Abstract
An electrochemical deposition apparatus is provided to include a process groove body with an accommodating groove is configured to accommodate a plating solution; a substrate carrier including a carrying surface for carrying a substrate to be plated, and at least a portion of the substrate carrier is in the accommodating groove; and at least one driving assembly on the process groove body and configured to control the substrate carrier to move along a first plane, wherein the first plane intersects with a normal direction of the carrying surface.
Claims
1. An electrochemical deposition apparatus, comprising: a process groove body with an accommodating groove, wherein the accommodating groove is configured to accommodate a plating solution; a substrate carrier, wherein the substrate carrier comprises a carrying surface for carrying a substrate to be plated, and at least a portion of the substrate carrier is in the accommodating groove; and at least one driving assembly on the process groove body and configured to control the substrate carrier to move along a first plane, wherein the first plane intersects with a normal direction of the carrying surface.
2. The electrochemical deposition apparatus of claim 1, wherein each of the at least one driving assembly comprises: a transmission adaptor; a first displacement unit on the process groove body and configured to control the transmission adaptor to move along a first direction; and a second displacement unit on the transmission adaptor and configured to control the substrate carrier to move in a second direction; wherein the first direction intersects with the second direction, and the first direction and the second direction intersect with the normal direction of the carrying surface.
3. The electrochemical deposition apparatus of claim 2, wherein the first displacement unit comprises: a first mounting member comprising a first slide way on the first mounting member and extending along the first direction; a first sliding block in the first slide way; and a first motor; wherein a housing of the first motor is fixedly connected to the first mounting member, and a driving shaft of the first motor is connected to the first sliding block and configured to control the first sliding block to slide along the first slide way; wherein the transmission adaptor is connected to the first sliding block.
4. The electrochemical deposition apparatus of claim 2, wherein each of the at least one driving assembly further comprises: a limiting device on the process groove body and configured to limit a moving range within which the transmission adaptor moves in the first direction.
5. The electrochemical deposition apparatus of claim 2, wherein the second displacement unit comprises: a second mounting member comprising a second slide way on the second mounting member and extending along the second direction; a second sliding block in the second slide way; and a second motor, wherein a housing of the second motor is fixedly connected to the second mounting member, and a driving shaft of the second motor is connected to the second sliding block and configured to control the second sliding block to slide along the second slide way.
6. The electrochemical deposition apparatus of claim 2, wherein the process groove body comprises: a main groove body having the accommodating groove, and a reinforcing structure fixed around the main groove body; wherein the first displacement unit is on the reinforcing structure, and the electrochemical deposition apparatus further comprises an avoidance notch on a side wall of the main groove body at a position corresponding to the first displacement unit.
7. The electrochemical deposition apparatus of any claim 1, wherein the electrochemical deposition apparatus comprises two driving assemblies on two opposite sides of the process groove body, respectively.
8. The electrochemical deposition apparatus of claim 1, wherein the electrochemical deposition apparatus further comprises: an injection plate detachably arranged in the accommodating groove, and comprising an accommodating case having a first accommodating chamber, wherein the accommodating case is provided with a first liquid inlet and a plurality of liquid outlets, the first liquid inlet and the plurality of liquid outlets are communicated with the first accommodating chamber, and the plurality of liquid outlets are arranged to face the carrying surface; wherein a distance from the injection plate to the carrying surface is adjustable.
9. The electrochemical deposition apparatus of claim 8, wherein the accommodating case further comprises a plurality of first mounting hole groups thereon arranged in the first direction, each of the plurality of first mounting hole groups comprises a plurality of first mounting holes arranged in a third direction, and the third direction is the normal direction of the carrying surface; the electrochemical deposition apparatus further comprises: a mounting plate comprising a plurality of second mounting hole groups thereon, wherein each of the plurality of second mounting hole groups comprises a plurality of second mounting holes arranged in the third direction, the plurality of second mounting hole groups are in one-to-one correspondence with the plurality of first mounting hole groups, and each of the plurality of second mounting holes is configured to correspond to and be aligned with one of the plurality of first mounting holes; and a plurality of fasteners, each of which is configured to extend into one first mounting hole and one second mounting hole aligned with each other, to fasten the accommodating case and the mounting plate.
