Abstract
A drop test device for a micromechanical component. The drop test device includes a drop body having a shell and having an interior space for receiving at least one micromechanical component.
Claims
1. A drop test device for a micromechanical component, comprising: a drop body including a shell and an interior space configured to receive at least one micromechanical component.
2. The drop test device according to claim 1, wherein the micromechanical component can be placed in the interior space and can be connected to the shell in a form-fitting and/or force-fitting manner.
3. The drop test device according to claim 1, wherein the drop body is spherical.
4. The drop test device according to claim 3, wherein the shell includes two hemispheres.
5. The drop test device according to claim 1, further comprising: a test board configured to receive the micromechanical component, and being arranged in the interior space, wherein the micromechanical component can be connected to the test board in a form-fitting and/or force-fitting and/or materially-bonded manner.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] FIG. 1 schematically shows a micromechanical device in an LGA package in the related art.
[0015] FIG. 2 schematically shows a micromechanical device in a bare-die chip-scale package in the related art.
[0016] FIG. 3 schematically shows a drop test device according to the present invention in the form of a spherical drop body in a first exemplary embodiment.
[0017] FIG. 4 schematically shows a drop test device according to the present invention in the form of a spherical drop body in a second exemplary embodiment.
DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS
[0018] FIG. 1 schematically shows a micromechanical device in an LGA package in the related art. An ASIC chip 10 and a micromechanical (MEMS) chip 20 are stacked on top of one another and surrounded by a substrate printed circuit board (PCB) 30 at the bottom and encapsulation material 40 at the top and sides. Solder balls 50 are arranged on the underside of the printed circuit board. A drop test of a MEMS component packaged in this way leaves only minor traces, if any.
[0019] FIG. 2 schematically shows a micromechanical device in a bare-die chip-scale package in the related art. The stacked silicon substrates of MEMS chip 20 and ASIC chip 30 are exposed. In a drop test of a MEMS component packaged in this manner, impact with a hard surface can cause damage to the silicon, such as chip fractures or chipping at the chip surface, in particular at corners and edges.
[0020] FIG. 3 schematically shows a drop test device according to the present invention in the form of a spherical drop body in a first exemplary embodiment. The drop test device comprises a drop body 100 having a shell 110 and having an interior space 120 for receiving a micromechanical component 1. The figure shows a micromechanical component in a chip-scale package, installed in a drop body 100 having a shell 110 in the form of a sphere consisting of two hemispheres 111, 112. The drop body is designed to fall freely and impact a base. The micromechanical component is mounted in the drop body and protected by the shell. When the drop body impacts the base, the micromechanical component therefore experiences the impact event without external damage.
[0021] FIG. 4 schematically shows a drop test device according to the present invention in the form of a spherical drop body in a second exemplary embodiment. The figure shows a micromechanical component 1 in a chip-scale package, soldered by means of solder balls 50 on a test board 130 in a sphere consisting of two hemispheres 111, 112. The micromechanical component is mounted on the test board in the drop body and protected by the shell.
LIST OF REFERENCE SIGNS
[0022] 1 Micromechanical component [0023] 10 ASIC chip [0024] 20 Micromechanical (MEMS) chip [0025] 30 Substrate printed circuit board (PCB) [0026] 40 Encapsulation material [0027] 50 Solder balls [0028] 100 Drop body [0029] 110 Shell [0030] 111, 112 Hemispheres [0031] 120 Interior space [0032] 130 Test board
