Luminescent greenhouse glazing structures
12484489 ยท 2025-12-02
Assignee
Inventors
- Sadiq VAN OVERBEEK (Delft, NL)
- Chung-che KAO (Delft, NL)
- Sicco Henricus Godefridus PEETERS (Delft, NL)
- Ana JUNG (Delft, NL)
- Chao-chun HSU (Delft, NL)
Cpc classification
A01G9/20
HUMAN NECESSITIES
C03C17/00
CHEMISTRY; METALLURGY
C03C17/007
CHEMISTRY; METALLURGY
C09K11/00
CHEMISTRY; METALLURGY
C09K11/77348
CHEMISTRY; METALLURGY
G02B5/021
PHYSICS
B32B17/00
PERFORMING OPERATIONS; TRANSPORTING
C09K11/025
CHEMISTRY; METALLURGY
C03C17/009
CHEMISTRY; METALLURGY
International classification
A01G9/20
HUMAN NECESSITIES
B32B17/00
PERFORMING OPERATIONS; TRANSPORTING
C03C17/00
CHEMISTRY; METALLURGY
C09K11/00
CHEMISTRY; METALLURGY
C09K11/02
CHEMISTRY; METALLURGY
Abstract
Luminescent greenhouse glazing structures are described wherein the glazing structures comprise: a glass pane for a greenhouse; and, one or more Eu.sup.2+ doped amorphous inorganic luminescent thin film layers provided over the glass pane, wherein the one or more Eu.sup.2+ doped amorphous inorganic luminescent layers comprise or consist essentially of the elements Al and/or Si and the elements O and/or N; and, wherein the Si concentration is selected between 0 and 45 at. %, the Al concentration between 0 and 50 at. %, the O concentration between 0 and 70 at. %, the N concentration between 0 and 60 at. % and the Eu.sup.2+ between 0.01 and 30 at. %.
Claims
1. A luminescent greenhouse glazing structure comprising: a glass pane for a greenhouse; and one or more Eu.sup.2+ doped amorphous inorganic luminescent thin film layers provided over the glass pane, wherein the one or more Eu.sup.2+ doped amorphous inorganic luminescent layers consist of elements Al and/or Si and elements O and/or N; and have a Si concentration between 0 at. % and 45 at. %, an Al concentration between 0 at. % and 50 at. %, an O concentration between 0 at. % and 70 at. %, an N concentration between 0 at. % and 60 at. % and a Eu.sup.2+ concentration between 0.01 at. % and 30 at. %.
2. The luminescent glazing structure according to claim 1, wherein at least one of the one or more luminescent thin film layers is an Eu.sup.2+ doped SiAION thin film layer having a Si concentration greater than 10 at. % to less than 45 at. %, an Al concentration greater than 2 at. % to less than 20 at. %, an O concentration greater than 30 at. % to less than 70 at. %, an N concentration greater than 0 at. % to less than 31 at. % and a Eu.sup.2+ concentration greater than 0.05 at. % to less than 8 at. %.
3. The luminescent glazing structure according to claim 1, wherein at least one of the one or more luminescent layers is an Eu.sup.2+ doped SiAION thin film layer, the composition of the Eu.sup.2+ doped SiAION thin film layer including Si at 38.4 at. %; Al at 3.7 at. %; O at 41.1 at. %; N at 16.3 at. %; Eu.sup.2+ at 0.5 at. %, and atomic percentages of the individual elements Si, Al, O, N and Eu.sup.2+ may vary +/10%.
4. The luminescent greenhouse glazing structure according to claim 1, wherein a thickness of the Eu.sup.2+ doped SiAION thin film layer is between 10 nm and 2000 nm.
5. The luminescent greenhouse glazing structure according to claim 1, wherein the luminescent glazing structure has a length between 100 cm and 300 cm, a width between 40 cm and 200 cm and a thickness between 3 mm and 6 mm.
6. The luminescent glazing structure according to claim 1, further comprising a thin film anti-reflection structure provided over the one or more luminescent thin film layers, for coupling light into the glass pane.