10-12. (canceled)
13. The electrochemical deposition apparatus of claim 8, wherein the accommodating case comprises: a first wall, a second wall opposite to the first wall, and a plurality of side walls for connecting the first wall and the second wall, the first wall, the second wall, and the plurality of side walls are connected together to form the first accommodating chamber, wherein the plurality of liquid outlets are on the first wall, and the plurality of first mounting holes are on the plurality of side walls.
14. The electrochemical deposition apparatus of claim 13, wherein the injection plate further comprises: a plurality of liquid return lines passing through the first accommodating chamber, an inlet of each of the plurality of liquid return lines is on the first wall, and an outlet of each of the plurality of liquid return lines is on the second wall; and wherein multiple liquid outlets are around the inlet of each of the plurality of liquid return lines.
15-18. (canceled)
19. The electrochemical deposition apparatus of claim 8, wherein the process groove body is provided with a liquid circulation outlet communicated with the accommodating groove; the electrochemical deposition apparatus further comprises: a filter screen at the liquid circulation outlet, and configured to filter the plating solution discharged from the accommodating groove to the liquid circulation outlet; and a circulation assembly, wherein an inlet of the circulation assembly is connected to the liquid circulation outlet, and an outlet of the circulation assembly is communicated with the first liquid inlet.
20. The electrochemical deposition apparatus of claim 1, wherein the substrate carrier comprises: a carrying plate comprising a first carrying sub-surface, and comprising a hollowed-out structure therein; and a supporting plate, wherein the supporting plate covers the hollowed-out structure, and comprises a second carrying sub-surface, and the second carrying sub-surface and the first carrying sub-surface together form the carrying surface.
21. The electrochemical deposition apparatus of claim 20, wherein the substrate carrier further comprises: a conductive ring on the carrying plate and surrounding the supporting plate; a pull-up structure fixedly connected to the carrying plate; and a conductive block on the pull-up structure and electrically connected to the conductive ring, wherein the conductive block is connected to the driving assembly.
22. The electrochemical deposition apparatus of claim 21, wherein the driving assembly comprises: a first displacement unit and a second displacement unit comprising a second sliding block; and one of the conductive block and the second sliding block is provided with a limiting protrusion, and the other one of the conductive block and the second sliding block is provided with a limiting groove, and the limiting protrusion is arranged in the limiting groove.
23. The electrochemical deposition apparatus of claim 21, wherein the pull-up structure comprises: a first sealing plate and a second sealing plate opposite to each other, wherein the first sealing plate and the second sealing plate are connected to two opposite surfaces of the carrying plate, respectively; and a handle between the first sealing plate and the second sealing plate and connected to the first sealing plate and the second sealing plate; wherein at least a portion of the conductive block is between the first sealing plate and the second sealing plate.
24. The electrochemical deposition apparatus of claim 23, wherein the electrochemical deposition apparatus further comprises an insulating layer between the conductive block and the first sealing plate and between the conductive block and the second sealing plate.
25. The electrochemical deposition apparatus of claim 1, wherein the electrochemical deposition apparatus further comprises an electrode structure; and the electrode structure comprises a support frame and at least one metal mesh structure on the support frame.
26. The electrochemical deposition apparatus of claim 25, wherein the electrode structure comprises a plurality of metal mesh structures, and the support frame comprises a support portion electrically connected to each of the plurality of metal mesh structures.
27. The electrochemical deposition apparatus of claim 25, wherein the electrode structure further comprises: an energizing portion configured to apply an electric signal and a transmission portion, wherein each of the plurality of metal mesh structures is electrically connected to the energizing portion through the transmission portion; and at least one of the energizing portion and the transmission portion comprises: a conductive main body and a protective layer wrapping the conductive main body, wherein an electric conductivity of the conductive main body is greater than that of the protective layer.
28-30. (canceled)
Description
BRIEF DESCRIPTION OF DRAWINGS
[0033] The accompanying drawings, which are provided for further understanding of the present disclosure and constitute a part of this specification, are for explaining the present disclosure together with the embodiments of the present disclosure, but are not intended to limit the present disclosure. In the drawings:
[0034] FIG. 1 is a schematic perspective view of an electrochemical deposition apparatus provided in some embodiments of the present disclosure.
