ELECTROPLATING TANK EQUIPMENT AND OPERATING METHOD THEREOF

Abstract

An electroplating device includes a carrying module, a moving module, a driving module and ejecting tubes. The carrying module has a slide rail. The moving module has a first portion and a second portion. The first portion is movably disposed in the slide rail. The moving module is moved back and forth parallel to a length direction of the slide rail by the driving module. Opposite two ends of the ejecting tubes are respectively disposed on the first portion and the second portion. When the moving module is driven to move back and forth parallel to the length direction, the moving module drives the ejecting tubes to move back and forth as well. Each of the ejecting tubes has nozzles. The nozzles on the ejecting tube are misaligned with the nozzles on the other ejecting tube adjacent to the ejecting tube.

Claims

1. An electroplating tank equipment for electroplating a to-be-electroplated surface of an electroplating substrate, the electroplating tank equipment comprising: an electroplating device, comprising: a carrying module having a slide rail; a moving module having a first portion and a second portion opposite to the first portion, wherein the first portion of the moving module is movably disposed in the slide rail; a driving module connected to the second portion of the moving module and configured to move the moving module back and forth in a direction parallel to a length direction of the slide rail; and a plurality of ejecting tubes, wherein two opposite ends of each one of the plurality of the ejecting tubes are respectively disposed on the first portion and the second portion of the moving module, when the driving module moves the moving module back and forth along the length direction, the moving module simultaneously drives the plurality of ejecting tubes to move back and forth, and each one of the plurality of the ejecting tubes has a plurality of nozzles, and the plurality of the nozzles on the ejecting tube are misaligned with the nozzles on the other ejecting tube adjacent to the ejecting tube, wherein a distance between the nozzle on one of the two adjacent ejecting tubes and the first portion of the moving module is different from a distance between the nozzle on the other of the two adjacent ejecting tubes and the first portion of the moving module; a conduit pipe connected to the electroplating device and configured to deliver an electroplating solution into the moving module to enter the plurality of the ejecting tubes; and a accommodating tank connected to the electroplating device and configured to contain the electroplating solution to form an electroplating tank structure, wherein the accommodating tank further has an overflow port and a circulation space for containing the electroplating solution, and the electroplating solution around the plurality of ejecting tubes overflows into the circulation space of the accommodating tank through the overflow port such that the electroplating solution is returned to the plurality of the ejecting tubes by the conduit pipe, wherein the to-be-electroplated surface of the electroplating substrate is configured to cover an electroplating opening of the electroplating device such that a sealed electroplating space is formed, and the sealed electroplating space is configured to contain the electroplating solution such that the to-be-electroplated surface of the electroplating substrate is electroplated in the sealed electroplating space.

2. The electroplating tank equipment according to claim 1, wherein each one of the plurality of the ejecting tubes has an initial position, a first limit position and a second limit position located at two opposite sides of the initial position, and the moving module is further configured to: drive the ejecting tube to move from the initial position to the first limit position; drive the ejecting tube to move from the first limit position to the second limit position; and drive the ejecting tube to move from the second limit position back to the initial position.

3. The electroplating tank equipment according to claim 2, wherein a distance between two centerlines of the two adjacent ejecting tubes is the same as a distance between the initial position and the first limit position and a distance between the initial position and the second limit position.

4. The electroplating tank equipment according to claim 1, wherein distances between two adjacent ones of the plurality of the ejecting tubes are the same.

5. The electroplating tank equipment according to claim 1, wherein distances between the two adjacent nozzles on one of the plurality of the ejecting tubes are the same, and the moving module has a third portion perpendicular to the first portion and the second portion, the third portion is parallel to the plurality of the ejecting tubes, and the plurality of the ejecting tubes are connected to the first portion, the second portion and the third portion of the moving module.

6. The electroplating tank equipment according to claim 1, wherein the second portion of the moving module has a main body and an external portion connected to the main body, the external portion is disposed on a side of the main body away from the first portion, one end of the plurality of the ejecting tubes is connected to the main body, and the external portion is connected to the driving module.