7. The luminescent glazing structure according to claim 6, wherein the thin-film anti-reflection structure includes at least one thin film of a porous oxide material.
8. The luminescent glazing structure according to claim 6, wherein the thin film anti-reflection structure comprises a stack of dielectric thin film layers, the stack of dielectric thin film layers including one or more first layers of a first dielectric material having a first refractive index and one or more second layers of a second dielectric material having a second refractive index, the second refractive index being higher than the first refractive index.
9. The luminescent glazing structure according to claim 1, wherein at least part of the one or more luminescent thin film layers is part of a thin film anti-reflection structure for coupling light into the glazing structure.
10. The luminescent glazing structure according to claim 8, wherein at least part of the one or more first layers includes a low-refractive index Eu.sup.2+ doped SiAION layer; and/or, at least part of the one or more second layers includes a high-refractive index Eu.sup.2+ doped SiAION layer; and/or, at least part of the one or more second layers includes a high-refractive index non-doped SiAION layer.
11. The luminescent glazing structure according to claim 1, wherein the glass pane comprises a first top surface and a second bottom surface, the one or more Eu.sup.2+ doped amorphous inorganic luminescent thin film layers being provided over the first top surface, and the first top surface is textured with a surface texture for providing a light scattering interface between the glass pane and the one or more Eu.sup.2+ doped amorphous inorganic luminescent thin film layers.
12. The luminescent glazing structure according to claim 1, wherein the one or more thin film layers include a top surface for receiving solar light, the top surface comprising a surface texture for providing a light scattering interface.
13. The luminescent glazing structure according to claim 11, wherein the surface texture includes patterned cones, pyramids and/or microlenses with average dimensions between 10 nm and 1000 nm or between 1 and 1000 micrometer or wherein the texture features are semi-random texture features with dimensions i with average dimensions between 10 nm and 1000 nm or between 1 and 1000 micrometer.
14. The luminescent glazing structure according to claim 1, wherein the at least one transparent substrate is a diffused transparent substrate having a high haze factor larger than 70%; and/or the luminescent layer has a low haze factor smaller than 20%.
15. A greenhouse comprising the luminescent glazing structure according to claim 1.
16. The luminescent glazing structure according to claim 2, wherein the Si concentration is between-greater than 20 at. % to less than 45 at. %, the Al concentration is between greater than 2 at. % to less than 10 at. %, the O concentration is greater than 30 at. % to less than 60 at. %, the N concentration is greater than 0 at. % to less than 31 at. % and the Eu.sup.2+ concentration is greater than 0.1 at. % to less than 4 at. %.
17. The luminescent glazing structure according to claim 4, wherein the thickness of the Eu.sup.2+ doped SiAION thin film layer is between 40 nm and 400 nm.
18. The luminescent glazing structure according to claim 10, wherein at least part of the one or more first layers includes a low-refractive index Eu.sup.2+ doped SiO.sub.2 layer doped with Al.sup.3+, N.sup.3+ and Eu.sup.2+ or a SiAlO layer doped with Eu.sup.2+; and/or, at least part of the one or more second layers includes a high-refractive index doped AlN layer doped with Si.sup.4+, O.sup.2+ and Eu.sup.2+ or a SiAlN layer doped with Eu.sup.2+; and/or, at least part of the one or more second layers includes a high-refractive index non-doped AlN layer or a non-doped SiAlN layer.
19. The luminescent glazing structure according to claim 11, wherein the surface texture has a standard deviation of a Gaussian scattering distribution at the light scattering interface of 20 degrees or more.
20. The luminescent glazing structure according to claim 14, wherein the haze factor of the at least one transparent substrate is larger than 90% and/or the haze factor of the luminescent layer is smaller than 2%.
