Low resistance polyethylene sheath with combined adhesive and mechanical properties
20220336121 · 2022-10-20
Inventors
Cpc classification
B29C48/154
PERFORMING OPERATIONS; TRANSPORTING
H01B7/282
ELECTRICITY
B29C48/022
PERFORMING OPERATIONS; TRANSPORTING
International classification
H01B7/282
ELECTRICITY
B29C48/00
PERFORMING OPERATIONS; TRANSPORTING
B29C48/154
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A water barrier for encapsulating a cable core has a layer of metal foil having a thickness of t.sub.1, and a single layer of a polyethylene-based polymer having a thickness of t.sub.2. The ratio t.sub.2:t.sub.1 is at least seven and the single layer of a polyethylene-based polymer has been deposited onto the metal foil by extrusion at an extrusion temperature of at least 150° C. with the metal foil preheated to a temperature of at least 130° C.
Claims
1. A water barrier for surrounding a cable core, said water barrier comprising an inner layer of lead-free metal foil having a thickness of t.sub.1, and an outer single layer of a polyethylene-based semi-conducting polymer having a thickness of t.sub.2, wherein the ratio t.sub.2:t.sub.1 is at least 7.
2. The water barrier according to claim 1, wherein the single layer of a polyethylene-based semi-conducting polymer has been deposited by extrusion at an extrusion temperature of at least 100° C. onto the metal foil layer, the outer surface of the metal foil being heated to a temperature of at least 100° C.
3. The water barrier according to claim 1, wherein the metal foil is selected from the group consisting of: aluminium, an aluminium alloy of the AA1xxx series, AA5xxx series or the AA6xxx series according to the Aluminium Association Standard, copper, a copper-alloy, a CuNi-alloy, a CuNiSi-alloy, iron, a Fe-alloy, a stainless steel alloy SS316, and a stainless steel alloy S32750.
4. The water barrier according to claim 1, wherein the metal foil is selected from the group consisting of pure copper and a Cu-alloy.
5. The water barrier according to claim 1, wherein the metal foil layer is non-corrugated.
6. The water barrier according to claim 1, wherein the thickness of the metal foil is from 10 to 1000 μm.
7. The water barrier according to claim 1, wherein the polymer of the single layer of a polyethylene-based semi-conducting polymer is selected from the group consisting of: a low density polyethylene (LDPE), a linear low density polyethylene (LLDPE), a medium density polyethylene (MDPE), and a high density polyethylene (HDPE), constituted of a copolymer of ethylene with one or more polar monomers selected from the group consisting of acrylic acid, methacrylic acid, glycidyl methacrylate, maleic acid, or maleic anhydride and any combination thereof.
8. The water barrier according to claim 1, wherein the polyethylene-based polymer is made electrically semi-conducting by addition and homogenisation of 4 to 40 weight % particulate carbon, silver or aluminum in the polymer mass.
9. The water barrier according to claim 8, wherein the particulate carbon is selected from the group consisting of comminuted petrol coke, comminuted anthracite, comminuted char coal, carbon black, and carbon nanotubes.
10. The water barrier according to claim 8, wherein the particulate carbon is carbon black.
11. A power cable comprising the water barrier according to claim 1, wherein the water barrier surrounds a cable core of said power cable.
12. The power cable according to claim 11, wherein the water barrier is outermost layer of the power cable.
13. The power cable according to claim 11, wherein the water barrier is covered with armouring or an outer mantel.
14. A method of manufacturing a water barrier for surrounding a cable core, the method comprising the steps of: a) providing a layer of lead-free metal foil having a thickness t.sub.1, b) welding said layer around the cable core, c) heating a semi-conducting polyethylene-based polymer to a temperature of at least 100° C., d) heating the outer surface of the metal foil layer to a temperature of at least 100° C., and e) depositing onto the outer surface of the metal foil layer by extrusion a single layer of a polyethylene-based polymer having a thickness t.sub.2, at an extrusion temperature of at least 100° C. wherein the ratio t.sub.2:t.sub.1 is at least 7.
15. The water barrier according to claim 4, wherein the metal foil is selected from the group consisting of pure copper, a CuNi-alloy and a CuNiSi-alloy.
16. The water barrier according to claim 1, wherein the thickness of the metal foil is from 10 to 700 μm.
17. The water barrier according to claim 1, wherein the thickness of the metal foil is from 10 to 500 μm.
18. The water barrier according to claim 1, wherein the thickness of the metal foil is from 10 to 250 μm.
19. The water barrier according to claim 1, wherein the thickness of the metal foil is from 10 to 75 μm.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0045] The present invention is described in detail by reference to the following drawings:
[0046]
[0047]
DETAILED DESCRIPTION OF THE INVENTION
[0048] High-voltage subsea power cables operating with highest continuous voltage (Um) over 72.5 kV are required to be dry, and they are usually sheathed with a lead water-barrier at Um>36 kV as recommended by IEC 60840. Lead sheathing has been under scrutiny because of the negative impact of lead on the environment and will most likely be banned in the future. This means that alternative solutions need to be developed.
[0049] The use of a lead-free metal and polyethylene laminate as water barrier has been evaluated as an alternative solution. One challenge associated with water barriers of stiffer materials such as welded copper is a reduced buckling resistance under bending.
[0050] Lead-free water barrier known in the art describe a laminate system, comprising a metal foil layer, an adhesive layer and a polymeric jacket.
