METHOD FOR PREPARING COPPER-PLATED TITANIUM ALLOY WIRE REINFORCED ALUMINUM-BASED COMPOSITE MATERIAL

Abstract

The present disclosure discloses a method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material, including steps of: etching a cleaned TC4 wire; then electroplating a copper layer to obtain a copper-plated titanium alloy wire; performing heat treatment with two-step slow cooling on the copper-plated titanium alloy wire by using a heat treatment furnace; and, cladding a single-layer and single-pass ER5356 aluminum alloy on an aluminum alloy substrate by an arc additive manufacturing technology, then flatly spreading the heat-treated copper-plated titanium alloy wire in the center of the cladding layer to form an intermediate layer, and finally cladding a single-layer and single-pass ER5356 aluminum alloy matrix on the surface of the intermediate layer. In the present invention, by using copper as a transition interlayer of the aluminum-titanium interface, the generation of brittle intermetallic compounds between aluminum and titanium can be completely suppressed.

Claims

1. A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material, comprising the following steps of: step 1: pretreating a TC4 wire, comprising etching the cleaned TC4 wire; wherein, in the step 1, pretreating the TC4 wire comprises: grinding the surface of the TC4 wire by a piece of sand paper, then pickling with H.sub.2SO.sub.4, degreasing with NaOH, cleaning with ethyl alcohol, drying, and finally etching, wherein the concentration of H.sub.2SO.sub.4 is 5 wt % to 10 wt %, and the concentration of NaOH is 1 wt % to 3 wt %; and the cleaned TC4 wire is etched using an etching solution, the etching temperature is 35 C. to 50 C. and the etching time is 15 min to 30 min; the etching solution is composed of 10 wt %-15 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 5 wt %-10 wt % H.sub.2O, and the total mass percentage of the above components is 100%; wherein the volume concentration of the HF aqueous solution is 40%; step 2: electroplating a copper layer on the etched TC4 wire to obtain a copper-plated titanium alloy wire; wherein the TC4 wire has a diameter of 0.2 mm to 0.5 mm, and the copper-plated layer of the copper-plated titanium alloy wire has a thickness of 50 m to 80 m; wherein, in the step 2, during electroplating the copper layer on the etched TC4 wire, the electroplating solution is composed of 55 wt %-83 wt % CuSO.sub.4.Math.5H.sub.2O, 14 wt %-42 wt % H.sub.2SO.sub.4, <1 wt % emulsifier, <1 wt % sodium sulfonate and <1 wt % sodium chloride, and the total mass percentage of the above components is 100%; the deposition temperature is 60 C. to 80 C. the deposition current is 0.01 A to 0.09 A, and the deposition time is 30 min to 120 min; step 3: performing heat treatment with two-step slow cooling on the copper-plated titanium alloy wire by using a heat treatment furnace, comprising raising the furnace temperature to 820 C. to 880 C. at 10 C./min, keeping the temperature for 15 min to 60 min, then performing two-stage slow cooling, and finally cooling to the room temperature along with the furnace; wherein, in the step 3, before raising the furnace temperature to 820 C. to 880 C. the furnace temperature is raised to 740 C. at 10 C./min and kept for 10 min: the cooling speed in the two-stage slow cooling is 5 C./min; and, the temperature is cooled from 820 C.-880 C. to 740 C. and kept for 5 min in the first stage, and cooled from 740 C. to 500 C. in the second stage; and step 4: cladding a single-layer and single-pass ER5356 aluminum alloy on an aluminum alloy substrate by an arc additive manufacturing technology, then flatly spreading the heat-treated copper-plated titanium alloy wire in the center of the cladding layer to form an intermediate layer, and finally cladding a single-layer and single-pass ER5356 aluminum alloy matrix on the surface of the intermediate layer.

2-7. (canceled)

8. The method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material according to claim 17, wherein, in the step 4, during cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate by the arc additive manufacturing technology, the used raw material is an ER5356 aluminum alloy wire, the wire feeding speed is 600 mm/min, the current is 60 A to 100 A, and the flow of pure argon as a protective gas is 15 L/min.

9. The method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material according to claim 8, wherein, in the step 4, the process of cladding the single-layer and single-pass ER5356 aluminum alloy matrix on the surface of the intermediate layer is the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG. 1 is a process flowchart of performing heat treatment with two-step slow cooling on the copper-plated titanium alloy wire in the method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material according to the present disclosure;

[0025] FIG. 2 is a microscopically structure diagram of the copper-plated titanium alloy wire according to Example 1 of the present disclosure;

[0026] FIG. 3 is a scanning energy spectrum chart of the cross section of the copper-plated titanium alloy wire according to Example 1 of the present disclosure;

[0027] FIG. 4 is an SEM chart of the copper-plated titanium alloy wire reinforced aluminum-based composite material according to Example 1 of the present disclosure; and

[0028] FIG. 5 is an SEM chart of the copper-plated titanium alloy wire reinforced aluminum-based composite material according to Comparison example 1 of the present disclosure;

[0029] in which: 1: TC4 wire; 2: copper-plated layer; and, 3: ER5356 aluminum alloy matrix.

