METHOD FOR CUTTING A GLASS ELEMENT AND CUTTING SYSTEM

Abstract

A method for cutting a glass element (2) with a processing laser (4) is intended to enable a particularly simple process sequence with a high degree of reliability and a low level of equipment expenditure. For this purpose, according to the invention, the processing laser (4) is operated in a first processing step as a perforation laser, with which a perforation (12) is produced in the glass element (2) along an intended cutting line (8), whereby the processing laser (4) is operated in a second processing step with a modified laser beam (14) as a separating laser, with which a splitting of the filaments (6) forming the perforation (12) is effected.

Claims

1. A method for cutting a glass element with a processing laser, in which the processing laser is operated in a first processing step as a perforation laser, with which a perforation is produced in the glass element along an intended cutting line, and in which the same processing laser is operated in a second processing step with a modified laser beam as a separating laser, with which a splitting of the filaments forming the perforation is effected, the filaments forming the perforation being split by ablative laser processing, characterized in that a laser beam of the processing laser is split in the second processing step by beam shaping into a plurality of partial beams, a notch with a bevel being produced in the second processing step in a region of the previously introduced perforation by ablative laser processing.

2. The method of claim 1, in which an ultrashort pulse laser is used as the processing laser.

3. The method of claim 1, in which the laser beam of the processing laser is divided into six partial beams by beam shaping in the second processing step.

4. The method of claim 1, in which a plasma is generated in the glass element by the processing laser during operation as a separating laser.

5. The method of claim 1, wherein a beam shaping element is pivoted into a beam path of the processing laser for the second processing step.

6. The method of claim 5, wherein a diffractive optical element is used as the beam shaping element.

7. (canceled)

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] An embodiment of the invention is explained in more detail with reference to a drawing. Therein:

[0016] FIG. 1 schematically shows a cutting system for cutting glass elements,

[0017] FIG. 2 shows a beam shaping element of the cutting system according to FIG. 1,

[0018] FIG. 3 shows a glass element with inserted filaments, and

[0019] FIG. 4 shows the edge profile of a separating edge of the glass element according to FIG. 3.

[0020] Identical parts are marked with the same reference signs in all figures.

DETAILED DESCRIPTION OF THE DRAWINGS

[0021] The cutting system 1 according to FIG. 1 is provided for cutting glass elements 2 by laser filament cutting. For this purpose, the cutting system 1 comprises a processing laser 4, which is basically and by design designed as a perforation laser suitable for filamentation and is guided via an FI optic 5 in the direction towards the glass element 2. As a result of the design of the processing laser 4 during operation as a perforation laser, local heating occurs in the material of the glass element 2 at the point where the focal point is located, the formation of local stresses and a change in the refractive index, so that ultimately, as a result of non-linear optical effects in the glass material, elongated disturbances, or modifications, also referred to as filaments 6, are produced. The processing laser is controllable via an associated control device not shown in more detail. Via the control by means of the control device 8, the focal point of the processing laser 4 can be guided along a predeterminable cutting line 10 on the surface of the glass element 2 to be cut. The filaments 6 which form the desired perforation 12 are thus created along this cutting line 10.

[0022] When guiding the laser beam 14 of the processing laser 4, its point of impact on the glass element 2 and/or its focus point is suitably guided. In the context of the control, the focus position can be used in particular as a parameter for calculation in CNC data, since this is usually easy to describe. The focus position could be in, below, or above the material of the glass element 2 in order to enable two-dimensional processing by the laser light.

