping diode defines a second breakdown voltage, and the first breakdown voltage is greater than the second breakdown voltage. A series resistance of the clamping diode includes a drift resistance and a clamping resistance, and the drift resistance is formed together with the clamping diode and the clamping resistance is formed independently from the clamping diode and configured to secure a uniform avalanche current.

Claims

1. A semiconductor device, comprising: a MOSFET integrated with a p-n junction, the p-n junction arranged as a clamping diode across a source contact and a drain contact of the MOSFET; wherein the MOSFET defines a first breakdown voltage and the clamping diode defines a second breakdown voltage; wherein the first breakdown voltage is greater than the second breakdown voltage; wherein the clamping diode has a series resistance that comprises a drift resistance and a clamping resistance; wherein the drift resistance is formed together with the clamping diode; and wherein the clamping resistance is formed independently from the clamping diode and configured to secure a uniform avalanche current.

2. The semiconductor device as claimed in claim 1, wherein the clamping resistance comprises one or more deep trench structures.

3. The semiconductor device as claimed in claim 1, wherein the clamping diode comprises a first pad for the cathode of the clamping diode and a second pad for the anode of the clamping diode, so that the clamping diode can be used for the temperature sensing.

4. The semiconductor device as claimed in claim 1, wherein the drifting resistance comprises an intrinsic resistance of the clamping diode and a spreading resistance.

5. The semiconductor device as claimed in claim 1, wherein the MOSFET comprises: a semiconductor substrate; an epitaxial layer formed on the semiconductor substrate; a body layer formed on the epitaxial layer; and a plurality of spaced apart deep conductive trenches extending through the body layer and the epitaxial layer and extending into the semiconductor substrate; wherein the semiconductor substrate and the epitaxial layer are formed of a first conductivity type; and wherein the body layer is formed of a second conductivity type opposite to the first conductivity type.

6. The semiconductor device as claimed in claim 2, wherein the clamping resistance is configured by a length of the deep trench structures and/or a width of the deep trench structures.

7. The semiconductor device as claimed in claim 2, wherein the polysilicon of the deep trench structures is heavily doped so that a variation of the clamping resistance with temperature is minimized.

8. The semiconductor device as claimed in claim 2, wherein the clamping diode comprises a first pad for the cathode of the clamping diode and a second pad for the anode of the clamping diode, so that the clamping diode can be used for the temperature sensing.

9. The semiconductor device as claimed in claim 2, wherein the drifting resistance comprises an intrinsic resistance of the clamping diode and a spreading resistance.

10. The semiconductor device as claimed in claim 5, wherein the spaced apart deep conductive trenches define a contact window of the body layer; and wherein the contact window is connected to at least one shallow conductive trench forming a first contact terminal of the p-n junction.

11. The semiconductor device as claimed in claim 6, wherein the clamping diode comprises a first pad for the cathode of the clamping diode and a second pad for the anode of the clamping diode, so that the clamping diode can be used for the temperature sensing.

12. The semiconductor device as claimed in claim 6, wherein the polysilicon of the deep trench structures is heavily doped so that a variation of the clamping resistance with temperature is minimized.

13. The semiconductor device as claimed in claim 6, wherein the drifting resistance comprises an intrinsic resistance of the clamping diode and a spreading resistance.

14. The semiconductor device as claimed in claim 12, wherein the clamping diode comprises a first pad for the cathode of the clamping diode and a second pad for the anode of the clamping diode, so that the clamping diode can be used for the temperature sensing.

15. A method of manufacturing a semiconductor device, comprising the steps of: forming a MOSFET integrated with a p-n junction, the p-n junction arranged as a clamping diode across a source contact and a drain contact of the MOSFET; wherein the MOSFET defines a first breakdown voltage and the clamping diode defines a second breakdown voltage; wherein the first breakdown voltage is greater than the second breakdown voltage; wherein the clamping diode has a series resistance that comprises a drift resistance and a clamping resistance; wherein the drift resistance is formed together with the clamping diode; and wherein the clamping resistance is formed independently from the clamping diode and configured to secure a uniform avalanche current.

16. The method as claimed in claim 15, further comprising the steps of: providing a semiconductor substrate; forming an epitaxial layer on the semiconductor substrate; forming a body layer on the epitaxial layer; forming a plurality of spaced apart deep conductive trenches extending through the body layer and the epitaxial layer and extending into the semiconductor substrate; wherein the semiconductor substrate and the epitaxial layer are formed of a first conductivity type; and wherein the body layer is formed of a second conductivity type opposite to the first conductivity type.

