CAST COMPONENTS AND METHODS OF MANUFACTURE

Abstract

Cast components, electronic devices including cast components, alloys for cast components, and methods of forming cast components are disclosed. In an example, a component for an electronic device includes an aluminum alloy including a plurality of silicon particles having spheroidal shapes and a silicon concentration of greater than 1.5 wt %, and a b* value of 0.5 or less.

Claims

1. A component for an electronic device, the component comprising: an aluminum alloy comprising: a plurality of silicon particles having spheroidal shapes; and a silicon concentration of greater than 1.5 wt %.

2. The component of claim 1, wherein the silicon concentration is from 7 wt % to 10 wt %.

3. The component of claim 2, wherein an L* value of the component is at least 65.

4. The component of claim 1, wherein the silicon concentration is 3 wt % or less.

5. The component of claim 4, wherein: an L* value of the component is at least 85; and a b* value of the component is 0.5 or less.

6. The component of claim 1, wherein a mean cross-sectional area of the plurality of silicon particles is at least 1 m.sup.2.

7. The component of claim 1, wherein a Vickers hardness value of the component is at least 81.

8. The component of claim 1, wherein the component has a thermal conductivity of at least 180 W/m.Math.K.

9. A method comprising: casting a component from an aluminum alloy; and performing a heat treatment on the component to concentrate silicon in the component into silicon particles having spheroidal shapes, wherein after the heat treatment, the component has an L* value of at least 65.

10. The method of claim 9, wherein the aluminum alloy comprises silicon having a concentration of 3 wt % or less.

11. The method of claim 9, wherein the component is cast using squeeze casting, sand casting, or die casting.

12. The method of claim 9, further comprising anodizing the component after performing the heat treatment.

13. The method of claim 9, wherein the heat treatment comprises heating the component to a temperature in a range from 450 C. to 480 C.

14. The method of claim 9, wherein the heat treatment comprises heating the component to a temperature in a range from 450 C. to 550 C.

15. The method of claim 9, wherein the heat treatment comprises ageing the component at a temperature in a range from 150 C. to 230 C.

16. An aluminum alloy cast component comprising: a plurality of silicon particles having spherical shapes, the silicon particles having a concentration in the aluminum alloy in a range from 1.5 wt % to 3 wt %.

17. The component of claim 16, wherein a mean cross-sectional area of the plurality of silicon particles is from 1 m.sup.2 to 1.5 m.sup.2.

18. The component of claim 16, wherein a mean cross-sectional area of the plurality of silicon particles is from 0.25 m.sup.2 to 0.75 m.sup.2.

19. The component of claim 16, wherein the component has an L* value of at least 87 and a b* value of 0.5 or less.

20. The component of claim 16, wherein the component has a Vickers hardness value of at least 81 and a thermal conductivity of at least 180 W/m.Math.K.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements.

[0015] FIG. 1A illustrates a perspective view of an electronic device.

[0016] FIG. 1B illustrates an exploded view of the electronic device of FIG. 1A.

[0017] FIG. 2 illustrates a flow diagram of a method of forming a cast component.

[0018] FIGS. 3A and 3B illustrate microscopic cross-sectional views of a cast material.

[0019] FIG. 4 illustrates a microscopic cross-sectional view of a cast material.

[0020] FIG. 5 illustrates a microscopic cross-sectional view of a cast material.

[0021] FIG. 6 illustrates a microscopic cross-sectional view of a cast material.

[0022] FIG. 7 illustrates a microscopic cross-sectional view of a cast material.

[0023] FIG. 8 illustrates a microscopic cross-sectional view of a cast material.

DETAILED DESCRIPTION

[0024] Reference will now be made in detail to representative embodiments illustrated in the accompanying drawings. It should be understood that the following descriptions are not intended to limit the embodiments to one preferred embodiment. To the contrary, it is intended to cover alternatives, modifications, and equivalents as can be included within the spirit and scope of the described embodiments as defined by the appended claims.

[0025] The following disclosure relates to cast components, electronic devices including cast components, alloys for cast components, and methods of forming cast components. As compared with traditional alloys for casting, the alloys described herein can have a decreased silicon concentration. Heat treatments can be performed on the cast components in order to concentrate silicon included in the alloys into spheroidal particles. For the purposes of this disclosure, spheroidal particles, particles having spheroidal shapes, or particles having spherical shapes can be sphere-shaped, semi-sphere-shaped, about sphere-shaped, approximately sphere-shaped, or within about 10% of being sphere-shaped. As a result of forming cast components from the alloys of the present disclosure and/or using the heat treatments of the present disclosure, the cast components can have improved cosmetics, mechanical properties, and thermal properties. Moreover, by casting components, as opposed to other manufacturing methods, the components can be formed with less material waste and less manufacturing processes and time.

[0026] The cast components can be shaped by various casting processes, such as squeeze casting, die casting, sand casting, or the like. Once the cast components are shaped, the as cast components can be cooled and subjected to a heat treatment, which can cause silicon in the cast components to concentrate into spheroidal particles. The heat treatment can be a two-step process. The first step can include raising the temperature of the cast components to a high temperature and then quenching the cast components. The second step can include an artificial aging process, which includes raising the temperatures of the cast components to a relatively low raised temperature. In some examples, the heat treatment can include the first step followed by the second step or can include either the first step or the second step alone. Performing the heat treatment on the cast components can provide the cast components with improved cosmetic, mechanical, and thermal properties.