[0035] FIG. 2 is a top view of an electrochemical deposition apparatus provided in some embodiments of the present disclosure.
[0036] FIG. 3 is a schematic view of a structure of a portion of a main groove body and an accommodating groove provided in some embodiments of the present disclosure.
[0037] FIG. 4 is a schematic view of a driving assembly, a substrate carrier, and a reinforcing structure provided in some embodiments of the present disclosure.
[0038] FIG. 5 is a schematic perspective view of a driving assembly provided in some embodiments of the present disclosure.
[0039] FIG. 6 is a schematic view of a first displacement unit provided in some embodiments of the present disclosure.
[0040] FIG. 7 is a schematic view of an overall structure of an injection plate and a mounting plate provided in some embodiments of the present disclosure.
[0041] FIG. 8 is a schematic cross-sectional view of an injection plate provided in some embodiments of the present disclosure.
[0042] FIG. 9 is a cross-sectional view taken along a line A-A of FIG. 7.
[0043] FIG. 10 is a plan view of a first wall of an injection plate provided in some embodiments of the present disclosure.
[0044] FIG. 11 is a plan view of a second wall of an injection plate provided in some embodiments of the present disclosure.
[0045] FIG. 12 is a schematic view illustrating a distribution of liquid return lines and liquid outlets provided in some embodiments of the present disclosure.
[0046] FIG. 13 is a schematic view illustrating a distribution of first mounting holes in an injection plate and second mounting holes in a mounting plate provided in some embodiments of the present disclosure.
[0047] FIG. 14 is a schematic view of an injection plate mounting member provided in some embodiments of the present disclosure.
[0048] FIG. 15 is a schematic perspective view of a substrate carrier provided in some embodiments of the present disclosure.
[0049] FIG. 16 is a cross-sectional view taken along a line B-B of FIG. 15.
[0050] FIG. 17 is a schematic view illustrating matching of a conductive block with a second slider.
[0051] FIG. 18 is a schematic perspective view of an electrode structure provided in some embodiments of the present disclosure.
[0052] FIG. 19 is a schematic perspective view illustrating an electrode structure, at a different angle, provided in some embodiments of the present disclosure.
[0053] FIG. 20 is a schematic perspective view of an electrode structure provided in further embodiments of the present disclosure.
[0054] FIG. 21 is a schematic perspective view of an electrode mounting member provided in some embodiments of the present disclosure.
[0055] FIG. 22 is a schematic view of a portion of an electrochemical deposition apparatus provided in some embodiments of the present disclosure.
DETAIL DESCRIPTION OF EMBODIMENTS
[0056] The detail description of embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the detail description of embodiments described here is only used to illustrate and explain the present disclosure and is not intended to limit the present disclosure.
[0057] To make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few, not all of, embodiments of the present disclosure. All other embodiments, which can be derived by one of ordinary skill in the art from the embodiments of the present disclosure without any creative effort, are within the protective scope of the present disclosure.
[0058] Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which the present disclosure belongs. The terms first, second, and the like used in the present disclosure are not intended to indicate any order, quantity, or importance, but rather are used for distinguishing one element from another. The term comprising, including, or the like means that the element or item preceding the term contains the element or item listed after the term and its equivalent, but does not exclude other elements or items. The term connected, coupled, or the like is not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect connections. The terms upper, lower, left, right, and the like are used only for indicating relative positional relationships, and when the absolute position of an object being described is changed, the relative positional relationships may also be changed accordingly.
[0059] As used herein, terms parallel and perpendicular include the recited case and similar cases within an acceptable range of deviation as determined by one of ordinary skill in the art in view of a measurement in question and an error associated with a measurement of a particular quantity (i.e., limitations of a measurement system). For example, the term parallel includes absolute parallel and approximately parallel, where an acceptable range of deviation of the approximately parallel may be, for example, a range within 5. The term perpendicular includes absolute perpendicular and approximately perpendicular, where an acceptable range of deviation of the approximately perpendicular may also be, for example, a range within 5.