7. The electroplating tank equipment according to claim 6, wherein the driving module has a push rod and a power source, two ends of the push rod are respectively connected to the external portion and pivotally connected to the power source, and the power source is configured to drive the push rod and the moving module to move back and forth along the length direction.

8. An operating method of an electroplating tank equipment for electroplating a to-be-electroplated surface of an electroplating substrate, the operating method of the electroplating tank equipment comprising steps of: a) movably disposing a first portion of a moving module of an electroplating device in a slide rail of a carrying module; b) moving the moving module back and forth in a direction parallel to a length direction of the slide rail by a driving module of the electroplating device such that the moving module simultaneously drives a plurality of ejecting tubes to move back and forth, wherein two opposite ends of each one of the plurality of the ejecting tubes are respectively disposed on the first portion and a second portion of the moving module, and each one of the plurality of the ejecting tubes has a plurality of nozzles, and the plurality of the nozzles on the ejecting tube are misaligned with the nozzles on the other ejecting tube adjacent to the ejecting tube, wherein a distance between the nozzle on one of the two adjacent ejecting tubes and the first portion of the moving module is different from a distance between the nozzle on the other of the two adjacent ejecting tubes and the first portion of the moving module; c) delivering an electroplating solution into the moving module through a conduit pipe connected to the electroplating device to enter the plurality of the ejecting tubes; and d) allowing the electroplating solution to overflow from an overflow port of a accommodating tank connected to the electroplating device to form an electroplating tank structure, wherein the accommodating tank has a circulation space to collect the electroplating solution around the ejecting tubes such that the electroplating solution is returned to the plurality of the ejecting tubes by the conduit pipe, wherein the to-be-electroplated surface of the electroplating substrate is configured to cover an electroplating opening of the electroplating device such that a sealed electroplating space is formed, and the sealed electroplating space is configured to contain the electroplating solution such that the to-be-electroplated surface of the electroplating substrate is electroplated in the sealed electroplating space.

9. The operating method of the electroplating tank equipment according to claim 8, wherein each one of the plurality of the ejecting tubes has an initial position, a first limit position, and a second limit position located at two opposite sides of the initial position and driving the plurality of the ejecting tubes to move back and forth by the moving module further comprises: driving the plurality of the ejecting tubes to move from the initial position to the first limit position by the moving module; driving the plurality of the ejecting tubes to move from the first limit position to the second limit position by the moving module; and driving the plurality of the ejecting tubes to move from the second limit position back to the initial position by the moving module.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

[0017] FIG. 1 is a perspective view of an electroplating tank equipment according to an embodiment of the present disclosure.

[0018] FIG. 2 is a front view of an electroplating device according to an embodiment of the present disclosure.

[0019] FIG. 3 is a cross-sectional view of an electroplating device, an accommodating tank and an electroplating substrate according to an embodiment of the present disclosure.

[0020] FIG. 4 is a schematic view illustrating that a driving module of an electroplating device is operated according to an embodiment of the present disclosure.

[0021] FIG. 5 is a schematic view of an electroplating device according to an embodiment of the present disclosure.

[0022] FIG. 6 is a flowchart illustrating an operating method of an electroplating device according to an embodiment of the present disclosure.

[0023] FIG. 7 is a schematic view showing that ejecting tubes of an electroplating device is located at an initial position according to an embodiment of the present disclosure.

[0024] FIG. 8 is a schematic view showing that ejecting tubes of an electroplating device is located at a first limit position according to an embodiment of the present disclosure.

[0025] FIG. 9 is a schematic view showing that ejecting tubes of an electroplating device is located at a second limit position according to an embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