[0027] The present disclosure describes cast components, alloys for cast components, and the like, which can have improved visual characteristics. In some examples, the visual characteristics of cast components can be measured using colorimetry spectrophotometer techniques and quantified according to color space standards, such as CIE 1976 L*a*b* by the International Commission on Illumination. The CIE 1976 L*a*b* color space model is used to characterize colors of an object according to color opponents: L* corresponding to an amount of lightness, a* corresponding to amounts of green and red, and b* corresponding to amounts of blue and yellow. Higher L* values correspond to greater amounts of lightness and lower L* values correspond to lesser amounts of lightness. Negative a* values indicate a green color, with more negative a* values indicating a greener color, and positive a* values indicate a red color, with more positive b* values indicating a redder color. Negative b* values indicate a blue color, with more negative b* values indicating a bluer color, and positive b* values indicate a yellow color, with more positive b* values indicating a yellower color.

[0028] These and other examples are discussed below with reference to FIGS. 1A through 8. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these Figures is for explanatory purposes only and should not be construed as limiting. Furthermore, as used herein, a system, a method, an article, a component, a feature, or a sub-feature including at least one of a first option, a second option, or a third option should be understood as referring to a system, a method, an article, a component, a feature, or a sub-feature that can include one of each listed option (e.g., only one of the first option, only one of the second option, or only one of the third option), multiple of a single listed option (e.g., two or more of the first option), two options simultaneously (e.g., one of the first option and one of the second option), or combination thereof (e.g., two of the first option and one of the second option).

[0029] FIGS. 1A and 1B show a perspective view and an exploded view, respectively, of an example of an electronic device 100. The electronic device 100 shown in FIGS. 1A and 1B is a mobile wireless communication device (e.g., a smart phone). The smart phone of FIGS. 1A and 1B is merely one representative example of a device that can be used in conjunction with the systems and methods disclosed herein. The electronic device 100 can correspond to any form of a wearable electronic device (e.g., watches, such as smart watches), a cellular telephone, a portable media player, a media storage device, a portable digital assistant (PDA), a tablet computer, a computer, a mobile communication device, a GPS unit, a remote control device, or another electronic device. The electronic device 100 can be referred to as an electronic device, a device, a consumer device, a cellphone, a smart phone, or the like.

[0030] The electronic device 100 can have a housing or an enclosure that includes a band 102 or a frame. The band 102 can define an outer perimeter of the electronic device 100. The band 102, or portions thereof, can be or can include a metallic component (e.g., a cast component), as described herein. In some examples, the band 102 can include several sidewall components, such as a first sidewall component 104, a second sidewall component 106, a third sidewall component 108 (opposite the first sidewall component 104), and a fourth sidewall component 110 (opposite the second sidewall component 106). The sidewall components 104, 106, 108, 110 can be or can include components formed from cast materials and methods as described herein.

[0031] Any of the sidewall components 104, 106, 108, 110 can form part of an antenna assembly (not shown in FIGS. 1 and 1B). As a result, a non-metal material or materials can separate the sidewall components 104, 106, 108, 110 of the band 102 from one another in order to electrically isolate the sidewall components 104, 106, 108, 110. For example, a separating material 112 can separate the first sidewall component 104 from the second sidewall component 106. The separating material 112 can include a moldable non-metallic material, such as a polymeric material. In some examples, the non-metallic material can be electrically inert or insulating, such as plastics, resins, combinations thereof, or the like.

[0032] The electronic device 100 can further include a display assembly 114 that can include a transparent protective cover that at least partially defines an exterior surface of the electronic device 100. The display assembly 114 can include multiple layers, with each layer providing a unique function. In some examples, the transparent protective cover can be formed from a transparent material, such as glass, plastic, sapphire, or similar transparent materials. In this regard, the transparent protective cover can be referred to as a transparent cover, a protective cover, or a cover glass (e.g., when the protective transparent cover includes glass). The electronic device 100 can further include a port 116 designed to receive a connector of a cable assembly. The port 116 can extend through an opening in a sidewall component 104, 106, 108, 110 and is illustrated extending through the third sidewall component 106 in FIG. 1A. The port 116 can allow the electronic device 100 to communicate data information (send and receive), and also allow the electronic device 100 to receive electrical energy to charge a battery assembly of the electronic device 100. Accordingly, the port 116 can include terminals that electrically couple to the connector.

[0033] The electronic device 100 can include several control inputs designed to provide a command to the electronic device 100. For example, the electronic device 100 can include a control input 120. The control input 120 can be used to adjust the visual information presented on the display assembly 114, to adjust the volume of sound output by an audio module of the electronic device 100, or the like. The control input 120 can include a switch, a sensor, a button, or the like, and can be configured to generate a command to a processor circuit. The control input 120 can at least partially extend through an opening in a sidewall component 104, 106, 108, 110. For example, as illustrated in FIG. 1A, the second sidewall component 106 can include or define an opening 122 that receives a control input 124, which can be the same as or similar to the control input 120.