[0060] Electrochemical deposition is a technique in which positive and negative ions in a plating solution containing metal ions are migrated under the action of an external electric field with structures made of a conductive material used as a positive electrode and a negative electrode in the plating solution containing the metal ions, so that the metal ions are reduced at the negative electrode, thereby forming a metal plating layer on a surface of a conductive material. For example, when the metal ions in the plating solution are copper ions, the formed metal plating layer is a copper layer.
[0061] The plating solution is accommodated in an accommodating groove Sp of an electrochemical deposition apparatus, an electrode structure is further arranged in the accommodating groove Sp, and a substrate to be plated is fixed on a substrate carrier 30 in an electrochemical deposition process. Then, the substrate carrier 30 carrying the substrate is placed in the accommodating groove Sp, the substrate carrier 30 is arranged opposite to the electrode structure, and a negative electrode of a power supply is electrically connected to a seed layer on the substrate. The electrode structure is connected to a positive electrode of the power supply, so that an electric field is formed between the electrode structure and the substrate, and the metal ions in the electrolyte are attached onto the substrate to form an electrochemical deposition layer.
[0062] The inventors found that when performing the electrochemical deposition process on a substrate with a surface area exceeding 2.5m.sup.2 (for example, 1.5 m 1.85 m or larger), a voltage signal needs to be applied to the electrode structure 50 on the substrate by the power supply. Due to an extending direction or a large width of the electrode structure, a voltage drop (IR drop) phenomenon may cause a voltage difference between a portion of the electrode structure 50 close to the power supply and a portion of the electrode structure away from the power supply, and further cause a difference in electric fields formed in different regions of the electrode structure, and further cause a difference in thickness of portions of the metal plating layer formed on the substrate in the different regions to exceed 20%, which seriously affects uniformity of the metal plating layer, and reduces reliability.
[0063] FIG. 1 is a schematic perspective view of an electrochemical deposition apparatus provided in some embodiments of the present disclosure. FIG. 2 is a top view of an electrochemical deposition apparatus provided in some embodiments of the present disclosure. FIG. 3 is a schematic view of a structure of a portion of a main groove body and an accommodating groove provided in some embodiments of the present disclosure. FIG. 4 is a schematic view of a driving assembly, a substrate carrier, and a reinforcing structure provided in some embodiments of the present disclosure. As shown in FIGS. 1 to 4, the electrochemical deposition apparatus includes: a process groove body 10 with an accommodating groove Sp, a substrate carrier 30 and at least one driving assembly 20. The accommodating groove Sp is configured to accommodate the plating solution. The substrate carrier 30 includes a carrying surface for carrying a substrate to be plated, and at least a portion of the substrate carrier 30 is located in the accommodating groove Sp. The substrate may be a silicon substrate or a glass substrate.
[0064] The driving assembly 20 is disposed on the process groove body 10, and is configured to control the substrate carrier 30 to move along a first plane, which intersects with a normal direction of the carrying surface. For example, the first plane is perpendicular to the normal direction of the carrying surface. The normal direction of the carrying surface is a direction perpendicular to the carrying surface.
[0065] When the electrochemical deposition apparatus according to the embodiment of the present disclosure is used for the electrochemical deposition process, the driving assembly 20 may be used to drive the substrate carrier 30 to move along the first plane, so that a portion of a substrate originally in the strong electric field may be moved into a weak electric field, and a portion of the substrate originally in the weak electric field may be moved into the strong electric field, which is favorable for improving the uniformity of the thickness of the layer formed on the substrate.
[0066] In some embodiments, as shown in FIGS. 1 and 3, the process groove body 10 may include: a main groove body 11 having an accommodating groove Sp, and a reinforcing structure 12. The main groove body 11 may be made of an insulating material, such as polypropylene. The reinforcing structure 12 is provided around the main groove body 11. The reinforcing structure 12 may include a plurality of reinforcing cross members and a plurality of reinforcing longitudinal members. The driving assembly 20 may be disposed on the reinforcing structure 12. A bottom of the process groove body 10 may be provided with rollers 13 to facilitate movement of the electrochemical deposition apparatus. As shown in FIG. 4, the process groove body 10 may be provided with a clamping member 14 on the reinforcing structure 12, and the clamping member 14 has a clamping slot 14v, so that the clamping member 14 may be clamped with a mounting base, so as to maintain the electrochemical process apparatus to be fixed during the process.
