Selective soldering system for selective wave soldering of circuit boards comprising gripping unit for exchanging solder nozzles

Abstract

Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.

Claims

1. Selective soldering system for selective wave soldering of circuit boards, comprising a solder pot, comprising a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and comprising a control unit for controlling the moving unit, characterized in that a magazine for receiving different solder nozzles is arranged on the moving unit, in that a gripping unit comprising gripping fingers for gripping the solder nozzle is provided, which can be controlled by the control unit, wherein the gripping unit can be moved along the z axis using a drive unit being controlled by the control unit, and wherein the control unit being designed such that it controls the moving unit, the drive unit and the gripping unit, in such a way that a solder nozzle in the magazine can be gripped, lifted, and deposited in the solder pot with the gripping unit.

2. Selective soldering system according to claim 1, characterized in that the drive unit is designed such that the gripping unit can only be moved along the z axis, and in that when the solder nozzle is gripped and lifted, the moving unit moves the solder pot along the x, y, and z axes.

3. Selective soldering system according to claim 1, characterized in that the control unit is designed such that it controls the moving unit and the drive unit such that the magazine and the gripping unit are moved toward and/or away from one another along the z axis.

4. Selective soldering system according to claim 1, characterized in that a finger heater is provided for heating the gripping fingers to a preheating temperature before and/or during the gripping process.

5. Selective soldering system according to claim 4, characterized in that the finger heater is designed as an electrical resistance heater which is arranged on the gripper fingers or integrated into the gripper fingers.

6. Selective soldering system according to claim 1, characterized in that a magazine heater is provided for heating the magazine and/or the solder nozzles in the magazine to a preheating temperature.

7. Selective soldering system according to claim 6, characterized in that the magazine has a magazine bottom, and in that the magazine heater is provided in or on the magazine base.

8. Selective soldering system according to claim 6, characterized in that the magazine has a cover element, and in that the magazine heater is provided in or on the cover element.

9. Selective soldering system according to claim 6, characterized in that a contact material is provided between the magazine heater and the solder nozzles for contact with the solder nozzles.

10. Selective soldering system according to claim 9, characterized in that the contact material is formed from metal wool.

11. Selective soldering system according to claim 8, characterized in that the contact material is formed from metal elements which are mounted so as to be displaceable parallel to one another and the free ends of which act against solder nozzles in the magazine.

12. Selective soldering system according to claim 1, characterized in that a cleaning unit, which can be controlled the control unit, is arranged for cleaning the nozzle base of a solder nozzle removed from the solder pot, and in that the control unit is provided such that a solder nozzle that is gripped and lifted from the solder pot by the gripping unit is moved into the cleaning unit and cleaned there before being deposited in the magazine.

13. Selective soldering system according to claim 12, characterized in that the cleaning unit is provided on the moving unit.

14. Selective soldering system according to claim 12, characterized in that the cleaning unit comprises a rotating metal brush for cleaning at least the nozzle base.

15. Method for exchanging a solder nozzle of a selective soldering system, comprising the following steps: a. Moving a moving unit along the x, y, and/or z axes into an exchanging position in which a solder nozzle in the magazine and to be gripped is vertically below a gripping unit along the z axis, b. Moving the gripping unit vertically downward along the z axis into a gripping position and gripping the solder nozzle in the magazine by means of a gripping unit, c. Moving the gripping unit together with the solder nozzle along the z axis vertically upward into a lifting position, d. Moving the moving unit along the x, y, and/or z axes into a receiving position in which a solder pot, into which the solder nozzle is to be inserted, is vertically below the gripped solder nozzle along the z axis, e. Moving the gripped solder nozzle along the z axis vertically downward into a deposited position in which the solder nozzle is in the solder pot, and releasing the solder nozzle by the gripping unit, f. Moving the gripping unit vertically upward along the z axis into a rest position.

