MODULE FOR A PROJECTION EXPOSURE APPARATUS, METHOD, AND PROJECTION EXPOSURE APPARATUS
20250334890 ยท 2025-10-30
Inventors
Cpc classification
G03F7/70316
PHYSICS
International classification
G03F7/00
PHYSICS
Abstract
A module for a projection exposure apparatus for semiconductor lithography comprises a heating device having at least one radiation source for emitting electromagnetic heating radiation for heating at least regions of a component of the module. The heating device comprises at least one heating element built into the component and configured to convert radiant energy into heat. A corresponding method and a projection exposure apparatus are disclosed.
Claims
1. A module, comprising: a component; and a heating device, comprising: a radiation source configured to emit electromagnetic heating radiation to heat regions of the component; and a heating element built into the component, wherein the heating element is configured to convert the electromagnetic radiation into heat.
2. The module of claim 1, wherein the heating element comprises an optical resonator.
3. The module of claim 1, wherein the heating element comprises a ring resonator.
4. The module of claim 1, wherein the heating element comprises a a whispering gallery resonator.
5. The module of claim 1, wherein the heating element comprises a region having a periodic refractive index variation.
6. The module of claim 1, wherein the heating device comprises a plurality of heating elements.
7. The module of claim 6, wherein at least some of the heating elements are connected in series.
8. The module of claim 6, wherein at least some of the heating elements are connected in parallel.
9. The module of claim 1, wherein the radiation source is configured to emit electromagnetic radiation at a wavelength of the order of 1370 nm.
10. The module of claim 1, wherein the radiation source comprises a laser.
11. The module of claim 10, wherein the heating element comprises a resonator, the module comprises a stabilization circuit configured to stabilize a wavelength of the electromagnetic radiation emitted by the laser.
12. The module of claim 1, wherein the radiation source comprises a tunable laser.
13. The module of claim 1, wherein the heating element comprises a local structural modification in a material of the component.
14. The module of claim 13, wherein the local structural modification is created by an ion beam, an electron beam, a laser beam, or a lithographic microstructuring method.
15. The module of claim 1, wherein the heating element comprises an optical fiber.
16. The module of claim 1, wherein the component comprises a mirror.
17. An apparatus, comprising: a module according to claim 1, wherein the apparatus is a semiconductor lithography projection exposure apparatus.
18. A module, comprising: a component comprising a heating element; and a radiation source configured to emit electromagnetic heating radiation to heat regions of the component, wherein the heating element is configured to convert the electromagnetic radiation into heat.
19. An apparatus, comprising: a module according to claim 18, wherein the apparatus is a semiconductor lithography projection exposure apparatus.
20. A method of heating regions of a component of a module for a projection exposure apparatus for semiconductor lithography using electromagnetic radiation, the method comprising: converting the electromagnetic radiation into heat via a heating element built into the component.
21.-28. (canceled)
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Exemplary embodiments and variants of the disclosure will be explained in more detail hereinafter with reference to the drawing, in which:
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DETAILED DESCRIPTION
[0048] Certain constituent parts of a microlithographic projection exposure apparatus 1, in which the disclosure can be used, are described in exemplary fashion below initially with reference to
[0049] An embodiment of an illumination system 2 of the projection exposure apparatus 1 has, in addition to a light source 3, an illumination optical unit 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 may also be provided as a module separate from the rest of the illumination system. In this case, the illumination system does not comprise the light source 3.
[0050] A reticle 7 arranged in the object field 5 is illuminated. The reticle 7 is held by a reticle holder 8. The reticle holder 8 is displaceable, for example in a scanning direction, by way of a reticle displacement drive 9.
[0051]
[0052] The projection exposure apparatus 1 comprises a projection optical unit 10. The projection optical unit 10 serves for imaging the object field 5 into an image field 11 in an image plane 12. The image plane 12 extends parallel to the object plane 6. Alternatively, an angle that differs from 0 between the object plane 6 and the image plane 12 is also possible.