[0051] Assembly of the present invention, in a dry high voltage subsea power cable 1 is illustrated in
[0052] Thereafter, as shown in
[0053] The Metal Foil Layer 4
[0054] The metal foil layer 4 according to the present invention can have a thickness needed to meet electrical properties requirements and fatigue resistance according to the invention.
[0055] The metal foil layer 4 is formed from a conducting metal material, preferably consisting of copper, steel or aluminum, for example, and more preferably from a readily weldable metal. In one example embodiment, the metal foil is either an Al/Al-alloy such as for example an AA1xxx series, an AA5xxx series or an AA6xxx series alloy according to the Aluminium Association Standard, or a Cu/Cu-alloy such as for example pure Cu, a CuNi-alloy or a CuNiSi-alloy, or a Fe/Fe-alloy, such for example stainless alloy SS316 or S32750. The most preferred metallic moisture barrier is a copper alloy moisture barrier, preferably pure Cu or a CuNiSi-alloy.
[0056] The most preferred design of the metal foil layer 4 is a tube, so that the metal foil layer 4 is preferably a metallic tube.
[0057] The metal foil layer 4 may be obtained from a strip of metal, which can be wrapped around the insulation of the electrical conductor. Then the metallic strip may be longitudinally welded to form an exogenous or autogenously welded metallic tube.
[0058] The diameter of the welded sheath may thereby be reduced by either drawing or rolling.
[0059] The metal foil 4 (or the metallic tube) may preferably be non-corrugated in order to get a substantially 100% void-free interface between the single-layer of a polyethylene-based polymer 5 and said metal foil layer 4 (or said metallic tube).
[0060] The thickness, t.sub.1, of the metal foil layer 4 may in an example embodiment be in one of the following ranges; from 10 to 1000 μm, preferably from 10 to 700 μm, more preferably from 10 to 500 μm, more preferably from 10 to 250 μm, and most preferably from 10 to 75 μm.
[0061] The Semi-Conductive Polymeric Layer 5
[0062] The semi-conductive polymeric layer 5 is typically any polyethylene-based polymer used in electrical insulation applications, and being preferably easily extrudable, which has been rendered semi-conductive by incorporation of electrically semi-conductive filler.
[0063] The polyethylene-based polymer may in one example embodiment be either a low density polyethylene (LDPE), a linear low density polyethylene (LLDPE), a medium density polyethylene (MDPE), or a high density polyethylene (HDPE) constituted of a copolymer of ethylene with one or more polar monomers of acrylic acid, methacrylic acid, glycidyl methacrylate, maleic acid, or maleic anhydride or any combination thereof.
[0064] Examples of suitable polyethylene-based polymers include, but are not limited to: [0065] copolymer of ethylene and ethyl acrylate or similar acrylates; [0066] copolymer of ethylene and ethyl acrylic acid, methacrylic acid or similar; [0067] copolymer of ethylene and glycidyl methacrylate or similar epoxy-based monomer such as 1,2-epoxy-1-butene or similar; or [0068] copolymer of ethylene and maleic-anhydride, or similar.
[0069] These copolymer of ethylene with one or more polar monomers will obtain an excellent adherence to the metal foil layer 4 if deposited by an extrusion et elevated temperature of at least 100° C. for the polymer and of at least 100° C. for the outer surface of the metal foil. These temperatures are chosen independently. According to a particular embodiment of the invention, these temperatures are identical.
[0070] The polyethylene-based polymer may in one example embodiment be made electrically semi-conducting by addition and homogenisation of 4 to 40 weight % particulate carbon, silver or aluminium in the polymer mass to enable carrying away capacitive charges.
[0071] Examples of suited particulate carbon includes but is not limited to: comminuted petrol coke, comminuted anthracite, comminuted char coal, carbon black, carbon nanotubes, etc.
[0072] The preferred semi-conductive polymer layer 5 has incorporated therein a loading of carbon black from 4 to 30% by weight of the composition.
[0073] According to a particular embodiment of the invention, the semi-conductive polymeric layer 5 can be the most outer layer of the cable.
[0074] Furthermore, the semi-conductive polymeric layer 5 may be not cross-linked.
[0075] Since there is no adhesive layer between the metal foil layer 4 and the semi-conductive polymeric layer 5, in order for the polymer layer 5 to have a better adhesion to the metal foil layer 4, it may advantageously be extruded at high temperatures over 100° C., and the outer surface of the metal foil layer 4 may also advantageously be pre-heated at over 100° C. This can be achieved for example by induction heating or by air heating. The outer surface of the metal foil layer 4 may also advantageously be thoroughly cleaned from grease and dirt before this process. The polymer layer 5 is of sufficient thickness to guarantee the necessary mechanical stability, that is to say at least seven times thicker than the metal foil layer 4.
[0076] Testing of the adhesion of the semi-conductive polymeric layer 5 onto the metal foil layer 4 may be conducted according to IEC62067. To be sufficient, the peeling strength shall be more than 0.5 N/mm according to IEC62067.
[0077] In one embodiment, the value of the adhesion of the semi-conductive polymeric layer 5 onto the metal foil layer 4 is more than 0.5 N/mm according to IEC62067. In an alternative embodiment the value of the adhesion is in the range of 0.5 to 5 N/mm according to IEC62067. In an alternative embodiment the value of the adhesion is in the range of 1.0 to 1.5 N/mm according to IEC62067.
[0078] Outer Layer
[0079] As shown in