16. Method according to claim 15, characterized in that the gripping fingers are heated to a preheating temperature before gripping the solder nozzle and/or in that the solder nozzles in the magazine are heated to a preheating temperature before being gripped.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) In the drawings:

(2) FIG. 1 is a front view of a selective soldering system according to the invention;

(3) FIG. 2 is the side view of the selective soldering system according to FIG. 1;

(4) FIG. 3 is a schematic view of a moving unit and a gripping unit of the selective soldering system according to FIGS. 1 and 2;

(5) FIG. 4 is the moving unit and the gripping unit according to FIG. 3 in a side view in an exchanging position;

(6) FIG. 5 is the view according to FIG. 4 in a gripping position;

(7) FIG. 6 is the view according to FIG. 5 in a lifting position;

(8) FIG. 7 is the view according to FIG. 6 in a receiving position;

(9) FIG. 8 is the view according to FIG. 7 in a deposited position in the solder pot;

(10) FIG. 9 is the view according to FIG. 8 in a cleaning position;

(11) FIG. 10 is the view according to FIG. 9 in a deposited position in the magazine;

(12) FIG. 11 is a first embodiment of a magazine;

(13) FIG. 12 is a second embodiment of a magazine; and

(14) FIG. 13 is a third embodiment of a magazine.

DETAILED DESCRIPTION

(15) FIGS. 1 and 2 show a selective soldering system 10 for wave soldering of circuit boards. The system comprises a housing 12 with a cover 14 which can close off the housing 12 and which is closed when the selective soldering system 10 is in operation. A moving unit 16 is provided within the housing 12, which moving unit can be moved in the horizontal plane along an x and y axis and in the vertical direction along a z axis.

(16) The moving unit 16 is shown schematically in FIG. 3. A solder pot 40 for receiving liquid solder and a magazine 20 for receiving a total of ten solder nozzles 22 are provided on the moving unit 16, with a total of five solder nozzles 22 being inserted in the magazine. One of the solder nozzles 22 can be inserted into the solder pot 40. The solder pot 40 has a holder 42 for receiving a solder nozzle 22.

(17) Furthermore, a cleaning unit 24 for cleaning solder nozzles 22 is provided on the moving unit 16. As also becomes clear from FIG. 3, a drive 26 is provided along the x axis and a drive 28 is provided along the y axis for displacing the moving unit 16. A z axis drive 30 is provided for moving the moving unit 16 along the z axis. The three drives 26, 28, 30 are controlled by a control unit 32.

(18) In the vertical direction above the plane in which the moving unit 16 is located, a gripping unit 34 is provided, which can be moved in the vertical direction along the z axis by a drive unit 36. The gripping unit 34 has two gripping fingers 38 which can be moved toward and away from one another. The drive unit 36 and the movement of the gripping fingers 38 of the gripping unit 34 can be controlled via the control unit 32. The cleaning unit 24 is also actuated by the control unit 32.

(19) The control unit 32 is designed to control the moving unit 16 and the gripping unit 34 with the drive unit 36 such that a solder nozzle 22 in the magazine 20 can be gripped by the gripping unit 34, lifted, and deposited in the solder pot 40.

(20) The arrangement is preferably such that the gripping unit 34 can only be moved along the z axis and not along the x and y axes.

(21) To exchange the solder nozzle 22, in a first step, which is shown in FIG. 4, the moving unit 16 can be moved along the x, y, and z axes in an exchanging position in which the solder nozzle 22 to be gripped in the magazine is below the gripping unit 34 along the z axis 44.

(22) In a next step, the gripping unit 34 is then moved vertically downward along the z axis 44 into a gripping position as shown in FIG. 5. Upon or after reaching the gripping position, the gripping fingers 38 are moved toward one another and the solder nozzle 22 is gripped.

(23) The gripped solder nozzle is then, as shown in FIG. 6, displaced into a lifting position by moving the gripping unit 34 along the z axis 44 vertically upward.

(24) In a next step, as shown in FIG. 7, the moving unit 16 is displaced horizontally along the x, y, and z axes, so that, in a receiving position, the solder pot 40 or the holder 42 of the solder pot 40 is below the gripped solder nozzle 22 along the z axis 44.

(25) Then, as shown in FIG. 8, the gripping unit 34 is moved vertically downward along the z axis into a deposited position, the gripping unit 34 then being released and, in a next step, it being possible to move the gripping unit 34 vertically upward into a rest position.

(26) To shorten the described nozzle exchange process, it is conceivable that when the gripping device is moved along the x axis 44, the moving unit 16 is simultaneously moved along the z axis in the opposite direction of the gripping unit 34, which can result in shorter cycle times overall.

(27) It is conceivable that, during the movement of the moving unit 16, liquid solder is pumped in or through the holder 42. Shortly before reaching the deposited position, the solder nozzle can be held just above the soldering wave flowing in or out of the holder 42 so that the solder nozzle 22 is heated from below by the soldering wave and, optionally, washed thereby until the nozzle 22 is at least largely homogeneously preheated. The solder pump can then be switched off and the solder nozzle 22 can be deposited in the solder pot 40.