[0053] A structure on the reticle 7 is imaged onto a light-sensitive layer of a wafer 13 arranged in the region of the image field 11 in the image plane 12. The wafer 13 is held by a wafer holder 14. The wafer holder 14 is displaceable, for example in the y-direction, by way of a wafer displacement drive 15. The displacement firstly of the reticle 7 by way of the reticle displacement drive 9, and secondly of the wafer 13 by way of the wafer displacement drive 15, can be implemented so as to be mutually synchronized.
[0054] The radiation source 3 is an EUV radiation source. The radiation source 3 emits EUV radiation 16, which is also referred to below as used radiation, illumination radiation or illumination light. For example, the used radiation has a wavelength in the range between 5 nm and 30 nm. The radiation source 3 may be a plasma source, for example an LPP (laser produced plasma) source or a GDPP (gas discharge produced plasma) source. It may also be a synchrotron-based radiation source. The radiation source 3 may be a free electron laser (FEL).
[0055] The illumination radiation 16 emanating from the radiation source 3 is focused by a collector 17. The collector 17 may be a collector with one or more ellipsoidal and/or hyperboloid reflection surfaces. The illumination radiation 16 can be incident on the at least one reflection surface of the collector 17 with grazing incidence (GI), i.e. at angles of incidence of greater than 45 relative to the direction of the normal to the mirror surface, or with normal incidence (NI), i.e. at angles of incidence of less than 45. The collector 17 may be structured and/or coated, firstly to optimize its reflectivity for the used radiation and secondly to suppress extraneous light.
[0056] Downstream of the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focal plane 18. The intermediate focal plane 18 may represent a separation between a radiation source module, having the radiation source 3 and the collector 17, and the illumination optical unit 4.
[0057] The illumination optical unit 4 comprises a deflection mirror 19 and, downstream thereof in the beam path, a first facet mirror 20. The deflection mirror 19 can be a plane deflection mirror or, alternatively, a mirror with a beam-influencing effect that goes beyond the purely deflecting effect. As an alternative or in addition, the deflection mirror 19 may be designed as a spectral filter that separates a used light wavelength of the illumination radiation 16 from extraneous light of a wavelength deviating therefrom. If the first facet mirror 20 is arranged in a plane of the illumination optical unit 4 that is optically conjugate to the object plane 6 as a field plane, it is also referred to as a field facet mirror. The first facet mirror 20 comprises a multiplicity of individual first facets 21, which are also referred to below as field facets.
[0058] The first facets 21 may be embodied as macroscopic facets, for example as rectangular facets or as facets with an arcuate or part-circular edge contour. The first facets 21 may be in the form of plane facets or alternatively of facets with convex or concave curvature.
[0059] As is known for example from DE 10 2008 009 600 A1, the first facets 21 themselves may also each be composed of a multiplicity of individual mirrors, for example a multiplicity of micromirrors. The first facet mirror 20 may for example be in the form of a microelectromechanical system (MEMS system). For details, reference is made to DE 10 2008 009 600 A1.
[0060] The illumination radiation 16 travels horizontally, i.e. in the y-direction, between the collector 17 and the deflection mirror 19.
[0061] In the beam path of the illumination optical unit 4, a second facet mirror 22 is arranged downstream of the first facet mirror 20. If the second facet mirror 22 is arranged in a pupil plane of the illumination optical unit 4, it is also referred to as a pupil facet mirror. The second facet mirror 22 can also be arranged at a distance from a pupil plane of the illumination optical unit 4. In this case, the combination of the first facet mirror 20 and the second facet mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006/0132747 A1, EP 1 614 008 B1, and U.S. Pat. No. 6,573,978.
[0062] The second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets.
[0063] The second facets 23 may likewise be macroscopic facets, which may for example have a round, rectangular or else hexagonal boundary, or may alternatively be facets composed of micromirrors. In this regard, reference is likewise made to DE 10 2008 009 600 A1. The second facets 23 can have plane, convexly curved, or concavely curved reflection surfaces.
[0064] The illumination optical unit 4 thus forms a double-faceted system. This basic principle is also referred to as a fly's eye integrator.