[0034] The electronic device 100 can include internal components, such as processors, memory, circuit boards, batteries, and sensors. Such components can be disposed within an internal volume defined, at least partially, by the band 102, and can be affixed to the band 102, via internal surfaces, attachment features, threaded connectors, studs, posts, and/or other fixing features (collectively referred to as fixing features). The fixing features can be formed into, defined by, or otherwise part of the band 102. In examples in which the band 102 is formed as a cast component, the fixing features of the band 102 can be formed during casting or can be machined into the band 102 after casting.

[0035] As illustrated in FIG. 1B, the electronic device 100 can include internal components, such as a system in package (SiP) 130 including one or more integrated circuits, such as a processors, sensors, and memory. The electronic device 100 can also include a battery 132 housed in the internal volume of the electronic device 100. The electronic device 100 can include one or more sensors, such as optical or other sensors, which can sense or otherwise detect information regarding the environment external to the internal volume of the electronic device 100. Additional components, such as a haptic engine, can be included in the electronic device 100.

[0036] The electronic device 100 can include a chassis 134, which can provide structural support to the electronic device 100. The chassis 134 can include a rigid material, such as a metal, or can include a composite construction. The chassis 134 can be coupled to the band 102. The chassis 134 can provide an electrical grounding path for components of the electronic device 100 electrically coupled to the chassis 134. The electronic device 100 can alternatively or additionally include a back plate 136, which can include cladding layers and/or other attachment features, such that one or more components of the electronic device 100 can be attached to the back plate 136, for example, by welding. The back plate 136 can form conductive pathways for connecting components of the electronic device 100. In some examples, the back plate 136 can be attached to the band 102 of the electronic device 100 by one or more attachment features. The chassis 134 and/or the back plate 136 can be or can include components formed from cast materials and methods as described herein.

[0037] An exterior surface of the electronic device 100 can further be defined by a back cover 138 that can be coupled to the band 102. The back cover 138 and the band 102 can collectively form an enclosure or housing of the electronic device 100 with the enclosure or housing (including the band 102 and the back cover 138) at least partially defining an internal volume. The back cover 138 can include a material that is transparent to any desired range of wavelengths of electromagnetic radiation, such as visible light. In some examples, the back cover 138 can include a material that can allow for inductive charging through the back cover 138. In some examples, the back cover 138 can include a material such as metals, glass, plastic, and/or sapphire. The back cover 138 can be or can include components formed from cast materials and methods as described herein.

[0038] Any number or variety of components of an electronic device, such as the electronic device 100, can be formed from the cast materials and methods described in the present disclosure. For example, the band 102 (including any of the sidewall components 104, 106, 108, 110), the chassis 134, the back plate 136, and/or the back cover 138 can include components formed from cast materials and methods as described herein. The cast materials described herein can have improved cosmetics, mechanical properties, and thermal properties as compared to cast materials formed from traditional casting alloys and by traditional casting methods. Further, forming components of the electronic device 100 by casting, as opposed to other manufacturing processes, can reduce material waste, processing steps, and processing time for forming the cast components.

[0039] FIG. 2 shows a flow diagram of a method 200 of forming a cast component. In block 202, a component is cast. The cast component can be any component, such as a component that can be used in an electronic device. The cast component can be shaped using any suitable casting process, such as squeeze casting, die casting, sand casting, or the like. Specifically, a molten metal material can be poured or injected into a mold representative of a desired end shape, solidified, and removed from the mold to form the cast component. Heat and pressure can be applied to the metal material as the metal material is injected into, or while the metal material is positioned within the mold. The metal material can include an aluminum alloy or other suitable metallic material.

[0040] In examples in which the cast component is formed from an aluminum alloy, the aluminum alloy can include silicon. Including silicon in the aluminum alloy can improve the flowability and moldability of the aluminum alloy and can reduce the melting temperature of the aluminum alloy. This can be used to reduce porosity in the metal of the cast component and improve the suitability of the aluminum alloy for casting. However, including a higher concentration of silicon in the aluminum alloy can traditionally cause various cosmetic defects to be present in the case component. For example, higher concentrations of silicon in the aluminum alloy can result in the cast component having a coral-like or sponge-like microstructure, a dull appearance (e.g., a low L* value), a poor response to anodization, a chalky texture, and the like. In some examples, the aluminum alloy can include a silicon concentration in a range from about 1 wt % to about 12 wt %, at least about 1.5 wt %, 3 wt % or less, from about 7 wt % to about 11 wt %, from about 7 wt % to about 10 wt %, or the like.

[0041] In some examples, the aluminum alloy can include a silicon concentration in a range from about 6 wt % to about 12 wt %, from about 7 wt % to about 11 wt %, from about 7 wt % to about 10 wt %, or the like. Concentrations of silicon in these ranges can produce an as-cast component with a poor microstructure and visual characteristics. For example, the as-cast components can have a coral-like or sponge-like microstructure, a dull appearance (e.g., an L* value in a range from about 30 to about 40, from about 32 to about 38, from about 34 to about 36, at least about 35 or the like), a poor response to anodization, a chalky texture, and the like. The coral-like or sponge-like microstructure can be caused by aluminum-silicon mixed phases that extend in a coral-like or sponge-like pattern through the as-cast components. However, subsequent heat treatments, discussed below, can be performed on the as-cast component to improve both the visual characteristics and the microstructure of the cast components. For example, after heat treatments are performed on the cast components, the cast components can have a solid microstructure with spheroidal silicon particles. The cast components can have an improved anodization response and a smooth texture. The cast components can have an L* value in a range from about 60 to about 70, from about 62 to about 68, in a range from about 64 to about 66, at least about 65, or the like. Performing the heat treatments on the as-cast components can cause silicon in the as-cast components to concentrate into spheroidal particles within the cast components.

