DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND ELECTRIC CURRENT FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

Abstract

The invention relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a substrate and a data processing device. The distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate comprises a distribution body and a shield element. The distribution body comprises a plurality of openings for the process fluid. The shield element is configured to at least partially cover at least one of the plurality of openings to limit a flow of the process fluid through the distribution body.

Claims

1.-15. (canceled)

16. A distribution system for a process fluid for electrolytic surface treatment of a substrate, comprising: a distribution body, and a shield element, characterized in that the distribution body comprises a plurality of openings for the process fluid and an electrical current, wherein some of the openings are drain holes, configured to direct the electric current, and wherein the drain holes are through holes extending between a front face of the distribution body directed towards the substrate and a rear face of the distribution body opposite to the front face, and wherein other openings are jet holes configured to direct the process fluid onto the substrate, and wherein the shield element is configured to at least partially cover at least one of the plurality of openings to limit a flow of the process fluid and/or a flow of the electrical current through the distribution body so that a flow of the process fluid is modified through the distribution body and/or the electrical current distribution of the substrate is altered.

17. The distribution system according to claim 16, further comprising a process unit configured to control a coverage of the openings by the shield element based on a predetermined local deposition rate for a local portion of the substrate to be treated.

18. The distribution system according 17, wherein the process unit is further configured to determine the local deposition rate based on a local density of structures to be applied on the local portion of the substrate.

19. The distribution system according to claim 17, wherein the process unit is configured to control the coverage of the openings by the shield element to limit an electrical current distribution for chemical and/or electrolytic surface treatment of the substrate.

20. The distribution system according to claim 16, wherein the shield element is a plate shaped to cover an array of openings.

21. The distribution system according to claim 16, wherein the shield element is movable relative to the distribution body.

22. The distribution system according to claim 16, wherein the shield element is mechanically, electro-statically and/or magnetically connected to the distribution body.

23. The distribution system according to claim 16, wherein the shield element comprises a plurality of stencils to be inserted at least partially in at least some of the plurality of openings of the distribution body.

24. The distribution system according to claim 23, wherein at least one of the stencils comprises boreholes.

25. A distribution method for a process fluid for electrolytic surface treatment of a substrate, comprising the following steps: providing a distribution body, wherein the distribution body comprises a plurality of openings for the process fluid and an electrical current, wherein some of the openings are drain holes, configured to direct the electric current, and wherein the drain holes are through holes extending between a front face of the distribution body directed towards the substrate and a rear face of the distribution body opposite to the front face, and wherein other openings are jet holes configured to direct the process fluid onto the substrate, providing a shield element, wherein the shield element is configured to at least partially cover at least one of the plurality of openings to limit a flow of the process fluid and/or a flow of the electrical current through the distribution body, so that a flow of the process fluid is modified through the distribution body and/or the electrical current distribution of the substrate is altered, and controlling the flow of process fluid through the distribution body by the shield element.

26. A data processing device configured to carry out the method steps of claim 25.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Exemplary embodiments of the invention will be described in the following with reference to the accompanying drawing:

[0049] FIG. 1 shows schematically and exemplarily an embodiment of a distribution system for a process fluid and an electric current for chemical and/or electrolytic surface treatment of a substrate according to the invention.

[0050] FIGS. 2a,b show schematically and exemplarily an embodiment of a shield element arranged at a distribution body in a distribution system according to the invention.

[0051] FIGS. 3a,b show schematically and exemplarily an embodiment of a shield element arranged in a distribution system according to the invention.

[0052] FIGS. 4a,b show schematically and exemplarily an embodiment of a shield element according to the invention.

[0053] FIG. 5 show schematically and exemplarily an embodiment of a shield element according to the invention.

DETAILED DESCRIPTION OF EMBODIMENTS

[0054] FIG. 1 shows schematically and exemplarily an embodiment of a distribution system 1 for a process fluid and an electric current for chemical and/or electrolytic surface treatment of a substrate 20 according to the invention.

[0055] In chemical and/or electrolytic surface treatment techniques, a substrate 20 to be processed is attached to a substrate holder 21 and immersed into an electrolytic process fluid and serves as a cathode. An electrode is immersed into the process fluid and serves as an anode 40. A direct current is applied to the process fluid and dissociates positively charged metal ions at the anode 40. The ions then migrate to the cathode, where they plate the substrate 20 attached to the cathode.

[0056] The substrate 20 may comprise a conductor plate, a semi-conductor substrate, a film substrate, an essentially plate-shaped, metal or metallized workpiece or the like.

[0057] The distribution system 1 comprises a distribution body 10 and a shield element 30. To direct a flow of process fluid and/or an electrical current to the substrate 20, the distribution body 10 comprises a plurality of openings 11 (see also FIGS. 3a and 3b). The openings 11 may eject the process fluid to the substrate 20 and/or receive a backflow of the process fluid from the substrate 20. Other openings 11 may eject the electric current to the substrate 20. The shield element 30 is configured to cover some of the plurality of openings 11 to limit a flow of the process fluid and/or the electric current through the distribution body 10. The shield element 30 comprises at least an aperture 32, through which the process fluid and an electrical current may flow (see also FIGS. 4a and 4b).