[0065] It may be desirable to arrange the second facet mirror 22 not exactly in a plane that is optically conjugate to a pupil plane of the projection optical unit 10. For example, the pupil facet mirror 22 may be arranged so as to be tilted relative to a pupil plane of the projection optical unit 10, as described, for example, in DE 10 2017 220 586 A1.
[0066] The individual first facets 21 are imaged into the object field 5 using the second facet mirror 22. The second facet mirror 22 is the last beam-shaping mirror or else indeed the last mirror for the illumination radiation 16 in the beam path upstream of the object field 5.
[0067] In a further embodiment (not illustrated) of the illumination optical unit 4, a transfer optical unit may be arranged in the beam path between the second facet mirror 22 and the object field 5, and contributes for example to the imaging of the first facets 21 into the object field 5. The transfer optical unit may comprise exactly one mirror or, alternatively, two or more mirrors, which are arranged in succession in the beam path of the illumination optical unit 4. The transmission optical unit can for example comprise one or two normal-incidence mirrors (NI mirrors) and/or one or two grazing-incidence mirrors (GI mirrors).
[0068] In the embodiment shown in
[0069] The deflection mirror 19 may also be omitted in a further design of the illumination optical unit 4, and so the illumination optical unit 4 may then have exactly two mirrors downstream of the collector 17, specifically the first facet mirror 20 and the second facet mirror 22.
[0070] The imaging of the first facets 21 into the object plane 6 via the second facets 23 or using the second facets 23 and a transfer optical unit is often only approximate imaging.
[0071] The projection optical unit 10 comprises a plurality of mirrors Mx, which are consecutively numbered in accordance with their arrangement in the beam path of the projection exposure apparatus 1.
[0072] In the example illustrated in
[0073] Reflection surfaces of the mirrors Mx can be in the form of free-form surfaces without an axis of rotational symmetry. Alternatively, the reflection surfaces of the mirrors Mx can be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflection surface shape. Just like the mirrors of the illumination optical unit 4, the mirrors Mx can have highly reflective coatings for the illumination radiation 16. These coatings may be designed as multilayer coatings, for example with alternating layers of molybdenum and silicon.
[0074] The projection optical unit 10 has a large object-image offset in the y-direction between a y-coordinate of a center of the object field 5 and a y-coordinate of the center of the image field 11. In the y-direction, this object-image offset can be of approximately the same magnitude as a z-distance between the object plane 6 and the image plane 12.
[0075] The projection optical unit 10 may for example have an anamorphic form. For example, it has different imaging scales x, y in the x- and y-directions. The two imaging scales x, By of the projection optical unit 10 can be (x, y)=(+/0.25, +/0.125). A positive imaging scale means imaging without image inversion. A negative sign for the imaging scale means imaging with image inversion.
[0076] The projection optical unit 10 consequently leads to a reduction in size with a ratio of 4:1 in x-direction, i.e. in a direction perpendicular to the scanning direction.
[0077] The projection optical unit 10 leads to a reduction in size of 8:1 in y-direction, i.e. in scanning direction.
[0078] Other imaging scales are likewise possible. Imaging scales with the same signs and the same absolute values in x-direction and y-direction are also possible, for example with absolute values of 0.125 or 0.25.
[0079] The number of intermediate image planes in the x-direction and in the y-direction in the beam path between the object field 5 and the image field 11 may be the same or may differ depending on the design of the projection optical unit 10. Examples of projection optical units with different numbers of such intermediate images in x- and y-directions are known from US 2018/0074303 A1.
[0080] One of the pupil facets 23 in each case is assigned to exactly one of the field facets 21, in each case to form an illumination channel for illuminating the object field 5. This may for example result in illumination according to the Khler principle. The far field is deconstructed into a multiplicity of object fields 5 with the aid of the field facets 21. The field facets 21 generate a plurality of images of the intermediate focus on the pupil facets 23 respectively assigned thereto.
[0081] The field facets 21 are imaged, each by way of an assigned pupil facet 23, onto the reticle 7 in a manner such that they are mutually superposed for illumination of the object field 5. The illumination of the object field 5 is for example as homogeneous as possible. It can have a uniformity error of less than 2%. Field uniformity can be achieved by overlaying different illumination channels.