[0067] In some embodiments, the electrochemical deposition apparatus includes two driving assemblies 20 respectively disposed on two opposite sides of the process groove body 10, and the two driving assemblies 20 can simultaneously control the movement of the substrate carrier 30, thereby improving the stability of the movement of the substrate carrier 30.
[0068] FIG. 5 is a schematic perspective view of a driving assembly provided in some embodiments of the present disclosure. As shown in FIG. 5, the driving assembly 20 includes: a transmission adaptor 23, a first displacement unit 21 and a second displacement unit 22.
[0069] The first displacement unit 21 is arranged on the process groove body 10 and is configured to control the transmission adaptor 23 to move along a first direction. For example, the reinforcing structure 12 is provided with a fixing plate 24 thereon on which the first displacement unit 21 is provided.
[0070] For example, the transmission adaptor 23 may include: a first connecting plate 231, a second connecting plate 232, and a reinforcing plate 233, the first connecting plate 231 is connected to the first displacement unit 21, the second connecting plate 232 is connected to the first connecting plate and configured to carry the second displacement unit 22. The first connecting plate 231 and the second connecting plate 232 may be substantially perpendicular to each other. The reinforcing plate 233 is connected to the first connecting plate 231 and the second connecting plate 232, and is substantially perpendicular to both the first connecting plate 231 and the second connecting plate 232, thereby improving the overall stability of the transmission adaptor 23.
[0071] As shown in FIG. 5, the second displacement unit 22 is provided on the transmission adaptor 23 and configured to control the substrate carrier 30 to move in a second direction. The first direction intersects with the second direction, and the first direction and the second direction intersect with the normal direction of the carrying surface.
[0072] For example, the first direction may be a depth direction of the accommodating groove Sp, and the second direction may be perpendicular to both the first direction and the normal direction of the carrying surface.
[0073] In the embodiment of the present disclosure, the substrate carrier 30 may be controlled by the first displacement unit 21 and the second displacement unit 22 to move along a plane perpendicular to the normal direction of the carrying surface.
[0074] FIG. 6 is a schematic view of a first displacement unit provided in some embodiments of the present disclosure. In conjunction with FIG. 5 and FIG. 6, the first displacement unit 21 may include: a first mounting member 212, a first sliding block 213, and a first motor 211. The first mounting member 212 may be disposed on the fixing plate 24, and the first mounting member 212 is provided with a first slide way G1 extending along the first direction. The first sliding block 213 is slidably disposed in the first slide way G1. A housing of the first motor 211 is fixedly connected to the first mounting member 212, and a driving shaft of the first motor 211 is connected to the first sliding block 213 and configured to control the first sliding block 213 to slide along the first slide way G1. The transmission adapter 23 is fixedly connected to the first sliding block 213. The first sliding block 213 may be moved along the first direction by the first motor 211, so as to drive the transmission adaptor 23 to move along the first direction, and further drive the second displacement unit 22 to move along the first direction.
[0075] In one example, the first sliding block 213 is provided with a guide hole extending in the first direction, and the driving shaft of the first motor 211 passes through the guide hole and controls the first sliding block 213 to slide along the first slide way G1. The first motor may be a linear motor or a rotating motor.
[0076] In some embodiments, as shown in FIG. 5, the second displacement unit 22 may include: a second mounting member 222, a second sliding block 223, and a second motor 221. The second mounting member 222 is provided on the transmission adapter 23, and the second mounting member 222 is provided with a second slide way G2 extending in the second direction. The second sliding block 223 is disposed in the second slide way G2. A housing of the second motor 221 is fixedly connected to the second mounting member 222, and a driving shaft of the second motor 221 is connected to the second sliding block 223 and configured to control the second sliding block 223 to slide along the second slide way G2.
[0077] In some embodiments, as shown in FIG. 5, each driving assembly 20 further includes a limiting device 25, and the limiting device 25 is disposed on the process groove body 10 and configured to limit a moving range within which the transmission adaptor 23 moves in the first direction. For example, the limiting device 25 may be disposed on the fixing plate 24, and the first direction is a depth direction of the accommodating groove Sp. By disposing the limiting device 25, it can be avoided that the seed layer on the substrate cannot be in sufficiently contact with the electrolyte solution caused by the substrate carrier 30 being at a higher position, and that the substrate carrier 30 collides with the bottom wall of the process groove body 10 caused by the substrate carrier 30 being at a lower position.