21. A luminescent greenhouse glazing structure comprising: a glass pane for a greenhouse; and one or more Eu.sup.2+ doped amorphous inorganic luminescent thin film layers provided over the glass pane, wherein the one or more Eu.sup.2+ doped amorphous inorganic luminescent layers comprises elements Al and/or Si and elements O and/or N; and have a Si concentration greater than 0 at. % to less than 45 at. %, an Al concentration greater than 0 at. % to less than 50 at. %, an O concentration greater than 0 at. % to less than 70 at. %, an N concentration greater than 0 at. % to less than 60 at. % to less than a Eu.sup.2+ concentration greater than 0.01 at. % to less than 30 at. %, the glass pane comprises a first top surface and a second bottom surface, the one or more Eu.sup.2+ doped amorphous inorganic luminescent thin film layers being provided over the first top surface, and the first top surface is textured with a surface texture for providing a light scattering interface between the glass pane and the one or more Eu.sup.2+ doped amorphous inorganic luminescent thin film layers, and the surface texture includes texture features selected from the group consisting of patterned cones, pyramids and/or microlenses with average dimensions greater than 10 nm and 1000 nm, or the texture features are semi-random texture features with dimensions i with average dimensions greater than 10 nm and 1000 nm.
22. A luminescent greenhouse glazing structure comprising: a glass pane for a greenhouse; one or more Eu.sup.2+ doped amorphous inorganic luminescent thin film layers provided over the glass pane, and a thin film anti-reflection structure provided over the one or more luminescent thin film layers, for coupling light into the glass pane; wherein the one or more Eu.sup.2+ doped amorphous inorganic luminescent layers comprises elements Al and/or Si and elements O and/or N; and have a Si concentration greater than 0 at. % to less than 45 at. %, an Al concentration greater than 0 at. % to less than 50 at. %, an O concentration greater than 0 at. % to less than 70 at. %, an N concentration greater than 0 at. % to less than 60 at. % to less than a Eu.sup.2+ concentration greater than 0.01 at. % to less than 30 at. %, the thin film anti-reflection structure comprises a stack of dielectric thin film layers, the stack of dielectric thin film layers including one or more first layers of a first dielectric material having a first refractive index and one or more second layers of a second dielectric material having a second refractive index, the second refractive index being higher than the first refractive index, at least part of the one or more first layers includes a low-refractive index Eu.sup.2+ doped SiAION layer; and/or, at least part of the one or more second layers includes a high-refractive index Eu.sup.2+ doped SiAION layer; and/or, at least part of the one or more second layers includes a high-refractive index non-doped SiAION layer, and at least part of the one or more first layers includes a low-refractive index Eu.sup.2+ doped SiO.sub.2 layer doped with Al.sup.3+, N.sup.3+ and Eu.sup.2+ or a SiAlO layer doped with Eu.sup.2+; and/or, at least part of the one or more second layers includes a high-refractive index doped AlN layer doped with Si.sup.4+, O.sup.2+ and Eu.sup.2+ or a SiAlN layer doped with Eu.sup.2+; and/or, at least part of the one or more second layers includes a high-refractive index non-doped AlN layer or a non-doped SiAlN layer.
23. A luminescent greenhouse glazing structure comprising: a glass pane for a greenhouse; and one or more Eu.sup.2+ doped amorphous inorganic luminescent thin film layers provided over the glass pane, wherein the one or more Eu.sup.2+ doped amorphous inorganic luminescent layers comprises elements Al and/or Si and elements O and/or N; and have a Si concentration greater than 0 at. % to less than 45 at. %, an Al concentration greater than 0 at. % to less than 50 at. %, an O concentration greater than 0 at. % to less than 70 at. %, an N concentration greater than 0 at. % to less than 60 at. % to less than a Eu.sup.2+ concentration greater than 0.01 at. % to less than 30 at. %, the glass pane comprises a first top surface and a second bottom surface, the one or more Eu.sup.2+ doped amorphous inorganic luminescent thin film layers being provided over the first top surface, and the first top surface is textured with a surface texture for providing a light scattering interface between the glass pane and the one or more Eu.sup.2+ doped amorphous inorganic luminescent thin film layers, and the surface texture has a standard deviation of a Gaussian scattering distribution at the light scattering interface of 20 degrees or more.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
(13) In this disclosure, divalent Europium (Eu.sup.2+) doped SiAlON luminescent thin films are described that have superior and improved properties for greenhouse and crop growth applications. The improved properties include improved luminescent, optical and/or material properties when compared to conventional luminescent materials that are used in crop growth applications.