[0027] Spatially relative terms, such as beneath, below, lower, above, upper, front, back and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0028] Please refer to FIG. 1 to FIG. 3, FIG. 1 is a perspective view of an electroplating tank equipment 200 according to an embodiment of the present disclosure, FIG. 2 is a front view of an electroplating device 100 according to an embodiment of the present disclosure, and FIG. 3 is a cross-sectional view of the electroplating device 100, an accommodating tank 220 and an electroplating substrate 300 according to an embodiment of the present disclosure. In FIG. 1 to FIG. 3, the electroplating tank equipment 200 includes the electroplating device 100 and a conduit pipe 210. The conduit pipe 210 is connected to the electroplating device 100 and is configured to deliver an electroplating solution into a moving module 120 of the electroplating device 100, so the electroplating solution is allowed to enter a plurality of ejecting tubes 140 of the electroplating device 100. In addition, the electroplating tank equipment 200 further includes the accommodating tank 220. The accommodating tank 220 is connected to the electroplating device 100 and is configured to contain the electroplating solution, so an electroplating tank structure is formed by the electroplating device 100, the conduit pipe 210 and the accommodating tank 220. The accommodating tank 220 of the electroplating tank equipment 200 further includes an overflow port O1 and a circulation space O2 for containing the electroplating solution. The electroplating solution around the plurality of ejecting tubes 140 of the electroplating device 100 is configured to overflow into the circulation space O2 of the accommodating tank 220 through the overflow port O1, so the electroplating solution is allowed to return to the plurality of ejecting tubes 140 of the electroplating device 100 by the conduit pipe 210 of the electroplating tank equipment 200. In this way, the conduit pipe 210 and the accommodating tank 220 circulating the electroplating solution may improve the overall electroplating quality. In some embodiments, the to-be-electroplated surface 310 of the electroplating substrate 300 is configured to cover an electroplating opening C of the electroplating device 100. A sealed electroplating space B is formed. The sealed electroplating space B is configured to contain the electroplating solution such that the to-be-electroplated surface 310 of the electroplating substrate 300 may be electroplated in the sealed electroplating space B. In addition, a backside surface opposite to the to-be-electroplated surface 310 of the electroplating substrate 300 is not in contact with the electroplating solution. The electroplating solution only contacts the to-be-electroplated surface 310 of the electroplating substrate 300, so a cup-type electroplating structure may be achieved.

[0029] In some embodiments, the electroplating device 100 includes a carrying module 110, a moving module 120, a driving module 130, and a plurality of ejecting tubes 140. The carrying module 110 has a slide rail 112. The slide rail 112 is disposed on the carrying module 110. The moving module 120 has a first portion 122 and a second portion 124 opposite to the first portion 122. For example, the first portion 122 of the moving module 120 may be a lower horizontal portion, and the second portion 124 of the moving module 120 may be an upper horizontal portion. The first portion 122 of the moving module 120 is movably disposed in the slide rail 112. That is, the first portion 122 of the moving module 120 is able to move relative to the slide rail 112.

[0030] In some embodiments, the driving module 130 is connected to the second portion 124 of the moving module 120. The driving module 130 is able to drive the moving module 120 to move back and forth in a direction parallel to a length direction D1 of the slide rail 112. Two opposite ends of the plurality of ejecting tubes 140 are respectively disposed on the first portion 122 and the second portion 124 of the moving module 120, which means that the two opposite ends of each ejecting tube 140 are disposed on the lower horizontal portion and the upper horizontal portion of the moving module 120, respectively. In other words, the ejecting tubes 140 are located between the first portion 122 and the second portion 124 of the moving module 120. When the driving module 130 drives the moving module 120 to move back and forth in the length direction D1, the moving module 120 simultaneously drives the plurality of ejecting tubes 140 to move back and forth. Furthermore, each ejecting tube 140 includes a plurality of nozzles 142. It is noted that the plurality of the nozzles 142 on the ejecting tube 140 are misaligned with the nozzles 142 on the other ejecting tube 140 adjacent to the ejecting tube 140. A distance between the nozzle 142 on one of the two adjacent ejecting tubes 140 and the first portion 122 of the moving module 120 is different from a distance between the nozzle 142 on the other of the two adjacent ejecting tubes 140 and the first portion 122 of the moving module 120. Therefore, the electroplating solution may be completely sprayed onto every area of the circuit board, thereby improving the overall electroplating quality.