[0058] The openings 11 to be covered by the shield element 30 may be drain holes. The drain holes may be formed as through holes extending between a front face of the distribution body 10 directed towards the substrate 20 and a rear face of the distribution body 10 opposite to the front face and directed towards the anode 40. The drain holes through the distribution body 10 are configured to provide the electric current towards the substrate 20 for the surface treatment of the substrate 20. The rear face is arranged opposite to the front face of the distribution body 10.

[0059] Alternatively, the openings 11 may be jet holes arranged on the front face and configured to direct the process fluid towards the substrate 20.

[0060] In yet another arrangement, the openings 11 may be a combination of drain holes to provide an electric current and jet holes to direct the process fluid to the substrate.

[0061] The openings 11 to be covered by the shield element 30 may be arranged at the front face of the distribution body 10. The openings 11 may be drain holes or jet holes or a mixture of both. In other words, the shield element 30 may be arranged between the substrate 20 and the distribution body 10. Alternatively, the openings 11 to be covered by the shield element 30 may be arranged at a rear face of the distribution body 10. In other words, the shield element 30 may be arranged between the anode 40 and the distribution body 10.

[0062] The distribution system 1 further comprises a process unit (not shown) configured to control a coverage of the openings 11 by means of the shield element 30 based on a predetermined local deposition rate for a local portion of the substrate 20 to be treated. The process unit is further configured to determine the local deposition rate based on a local density of structures to be applied on the local portion of the substrate 20. The process unit is also configured to control the coverage of the openings by means of the shield element to limit an electrical current distribution for chemical and/or electrolytic surface treatment of the substrate. The shield element may block or cover only the openings 11 for the process fluid or the openings 11 for electric current or a mixture of both.

[0063] FIGS. 2a and 2b show schematically and exemplarily an embodiment of a shield element 30 arranged at a distribution body 10. The shield element 30 is plate shaped to cover an array of openings 11 (see FIGS. 3a and 3b). The shield element 30 is movable relative to the distribution body 10, preferably in a vertical direction. To fixedly hold the shield element 30 at the distribution body 10, a shield element frame 31 is arranged at the distribution body 10. The shield element frame 31 comprises a groove, in which the plate shaped shield element can easily slide. Alternatively or additionally to the shield element frame 31, the shield element 30 may be connected to the distribution body 10 by applying an electrostatic, mechanical or magnetic force.

[0064] FIGS. 3a and 3b show schematically and exemplarily an embodiment of a shield element 30 arranged in a distribution system. In particular, FIG. 3a shows a distribution body 10 without a shield element 30. In contrast, FIG. 3b shows a distribution body 10, at which at least an array of the openings 11 is covered by the plate shaped shield element 30. The coverage of the openings 11 may be determined and controlled by a process unit (not shown) based on a predetermined local deposition rate for a local portion of the substrate 20 to be treated and/or a local density of structures to be applied on the local portion of the substrate 20.

[0065] The shield element 30 corresponds to the distribution body 10 in particular in view of its shape and size. As shown in FIG. 3b, the shield element 30 covers a particular portion of the openings 11 such that only the remaining uncovered openings may directly eject the process fluid or the electric current to the substrate 20. The covered openings 11 are covered by the shield element 30 such that the process fluid out of these openings 11 may not directly reach the substrate 20 and/or the electric current may not directly reach the substrate 20 (see also FIGS. 4a and 4b). A bulk material of the shield element 30 may cover for example 30%, 50% or 70% of the openings 11 of the distribution body 10.

[0066] FIGS. 4a and 4b show two designs of the shield element 30. As shown in FIG. 4a, the shield element 30 comprises a single aperture 32. As shown in FIG. 4b, the shield element 30 comprises a plurality of apertures 32 according to e.g. a predetermined electrical current distribution.

[0067] As an alternative, FIG. 5 shows a shield element 30 comprising a plurality of stencils 33 to be inserted at least partially in at least some of the plurality of openings 11 of the distribution body 10. Further, at least one of the stencils may comprise boreholes (not shown). The boreholes may allow an additional adjustment of a coverage or an electrical current distribution by varying a diameter of the through hole.

[0068] It has to be noted that embodiments of the invention are described with reference to different subject matters. In particular, some embodiments are described with reference to method type claims whereas other embodiments are described with reference to the device type claims. However, a person skilled in the art will gather from the above and the following description that, unless otherwise notified, in addition to any combination of features belonging to one type of subject matter also any combination between features relating to different subject matters is considered to be disclosed with this application. However, all features can be combined providing synergetic effects that are more than the simple summation of the features.

[0069] While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. The invention is not limited to the disclosed embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing a claimed invention, from a study of the drawings, the disclosure, and the dependent claims.

[0070] In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. A single processor or other unit may fulfil the functions of several items re-cited in the claims. The mere fact that certain measures are re-cited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.