17. The method as claimed in claim 16, further comprising the steps of: defining a contact window of the body layer between the spaced apart deep conductive trenches; and connecting the contact window to at least one shallow conductive trench to form a first contact terminal of the p-n junction.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0027] So that the manner in which the features of the present disclosure can be understood in detail, a more particular description is made with reference to embodiments, some of which are illustrated in the appended figures. It is to be noted, however, that the appended figures illustrate only typical embodiments and are therefore not to be considered limiting of its scope. The figures are for facilitating an understanding of the disclosure and thus are not necessarily drawn to scale.

[0028] Advantages of the subject matter claimed will become apparent to those skilled in the art upon reading this description in conjunction with the accompanying figures, in which like reference numerals have been used to designate like elements, and in which:

[0029] FIG. 1 illustrates a MOSFET semiconductor device in accordance with an embodiment of the present disclosure.

[0030] FIG. 2 illustrates a top view of a MOSFET semiconductor device, in accordance with an embodiment of the present disclosure.

[0031] FIG. 3 illustrates shows a variation of a clamping resistance formed by deep trenches with temperature according to an embodiment of the present disclosure.

DETAILED DESCRIPTION

[0032] An embodiment of this disclosure is shown in FIG. 1. A MOSFET semiconductor device 100 comprises a source 112, a gate 114 and a drain 116 contacts. These contacts are connected to a MOSFET active area 108, and a clamp circuit.

[0033] The clamp circuit comprises a clamping diode 102. A breakdown voltage of the clamping diode 102 is adjusted to be lower than the breakdown voltage of the MOSFET semiconductor device 100, which can be achieved for example by the spacing between the deep tranches as well as the linear thickness and the doping.

[0034] The clamping diode has an anode and a cathode. A series resistance of the clamping diode 102 comprises a drift resistance 106 and a clamping resistance 104. According to an embodiment of this disclosure the drift resistance 106 is formed together with the clamping diode 102. The clamping resistance 104 is formed independently from the clamping diode 102. Such a clamping resistance 104 is configured to secure an uniform avalanche current. The the breakdown voltage of the MOSFET semiconductor device 100 is a voltage at which an inherent body diode 110 breaks down and a significant avalanche current starts to flow between the source 112 and drain 116 of the MOSFET semiconductor device 100. During the operation of the MOSFET semiconductor device 100 multiple repetitive switching events are possible, and in this case repetitive avalanche events can be caused. These repetitive avalanche events can trigger a change of the MOSFET semiconductor device 100 parameters, e.g. a device on resistance, a threshold voltage, a drain-source leakage current, etc. The variation in the MOSFET semiconductor device 100 parameters may result in a reduced device functionality and/or reliability. The related repetitive hot majority carrier injection may eventually cause the MOSFET semiconductor device 100 to fail. Securing an uniform avalanche current that is achieved by the means of this disclosure prevents the MOSFET semiconductor device 100 parameters from changing and consequently prevents a failure of the MOSFET semiconductor device 100.

[0035] As shown in FIG. 1, the clamping resistance 104 arranged in parallel across the source 112 and drain 116 contacts of the MOSFET semiconductor device 100. The drift resistance 106 of the clamping diode 102 is associated with an inherent body diode 110 of the active area 108 across the source 112 and drain 116 contacts of the MOSFET semiconductor device 100.

[0036] The drift resistance 106 is formed at the same time when the clamping diode 102 is formed. The drift resistance comprises of an intrinsic resistance of a p-n junction diode and a spreading resistance into the drift region. The drift resistance refers to the resistance of the vertical portion of the clamping diode 102 underneath the diode contact.

[0037] The MOSFET semiconductor device 100 may comprise a substrate, an epitaxial layer formed on the substrate, which may form a drift region. The epitaxial layer may be a silicon epitaxial layer. The MOSFET semiconductor device 100 may further comprise a body layer that is formed on the epitaxial silicon layer. An insulating layer may be provided on the body layer and a conductive layer may be provided on the insulating layer. The conductive layer may form the source contact 112 of the MOSFET semiconductor device 100. The substrate may be a doped substrate.

[0038] The substrate and the epitaxial silicon layer can be formed as n-type layers and the body layer can be formed as a p-type layer. The body layer may be formed by way of an appropriate implant into the epitaxial silicon layer.

[0039] As illustrated in FIG. 2, clamping diode 102 comprises a long stripe between the deep trenches 220. In this way one single diode or only a few diodes can be used for one device instead of a network of many diodes.

[0040] The deep trenches extend from between portions of the body layer into, and terminate in, the doped substrate. Alternatively, the deep trenches may extend into and terminate in the epitaxial silicon layer. The deep trenches may be lined with an insulating material and then filled with a conductive material. A first set of shallow source trenches extend through the insulating layer to the conductive material of the deep trenches. The shallow source trenches are filled with a conductive material to form source contacts. The conductive material of the source contacts couples the conductive layer to the conductive material of the deep trenches. A second set of shallow trenches extend through the insulating layer and terminate in the body layer. Each of the second set of shallow trenches are arranged in contact windows between the each of the deep trenches and are filled with a conductive material to couple the conductive layer to the body layer.