(14) It has been surprisingly found that certain SiAlON:Eu.sup.2+ compositions exhibit UV absorbing PAR emitting Eu.sup.2+ doped SiAlON material wherein the absorption and emission spectra exhibit no or almost no overlap. In particular, it has been found that luminescent Eu.sup.2+ doped SiAlON materials absorb a substantial part of the UV band of the solar spectrum and convert radiation in this band to radiation of a longer wavelength, in particular radiation in the photosynthetically active radiation (PAR) region. The SiAlON host material exhibits superior properties in terms of mechanical strength, chemical inertness and thermal resistance and is for that reason used in protection and anti-reflection coatings in the glass industry. The Eu.sup.2+ doped SiAlON material forms a very stable conversion material that is fully compatible with standard production processes of the glass industry. In some embodiments, the Eu.sup.2+ doped SiAlON material may be used to form scatter-free amorphous Eu.sup.2+ doped SiAlON thin film layers. The use of a low-scattering amorphous SiAlON thin-film layer in a solar conversion device will ensure that the luminescent light does not escape the conversion device by scattering.
(15) The materials, their advantages and their uses in luminescent coatings for greenhouses and luminescent sheet structures for greenhouses are described hereunder in more detail with reference to the figures.
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(17) The Eu2+ doped SiAlON thin film was deposited on glass substrate within a magnetron sputtering system with a base pressure of 110.sup.9 bar, at room temperature. Prior to the deposition, the substrate was cleaned for 15 min in an ultrasonic cleaner with soap solution and subsequently rinsed with acetone, ethanol and DI water. The deposition was carried out with 5.08 cm diameter metal Al (99.9995%), Si (99.999%) and Eu (99.99%) targets that were reactively co-sputtered with 30 W DC power, 130 W RF power and 40 W RF power respectively for 11.25 h. The deposition rate of Eu was reduced by with a stainless steel mask, with a pattern of concentric holes 5.45 mm in diameter, blocking 50% of the surface of the Eu target. The process gas flow consisted of 18 sccm 6N purity Ar, 0.75 sccm 5N purity O.sub.2 and 13.25 sccm 3N purity N.sub.2 into the sputtering chamber at a working pressure of 410.sup.2 mbar. O.sub.2 and N.sub.2 were introduced next to the substrate, while Ar was introduced at the Si source. Following the sputter deposition, the thin film was annealed at 600 C. for 30 minutes in a rapid thermal processing (RTP) system to activate the luminescence. The annealing temperatures were reached with a ramp rate of 5 C. s.sup.1 and the RTP system was flushed with 9 SLM N.sub.2 containing 7% H.sub.2 during the entire annealing procedure.
(18) The excitation and emission spectra of the luminescent layer of
(19) Different deposition techniques may be used to form an Eu.sup.2+ doped SiAlON thin film according to the embodiments described in this application. The deposition processes are designed such that an amorphous SiAlON:Eu.sup.2+ is formed on a substrate which may be used to form amorphous scatter-free or at least a low-scattering luminescent greenhouse glazing structures.
(20) In an embodiment, a sputtering method, preferably a reactive magnetron sputtering technique, based on the elements Al, Si, O and N (SiAlON) may be used. The thin film may be deposited on various glazing of different materials, including but not limited to float glass, quartz glass, borosilicate glass, low-iron glass, etc. The glazing may be kept at room temperature or at elevated temperatures up to 650 C. for glass and up to 1300 C. for quartz. In a preferred embodiment, a low-temperature deposition technique may be selected to deposit or grow the luminescent thin film.
