GRINDING CONFIGURATION FOR SUBSTRATE GRINDING APPARATUS

Abstract

Disclosed is a grinding configuration for a substrate grinding apparatus. The grinding configuration includes a grinding disk, multiple first light guides, and multiple second light guides. Multiple mounting holes are penetrated through the grinding disk, with each first light guide and each second light guide being provided in each mounting hole, respectively. Each first light guide and each second light guide is penetrated along its axial direction to form a light channel. Multiple light transmission plates are provided at the lower end of each first light guide and each second light guide, which block the communication between each light channel and the space below the grinding disk, thereby preventing slurry or foam generated during substrate grinding from entering each light channel.

Claims

1. A grinding configuration for a substrate grinding apparatus, comprising: a grinding disk used to install an abrasive cloth for grinding a substrate positioned beneath the abrasive cloth; multiple mounting holes penetrated through the grinding disk along an axial direction to define a virtual circular line, with a center of the circular line being located at a rotation center of the grinding disk, wherein each mounting hole is spaced along the circular line; multiple first light guides and multiple second light guides respectively provided in each mounting hole, wherein each of the first light guides and each of the second light guides is penetrated along its axial direction to form a light channel; and multiple light transmission plates through which light passes provided at the lower end of each of the first light guides and each of the second light guides, wherein each light transmission plate blocks communication between each light channel and the space below the grinding disk, thereby preventing slurry or foam generated during grinding of the substrate from entering each light channel.

2. The grinding configuration for the substrate grinding apparatus according to claim 1, wherein multiple first positioning structures are respectively connected to each of the first light guides; and wherein each of the first positioning structures includes two clamping blocks, each of which cooperatively clamps the radial outer periphery of the first light guide and abuts the upper surface of the grinding disk, thereby axially positioning each of the first light guides.

3. The grinding configuration for the substrate grinding apparatus according to claim 1, wherein multiple second positioning structures are respectively connected to each of the second light guides; and wherein each of the second positioning structures includes a bushing and a base, wherein each bushing tightly encloses the radial outer periphery of each second light guide and protrudes downward with a protrusion; and each base abuts against the upper surface of the grinding disk and protrudes upward with a riser block, thereby positioning each of the second light guides along its axial direction at a first position or a second position.

4. The grinding configuration for the substrate grinding apparatus according to claim 2, wherein multiple second positioning structures are respectively connected to each of the second light guides; and wherein each of the second positioning structures includes a bushing and a base, wherein each bushing tightly encloses the radial outer periphery of each second light guide and protrudes downward with a protrusion; and each base abuts against the upper surface of the grinding disk and protrudes upward with a riser block, thereby positioning each of the second light guides along its axial direction at a first position or a second position.

5. The grinding configuration for the substrate grinding apparatus according to claim 3, wherein each bushing forms a gap along its radial direction, and each gap extends to the radial outer periphery and the radial inner periphery of each bushing; each bushing is screwed with a second fastening bolt, respectively, thereby reducing the width of each gap, tightening the radial inner periphery of each bushing, and enabling each bushing to tightly adhere to the radial outer periphery of each second light guide.

6. The grinding configuration for the substrate grinding apparatus according to claim 4, wherein each bushing forms a gap along its radial direction, and each gap extends to the radial outer periphery and the radial inner periphery of each bushing; each bushing is screwed with a second fastening bolt, respectively, thereby reducing the width of each gap, tightening the radial inner periphery of each bushing, and enabling each bushing to tightly adhere to the radial outer periphery of each second light guide.

7. The grinding configuration for the substrate grinding apparatus according to claim 1, wherein each of the first light guides and each of the second light guides respectively forms two stoppers, each stopper being located on the lower surface of each light transmission plate, thereby positioning each light transmission plate.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0010] FIG. 1 is a partial perspective view of a preferred embodiment of the present invention and the thickness measuring device.

[0011] FIG. 2 is a partial enlarged view of FIG. 1.

[0012] FIG. 3 is a partial top view of a preferred embodiment of the present invention.

[0013] FIG. 4 is an exploded perspective view of a first light guide and a first positioning structure of a preferred embodiment of the present invention.

[0014] FIG. 5 is a partial sectional view of a preferred embodiment of the present invention.

[0015] FIG. 6 is an exploded perspective view of a second light guide and a second positioning structure of a preferred embodiment of the present invention.

[0016] FIG. 7 is a partial sectional view of a preferred embodiment of the present invention, showing the second light guide positioned at the first position.

[0017] FIG. 8 is a partial sectional perspective view of a preferred embodiment of the present invention, showing the second light guide positioned at the second position.

DETAILED DESCRIPTION OF THE INVENTION

[0018] Please refer to the drawings for a preferred embodiment of a grinding configuration of a substrate grinding apparatus of the present invention, but these embodiments are for illustrative purposes only and are not subject to the limitations of this structure for patent application.

[0019] As shown in FIGS. 1 through 8, in the preferred embodiment of the present invention, a thickness measuring device 90 can be combined. During the grinding of a substrate (not shown) in the preferred embodiment, the operation of the preferred embodiment does not need to be stopped, and the thickness measuring device 90 can simultaneously measure the thickness of the substrate; wherein the substrate can be a wafer, but is not limited to wafers.