[0041] The first set of shallow source trenches and the second set of shallow source trenches may be formed simultaneously. Alternatively, they may be formed during separate processes. Likewise, the conductive materials are formed from the same material and, furthermore the conductive materials may be formed simultaneously to the formation of the conductive layer. In this way the conductive materials and the conductive layer may be formed from the same material.

[0042] The arrangement of the second set of shallow trenches forms the clamping diode 102 illustrated in FIG. 1. The conductive materials may be the same material and advantageously may be formed in the same process step.

[0043] The anode of the clamping diode 102 can be formed using the second set of shallow source trenches by coupling the conductive material to a p-type body layer. The cathode of the clamping diode 102 is formed by the substrate and the epitaxial silicon layer with an appropriate drain contact formed on the substrate. Therefore, a p-n junction of the clamping diode 102 is formed by the p-type body layer and the substrate and the epitaxial silicon layer forming a drift region. In this regard the anode of the clamping diode 102 is connected to the source 112 of the MOSFET semiconductor device by the electrical connection of the conductive layer to the conductive material of the second set of shallow trenches. Likewise, the cathode of the clamping diode 102 is connected to the drain 116 of the MOSFET semiconductor device so that the clamping diode 102 is connected in parallel across the source 112 and the drain 116. In this way, the clamping diode 102 and the drift resistance 106 is integrated on the die of the MOSFET semiconductor device 100, that is a vertical portion of the diode in the epitaxial silicon layer and substrate.

[0044] An embodiment of the disclosure is shown in FIG. 2. This is a top view of the structure of the MOSFET semiconductor device 100. The MOSFET semiconductor device 100 comprises a network of interconnected deep trenches 220 extending between portions of the body layer into the doped substrate. The deep trenches 220 may be lined with an insulating material and then filled with conductive material and the conductive material of the deep trenches is contacted to the first set of shallow source trenches filled with a conductive material, thus forming the source contacts. The second set of shallow trenches are arranged in the contact windows between the each of the deep trenches and are filled with a conductive material to form the anode contact of the clamping diode 102 to the underlying body layer. Each contact window, also known as the diode region, may contain multiple, spaced apart, anode contacts of the clamping diode.

[0045] An appropriate edge termination structure may be provided around the periphery of the MOSFET semiconductor device 100 as understood by the skilled person. The skilled person will also appreciate that the edge termination structure may be formed by any appropriate structure such as an edge trench or combination of edge trenches.

[0046] Consequently, where the MOSFET semiconductor device 100 according to embodiments undergoes multiple repetitive switching events, securing an uniform avalanche current that is achieved by the means of this disclosure prevents the MOSFET semiconductor device 100 parameters from changing and consequently prevents a failure of the MOSFET semiconductor device 100.

[0047] The MOSFET semiconductor device can be a n-channel MOSFET semiconductor device, however the skilled person will appreciate that the arrangements of the present disclosure are equally applicable to a p-channel MOSFET semiconductor devices. For example, the MOSFET semiconductor device may comprise a p-type substrate, a p-type epitaxial silicon layer and an n-type body layer.

[0048] As shown in FIG. 3, when the polysilicon of deep trench is heavily doped to certain extend, the clamping resistance formed by deep trenches has very little variation with temperature. In an embodiment of the disclosure, separate contact pads can be designed for the cathode and anode of the clamping diode, so that the clamping diode is used for temperature sensing.

[0049] Aspects of the disclosure are set out in the accompanying independent claims. Combinations of features from the dependent and/or independent claims may be combined as appropriate and not merely as set out in the claims.

[0050] The scope of the present disclosure includes any novel feature or combination of features disclosed therein either explicitly or implicitly or any generalisation thereof irrespective of whether or not it relates to the claimed disclosure or mitigate against any or all of the problems addressed by the present disclosure. The applicant hereby gives notice that new claims may be formulated to such features during prosecution of this application or of any such further application derived there from. In particular, with reference to the appended claims, features from dependent claims may be combined with those of the independent claims and features from respective independent claims may be combined in any appropriate manner and not merely in specific combinations enumerated in the claims.

[0051] Features which are described in the context of separate embodiments may also be provided in combination in a single embodiment. Conversely, various features which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable sub combination.

[0052] The term “comprising” does not exclude other elements or steps, the term “a” or “an” does not exclude a plurality. Reference signs in the claims shall not be construed as limiting the scope of the claims.