(21) An exemplary synthesis method for producing an amorphous Eu.sup.2+ doped SiAlON thin film may include the following steps: prior to the deposition, the substrate may be cleaned by rinsing with ethanol and/or DI water. the deposition may be carried out with separate Al, Si, and Eu targets and/or combined AlSiEu target (for example 71% Si, 28% Al, 1% Eu); during sputtering, the process gas flow may comprise of a mixture of Ar, O.sub.2, N.sub.2 and H.sub.2 (for example 18 sccm Ar, 0.75 sccm O.sub.2, 13.25 sccm N.sub.2 and 0.4 sccm H.sub.2); following the sputter deposition, the sample may be annealed at temperatures between of 50 and 1400 C. to enhance the luminescence, preferably an annealing step and an annealing temperature is selected that is compatible with the fabrication processes of the glass industry; during annealing, system may be flushed with forming gas containing H.sub.2 during the entire annealing procedure.
(22) A glazing coated with an amorphous SiAlON:Eu.sup.2+ thin film layer that is produced by the sputtering process described above exhibits excellent optical properties such as transparency in the PAR region and haze. As shown in
(23) In an embodiment, a wet coating technique may be used to deposit an SiAlON:Eu.sup.2+ thin film on a glazing structure. In particular, a sol-gel wet-coating may be used. A solution may be prepared containing precursors for elemental Si, Al, O, N, and Eu, which can be directly applied onto a glazing by conventional wet coating techniques. Different post-deposition treatments, including an annealing treatment, can be applied to a sol-gel coated glazing. Traces of binder material precursors can also be included in the liquid precursor for different purposes such as controlling solution viscosity, increasing coating adhesion, minimizing coating porosity, altering coating surface morphology, etc.
(24) An exemplary sol-gel coating technique for forming a SiAlON:Eu2+ thin film coated glazing may include the following steps: stoichiometrically weighting 7.7447 g Si(OC.sub.2H.sub.5).sub.4, 0.3299 g Al(NO.sub.3).sub.3, 0.0681 g Eu.sub.2O.sub.3; dissolving the Eu.sub.2O.sub.3 in minimal amount of diluted nitric acid; dissolving Al(NO.sub.3).sub.3 in ethanol and placing it on a heating plate; dissolving TEOS (Si(OC.sub.2H.sub.5).sub.4) in ethanol and placing it on a heating plate; mixing TEOS solution with Al(NO.sub.3).sub.3 solution and Eu.sub.2O.sub.3 solution to form a mixture of sol; diluting the sol to the wt. concentration to 10% of oxide; spraying or spin coating the diluted solution on the glass substrate and aging for 72 hours days under 60 C.; calcinating at 500 C. to fully remove organic residual; using a flash annealing or rapid thermal processing facility to anneal the coating at 1000 C. under reducing atmosphere.
(25) Based on these deposition techniques, different SiAlON:Eu.sup.2 thin films may be produced, wherein, per 1 molar SiAlON:Eu.sup.2+ product, the Eu.sup.2+ dopant concentration may be selected between 0.01 and 49.99 mol % of cations (Si and Al) and the Si/Al ratio may be selected between 99:1 and 1:99. In another embodiment, the Eu.sup.2+ dopant concentration may be between selected between 0.5% and 10 mol % of cations (Si and Al) and the Si/Al ratio may be selected between 20:1 and 1:20.
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(28) The length of the glazing may be selected between 300 and 100 cm, preferably 250 and 140 cm, more preferably 220 and 160 cm and the width of the glazing may be selected between 200 and 40, preferably 180 and 50, more preferably between 160 and 60 cm. Typical dimensions (lengthwidth) may include: 2.1401.122, 1.6501.22, 1.650997 and 1.650730 mm. Further, a glazing may have a thickness between 6 and 3 mm, preferably 5.5 and 3.5 mm, more preferably 5.0 and 3.5 mm.