[0042] In some examples, the aluminum alloy can include a silicon concentration in a range from about 1 wt % to about 5 wt %, from about 1.2 wt % to about 3.5 wt %, from about 1.5 wt % to about 3 wt %, from about 2 wt % to about 3 wt %, at least about 1.2 wt %, at least about 1.5 wt %, 3.5 wt % or less, 3 wt % or less, or the like. Concentrations of silicon in these reduced ranges can produce an as-cast component with a solid microstructure and good visual characteristics. The as-cast components with reduced silicon concentrations can have a solid microstructure with spheroidal silicon particles, a good anodization response, and a smooth texture. The as-cast components can have an L* value in a range from about 80 to about 90, from about 85 to about 90, from about 86 to about 89, at least about 85, at least about 86, or the like. The as-cast components can have a b* value in a range from about 0.3 to about 0.65, from about 0.35 to about 0.6, about 0.6 or less, or the like. Subsequent heat treatments, discussed below, can be performed on the as-cast components to further improve visual characteristics and the microstructure of the cast components. For example, after heat treatments are performed on the cast components, the cast components have an L* value in a range from about 80 to about 95, from about 85 to about 92, from about 86 to about 91, at least about 86, at least about 87, at least about 89, or the like. The cast components can have a b* value in a range from about 0.1 to about 2.2, from about 0.1 to about 1.5, from about 0.15 to about 0.6, about 0.6 or less, about 0.5 or less, about 0.4 or less, or the like. Performing the heat treatments on the as-cast components can cause silicon in the as-cast components to concentrate into spheroidal particles and can cause the spheroidal particles to grow to a lesser number of spheroidal particles with greater areas in a cross-sectional view within the cast components.

[0043] In block 204, a heat treatment is performed on the as-cast component. Generally, the heat treatment can be a two-step heat treatment. The first step can include a high-temperature heat treatment. The second step can include a low-temperature ageing. The heat treatment can include the first step followed by the second step, the second step followed by the first step, or either the first step or the second step alone.

[0044] The first step of the heat treatment at block 204 can include a high-temperature heat treatment, which can be followed by a quenching process. In some examples, the first step can be performed at a temperature in a range from about 450 C. to about 550 C., from about 480 C. to about 530 C., from about 450 C. to about 480 C., from about 465 C. to about 475 C., from about 480 C. to about 500 C., from about 530 C. to about 550 C., from about 535 C. to about 545 C., about 470 C., about 540 C., or the like. The first step of the heat treatment can be performed for about 30 minutes about 2 hours, about 24 hours, a period in a range from about 1 hour to about 25 hours, from about 1.5 hours to about 2.5 hours, from about 0.5 hours to about 2 hours, from about 15 minutes to about 45 minutes, from about 22 hours to about 26 hours, or the like.

[0045] Performing the first step of the heat treatment can cause silicon in the cast component to concentrate within the cast component into spheroidal particles, which can improve the microstructure of the cast component. Specifically, concentrating silicon in the cast component into spheroidal particles can improve (e.g., increase) an L* value of the cast component. In examples in which the as-cast component includes a coral or sponge-like microstructure, concentrating the silicon into spheroidal particles can replace the coral or sponge-like microstructure and increase a solidity of the cast component. This can improve an anodization response of the cast component. Further, performing the first step of the heat treatment can increase a hardness of the cast component. For example, after performing the first step of the heat treatment, the cast component can have a Vickers hardness value of greater than about 81, greater than about 90, greater than about 100, or the like.

[0046] The second step of the heat treatment at block 204 can include a high-temperature heat treatment. In some examples, the second step can be performed at a temperature in a range from about 150 C. to about 230 C., from about 150 C. to about 185 C., from about 170 C. to about 190 C., from about 185 C. to about 195 C., about 180 C., about 190 C., or the like. The second step of the heat treatment can be performed for about 6 hours, about 2 hours, a period in a range from about 5 hours to about 7 hours, from about 5.5 hours to about 6.5 hours, from about 1.5 hours to about 2.5 hours, or the like. Performing the second step of the heat treatment can increase a hardness of the cast component. For example, after performing the second step of the heat treatment, the cast component can have a Vickers hardness value of at least about 81, at least about 90, at least about 100, or the like.

