Halogen-free modified high-filling recyclable plastic board and method of forming the same

Abstract

A halogen-free modified high-filling recyclable plastic board is provided in this disclosure, which includes a substrate layer and a printed layer and a protective layer disposed sequentially on the substrate layer from bottom to top. Raw materials of the substrate layer include, by weight in percent, 20 to 25% of PEAT resin, 70 to 75% of stone powder, 0.5 to 0.8% of chain extender, 1 to 2% of white mineral oil, 3 to 6% PE, and 0.4 to 0.8% stearic acid. The plastic board according to the present disclosure is formed using a hot press process, without glue bonding and with good integrity; and the manufactured board is large in surface tension, its surface is easy to be processed and a substrate layer thereof has good compatibility with a printed layer and a protective layer, which can be recycled as a whole.

Claims

1. A halogen-free modified high-filling recyclable plastic board, comprising a substrate layer, and a printed layer and a protective layer disposed sequentially on the substrate layer from bottom to top; wherein raw materials of the substrate layer include, by weight in percent, 20 to 25% of polyethylene terephthalate-co-polyethylene adipate (PEAT) resin, 70 to 75% of stone powder, 0.5 to 0.8% of chain extender, 1 to 2% of white mineral oil, 3 to 6% polyethylene (PE), and 0.4 to 0.8% stearic acid.

2. The halogen-free modified high-filling recyclable plastic board according to claim 1, wherein the PEAT resin is prepared by esterification reaction of 65 to 70% of Pure Terephthalic Acid (PTA), 13 to 20% of adipic acid, 13 to 20% of ethylene glycol, 0.0012 to 0.0025% of phosphoric acid and its ester derivatives, 1 to 1.5% of diethylene glycol and 0.02 to 0.03% of catalyst, by weight in percent.

3. The halogen-free modified high-filling recyclable plastic board according to claim 2, wherein the catalyst is ethylene glycol antimony.

4. The halogen-free modified high-filling recyclable plastic board according to claim 1, wherein the PEAT resin is prepared by esterification reaction of 55 to 60% of PTA, 13 to 20% of adipic acid, 13 to 20% of ethylene glycol, 0.0012 to 0.0025% of phosphoric acid and its ester derivatives, 1 to 1.5% of diethylene glycol, 0.02 to 0.03% of catalyst and 10 to 15% of recycled polyethylene terephthalate (PET), by weight in percent.

5. The halogen-free modified high-filling recyclable plastic board according to claim 3, wherein the catalyst is ethylene glycol antimony.

6. The halogen-free modified high-filling recyclable plastic board according to claim 1, wherein the chain extender is 2-methyl-2-propenoic acid oxiranylmethyl ester.

7. The halogen-free modified high-filling recyclable plastic board according to claim 1, wherein the PE is high density polyethylene (HDPE).

8. The halogen-free modified high-filling recyclable plastic board according to claim 1, wherein a lower surface of the substrate layer is provided with a balance layer, the protective layer and the balance layer being all poly (ethylene terephthalate-co-1,4-cylclohexylenedimethylene terephthalate) (PETG) transparent sheets.

Description

DETAILED DESCRIPTION

(1) In the following, a detailed and complete description of the present disclosure will be made with specific embodiments.

Embodiment 1

(2) 16 parts of PEAT resin, 50 parts of stone powder, 0.5 parts of chain extender, 0.8 parts of white mineral oil, 0.4 parts of stearic acid and 3 parts of PE (by weight) were stirred at a high speed. When a stirring temperature reached 100 C., stirring was stopped, and materials were fed by a feeder and extruded by a twin-screw extruder. Five stages of extrusion temperatures were set at 210 C., 200 C., 195 C., 190 C. and 185 C. respectively, with duration for each of stages of extrusion temperatures of 15 s. Vacuum treatment is performed between the third and fourth stages of temperatures with a vacuum of 0.8 mpa, and with temperatures at both ends of a mold being set at 210 C. and a temperature at its middle part being set at 200 C., extrusion is performed and pressing into sheets is performed by two steel rollers with temperatures of both steel rollers of 140 C. At the same time, a PETG printed layer and a PETG transparent sheet (with 0.01 mm embossing on a bonding surface thereof) are bonded on its surface by a rubber roller, and then pressing is performed by two steel rollers, with a temperature of an upper steel roller with embossing of 150 C. and a temperature of a lower steel roller of 140 C. The compounded board was cooled to 50 C. for cutting into slices.

Embodiment 2

(3) 16 parts of PEAT resin, 55 parts of stone powder, 0.5 parts of chain extender, 0.8 parts of white mineral oil, 0.4 parts of stearic acid and 3 parts of PE (by weight) were stirred at a high speed. When a stirring temperature reached 100 C., stirring was stopped, and materials were fed by a feeder and extruded by a twin-screw extruder. Five stages of extrusion temperatures were set at 210 C., 205 C., 200 C., 190 C. and 185 C. respectively, with duration for each of stages of extrusion temperatures of 15 s. Vacuum treatment is performed between the third and fourth stages of temperatures with a vacuum of 0.8 mpa, and with temperatures at both ends of a mold being set at 210 C. and a temperature at its middle part being set at 200 C., extrusion is performed and pressing into sheets is performed by two steel rollers so as to obtain the substrate layer. A surface of the substrate layer is digitally printed to form the printed layer, uv can be coated on a surface of the printed layer for pattern protection, and texture is provided by digital 3D printing.

Embodiment 3

(4) 16 parts of PEAT resin, 55 parts of stone powder, 0.5 parts of chain extender, 0.8 parts of white mineral oil, 0.4 parts of stearic acid and 3 parts of PE (by weight) were stirred at a high speed. When a stirring temperature reached 100 C., stirring was stopped, and materials were fed by a feeder and extruded by a twin-screw extruder. Five stages of extrusion temperatures were set at 210 C., 205 C., 200 C., 190 C. and 185 C. respectively, with duration for each of stages of extrusion temperatures of 15 s. Vacuum treatment is performed between the third and fourth stages of temperatures with a vacuum of 0.8 mpa, and with temperatures at both ends of a mold being set at 210 C. and a temperature at its middle part being set at 200 C., extrusion is performed and pressing into sheets is performed by two steel rollers. A PETG printed layer was placed on a surface of the substrate and a PETG transparent sheet was placed on a surface of the printed layer to respectively form a protective layer and a balance layer at a bottom of the substrate, and steel plates was placed on top and bottom thereof to press using a press. A hot pressing temperature of the press is 130 C., a pressure of the press is set to be with three sections of 4, 5 and 6 mpa, with duration for respective sections being 6 minutes, 8 minutes and 8 minutes, respectively; and a cold machine is set to be with a temperature of 35 C., and the pressure is set to three sections of 8, 9 and 10 mpa, with duration for respective sections being 6 minutes, 10 minutes and 10 minutes, respectively, so as to obtain the plastic board.

(5) The above is only preferred embodiments of the present disclosure, which does not limit a protection scope of the present disclosure. Any equivalent structural transformation made with content of the specification of the present disclosure, which is directly or indirectly applied to other related technical fields, is included within the scope of the disclosure.