(29) A SiAlON:Eu.sup.2 thin film 608 may be deposited based on a sputtering method or a sol-gel method on the first surface of the substrate. The thickness of the SiAlON:Eu.sup.2 thin film may be between 2000 and 10 nm, preferably between 1000 and 50 nm, more preferably between 800 and 80 nm. Here, the composition of the SiAlON:Eu.sup.2 may be selected so that efficient UV absorption is achieved without requiring relatively thick thin film layers. This requirement is important as the thickness and the refractive index of the luminescent layer will contribute to the optical properties of the luminescent glazing structure.
(30) A broadband anti-reflection (AR) thin film structure 610 may be provided over the luminescent thin film for reducing the percentage of reflected light and enable to achieve higher transmission through the glass. The AR thin film structure may include one or more thin film layers of low refractive index materials. In an embodiment, the AR thin film structure may comprise at least one porous SiO2 thin film layer. Porous SiO2 thin films are known to have good anti-reflective properties and are used as AR coatings in solar cells. Additional advantage of porous SiO2 is that the presence of scattering centres in the porous coating may increase the inherent volume scattering, thereby improving outcoupling of light out of the glazing. Porous SiO2 coating may be based on reactive high-power impulse magnetron sputtering at high working pressure as described in the article by Kim et al, Anti-reflection porous SiO2 thin film deposited using reactive high power impulse magnetron sputtering at high working pressure for use in a-Si:H solar cells, in Solar Energy Materials & Solar Cells, 130 (2014) pp 582-586. Alternatively, these layers may be deposited using plasma-enhanced chemical vapour deposition technique (PECVD) as described by Barranco et al Room temperature synthesis of porous SiO2 thin films by plasma enhanced chemical vapor deposition, Journal of Vacuum Science & Technology A 22, 1275-1284 (2004) or co-sputtering of the coating with a soluble material (such as a halide, such as NaCl) followed by immersion in water to remove the soluble material, to obtain a porous sponge-like structure as described by Dedoncker et al, Sputter deposition of porous thin films form metal/NaCl powder targets, App. Phys. Lett, 115, 041601 (2019). The contents of these articles may be incorporated by reference into this application.
(31) In addition and/or alternatively to a porous ARC thin film such as illustrated in
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(33) In an embodiment, the anti-reflection structure may include two or more dielectric layers, wherein the thicknesses and the refractive indices of the dielectric layers are selected to form an AR structure for the glazing of a glass composition which typically has a refractive index of approx. 1.5. In an embodiment, such AR thin film structure may be provided over the one or more luminescent layers that are provided on a greenhouse glazing, i.e. a glass pane that is suitable for use in greenhouses. The stack of dielectric thin film layers may include alternating high and low refractive index layers. Preferably the high- and low refractive index layers are composed a SiAlON composition or a Eu2+ doped SiAlON composition.
(34) In an embodiment, a low refractive index dielectric layer may include for example a SiO.sub.2 layer or a dielectric layer of a material having a similar (or lower) refractive index as (than) SiO.sub.2. Such layer may have a refractive index of approx. 1.5 or lower (referred to as low n dielectric material). In another embodiment, a high refractive index dielectric layer may include for example an AlN layer or a dielectric layer of a material having a similar (or higher) refractive index as (than) AlN. Such layer will have a refractive index of approx. 2 or higher (referred to as high n dielectric material). In a further embodiment, an oxinitride SiAlON layer may be used for a dielectric layer having a refractive index between 1.48 (SiO.sub.2) and 2.16 (AlN) depending on the SiAlON composition. Based on these materials, an AR coating can be designed which can couple UV and visible light, in particular PAR, into the luminescent layer.