[0078] In one example, as shown in FIG. 5, a limiting protrusion 23a is fixedly disposed on the transmission adaptor 23, the limiting device 25 includes two limiting members 251 arranged along the first direction, and the limiting protrusion 23a moves between the two limiting members 251 when the first displacement unit 21 controls the transmission adaptor 23 to move along the first direction.
[0079] As shown in FIG. 3, the main groove body 11 has a bottom wall and a side wall 11a, and an avoidance notch 11v is provided at the side wall of the main groove body 11 at a position corresponding to the first displacement unit 21 to prevent the transmission adaptor 23 from colliding with the main groove body 11 when the transmission adaptor 23 moves.
[0080] As shown in FIG. 3, a bending member 11s is provided on the main groove body 11 and opposite to the avoidance notch 11v and bent toward the middle of the accommodating groove Sp. The bending member 11s may shield the second sliding block 223, to prevent the second sliding block 223 from moving too much in the second direction.
[0081] As shown in FIG. 3, the side wall 11a includes a first side wall portion 11a1 and a second side wall portion 11a2, the first side wall portion 11a1 is connected to the bottom wall, and the second side wall portion 11a2 is located on a side of the first side wall portion 11a1 away from the bottom wall and is connected to the first side wall portion 11a1. A portion of the accommodating groove Sp corresponding to the first side wall portion 11a1 is a first accommodating groove Sp1, and a portion of the accommodating groove Sp corresponding to the second side wall portion 11a2 is a second accommodating groove Sp2. A cross-sectional area of the second accommodating groove Sp2 is larger than that of the first accommodating groove Sp1, thereby preventing the plating solution from overflowing. A cross-sectional area of the first accommodating groove Sp1 (or the second accommodating groove Sp2) is an area of a cross section of the first accommodating groove Sp1 (or the second accommodating groove Sp2) in a plane perpendicular to a height direction of the process groove body 10.
[0082] As shown in FIG. 2, the electrochemical deposition apparatus further includes: an injection plate 40 detachably arranged in the accommodating groove Sp. FIG. 7 is a schematic view of an overall structure of an injection plate and a mounting plate provided in some embodiments of the present disclosure. FIG. 8 is a schematic cross-sectional view of an injection plate provided in some embodiments of the present disclosure. FIG. 9 is a cross-sectional view taken along a line A-A of FIG. 7. FIG. 10 is a plan view of a first wall of an injection plate provided in some embodiments of the present disclosure. FIG. 11 is a plan view of a second wall of an injection plate provided in some embodiments of the present disclosure. As shown in FIGS. 7 to 11, the injection plate 40 includes an accommodating case 41 having a first accommodating chamber CA1, the accommodating case 41 is provided with a first liquid inlet 401 and a plurality of liquid outlets 402, the first liquid inlet 401 and the liquid outlets 402 are both communicated with the first accommodating chamber CA1, and the liquid outlets 402 are disposed closely to the substrate carrier.
[0083] In the electrochemical deposition process, the electrode structure 50, the substrate to be plated and the injection plate 40 are all disposed in the accommodating groove Sp, the electrode structure 50 is connected to the positive electrode of the power supply, and the substrate carrier 30 is connected to the negative electrode of the power supply, so as to form an electric field between the electrode structure and the substrate. The plating solution enters the first accommodating chamber CA1 through the first liquid inlet 401 of the injection plate 40 and flows out of the first accommodating chamber CA1 through the liquid outlets 402. Under the action of the electric field, metal ions in the plating solution are deposited on the substrate to form a metal layer. The plating solution flows out of the liquid outlets 402, so that the distribution positions and sizes of the liquid outlets 402 may be adjusted when a large-sized substrate is subjected to the electrochemical deposition process, so as to improve the thickness uniformity of the layer deposited on the substrate.