(28) The control unit 32 can also be designed such that a nozzle 22 in the solder pot 40 is gripped by the gripping unit 34, lifted, and, if the nozzle 22 is no longer required, discarded. In the event that the nozzle 22 is needed again, it can be cleaned and then deposited in the magazine 20.

(29) Cleaning of the nozzle 22 is indicated in FIG. 9, in which a nozzle 22 removed from the solder pot 40 is moved into the cleaning unit 24 before being deposited in the magazine 20 and cleaned there. For this purpose, the cleaning unit 24 comprises a rotating metal brush 46, onto which the nozzle base of the relevant nozzle 22, as shown in FIG. 9, can be deposited. In this way, at least the metal base can be cleaned. After cleaning the metal base, the nozzle 22 can be deposited on the magazine 20 at a place provided therefor.

(30) In order to maintain or increase the temperature of the solder nozzle 22 during the gripping process, a finger heater 48, indicated in FIG. 3, is provided on or in the gripping fingers 38. The finger heater 48 is, in particular, an electrical resistance heater, which preheats the gripper fingers by applying a corresponding current. The finger heater 48 can be, in particular, in cavities in the gripping fingers 38, for example in holes provided for this purpose. The design is preferably such that the gripper fingers are heated to a preheating temperature of approx. 160° C. by the finger heater 48.

(31) A magazine heater 52 is also provided in the magazine 20, in particular in a magazine base 50, as shown in FIGS. 11 to 13. The magazine heater can also be designed as an electrical resistance heater and can be used, for example, as a surface or ring heating element.

(32) To receive the solder nozzles 22 in a precise position, a receiving element 62, for example in the form of a base, can be provided on the upper side of the magazine bottoms 50.

(33) In the case of the magazines 20 provided in FIGS. 11 to 13, the magazine bottom 50 is covered by means of a cover element 54, which can be designed as a lid element, for example. Side walls 55 are provided between the relevant magazine bottom 50 and the cover element 54. The side walls 55 can preferably be arranged on the magazine bottom 50. The cover element 54 can, in particular, be arranged displaceably so that it allows access to the solder nozzles 22 in an open position.

(34) Such a cover element 54 can protect the solder nozzles 22 in the magazine 20 and can also help ensure that these are provided at a largely constant preheating temperature.

(35) In the embodiment shown in FIG. 11, a magazine heater 52 is provided in the magazine base 50, which is designed as an electrical resistance heater and, as a surface heating element, extends more or less over the entire bottom 50. A magazine heater 52 can also be provided in the cover element 54, so that the solder nozzles 22 are also preheated from above.

(36) In the embodiment according to FIG. 12, a contact material in the form of metal pins 58 mounted so as to be displaceable parallel to one another is provided between the nozzle necks 56 of the nozzles 22 and the cover element 54. Due to the weight of the individual metal pins, which are mounted displaceably in the cover element 54, they act vertically downward against the nozzle necks 56. Due to the magazine heater 52 provided in the cover element 54, which can be designed here around the circumference as a ring element, the metal pins 58 are preheated and thus conduct the heat into the nozzle necks 56. The metal pins 58 preferably have an identical length, so that where the free ends of the metal pins 58 come to rest on the upper side of the nozzle necks 56, the metal pins 58 protrude in the vertical direction beyond the cover element 54. Overall, this results in a favorable heat transfer from the magazine heater 52, which is in or on the cover element 54, to the solder nozzles 22.

(37) In the embodiment according to FIG. 13, a magazine heater 52 is also provided in the cover element 54. Furthermore, a contact material in the form of metal wool 60 is provided on the inner side of the cover element 54 facing the solder nozzles 22. The metal wool 60 is elastically resiliently deformable and thus comes to rest on the nozzle necks 56 when the cover element 54 is in place. In this embodiment, too, a suitable heat transfer from the magazine heater 52 provided in the cover element 54 to the nozzle necks 56 can be implemented.

(38) The design when a cover element 54 is provided is preferably such that the cover element 54 is automatically lifted or pivoted to the side before a solder nozzle 22 is gripped, so that the gripping unit 34 can grip the nozzle necks of the solder nozzles that are then freely accessible.