[0047] Performance of each of the first step of the heat treatment and the second step of the heat treatment can increase an L* value (e.g., a brightness) of the cast component, thermal properties of the cast component (e.g., a thermal conductivity), and mechanical properties of the cast component (e.g., a Vickers hardness, an anodization response, and the like), but can also increase a b* value (e.g., a yellowness) of the cast component. Performing the first step of the heat treatment at a relatively lower temperature (e.g., a temperature of about 470 C. or in a range from about 450 C. to about 480 C., as opposed to a temperature of about 540 C. or in a range from about 530 C. to about 550 C.), or for a shorter duration (e.g., about 2 hours or in a range from about 1.5 hours to about 2.5 hours as opposed to about 24 hours or in a range from about 22 hours to about 26 hours) can prevent the b* value of the cast component from becoming undesirably high, while still providing a desired L* value, thermal properties, and mechanical properties. Further, in some examples, the first step of the heat treatment alone can be performed, or the second step of the heat treatment alone can be performed.

[0048] In an example in which the cast component is heated to a temperature of about 540 C. or in a range from about 530 C. to about 550 C. for about 2 hours or in a range from about 1.5 hours to about 2.5 hours and is subjected to ageing at a temperature of about 180 C. or in a range from about 150 C. to about 230 C. for about 6 hours or in a range from about 5.5 hours to about 6.5 hours, the cast component can have an L* value in a range from about 86 to about 92, from about 88 to about 91, or the like and a b* value in a range from about 1.5 to about 2, from about 1.7 to about 1.9, or the like. In an example in which the cast component is heated to a temperature of about 540 C. or in a range from about 530 C. to about 550 C. for about 24 hours or in a range from about 22 hours to about 26 hours and is subjected to ageing at a temperature of about 180 C. or in a range from about 150 C. to about 230 C. for about 6 hours or in a range from about 5.5 hours to about 6.5 hours, the cast component can have an L* value in a range from about 86 to about 92, from about 88.5 to about 91, or the like and a b* value in a range from about 1.75 to about 2.25, from about 1.8 to about 2.2, or the like. In an example in which the cast component is heated to a temperature of about 470 C. or in a range from about 450 C. to about 480 C. for about 24 hours or in a range from about 22 hours to about 26 hours without a second ageing step, the cast component can have an L* value in a range from about 87 to about 91, from about 88 to about 89, or the like and a b* value in a range from about 0.1 to about 0.3, from about 0.15 to about 0.25, or the like. In an example in which the cast component is heated to a temperature of about 470 C. or in a range from about 450 C. to about 480 C. for about 24 hours or in a range from about 22 hours to about 26 hours and is subjected to ageing at a temperature of about 180 C. or in a range from about 150 C. to about 230 C. for about 6 hours or in a range from about 5.5 hours to about 6.5 hours, the cast component can have an L* value in a range from about 87 to about 91, from about 88 to about 89, or the like and a b* value in a range from about 0.3 to about 0.6, from about 0.35 to about 0.45, or the like. In an example in which the cast component is heated to a temperature of about 540 C. or in a range from about 530 C. to about 550 C. for about 24 hours or in a range from about 22 hours to about 26 hours without a second ageing step, the cast component can have an L* value in a range from about 86 to about 92, from about 89 to about 91, or the like and a b* value in a range from about 0.75 to about 1.5, from about 0.9 to about 1.2, or the like. In an example in which the cast component is heated to a temperature of about 540 C. or in a range from about 530 C. to about 550 C. for about 2 hours or in a range from about 1.5 hours to about 2.5 hours without a second ageing step, the cast component can have an L* value in a range from about 86 to about 92, from about 88.5 to about 91, or the like and a b* value in a range from about 0.75 to about 1.5, from about 0.85 to about 1.2, or the like. In an example in which the cast component is subjected to ageing at a temperature of about 180 C. or in a range from about 150 C. to about 230 C. for about 6 hours or in a range from about 5.5 hours to about 6.5 hours without a first heat treatment step, the cast component can have an L* value in a range from about 85 to about 89, from about 86 to about 88, or the like and a b* value in a range from about 0.25 to about 1.75, from about 0.4 to about 1.5, or the like. In an example in which the cast component is not subjected to the heat treatment of block 204, the cast component can have an L* value in a range from about 85 to about 89, from about 86 to about 88.5, or the like and a b* value in a range from about 0.25 to about 0.75, from about 0.3 to about 0.6, or the like. In each of these examples, the cast component can include a silicon concentration in a range of about 1.2 wt % to about 3.5 wt % or in a range from about 1.5 wt % to about 3 wt %. The cast components in each of these examples can include a* values in a range from about 0.15 to about 0.4, from about 0.2 to about 0.3, or the like.

[0049] Providing a cast component with an L* value of greater than about 85, greater than about 87, or the like and a b* value of 1.5 or less, 1.2 or less, 1 or less, 0.5 or less, or the like can be desirable to cast components with cosmetics acceptable for exterior electronic device applications. As such, the silicon concentration, the first heat treatment step, and the second heat treatment step can be optimized in order to provide cast components with at least these L* and b* values.

[0050] The cast components can further include improved thermal and mechanical properties. For example, performing a first step on the cast component at a temperature of about 490 C. or in a range from about 480 C. to about 500 C. for about 30 minutes or in a range from about 15 minutes to about 45 minutes and performing a second step on the cast component at a temperature of about 190 C. or in a range from about 185 C. to about 195 C. for about 2 hours or in a range from about 1.5 hours to about 2.5 hours can provide the cast component with a thermal conductivity of about 180 W/m.Math.K, greater than about 170 W/m.Math.K, in a range from about 170 W/m.Math.K to about 190 W/m.Math.K, or the like. Subjecting the cast components to any of the first heat treatment step at the higher temperature, the first step at the lower temperature followed by the second step, or the second step alone can provide the cast components with Vickers hardness values of at least about 81, at least about 90, or at least about 100.