[0084] As shown in FIGS. 9 to 11, the accommodating case 41 includes: a first wall 411, a second wall 412 disposed opposite to the first wall 411, and a plurality of side walls 413 for connecting the first wall 411 and the second wall 412, the first wall 411, the second wall 412, and the plurality of side walls 413 are connected together to form a first accommodating chamber CA1. The liquid outlets 402 are arranged in the first wall 411. The injection plate 40 further includes: a plurality of liquid return lines 403 passing through the first accommodating chamber CA1, an inlet of each liquid return line 403 is provided in the first wall 411, and an outlet of each liquid return line 403 is provided in the second wall 412. The liquid return lines 403 are configured to circulate the plating liquid through two opposite sides of the injection plate 40.
[0085] FIG. 12 is a schematic view illustrating a distribution of liquid return lines and liquid outlets provided in some embodiments of the present disclosure. As shown in FIG. 12, in some embodiments, the liquid outlets 402 are uniformly distributed, the plurality of liquid return lines 403 are uniformly distributed, the liquid outlets 402 have the same aperture, and the liquid return lines 403 have the same inner diameter, so that the plating solution output at different positions have the same flow rate, thereby improving the uniformity of the thickness of the deposited layer on the substrate under the uniform electric field.
[0086] The liquid outlets 402 may be circular, the liquid return lines 403 are cylindrical, and the aperture of each liquid outlet 402 is smaller than the inner diameter of each liquid return line 403.
[0087] In some embodiments, as shown in FIG. 12, each liquid return line 403 is provided with liquid outlets 402 adjacent to and around the liquid return line. For at least some liquid return lines 403, lines sequentially connecting centers of the liquid outlets 402 around each liquid return line 403 form a hexagon. Alternatively, the liquid outlets 402 around each liquid return line 403 may be distributed in other ways. For example, the lines sequentially connecting the centers of the liquid outlets 402 around each liquid return line 403 form a quadrangle or a pentagon.
[0088] When the lines sequentially connecting the centers of the liquid outlets 402 around each liquid return line 403 form a polygon such as a quadrangle, a pentagon or a hexagon, a center of the inlet of the liquid return line 403 is located at a center of the polygon, so that when the injection plate 40 is placed in the accommodating groove Sp for the electrochemical deposition process, the metal ions in the plating solution, on one side of a region where the polygon is located, are distributed more uniformly, and the thickness of the layer deposited in a region of the substrate corresponding to the polygon is distributed more uniformly.
[0089] It should be noted that in the present disclosure, the distribution of the liquid return lines 403 and the liquid outlets 402 is not limited to the arrangement shown in FIG. 12, and may be specifically adjusted according to actual process requirements, which is not enumerated here.
[0090] As shown in FIG. 9, the injection plate 40 further includes: at least one uniform flow baffle 43 in the first accommodating chamber CA1 and configured to divide the first accommodating chamber CA1 to a main chamber CA11 and at least one pressure-equalizing chamber CA12. The first liquid inlet 401 is communicated with the at least one pressure-equalizing chamber CA12, the liquid outlets 402 are communicated with the main chamber, the at least one uniform flow baffle 43 is provided with a plurality of evenly distributed through holes 404, and the at least one pressure-equalizing chamber CA12 is communicated with the main chamber through the through holes 404 in the at least one uniform flow baffle 43. When the uniform flow baffle 43 is not provided, a liquid pressure near the first liquid inlet 401 is higher, and a liquid pressure at a position far from the first liquid inlet 401 is lower. By providing the uniform flow baffle 43, the pressure distribution of the plating solution is more uniform.
[0091] As shown in FIG. 9, the first liquid inlet 401 is located in the second wall 412. The injection plate 40 further includes: an injection box 42 provided with a second accommodating chamber CA2, and the second accommodating chamber CA2 is communicated with the first accommodating chamber CA1 through the first liquid inlet 401. The injection box 42 is provided with a second liquid inlet 42a communicated with the second accommodating chamber CA2. The plating solution enters the second accommodating chamber CA2 through the second liquid inlet 42a, enters the pressure-equalizing chamber CA12 through the first liquid inlet 401, then to the main chamber CA11, and exits through the liquid outlets 402. It should be noted that the first liquid inlet 401 may be provided in the first wall 411, as long as the second accommodating chamber CA2 may be communicated with the first accommodating chamber CA1 through the first liquid inlet 401.