(35) In an embodiment, the multilayer AR coating may include a stack of dielectric layers, in this case seven dielectric layers of the following thickness and composition: 150.36 nm (low n layer 710.sub.1)/13.01 nm (high n layer 710.sub.2)/27.99 nm (low n layer 710.sub.3)/43.90 nm (high n layer 710.sub.4)/11.56 nm (low n layer 710.sub.5)/32.64 nm (high n layer 710.sub.6)/81.43 nm (low n layer 710.sub.7) wherein the low n dielectric material may be SiO.sub.2 and the high n dielectric material may be AlN. It is noted that the layers in
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(37) In this embodiment, the dielectric thin film stack may comprise one or more luminescent layers. Hence, in this embodiment, the luminescent material may be integrated in or embattled in an AR structure which is configured to couple UV and PAR light into the coating. In an embodiment, a low refractive index (low n) dielectric layer may include a SiO.sub.2 layer doped with a few at. % Al.sup.3+, N.sup.3+ and Eu.sup.2+ ions. Such layer will have a refractive index of approx. 1.50. In an embodiment, a high refractive index (high n) dielectric layer may include AlN layer doped with a few at. % Si.sup.4+, O.sup.2+ and Eu.sup.2+ ions. Such dielectric layer will have a refractive index of approx. 2.14. In an embodiment, the luminescent multilayer AR coating may include a stack of dielectric layers, in this case five dielectric layers of the following thickness and composition: 139.47 nm (low n layer 712.sub.1)/12.30 nm (high n layer 712.sub.2)/26.07 nm (low n layer 712.sub.3)/100.86 nm (high n layer 712.sub.4)/76.05 nm (low n layer 712.sub.5).
(38) A sputtering process may be used to realize a luminescent thin-film AR stack. For example, a thin-film stack with five layers may be realized based on the following process steps: prior to the deposition, the substrate may be cleaned by rinsing with ethanol and/or DI water. the deposition may be carried out with separate Al, Si, and Eu targets and/or combined AlSiEu target (for example 91.5% Si, 7.5% Al, 1% Eu); during sputtering, the process gas flow may comprise of a mixture of Ar, O2, N2 and H2 (for example 18 sccm Ar, 0.75 sccm O2, 13.25 sccm N2 and 0.4 sccm H2); An AR stack may comprise of 5 layers where The top layer is a SiAlO:Eu layer of 91 nm thickness sputtered with 18 sccm Ar and 1.2 sccm 02 for 1201 seconds The second layer is a SiAlN layer of 68 nm thickness sputtered with 18 sccm Ar and 14 sccm N2 for 3931 seconds The third layer is a SiAlO:Eu layer of 26 nm thickness sputtered with 18 sccm Ar and 1.2 sccm O2 for 343 seconds The forth layer is a SiAlN layer of 26 nm thickness sputtered with 18 sccm Ar and 14 sccm N2 for 1503 seconds The fifth layer can be as thick as necessary for sufficient luminescence conversion but for example 800 nm thickness sputtered with 18 sccm Ar and 1.2 sccm 02 for 10558 seconds During the sputter deposition, the substrate may be heated to enhance the luminescence to temperatures between of 50 and 650 C. following the sputter deposition, the sample may be annealed at temperatures between of 50 and 1400 C. to enhance the luminescence, preferably an annealing step and an annealing temperature is selected that is compatible with the fabrication processes of the glass industry; during annealing, system may be flushed with forming gas containing H2 during the entire annealing procedure
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(40) TABLE-US-00001 TABLE 1 parameters of a three-layer luminescent thin film AR structure. Layer number 1 2 3 material SiAlON:Eu2+ SiAlN SiAlON:Eu2+ Refractive index type Low-n High-n Low-n Thickness (nm) 528 27 108
(41) The thin films are fabricated as a thin film stack on a quartz substrate.
(42) The luminescent glazing structures described with reference
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(44) In this embodiment, the top surface of the thin film structure, e.g. a SiAlON:Eu.sup.2 thin film, may be subjected to a surface treatment to introduce a light scattering top surface 910. The surface scattering interface may be introduced to maximize light coupling out of the second (bottom) surface of the glazing. The surface treatment may include an etching step resulting in a textured surface.