[0082] The illumination of the entrance pupil of the projection optical unit 10 may be geometrically defined by an arrangement of the pupil facets. It is possible to set the intensity distribution in the entrance pupil of the projection optical unit 10 by selecting the illumination channels, for example the subset of pupil facets, which guide light. This intensity distribution is also referred to as illumination setting.
[0083] A likewise preferred pupil uniformity in the region of sections of an illumination pupil of the illumination optical unit 4 that are illuminated in a defined manner can be achieved by a redistribution of the illumination channels.
[0084] Further aspects and details of the illumination of the object field 5 and for example of the entrance pupil of the projection optical unit 10 are described hereinbelow.
[0085] The projection optical unit 10 may for example have a homocentric entrance pupil. The latter may be accessible. It may also be inaccessible.
[0086] The entrance pupil of the projection optical unit 10 generally cannot be illuminated exactly via the pupil facet mirror 22. The aperture rays often do not intersect at a single point when imaging the projection optical unit 10 which telecentrically images the center of the pupil facet mirror 22 onto the wafer 13. However, it is possible to find an area in which the spacing of the aperture rays that is determined in pairs becomes minimal. This area represents the entrance pupil or an area in real space that is conjugate thereto. For example, this area has a finite curvature.
[0087] It may be the case that the projection optical unit 10 has different poses of the entrance pupil for the tangential beam path and for the sagittal beam path. In this case, an imaging element, for example an optical component of the transfer optical unit, should be provided between the second facet mirror 22 and the reticle 7. With the aid of this optical element, the different pose of the tangential entrance pupil and the sagittal entrance pupil can be taken into account.
[0088] In the arrangement of the components of the illumination optical unit 4 illustrated in
[0089] The first facet mirror 20 is in a tilted arrangement with respect to an arrangement plane defined by the second facet mirror 22.
[0090]
[0091] The setup of the projection exposure apparatus 101 and the principle of the imaging are comparable with the setup and procedure described in
[0092] In contrast to an EUV projection exposure apparatus 1 as described in
[0093] The illumination system 102 provides DUV radiation 116 for the imaging of the reticle 107 on the wafer 113. A laser, a plasma source, or the like can be used as the source of this radiation 116. The radiation 116 is shaped in the illumination system 102 via optical elements such that the DUV radiation 116 has the desired properties with regard to diameter, polarization, shape of the wavefront, and the like, when it is incident on the reticle 107.
[0094] Apart from the additional use of refractive optical elements 117, such as lens elements, prisms, terminating plates, the setup of the downstream projection optical unit 101 with the lens housing 119 does not differ in principle from the setup described in
[0095] The intention is to explain a principle of the disclosure using the basic schematic depicted in
the fed-in power P.sub.in is split into the power loss P.sub.loss, the power P.sub.ref1 reflected by the heating element 51, and the power P.sub.trans transmitted through the heating element 51. The power loss P.sub.loss=P.sub.heat+P.sub.scat itself is composed of the heating power P.sub.heat of interest here and the scattering losses P.sub.scat.
[0096] An implementation of such a heating element 51 can be realized in the form of a ring resonator for example, as depicted schematically in
E.sub.i1 and E.sub.i2 herein denote the amplitudes of the waves entering into the two inputs (of the waveguide 56 and ring resonator 51) from the left, and E.sub.t1 and E.sub.t2 denote the waves emerging at the two outputs. The coupling is described by the complex transmission parameter and the complex transfer parameter , wherein the following applies to reciprocal coupling: *+*=1. The ring resonator 51 itself is described by its circumference U, and denotes the wavelength of the fed-in radiation and n() denotes the wavelength-dependent refractive index of the substrate material of the component into which the ring resonator 51 is built. The circumferential transmission in the ring resonator 51 for a single revolution is denoted . The solution to the system of equations 2 can be found in standard textbooks and is:
in this case represents the circumferential phase in the ring resonator 51.