[0051] Performing the first step of the heat treatment of block 204 at a relatively lower temperature, such as a temperature of about 470 C. or in a range from about 450 C. to about 480 C., can provide several benefits. For example, performing the first step at a temperature of greater than about 465 C. (e.g., in a range from about 480 C. to about 530 C.) can cause magnesium silicide (Mg.sub.2Si) in the cast component to dissolve, which can increase the strength of the cast component. Performing the first step at a relatively low temperature can avoid other intermetallics, such as -Al.sub.9Fe.sub.2Si.sub.2 from dissolving, which can be beneficial to the structure of the cast component. Further, blistering and other dimensional concerns (e.g., distortion caused by quenching the cast component from a higher temperature) that can occur at higher temperatures can be prevented by performing the first step at a relatively lower temperature.

[0052] In block 206, the cast component is anodized. As described previously, the cast component can have an improved microstructure, which can result in an improved anodization response of the cast component. Anodizing the cast component can increase resistance of the cast component to corrosion and wear, improve cosmetics of the cast component (e.g., provide a more even surface texture to the cast components, alter a color of the cast components, or the like), and the like. In examples in which the heat treatment of block 204 is performed, the cast component can be anodized after performing the heat treatment of block 204 on the cast component, as the heat treatment can improve the anodization response of the cast component.

[0053] Blocks 204 and 206 can be optional, and either or both of blocks 204 and 206 can be omitted in some examples. Additional manufacturing processes can be performed throughout the method 200. For example, additional shaping processes, such as subtractive manufacturing processes (e.g., CNC processes or the like) can be performed between blocks 202 and 204, between blocks 204 and 206, or after block 206. In some examples, the cast components can be painted, plated, or the like in order to provide a desired finish on the cast components.

[0054] FIGS. 3A and 3B illustrate microscopic cross-sectional views of a cast material 300. The cast material 300 can be an aluminum alloy having a silicon concentration in a range from about 7 wt % to about 11 wt %. The cast material 300 can be an as-cast material that has not been subjected to the heat treatments of block 204 of the method 200, discussed above with respect to FIG. 2. The cast material 300 can include an aluminum material 302 and an aluminum-silicon mixed phase 304. The cast material 300 can be anodized and can include a substrate region 306 and an anodized region 308 (e.g., a metal oxide coating). The cast material 300 can include solid regions 310, which have good anodization responses, and sponge-like regions 312 that have a sponge-like or coral-like microstructure and have poor anodization responses. The aluminum-silicon mixed phase 304 can cause the cast material 300 to have the sponge-like or coral-like microstructure, which has poor brightness and poor anodization characteristics. The aluminum-silicon mixed phase 304 can be a web-like structure that extends through the aluminum material 302 of the cast material 300 and separates the aluminum material 302 into discrete portions of material, as opposed to the solid regions 310. The cast material 300 can have a relatively dull appearance, with an L* value in a range from about 30 to about 40, from about 32 to about 38, from about 34 to about 36, at least about 35 or the like.

[0055] Reducing the silicon concentration in the cast material 300 can reduce or eliminate the presence of the aluminum-silicon mixed phase 304. For example, reducing the silicon concentration in the cast material 300 to within a range from about 1.2 wt % to about 3.5 wt % or from about 1.5 wt % to about 3 wt % can reduce or eliminate the presence of the aluminum-silicon mixed phase 304 and the sponge-like regions 312. This can provide a continuous aluminum material 302 with spheroidal silicon particles, increase the brightness of the cast material 300, and improve the anodization characteristics of the cast material 300. Further, subjecting the cast material 300 to heat treatments, such as the heat treatments of block 204 of the method 200, discussed above with respect to FIG. 2, can concentrate silicon in the cast material 300 into spheroidal particles. This can reduce or eliminate the presence of the aluminum-silicon mixed phase 304 and the sponge-like regions 312, provide a continuous aluminum material 302 with spheroidal silicon particles, increase the brightness of the cast material 300, and improve the anodization characteristics of the cast material 300.

[0056] FIG. 4 illustrates a microscopic cross-sectional view of a cast material 400. The cast material 400 can be an aluminum alloy having a silicon concentration in a range from about 7 wt % to about 11 wt %. The cast material 400 can be the same as or similar to the cast material 300, discussed above with respect to FIGS. 3A and 3B, except that the cast material 400 is subjected to a heat treatment of block 204 of the method 200, discussed above with respect to FIG. 2. The cast material 400 can include an aluminum material 402 and spheroidal silicon particles 404. The cast material 400 can be anodized and can include a substrate region 406 and an anodized region 408 (e.g., a metal oxide coating).