(45) The etching process may be a wet etching process or a dry etching process. The wet etching process works by dissolving parts of the surface by immersing it in a chemical solution. In an embodiment, a mask may be used to selectively etch the material. A dry etching process may be based on sputtering or dissolution of the material at. This may be achieved by a reactive ion etching step or ion beams. The resulting surface characteristics (and therefore scattering properties) can be tuned by adjusting various etching parameters (e.g. plasma feed gas, reactive gas types and flows, gas pressure, etch time etc.) and measuring the scattering properties of the textured surface. The textured surface may have a regular (period) pattern or it may have a random pattern.
(46) The texture patterns may have features (diameters and heights) in the nanometer to micrometer range. Texture features fabricated on the basis of a mask-based etching process may include cones, pyramids, microlenses in nanometer range (approx. 10 nm up to 1000 nm) or features in the micrometer range, e.g. 1 micrometer up to 500 micrometer. Alternatively, texture features fabricated on the basis of a mask-les etching process, may result in substantially random texture features with dimensions in the nanometer range or micrometer range.
(47) A measure for the surface roughness of the surface interface is the standard deviation of the Gaussian scattering distribution of light scattered at the surface interface. Such measurements are well known in the art, e.g. Kurita et al, Optical surface roughness measurement from scattered light approximated by two-dimensional Gaussian function, Transactions on Engineering Sciences vol. 2, 1993. This article may hereby incorporated by reference in this disclosure.
(48) The effect of surface scattering on light coupling out of the glazing structure of
(49) This figure shows that increasing the scattering properties, i.e. the standard deviation of the Gaussian scattering distribution of the top interface significantly improves bottom outcoupling of light. As shown in this figure, the bottom escape efficiency 916 drastically increases (more than 70% up to 78%) with increasing scattering properties of the top surface. In an embodiment, the top surface may be etched to introduce a surface texture with a standard deviation of the Gaussian scattering distribution of more than 20 degrees, leading to an escape efficiency of around 70%. In this particular embodiment, the second surface 906 of the glazing and the interface between the first surface 904 of the glazing and the luminescent thin film are smooth, non-scattering interfaces.
(50) A luminescent film may be deposited on the surface of a glazing of diffusive glass by sputtering under low power and low temperature. This way lateral diffusion of dopants into the glazing can be substantially reduced so that low scattering interface is achieved. A highly scattering top surface may involve etching of the luminescent coating itself. The etching treatment may also decrease the refractive index of the top interface therefore also providing an anti-reflective function.
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(52) In this embodiment, before depositing the one or more SiAlON:Eu.sup.2 thin film layers onto the surface of the glazing, the surface of the glazing, a glass pane, may be subjected to a surface treatment to introduce a textured surface for light scattering in a similar way as described with reference to
(53) The effects of the scattering interface of both variants are shown in
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(55) In the embodiment of
(56) The glazing 1102.sub.1 may include a diffused glass material. The diffusive glass material may be optimized for light transmission (in particular light transmission in the PAR region), while scattering the light in random directions when the light leaves the substrate. In an embodiment, the glazing may comprise scattering structures for scattering the light in a diffusive way. Instead of a glass substrate, a (diffused) transparent polymer-based substrate may be used, wherein the substrate is provided with light scattering structures so that diffusive light leaves optical structure on the second surface.
(57) The optical structure depicted in
(58) In the embodiment of
(59) The optical structure depicted in
(60) It is submitted that the invention is not limited to the optical structures as described with reference to
(61) Further, in an embodiment, instead of providing one or more luminescent layers over the first surface (or in addition to providing one or more luminescent layers over a the first surface), a low-scattering or low-scattering luminescent layer may be provided over the second surface of the transparent substrate, which deepening on the applicationmay either be a high-scattering (diffused) substrate or a low-scattering substrate.
(62)
(63)
(64) In an embodiment, a reflective screen 1218 that can be folded out into an expanded state so that it extends over at least part of the back surface of the optical structure. This way, the reflective screen may prevent (part of) the solar radiation from entering the greenhouse and, additionally, help to increase the trapping of light into the optical structure as illustrated in
(65)
(66) The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms a, an, and the are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms comprises and/or comprising, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
(67) The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope of the appending claims and spirit of the invention. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.