[0097] Hence, the following is obtained for the relative transmitted power P.sub.t1:
where .sub.t=arg(t) denotes the additional phase retardation during the coupling. The following expression arises for the relative power circulating in the ring resonator 51:
[0098] Finally, the following result emerges for the power loss of interest from the balance equation 1 with P.sub.refl=0:
[0099] Certain conclusions are derived below from the discussion of relationships 5 to 7: If the phase in the argument of the cosine function adopts integer values, +.sub.t=2k, where k.sup.+, then the excitation is in resonance with the electric field in the ring resonator 51. The associated resonant frequencies
are:
where c.sub.0 is the speed of light in vacuo. Accordingly, the frequencies of a ring resonator correspond exactly to those of the better-known Fabry-Perot resonator with the free spectral range
between the equidistant spectral lines in the frequency space. In the case of resonance, the expressions for the powers simplify as:
[0100] The transmitted wave disappears if the circumferential transmission a and the coupler transmissivity |t| have identical values. Further, since no reflected wave is present, the input coupled power consequently has been completely converted in the ring resonator 51 in the matching condition =|t| case.
[0101] This matching while simultaneously satisfying the resonant condition is chosen as the working point of the radiant heater having a ring resonator. The plots in
[0102]
[0103] The following expression is obtained for the width of the resonances in the spectrum once the approximation cos()1.sup.2/2 and a few elementary computational steps have been implemented:
[0104] In the case of small losses, it is proportional to the mean power loss rate (+)/2.
[0105] The dissipation mechanism underlying the disclosure is explained in more detail below.
[0106] In general, the base material of the glasses used in lithography optics is amorphous silicon dioxide (fused silica).
can be derived for the dissipation power loss parameter for single ring circulation. In this case, C.sub.OH denotes the concentration of the OH groups and LS.sub.OH() denotes the normalized lineshape function of the 2nd harmonic with the normalization LS.sub.OH(1370 nm)=1.
[0107] Meeting the matching condition is central to the proposed heating principle working. There are a number of options for establishing and/or setting this condition. These will be explained in detail below.
[0108] Knowledge about the power loss during a single ring circulation is useful:
[0109] In embodiments, the losses in the ring resonator 51 are dominated by the dissipative component .sub.diss. To reduce the scattering and emission losses .sub.scat, appropriate measures (design of the photonic waveguide and coupler, production and processing, and choice of ring radius) are assumed to have been taken. Once knowledge about these parameters is available, the ring resonator 51 is designed during the actual design step.
[0110] In the weak coupling regime, approximately the following expression applies to the symmetric configuration of the coupling parameter illustrated on the basis of
[0111] The auxiliaries occurring therein are defined as follows: [0112] Mode power:
Transverse propagation constant: k.sub.t={square root over (n.sub.m.sup.2k.sup.2.sup.2)}, [0114]
Evanescent decay constant: ={square root over (.sup.2n.sub.0k.sup.2)}.
[0115] Here, Propagation constant: =n.sub.mk [0117]
Wavelength and wave number in vacuo: , k=2/ [0118]
Angular frequency of the radiation: =c.sub.0k [0119]
Field constants and speed of light in vacuo: .sub.0, .sub.0, c.sub.0
[0120] According to the disclosure, an appropriate choice of the design parameters can help make it possible to sufficiently satisfy the matching condition.
[0121] Exploiting the steepness of the absorption line along the sinking or rising flank is desirable for regulating or matching the power during operation or for setting a working point. To this end, the radiant power is fed into the lines of the resonator spectrum optimally assisting the target properties (optimal matching, defined power deposition, . . . ). For illustrative purposes,
[0122]
[0123] The design of the ring resonators in such a chain is considered in detail below. The resonant frequencies of a ring of index j=1, . . . , J with ring circumference U.sup.(j) are:
[0124] The goal is that of defining a band in the frequency space in which each resonator can be uniquely assigned a certain frequency such that, by way of a suitable choice of the frequency of the input coupled radiation, a resonator can be addressed in targeted fashion without a resonance arising in the remaining resonators and, connected therewith, an unwanted dissipation and hence heating of the corresponding regions. For a selected reference resonator with a free spectral range FSR.sup.(0) and a given working frequency f.sub.0, the associated mode index is
[0125] In the first design step, the mode indices of the resonators at the working frequency are defined as follows:
where k is an integer corresponding to the mode index spacing of two resonators adjacent in frequency. Using this, it is possible according to
to define the mode spacings of the ring resonators and hence the ring circumferences within a chain. With this choice, the frequencies of the resonators arise as:
where q is the differential index from the initial position, in which the frequencies of all resonators are degenerate (uniform) according to design.