[0023] For the actual cutting of the glass element 2, i.e. for the separation of the parts along the cutting line 10 and the perforation 12, a further processing step is provided downstream of the filamentation in the first processing step, i.e. after insertion of the perforation 12. The cutting system 1 is designed for a particularly efficient and cost-saving mode of operation when carrying out the cutting or separating process. In particular, the fact that two different laser systems are usually used in the laser filament cutting process is taken into account, whereby so far one of the lasers is specifically designed as a perforation laser and the other laser is designed as a separation laser for use in the subsequent separation cut. In order to specifically avoid the potentially considerable additional equipment and process costs involved, the processing laser 4 in the cutting system 1 is designed and intended for use both during the first processing step, which is intended for producing the perforation, and during the second processing step, which is intended for the actual separation. For a particularly efficient process control, the cutting system 1 is thus designed in the manner of a combined design of the processing laser 4 in such a way that the filaments 6 are produced in the glass substrate 2 with the processing laser 4 in the first processing step, whereby in a second processing step the laser beam 14 of the processing laser 4 is reshaped by means of a DOE (“diffractive optical element”) optical system 16 provided as a beam shaping element, and the filaments 6 are irradiated again with it. This generates a plasma in the area of the filaments 6; the resulting pressure causes the separation of the elements.

[0024] In order to be able to switch in a comparatively simple manner between the modes of operation of the processing laser 4 as a perforating laser on the one hand and a separating laser on the other hand, the DOE optics 16 provided as a beam shaping element is pivotably mounted by means of a suitable suspension as indicated by the double arrow 18 and can be pivoted into and out of the beam path 20 of the processing laser 4. Alternatively or additionally, the DOE optics 16 can be arranged downstream of the laser 4 parallel to the FI optics 5, whereby a beam switch switches the laser output beam between FI optics 5 and DOE optics 16.

[0025] The structure of the DOE optics 16 provided as a beam shaping element is shown schematically in FIG. 2 when swiveled into the beam path 20. The element or the DOE optics 16 comprises the actual diffractive optical element 22 and, downstream of this in the beam path 20, a lens 24. The interconnection of these components is provided in the embodiment example in such a way that the collimated laser beam 14 impinging on the element 16 is divided into six secondary laser beams or partial beams 28. For the wavelength of 1064 nm of the processing laser 4 provided in the embodiment example, this results in six partial beams 28 with a distance to each other of about 10 μm. The transmission of the laser radiation for the element 16 is 97%, and the six partial beams 28 with the same intensity have a total share of the supplied laser power of 86%.

[0026] As can be seen from the enlarged sectional representation of the glass element 2 in FIG. 3 during the phase of the second processing step, the processing laser 4 is operated as an ablation laser in its function as a separating laser in the area of the filaments 6 already set in the glass element. As a result of the action of the laser beam 14 formed in the element 16 and composed of the aforementioned six partial beams 28 on the glass substrate 2, a notch 30 is formed by laser ablation in the region of the previously introduced perforation 12 or of the filaments 6 forming this perforation. With increasing ablation of the notch 30, an expanding plasma is formed in the notch 30. With a suitable shape and geometry of the notch 30, the expansion pressure of this plasma can be used to cause the cleavage of the glass element 2 in the area of the filaments 6 or modifications as a result of the forces acting on the edges of the notch 30.

[0027] This mode of operation is ensured in particular by suitable control and tracking of the laser parameters. Surprisingly, it has been found that the beam shaping of the incident laser beam 26 is also important for reliable use of the expansion pressure to break the glass element 2: Beam shaping is required to build up the desired pressure in the notch 30, since a single beam would destroy the material at the intensity or energy density required to form the plasma. In addition to the plasma formation (intensity), the length and position of the acting plasma in the notch 30 also plays an important role for reliable separation.

[0028] The edge profile of the separating edge 32 produced by this separating process is shown in FIG. 4. In its upper region, as seen from the surface of the glass element 2 to a depth of about 20-30 μm, the separating edge 32 has a bevel 34 delimiting the notch 30, which is followed by a comparatively straight fracture wall 36 as seen into the depth of the substrate.

LIST OF REFERENCE SIGNS

[0029] 1 cutting system [0030] 2 glass element [0031] 3 processing laser [0032] 4 FI optics [0033] 5 filament [0034] 10 cutting line [0035] 12 perforation [0036] 14 laser beam [0037] 16 DOE optics [0038] 18 double arrow [0039] 20 beam path [0040] 22 diffractive optical element [0041] 24 lens [0042] 28 partial beams [0043] 30 notch [0044] 32 separating edge [0045] 34 bevel [0046] 36 fracture wall