[0020] The preferred embodiment of the present invention includes a grinding disk 10, multiple first light guides 20, and multiple second light guides 30. The grinding disk 10 is used to install an abrasive cloth 92, such that the abrasive cloth 92 can be driven by the grinding disk 10 to rotate, thereby grinding the substrate positioned beneath the abrasive cloth 92.

[0021] Multiple mounting holes 12 are penetrated through the grinding disk 10 along an axial direction to define a virtual circular line 13, with a center of the circular line 13 being located at a rotation center 14 of the grinding disk 10. The diameter direction of the circular line 13 is the same as the diameter direction of the grinding disk 10, and each mounting hole 12 is spaced along the circular line 13.

[0022] Each of the first light guides 20 and each of the second light guides 30 is provided in each mounting hole 12, respectively. Each of the first light guides 20 and each of the second light guides 30 is penetrated along its axial direction to form a light channel 40. Multiple light transmission plates 42 through which light can pass are provided at the lower end of each of the first light guides 20 and each of the second light guides 30, with each light transmission plate 42 blocking the communication between each light channel 40 and the space below the grinding disk 10, thereby preventing slurry or foam generated during grinding of the substrate from entering each light channel 40.

[0023] The thickness measuring device 90 is positioned above the grinding disk 10 and opposite any of the light channels 40. As the grinding disk 10 rotates to drive the abrasive cloth 92 to grind the upper surface of the substrate, each light channel 40 passes sequentially below the thickness measuring device 90, and the thickness measuring device 90 sequentially projects laser light onto the substrate through each light channel 40 and receives the reflected light of the laser light from the substrate through each light channel 40, so as to calculate the thickness of the substrate based on the reflected light.

[0024] The thickness measuring device 90 is a prior art known to those skilled in the art of the present invention, and the thickness measuring device 90 is not necessarily related to the technical features of the present invention, so the specific structure of the thickness measuring device 90 will not be described in detail.

[0025] In order to allow the laser light and the reflected light to pass through the abrasive cloth 92 without obstruction or interference, the abrasive cloth 92 is provided with multiple through-holes 93. The formation of each through-hole 93 is known to those skilled in the art of the present invention, and each through-hole 93 is located at the axial extension of each mounting hole 12, wherein the diameter of each through-hole 93 is larger than the diameter of each mounting hole 12.

[0026] The lower ends of each of the first light guides 20 and each of the second light guides 30 are each located near the lower surface of the grinding disk 10 to avoid contact with the substrate during grinding by the abrasive cloth 92. Therefore, during grinding of the substrate by the abrasive cloth 92, the lower ends of each first light guide 20 and each second light guide 30 are preferably located above the lower surface of the abrasive cloth 92.

[0027] During grinding of the substrate by the abrasive cloth 92, each of the first light guides 20 and each of the second light guides 30 rotates around the rotation center 14 following the circular line 13 without the need to stop the operation of the grinding disk 10. The thickness measuring device 90 can sequentially project laser light onto the substrate through each light channel 40 and sequentially receive the reflected light of the laser light from the substrate through each light channel 40, whereby the thickness measuring device 90 calculates and obtains the thickness of the substrate based on the reflected light.

[0028] The portion of the substrate removed by the abrasive cloth 92 forms a powder. The powder is mixed with the coolant used during grinding to form a slurry-like substance. The slurry-like substance cannot enter and accumulate in each light channel 40 due to the presence of each light transmission plate 42, and a foam generated by the relative rotation of the abrasive cloth 92 and the substrate also cannot enter each light channel 40 due to the blocking of each light transmission plate 42. Compared to the prior art, the preferred embodiment can reduce the impact of the slurry-like substance or foam on the laser light or the reflected light and increase the accuracy of the thickness of the substrate obtained by the thickness measuring device 90.

[0029] Multiple first positioning structures 50 are respectively connected to each of the first light guides 20 and for positioning each of the first light guides 20. Multiple second positioning structures 60 are respectively connected to each of the second light guides 30 and for positioning each of the second light guides 30.

[0030] The present invention may choose to respectively configure the first positioning structures 50 for each of the first light guides 20 and not to respectively configure the second positioning structures 60 for each of the second light guides 30; or the present invention may choose to respectively configure the second positioning structures 60 for each of the second light guides 30 and not to respectively configure the first positioning structures 50 for each of the first light guides 20, thereby forming multiple different alternative embodiments.

[0031] Each of the first positioning structures 50 includes two clamping blocks 52, each of which cooperatively clamps the radial outer periphery of the first light guide 20 and abuts the upper surface of the grinding disk 10, thereby axially positioning each of the first light guides 20.

[0032] Each of the first positioning structures 50 further includes a first fastening bolt 54 and a second positioning bolt 56. Each first fastening bolt 54 locks each clamping block 52 against each other so that each clamping block 52 can abut tightly against the outer periphery of each first light guide 20, thereby increasing the stability of each clamping block 52 in radially clamping each first light guide 20. Each second positioning bolt 56 is pivotally threaded through each clamping block 52 and screwed into the grinding disk 10 to lock each clamping block 52 to the grinding disk 10, thereby increasing the stability of each first positioning structure 50 in positioning on the grinding disk 10.