[0126]
[0127] The central partial figure plots the resonant frequencies for each ring and for different differential indices. It is quite evident from the central partial figure that the resonant frequencies of all 21 rings extend over an ever larger frequency range with increasing absolute value of q; this is elucidated further on the basis of the right partial figure by way of an illustration, depicted with hatching, of the swept frequency ranges.
[0128] As illustrated in
[0129] For the exemplary design used,
[0130] This spacing is large in comparison with the line width FWHM.sup.(j). This is translated into the following:
with the acceptance parameter g (typically 10). The line width is given by the circulation losses and the free spectral range, by way of the following relationship:
. Consequently, the following condition arises for the design of the resonator chain:
in order to obtain the desired sharpness of the resonances.
[0131] The most efficient input coupling of the power of the radiation source into the resonators is implemented at the peak of the respective resonance. On account of the desired sharpness of the resonances, using a suitable control method allows frequency-tunable laser sources to be stabilized at the maxima of the selected absorption lines.
[0132] Since a change in temperature leads to a resonance shift, also via the change in refractive index and thermal length expansion connected therewith, controlled tracking of the input coupling is at least desirable, if not absolutely mandatory, for the desired resonance sharpnesses. The Pound, Drever, and Hall (PDH) stabilization method can be used as control method.
[0133]
[0134] The aforementioned stabilization method is directly adaptable to the coupling of a laser source 53 as a radiation source to the mode of a ring resonator 51. In this case, the transmitted field in the case of the ring resonator 51 can be considered the direct equivalent of the field reflected by the input mirror of a mirror cavity (Fabry-Prot). From considering this analogy, the block diagram in
[0135] The Pound, Drever and Hall method is described extensively in the literature. In this context, particular reference is made to the elaborations by E. D. Black (E. D. Black, Am. J. Phys., Vol. 69, No. 1, January 2001). The functional principle is as follows:
[0136] Side bands on the laser radiation fed into the ring resonator 51 are created by the electro-optic modulator 64 (cf.
the complex field strength of the radiation field relevant to the PDH signal and entering the resonator is:
[0137] Here, denotes the phase modulation amplitude, f.sub.m denotes the associated modulation frequency, f.sub.0 denotes the laser frequency, and E.sub.0 denotes the laser amplitude. J.sub.k(x) represents a Bessel function of the first kind. The transfer function F between input and output arises directly from equation 4.1 and is
with the free spectral range
Hence, the light field transmitted at the ring resonator 51 arises as:
[0138] If this light field is incident on the photodetector 67, this yields a photocurrent proportional to the incident power:
The radiant powers occurring therein are P.sub.c=(E.sub.0J.sub.0()).sup.2 for the carrier and respectively P.sub.s=(E.sub.0J.sub.0()).sup.2 for the two side bands. The two quadrature components of the signal oscillating at the modulation frequency f.sub.m are exposed by demodulation. For illustrative purposes,
of the PDH signal for an exemplary configuration for the case f.sub.m>>f. In this case, the left part of
[0139]
[0140] A concept for feeding the radiation of a plurality of laser sources 53 into a chain of ring resonators 51 or heating elements via an optical distributor 81 is illustrated in
[0141] What is desirable by way of an appropriate design of the modulation frequencies in the case of a chain of resonators 51 and a multiple radiation source is that the beat frequencies occurring at the photodetector 67 can be separated in such a way that crosstalk between the signals is sufficiently suppressed.
[0142] The use of a stabilization method for feeding into a selected resonance opens up the possibility of highly accurately determining the frequency or its change, for example by way of a comparison of the laser frequency with a metrological laser frequency comb, by virtue of creating and evaluating a beat signal. Changes in the frequency occur when there are changes in the characteristic optical length (e.g. effective optical circumference of a ring resonator 51) on account of changes in the refractive index of the waveguide material or in the dimension as a consequence of material expansion. As a result, it is possible to obtain, at least indirectly, information about the temperature and/or the expansion. This information can be used to construct and close a control loop.