[0031] Specifically, the electroplating tank equipment 200 may drive the moving module 120 to move back and forth through the driving module 130 of the electroplating device 100, thereby driving the ejecting tubes 140 to move back and forth in a direction parallel to the length direction D1. The ejecting tubes 140 may perform horizontal reciprocating movement while spraying the electroplating solution. Therefore, the nozzles 142 on the ejecting tubes 140 of the electroplating device 100 may spray the electroplating solution in a movable manner. The metal ions in the electroplating solution may be uniformly sprayed onto the circuit board, thereby improving the conventional issue of blind spots on the circuit board which are difficult to be sprayed. In addition, the nozzles 142 on two adjacent ejecting tubes 140 of the electroplating device 100 are disposed in a misaligned configuration, allowing the electroplating solution to be fully sprayed onto every area of the circuit board, thereby enhancing the overall electroplating quality.

[0032] Please refer to FIG. 4 and FIG. 5, FIG. 4 is a schematic view illustrating that the driving module 130 of the electroplating device 100 is operated according to an embodiment of the present disclosure, and FIG. 5 is a schematic view of the electroplating device 100 according to an embodiment of the present disclosure. In FIG. 4 and FIG. 5, the number of ejecting tubes 140 and the number of nozzles 142 are not limited in this regard. In the embodiment shown in FIG. 5, the number of ejecting tubes 140 in the electroplating device 100 is twelve. The number of nozzles 142 on a single ejecting tube 140 may be an odd number or an even number. For example, the number of nozzles 142 on the leftmost ejecting tube 140 is sixteen, while the number of nozzles 142 on the ejecting tube 140 next to the leftmost ejecting tube 140 is fifteen. The sixteen nozzles 142 on the leftmost ejecting tube 140 are misaligned with the fifteen nozzles 142 on the ejecting tube 140 next to the leftmost ejecting tube 140.

[0033] In some embodiments, the moving module 120 includes a third portion 126 perpendicular to the first portion 122 and the second portion 124. The third portion 126 of the moving module 120 is parallel to the ejecting tubes 140, and the ejecting tubes 140 are in fluid communication with the first portion 122, the second portion 124, and the third portion 126 of the moving module 120. In addition, the second portion 124 of the moving module 120 includes a main body 123 and an external portion 125 connected to the main body 123. The external portion 125 of the second portion 124 is disposed at one side of the main body 123 opposite to the first portion 122. One end of each ejecting tube 140 is connected to the main body 123 of the second portion 124 of the moving module 120, and the external portion 125 of the second portion 124 of the moving module 120 is connected to the driving module 130. The driving module 130 includes a push rod 132 and a power source 134. The two ends of the push rod 132 of the driving module 130 are respectively connected to the external portion 125 of the second portion 124 of the moving module 120 and pivotally connected to the power source 134. In this embodiment, the power source 134 of the driving module 130 is an eccentric rotating element, but the type of power source 134 of the driving module 130 is not limited in this regard. For example, the power source 134 of the driving module 130 may also be a pneumatic cylinder or a linear motor, as long as the power source 134 of the driving module 130 is able to drive the push rod 132 and the moving module 120 to perform horizontal reciprocating movement parallel to the length direction D1.

[0034] In the following description, an operating method of electroplating tank equipment will be described. It is to be noted that the connection relationship of the aforementioned elements will not be repeated.