[0033] Each of the second positioning structures 60 includes a bushing 61 and a base 62, respectively. Each bushing 61 tightly encloses the radial outer periphery of each second light guide 30 and protrudes downward with two protrusions 63, which are spaced along the circumferential direction of the bushing 61. Each base 62 abuts against the upper surface of the grinding disk 10 and protrudes upward with two riser blocks 64 spaced along the circumferential direction of the base 62.

[0034] As shown in FIG. 7, when performing grinding operations in the preferred embodiment, each protrusion 63 abuts the upper end of each riser block 64, with each riser block 64 being used to raise each protrusion 63 so that each second light guide 30 can be positioned axially at a virtual first position and such that the lower end of each second light guide 30 does not extend beyond the lower surface of the abrasive cloth 92. As shown in FIG. 8, when installing or replacing the abrasive cloth 92, it is selected to cross each protrusion 63 and each riser block 64 to abut the lower end of each protrusion 63 against the upper end of each base 62, and the upper end of each riser block 64 against the lower surface of each bushing 61, thereby reducing the height of each bushing 61 so that each second light guide 30 can be positioned axially at a virtual second position. At this time, the lower end of each second light guide 30 further protrudes downward beyond the lower surface of the grinding disk 10 to penetrate the multiple through-holes 93 of the abrasive cloth 92 and guide the positioning of the abrasive cloth 92, thereby improving the convenience of installing the abrasive cloth 92.

[0035] The number of the protrusions 63 formed by each bushing 61 may vary as needed, but is limited to one protrusion 63 formed on each bushing 61; the number of the riser blocks 64 formed by each base 62 may vary as needed, but is limited to one riser block 64 formed on each base 62, and the number of the riser blocks 64 is not less than the number of the protrusions 63.

[0036] Each bushing 61 forms a gap 65 along its radial direction, and each gap 65 extends to the radial outer periphery and the radial inner periphery of each bushing 61. Each bushing 61 is screwed with a second fastening bolt 66 along its radial direction to reduce the width of the gap 65 and to tighten the radial inner periphery of the bushing 61 so that the bushing 61 can tightly adhere to the radial outer periphery of each second light guide 30, thereby increasing the bonding strength between each bushing 61 and each second light guide 30.

[0037] Each of the second positioning structures 60 also includes two second positioning bolts 67. Each of the second positioning bolts 67 is pivotally threaded through each base 62 and screwed into the grinding disk 10 to lock each base 62 to the grinding disk 10, thereby increasing the stability of each second positioning structure 60 in positioning on the grinding disk 10.

[0038] On each of the second light guides 30, a first groove 32 and a second groove 34 are formed and spaced axially along the radial outer periphery of the second light guides 30, wherein the first groove 32 and the second groove 34 are circularly surrounded along the radial outer periphery of each of the second light guides 30 to form a ring shape. Each of the second positioning structures 60 further includes a set screw 68, each of which is radially screwed into each of the bases 62. When each of the second light guides 30 is positioned at the first position, each of the set screws 68 enters the first groove 32, respectively. When each of the second light guides 30 is to be moved downward and positioned at the second position, each of the set screws 68 is rotated to come out of the first groove 32, respectively. After each of the second light guides 30 is positioned at the second position, each of the set screws 68 is further rotated to enter the second groove 34, respectively, wherein each of the set screws 68 is used to increase the stability of each of the second light guides 30 in positioning at the first position or the second position.

[0039] Each of the second positioning structures 60 further includes two connecting bolts 69. Each of the connecting bolts 69 is sequentially axially connected and composed of a head 692, a connecting rod section 694, and a screw section 696.

[0040] When each second light guide 30 is positioned at the first position, each screw section 696 is threaded through each bushing 61 and screwed into each riser block 64, and each head 692 abuts the upper surface of each bushing 61, thereby increasing the positioning stability of each bushing 61 relative to each base 62, which will not be affected by the vibration generated during the grinding process, so that each second light guide 30 can be more stably positioned at the first position.

[0041] When the second light guide 30 is axially positioned at the second position, each screw section 696 exits from each riser block 64 and screws into each bushing 61, with each head 692 disengaging from the upper surface of each bushing 61, whereby, the connecting bolt 69 will then not limit the operation of cross displacement between each protrusion 63 and each riser block 64. When it is necessary to install or replace the abrasive cloth 92, each connecting bolt 69 will still remain connected to each bushing 61 during the process of changing each second light guide 30 from the first position to the second position, thereby preventing the loss of the connecting bolt 69.

[0042] Each of the first light guides 20 and each of the second light guides 30 respectively forms two stoppers 44, each stopper 44 being located on the lower surface of each light transmission plate 42, thereby positioning each light transmission plate 42; the number of stoppers 44 may vary as needed, but each of the first light guides 20 and each of the second light guides 30 respectively is provided with at least one stopper 44 in principle.