DETAILED DESCRIPTION OF THE PRESENT DISCLOSURE

[0030] The present disclosure will be described below in detail by specific examples with reference to the accompanying drawings.

[0031] A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

[0032] At step 1, a TC4 wire is pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.2 mm to 0.5 mm by a piece of sand paper, then pickling with H.sub.2SO.sub.4 with a concentration of 5 wt % to 10 wt %, degreasing with NaOH with a concentration of 1 wt % to 3 wt %, cleaning with ethyl alcohol, drying and finally etching, where the etching temperature is 35 C. to 50 C.; the etching time is 15 min to 30 min; the etching solution is prepared from 10 wt %-15 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 5 wt %-10 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution is 40%.

[0033] At step 2, the etched TC4 wire 1 is electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution is composed of 55 wt %-83 wt % CuSO.sub.4.Math.5H.sub.2O, 14 wt %-42 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components is 100%; in the electroplating process of the copper layer, the deposition temperature is 60 C. to 80 C., the deposition current is 0.01 A to 0.09 A, and the deposition time is 30 min to 120 min; and, the copper-plated layer 2 of the copper-plated titanium alloy wire has a thickness of 50 m to 80 m.

[0034] At step 3, referring to FIG. 1, heat treatment with two-step slow cooling is performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min, and then raising the temperature to 820 C. to 880 C. and keeping the temperature for 15 min to 60 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling is 5 C./min, and the temperature is cooled from 820 C.-880 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

[0035] At step 4, a single-layer and single-pass ER5356 aluminum alloy is cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material is an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed is 600 mm/min, the current is 60 A to 100 A, and the flow of pure argon as a protective gas is 15 L/min; then, the heat-treated copper-plated titanium alloy wire is flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix is cladded on the surface of the intermediate layer, where the used process is the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Example 1

[0036] A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

[0037] At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.2 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 5 wt %, degreasing with NaOH with a concentration of 2 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 35 C.; the etching time was 15 min; the etching solution was prepared from 10 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 10 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

[0038] At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 55 wt % CuSO.sub.4.Math.5H.sub.2O, 42 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 60 C., the deposition current was 0.01 A, and the deposition time was 120 min.

[0039] At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 820 C. at 10 C./min and keeping the temperature for 30 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 820 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

[0040] The microstructure of the copper-plated titanium alloy wire after the heat treatment with two-step slow cooling was observed, where the cross section structure was shown in FIG. 2, with the TC4 wire 1 inside and the copper-plated layer 2 outside. The elements in the cross section of the copper-plated titanium alloy wire were detected. By taking the outermost layer of the copper-plated titanium alloy wire was taken as an origin and gradually extending inward, a scanning energy spectrum chart of the cross section of the copper-plated titanium alloy wire was shown in FIG. 3. It could be seen from FIG. 3 that, from the inside to the outside of the copper-plated titanium alloy wire, the content of Cu gradually decreased, while the content of Ti, Al and V gradually increased; and near the interface between the TC4 wire 1 and the copper-plated layer 2, the content of Ti, Al and V increased sharply, while the content of Cu decreased sharply decreased, almost to zero. It indicated that the copper-plated layer 2 could hinder the contact of the aluminum alloy matrix with the TC4 wire 1 and completely suppress the generation of brittle intermetallic compounds between aluminum and titanium.

[0041] At step 4, a ER5356 aluminum alloy was cladded in a single-layer and single-pass manner on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 60 A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix 3 was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Comparison Example 1

[0042] A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

[0043] At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.2 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 5 wt %, degreasing with NaOH with a concentration of 2 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 35 C.; the etching time was 15 min; the etching solution was prepared from 10 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 10 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

[0044] At step 2, the etched TC4 wire 1 was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 55 wt % CuSO.sub.4.Math.5H.sub.2O, 42 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 60 C., the deposition current was 0.01 A, and the deposition time was 120 min.

[0045] At step 3, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 60 A, and the flow of pure argon as a protective gas was 15 L/min; then, the copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

[0046] Compared with Example 1, in Comparison example 1, the heat treatment with two-step slow cooling was deleted, and other processes were the same.