[0057] Subjecting the cast material 400 to the heat treatments of block 204 of the method 200, discussed above with respect to FIG. 2, can cause silicon in the cast material 400 to concentrate into the spheroidal silicon particles 404. This can reduce or eliminate the sponge-like regions 312, illustrated in FIGS. 3A and 3B, and provide a solid aluminum material 402 with interspersed spheroidal silicon particles 404. This can increase the brightness of the cast material 400 and improve the anodization characteristics of the cast material 400. The cast material 400 can have an L* value in a range from about 60 to about 70, from about 62 to about 68, in a range from about 64 to about 66, at least about 65, or the like.

[0058] FIG. 5 illustrates a microscopic cross-sectional view of a cast material 500. The cast material 500 can be an aluminum alloy having a silicon concentration in a range from about 1.2 wt % to about 3.5 wt %. The cast material 500 can be the same as or similar to the cast material 500, discussed above with respect to FIGS. 3A and 3B, except that the cast material 500 has a lower concentration of silicon. The cast material 500 can be an as-cast material that has not been subjected to the heat treatments of block 204 of the method 200, discussed above with respect to FIG. 2. The cast material 500 can include an aluminum material 502 and spheroidal silicon particles 504. The cast material 500 can be anodized and can include a substrate region 506 and an anodized region 508 (e.g., a metal oxide coating).

[0059] Reducing the silicon concentration in the cast material 500 can cause silicon in the cast material 500 to concentrate into the spheroidal silicon particles 504. This can reduce or eliminate the sponge-like regions 312, illustrated in FIGS. 3A and 3B, and provide a solid aluminum material 502 with interspersed spheroidal silicon particles 504. This can increase the brightness of the cast material 500 and improve the anodization characteristics of the cast material 500. The cast material 500 can have an L* value in a range from about 80 to about 90, from about 85 to about 90, from about 86 to about 89, at least about 85, at least about 86, or the like.

[0060] FIGS. 6 through 8 illustrate microscopic cross-sectional views of cast materials 600, 700, 800, respectively. The cast material 600 is an example of an as-cast material that has not been subjected to the heat treatments of block 204 of the method 200, discussed above with respect to FIG. 2. The cast material 700 is an example of a cast material that has been subjected to the first step of the heat treatment of block 204 of the method 200, discussed above with respect to FIG. 2, at a relatively low temperature of about 470 C. or in a range from about 450 C. to about 480 C. for about 24 hours or in a range from about 22 hours to about 26 hours. The cast material 800 is an example of a cast material that has been subjected to the first step of the heat treatment of block 204 of the method 200 at a relatively high temperature of about 540 C. or in a range from about 530 C. to about 550 C. for about 24 hours or in a range from about 22 hours to about 26 hours. Each of the cast materials 600, 700, 800 can include the same aluminum alloys, and can include silicon concentrations in a range from about 1.2 wt % to about 3.5 wt %. Each of the cast materials 600, 700, 800 can be relatively solid, and the cast materials 600, 700, 800 can have good cosmetic, thermal, and mechanical properties. Each of the cast materials 600, 700, 800 can have good anodization responses. Performing the heat treatments to form the cast materials 700, 800 can improve mechanical properties (e.g., a hardness) of the cast materials 700, 800 and can improve a brightness of the cast materials 700, 800 relative to the cast material 600.

[0061] In FIG. 6, the cast material 600 includes an aluminum material 602 and silicon particles 604. The silicon particles 604 can have areas in a cross-sectional view in a range from 0 m.sup.2 to about 6.5 m.sup.2. Mean cross-sectional areas of the silicon particles 604 can be in a range from about 0.25 m.sup.2 to about 0.75 m.sup.2 or about 0.5 m.sup.2 and a mode for cross-sectional areas of the silicon particles 604 can be in a range from 0 m.sup.2 to about 0.25 m.sup.2. The silicon particles 604 can extend in lines, such as branched lines, and can surround granules of the aluminum material 602. The cast material 600 can have an L* value in a range from about 80 to about 90, from about 85 to about 90, from about 86 to about 89, at least about 85, at least about 86, or the like. The cast material 600 can be the same as or similar to the cast material 500.

[0062] In FIG. 7, the cast material 700 includes an aluminum material 702 and silicon particles 704. Performing the heat treatment on the cast material 600 to form the cast material 700 can cause the silicon particles 704 to become smaller, more discrete, and spheroidal-shaped. A count vs. cross-sectional area graph of the silicon particles 704 can become more spread out. The silicon particles 704 can have areas in a cross-sectional view in a range from 0 m.sup.2 to about 7.25 m.sup.2. Mean cross-sectional areas of the silicon particles 704 can be in a range from about 0.25 m.sup.2 to about 0.75 m.sup.2 or about 0.5 m.sup.2 and a mode for cross-sectional areas of the silicon particles 704 can be in a range from 0.25 m.sup.2 to about 0.5 m.sup.2. The silicon particles 704 can be spheroidal particles, and the aluminum material 702 can be solid with the silicon particles 704 interspersed in the aluminum material 702. The cast material 700 can have an L* value in a range from about 87 to about 91, from about 88 to about 89, at least about 87, at least about 88, or the like.