[0143] It is not readily possible to distinguish between the effects of expansion and temperature. However, expansion and temperature are completely correlated in the case of thermal actuation, with the result that, following an appropriate calibration, the signal obtained directly represents the effect to be attained.
[0144] There are a large number of design options based on the presented principle. By way of example, use can be made of more complex configurations with ring resonators 51 coupled in series and/or in parallel, with and without Bragg gratings. It may also be desirable to provide a read line.
[0145] In this case,
[0146] For example, the waveguide 56 can also be connected to the supply line 54 by joining methods such as adhesive bonding, soldering, welding, fusing.
[0147]
[0148]
[0149] As a result of integrating the Bragg gratings 52 it is possible to redesign the ring resonators 51 as conventional Fabry-Prot resonators, wherein this results in a circulation of the electric field that alternates in the sense of rotation as a consequence of the two-sided reflection at the Bragg grating 52 rather than a circulation of the electric field that is unchanging in the sense of rotation. The resonator is fed no longer from the outside but internally via the coupling site which is then located within the actual resonator. In contrast with the simple ring resonator, a reflected wave occurs again as a consequence of the field alternating in the sense of rotation of the circulation.
[0150]
[0151] It is self-evident that the variants explained are purely exemplary and non-limiting options for implementing the disclosure. Extensions and modifications are conceivable and desirable depending on the use case.
[0152] Lithographic and/or beam-based methods come into question as manufacturing technologies for the waveguide structures involved in fused silica or fused silica ceramics. The beam-based methods, by which local and persistent changes in the refractive index can be brought about in the material without further material (e.g. Si) coming into play, seem to be particularly desirable in this case. In this case, a light-guiding region forms by way of a local increase in the refractive index vis--vis the surroundings. In principle, by way of a writing process, functional photonic structures can be defined in three dimensions via irradiation. In this case, use is made of [0153] laser beams, [0154] ion beams, [0155] electron beams.
[0156]
LIST OF REFERENCE SIGNS
[0157] 1 Projection exposure apparatus [0158] 2 Illumination system [0159] 3 Radiation source [0160] 4 Illumination optical unit [0161] 5 Object field [0162] 6 Object plane [0163] 7 Reticle [0164] 8 Reticle holder [0165] 9 Reticle displacement drive [0166] 10 Projection optical unit [0167] 11 Image field [0168] 12 Image plane [0169] 13 Wafer [0170] 14 Wafer holder [0171] 15 Wafer displacement drive [0172] 16 EUV radiation [0173] 17 Collector [0174] 18 Intermediate focal plane [0175] 19 Deflection mirror [0176] 20 Facet mirror [0177] 21 Facets [0178] 22 Facet mirror [0179] 23 Facets [0180] 51 Ring resonator [0181] 52 Bragg grating [0182] 53 Radiation source [0183] 54 Supply line [0184] 55 Coupler [0185] 56 Waveguide [0186] 57 Photosensor [0187] 58 Beam splitter [0188] 59 Optical isolator [0189] 60 Resonator [0190] 61 Analyzer [0191] 62 Beam splitter [0192] 63 Isolator [0193] 64 Electro-optic modulator [0194] 65 Polarization-dependent beam splitter [0195] 66 Quarter wave plate [0196] 67 Photodetector [0197] 68 Mixer [0198] 69 Radiofrequency signal [0199] 70 Low-pass filter [0200] 71 Focused beam [0201] 80 Read line [0202] 81 Optical distributor [0203] 101 Projection exposure apparatus [0204] 102 Illumination system [0205] 107 Reticle [0206] 108 Reticle holder [0207] 110 Projection optical unit [0208] 113 Wafer [0209] 114 Wafer holder [0210] 116 DUV radiation [0211] 117 Optical element [0212] 118 Mounts [0213] 119 Lens housing [0214] M1-M6 Mirrors