[0047] The microstructures of the copper-plated titanium alloy wire reinforced aluminum-based composite materials prepared in Example 1 and Comparison example 1 were observed, and the observation results were shown in FIGS. 4 and 5, including the TC4 wire 1, the copper-plated layer 2 and the ER5456 aluminum alloy matrix 3. It could be seen that the copper-plated titanium alloy wire reinforced aluminum-based composite material prepared in Example 1 had a good interface state between titanium and copper and had no cracks, while the copper-plated titanium alloy wire reinforced aluminum-based composite material prepared in Comparison example 1 was not subjected to heat treatment with two-step slow cooling and had obvious cracks at the titanium-copper interface. It indicated that the heat treatment with two-step slow cooling could alleviate the shrinkage of the copper-plated titanium alloy wire, release the residual stress and avoid the formation of micro-cracks at the titanium-copper interface.

Example 2

[0048] A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

[0049] At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.3 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 6 wt %, degreasing with NaOH with a concentration of 1 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 40 C.; the etching time was 20 min; the etching solution was prepared from 12 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 8 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

[0050] At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 60 wt % CuSO.sub.4.Math.5H.sub.2O, 37 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 70 C., the deposition current was 0.03 A, and the deposition time was 100 min.

[0051] At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 840 C. at 10 C./min and keeping the temperature for 30 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 840 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

[0052] At step 4, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 70 A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Example 3

[0053] A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

[0054] At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.4 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 7 wt %, degreasing with NaOH with a concentration of 1 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 45 C.; the etching time was 25 min; the etching solution was prepared from 13 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 7 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

[0055] At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 65 wt % CuSO.sub.4.Math.5H.sub.2O, 33 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 70 C., the deposition current was 0.05 A, and the deposition time was 90 min.

[0056] At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 860 C. at 10 C./min and keeping the temperature for 30 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 860 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

[0057] At step 4, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 80 A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Example 4

[0058] A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

[0059] At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.5 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 7 wt %, degreasing with NaOH with a concentration of 3 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 45 C.; the etching time was 25 min; the etching solution was prepared from 13 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 7 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

[0060] At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 70 wt % CuSO.sub.4.Math.5H.sub.2O, 26 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 68 C., the deposition current was 0.06 A, and the deposition time was 80 min.

[0061] At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 880 C. at 10 C./min and keeping the temperature for 30 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 880 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

[0062] At step 4, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 90 A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Example 5

[0063] A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

[0064] At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.5 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 8 wt %, degreasing with NaOH with a concentration of 1 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 48 C.; the etching time was 28 min; the etching solution was prepared from 15 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 5 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

[0065] At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 78 wt % CuSO.sub.4.Math.5H.sub.2O, 20 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 70 C., the deposition current was 0.07 A, and the deposition time was 70 min.

[0066] At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 840 C. at 10 C./min and keeping the temperature for 15 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 840 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

[0067] At step 4, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 100A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Example 6

[0068] A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

[0069] At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.2 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 9 wt %, degreasing with NaOH with a concentration of 2 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 50 C.; the etching time was 30 min; the etching solution was prepared from 15 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 5 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

[0070] At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 80 wt % CuSO.sub.4.Math.5H.sub.2O, 17 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 80 C., the deposition current was 0.08 A, and the deposition time was 30 min.

[0071] At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 840 C. at 10 C./min and keeping the temperature for 45 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 840 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

[0072] At step 4, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 70 A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Example 7

[0073] A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

[0074] At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.4 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 10 wt %, degreasing with NaOH with a concentration of 3 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 50 C.; the etching time was 30 min; the etching solution was prepared from 15 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 5 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

[0075] At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 83 wt % CuSO.sub.4.Math.5H.sub.2O, 15 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 80 C., the deposition current was 0.09 A, and the deposition time was 40 min.

[0076] At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 840 C. at 10 C./min and keeping the temperature for 60 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 840 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

[0077] At step 4, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 80 A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

[0078] The mechanical properties of the ER5356 aluminum alloy matrix, the TC4 wire without copper plated (having a diameter of 0.2 mm) and the copper-plated titanium alloy wire reinforced aluminum-based composite materials prepared in Examples 1-7 were tested, and the test results were shown in Table 1 below:

TABLE-US-00001 TABLE 1 List of mechanical properties of the aluminum alloy matrix, the TC4 wire without copper plated and the samples prepared in Examples 1-7 Maximum Heat treatment time temperature for at the maximum Bending Impact Test samples heat treatment/ C. temperature/min strength/Mpa energy/J Aluminum alloy \ \ 619 14 matrix TC4 wire without \ \ 726 32 copper plated Example 1 820 30 826 53 Example 2 840 30 849 65 Example 3 860 30 911 56 Example 4 880 30 805 47 Example 5 840 15 805 48 Example 6 840 45 917 59 Example 7 840 60 852 53 - .

[0079] It could be seen from Table 1 that the copper-plated titanium alloy wire reinforced aluminum-based composite material prepared by the method of the present disclosure was good in strength and ductility.