[0035] Please refer to FIG. 6, FIG. 6 is a flowchart illustrating an operating method of an electroplating device according to an embodiment of the present disclosure. The operating method of the electroplating device includes steps as outlined below. In step (a) S1, a first portion of a moving module of an electroplating device is movably disposed in a slide rail of a carrying module. In step (b) S2, the moving module moves back and forth in a direction parallel to a length direction of the slide rail by a driving module of the electroplating device such that the moving module simultaneously drives a plurality of ejecting tubes to move back and forth. Two opposite ends of each one of the plurality of the ejecting tubes are respectively disposed on the first portion and a second portion of the moving module, and each one of the plurality of the ejecting tubes has a plurality of nozzles, and the plurality of the nozzles on the ejecting tube are misaligned with the nozzles on the other ejecting tube adjacent to the ejecting tube, wherein a distance between the nozzle on one of the two adjacent ejecting tubes and the first portion of the moving module is different from a distance between the nozzle on the other of the two adjacent ejecting tubes and the first portion of the moving module. In step (c) S3, an electroplating solution is delivered into the moving module through a conduit pipe connected to the electroplating device to enter the plurality of the ejecting tubes. In step (d) S4, the electroplating solution is allowed to overflow from an overflow port of an accommodating tank connected to the electroplating device to form an electroplating tank structure. The accommodating tank has a circulation space to collect the electroplating solution around the ejecting tubes such that the electroplating solution is returned to the plurality of the ejecting tubes by the conduit pipe. The to-be-electroplated surface of the electroplating substrate is configured to cover an electroplating opening of the electroplating device such that a sealed electroplating space is formed, and the sealed electroplating space is configured to contain the electroplating solution such that the to-be-electroplated surface of the electroplating substrate is electroplated in the sealed electroplating space. In the following description, the aforementioned steps will be described in detail.

[0036] Please refer to FIG. 7 to FIG. 9, FIG. 7 is a schematic view showing that the ejecting tubes 140 of the electroplating device 100 is located at an initial position according to an embodiment of the present disclosure, FIG. 8 is a schematic view showing that the ejecting tubes 140 of the electroplating device 100 is located at a first limit position according to an embodiment of the present disclosure, and FIG. 9 is a schematic view showing that that the ejecting tubes 140 of the electroplating device 100 is located at a second limit position according to an embodiment of the present disclosure. In FIG. 7 to FIG. 9, the ejecting tubes 140 of the electroplating device 100 have an initial position, a first limit position at one side of the initial position, and a second limit position at another opposite side of the initial position. For example, the first limit position of the ejecting tubes 140 is located to the left of the initial position, and the second limit position is located to the right of the initial position.

[0037] In this embodiment, the first portion 122 of the moving module 120 can be movably disposed in the slide rail 112 of the carrying module 110. The moving module 120 can then be driven by the driving module 130 to move back and forth parallel to the length direction D1 of the slide rail 112, thereby simultaneously driving the ejecting tubes 140 to perform reciprocating movement. Specifically, the moving module 120 first drives the ejecting tubes 140 to move from the initial position toward the first limit position along a moving direction D2, which is opposite to the length direction D1. After arriving in the first limit position, the moving module 120 drives the ejecting tubes 140 to move from the first limit position toward the second limit position along a moving direction D3. The moving direction D3 is the same as the length direction D1. The moving module 120 then drives the ejecting tubes 140 to return from the second limit position back to the initial position, thereby completing one movement cycle.

[0038] In some embodiments, the distance A between the two centerlines of two adjacent ejecting tubes 140 is the same as the distance between the initial position and the first limit position and the distance between the initial position and the second limit position. That is, among three adjacent ejecting tubes 140, the middle ejecting tube 140 moves to the position of the left ejecting tube 140, then the middle ejecting tube 140 moves to the position of the right ejecting tube 140, and finally the middle ejecting tube 140 returns from the right position back to the middle. In addition, the distances A1 between two adjacent ejecting tubes 140 are the same, and the distances A2 between two adjacent nozzles 142 on the ejecting tube 140 are the same.

[0039] It is noted that a distance between the nozzle 142 on one of the two adjacent ejecting tubes 140 and the first portion 122 of the moving module 120 is different from a distance between the nozzle 142 on the other of the two adjacent ejecting tubes 140 and the first portion 122 of the moving module 120. Furthermore, the accommodating tank 220 of the electroplating tank equipment 200 includes the overflow port O1 and the circulation space O2 for containing the electroplating solution. The electroplating solution around the plurality of ejecting tubes 140 of the electroplating device 100 overflows through the overflow port O1 into the circulation space O2 of the accommodating tank 220 of the electroplating tank equipment 200, so the conduit pipe 210 of the electroplating tank equipment 200 is allowed to return the electroplating solution back into the plurality of ejecting tubes 140 of the electroplating device 100. In this way, the conduit pipe 210 and the accommodating tank 220 circulating the electroplating solution may improve the overall electroplating quality.

[0040] The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.