[0063] In FIG. 8, the cast material 800 includes an aluminum material 802 and silicon particles 804. Performing the heat treatment on the cast material 600 to form the cast material 800 can cause the silicon particles 804 to become larger, fewer, and more spheroidal shaped relative to the cast materials 600, 700 of FIGS. 6 and 7. A spheroidal shape or a spheroidal shaped particle can include any object or particle that has a geometry shaped like a spheroid or is approximately or generally spherical. A count vs. cross-sectional area graph of the silicon particles 804 can become more spread out. The silicon particles 804 can have areas in a cross-sectional view in a range from 0 m.sup.2 to about 16 m.sup.2. Mean cross-sectional areas of the silicon particles 804 can be in a range from about 0.5 m.sup.2 to about 2 m.sup.2 or about 1 m.sup.2 and a mode for cross-sectional areas of the silicon particles 804 can be in a range from 1 m.sup.2 to about 2 m.sup.2. The silicon particles 804 can be spheroidal particles, and the aluminum material 802 can be solid with the silicon particles 804 interspersed in the aluminum material 802. The cast material 700 can have an L* value in a range from about 86 to about 92, from about 88.5 to about 91, at least about 86, at least about 88, or the like.

[0064] To the extent applicable to the present technology, gathering and use of data available from various sources can be used to improve the delivery to users of invitational content or any other content that may be of interest to them. The present disclosure contemplates that in some instances, this gathered data may include personal information data that uniquely identifies or can be used to contact or locate a specific person. Such personal information data can include demographic data, location-based data, telephone numbers, email addresses, X (formerly TWITTER) ID's, home addresses, data or records relating to a user's health or level of fitness (e.g., vital signs measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

[0065] The present disclosure recognizes that the use of such personal information data, in the present technology, can be used to the benefit of users. For example, the personal information data can be used to deliver targeted content that is of greater interest to the user. Accordingly, use of such personal information data enables users to calculated control of the delivered content. Further, other uses for personal information data that benefit the user are also contemplated by the present disclosure. For instance, health and fitness data may be used to provide insights into a user's general wellness, or may be used as positive feedback to individuals using technology to pursue wellness goals.

[0066] The present disclosure contemplates that the entities responsible for the collection, analysis, disclosure, transfer, storage, or other use of such personal information data will comply with well-established privacy policies and/or privacy practices. In particular, such entities should implement and consistently use privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for maintaining personal information data private and secure. Such policies should be easily accessible by users, and should be updated as the collection and/or use of data changes. Personal information from users should be collected for legitimate and reasonable uses of the entity and not shared or sold outside of those legitimate uses. Further, such collection/sharing should occur after receiving the informed consent of the users. Additionally, such entities should consider taking any needed steps for safeguarding and securing access to such personal information data and ensuring that others with access to the personal information data adhere to their privacy policies and procedures. Further, such entities can subject themselves to evaluation by third parties to certify their adherence to widely accepted privacy policies and practices. In addition, policies and practices should be adapted for the particular types of personal information data being collected and/or accessed and adapted to applicable laws and standards, including jurisdiction-specific considerations. For instance, in the US, collection of or access to certain health data may be governed by federal and/or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA); whereas health data in other countries may be subject to other regulations and policies and should be handled accordingly. Hence different privacy practices should be maintained for different personal data types in each country.

[0067] Despite the foregoing, the present disclosure also contemplates embodiments in which users selectively block the use of, or access to, personal information data. That is, the present disclosure contemplates that hardware and/or software elements can be provided to prevent or block access to such personal information data. For example, in the case of advertisement delivery services, the present technology can be configured to allow users to select to opt in or opt out of participation in the collection of personal information data during registration for services or anytime thereafter. In another example, users can select not to provide mood-associated data for targeted content delivery services. In yet another example, users can select to limit the length of time mood-associated data is maintained or entirely prohibit the development of a baseline mood profile. In addition to providing opt in and opt out options, the present disclosure contemplates providing notifications relating to the access or use of personal information. For instance, a user may be notified upon downloading an app that their personal information data will be accessed and then reminded again just before personal information data is accessed by the app.

[0068] Moreover, it is the intent of the present disclosure that personal information data should be managed and handled in a way to minimize risks of unintentional or unauthorized access or use. Risk can be minimized by limiting the collection of data and deleting data once it is no longer needed. In addition, and when applicable, including in certain health related applications, data de-identification can be used to protect a user's privacy. De-identification may be facilitated, when appropriate, by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of data stored (e.g., collecting location data a city level rather than at an address level), controlling how data is stored (e.g., aggregating data across users), and/or other methods.

[0069] Therefore, although the present disclosure broadly covers use of personal information data to implement one or more various disclosed embodiments, the present disclosure also contemplates that the various embodiments can also be implemented without the need for accessing such personal information data. That is, the various embodiments of the present technology are not rendered inoperable due to the lack of all or a portion of such personal information data. For example, content can be selected and delivered to users by inferring preferences based on non-personal information data or a bare minimum amount of personal information, such as the content being requested by the device associated with a user, other non-personal information available to the content delivery services, or publicly available information.

[0070] The foregoing description, for purposes of explanation, used specific nomenclature to provide a thorough understanding of the described embodiments. However, it will be apparent to one skilled in the art that the specific details are not required in order to practice the described embodiments. Thus, the foregoing descriptions of the specific embodiments described herein are presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to one of ordinary skill in the art that many modifications and variations are possible in view of the above teachings.