[0092] In one example, two uniform flow baffles 43 are provided in the first accommodating chamber CA1 so as to divide the first accommodating chamber CA1 into the main chamber CA11 and two pressure-equalizing chambers CA12, and the two uniform flow baffles 43 are arranged in a height direction of the process groove body 10. Accordingly, two injection boxes 42 are provided, and are communicated with the pressure-equalizing chambers CA12 in one-to-one correspondence.
[0093] In one example, each injection box 42 may be connected to the first wall 411 by fasteners such as screws. The second accommodating chamber CA2 is communicated with the first accommodating chamber CA1 through two first liquid inlets 401. Alternatively, the second accommodating chamber CA2 may be communicated with the first accommodating chamber CA1 through the first liquid inlets 401 with other number. As shown in FIG. 9, a sealing ring 47 is provided between the injection box 42 and the accommodating case 41 and around the first liquid inlet 401 to prevent leakage between the injection box 42 and the accommodating case 41. The sealing ring 47 may be made of a flexible material such as rubber.
[0094] In one example, as shown in FIG. 9, the first wall 411 may include a first edge portion 411a and a second edge portion 411b, the second wall 412 includes a first edge portion 412a and a second edge portion 412b, the liquid outlets 402 and the inlets of the liquid return lines 403 are disposed in the first edge portion 411a of the first wall 411, and the outlets of the liquid return lines 403 are disposed in the first edge portion 412a of the second wall 412. The second liquid inlet 42a is located in the second edge portion 412b of the second wall 412. The plurality of side walls 413 of the accommodating case 41 may include: an upper side wall, a lower side wall, a left side wall and a right side wall. In one example, the upper side wall, one second edge portion 412b of the second wall 412, and one uniform flow baffle 43 are formed to have a one-piece structure, and the lower side wall, the other second edge portion 412b of the second wall 412, and the other uniform flow baffle 43 are formed to have a one-piece structure.
[0095] Portions of the first wall 411, the second wall 412, the side walls 413, and the injection box 42 of the injection plate 40 in direct contact with the plating solution may be made of an insulating material, such as polypropylene (PP), polymethyl methacrylate (PMMA) or the like, to prevent reaction of the portions with the plating solution.
[0096] In some embodiments, a distance from the injection plate 40 to the carrying surface is adjustable, such that a thickness of the layer may be adjusted by adjusting the distance from the injection plate 40 to the carrying surface.
[0097] FIG. 13 is a schematic view illustrating a distribution of first mounting holes in an injection plate and second mounting holes in a mounting plate provided in some embodiments of the present disclosure. As shown in FIG. 13, a plurality of first mounting hole groups V1g are further provided in the accommodating case 41 and arranged in the first direction, each of the first mounting hole groups V1g includes a plurality of first mounting holes V1 arranged in a third direction, and the third direction is the normal direction of the carrying surface. The first mounting hole VI may be specifically disposed in the side wall 413 of the injection plate 40.
[0098] The electrochemical deposition apparatus further includes: a mounting plate 40a and a plurality of fasteners, the mounting plate 40a is provided with a plurality of second mounting hole groups V2g, each of which includes a plurality of second mounting holes V2 arranged in the third direction, the second mounting hole groups V2g are in one-to-one correspondence with the first mounting hole groups V1g, and each of the second mounting holes V2 may be aligned with one of the first mounting holes V1. Each fastener may extend into one first mounting hole V1 and one second mounting hole V2 aligned with each other, to fasten the accommodating case 41 and the mounting plate 40a. For example, the fasteners are screws, and the first mounting holes V1 and the second mounting holes V2 are both threaded holes.
[0099] The mounting plate 40a may be disposed at a fixed position in the accommodating groove Sp. When a distance between the injection plate 40 and the carrying surface needs to be adjusted, a relative position between the mounting plate 40a and the injection plate 40 may be adjusted, so as to adjust the distance between the mounting plate 40a and the carrying surface. After the relative position between the mounting plate 40a and the injection plate 40 is determined, the accommodating case 41 and the mounting plate 40a are fixed by the fasteners.
[0100] In some embodiments, as shown in FIG. 13, each of the first mounting hole groups V1g includes N first mounting holes V1, N is an integer greater than 1, and the number of the second mounting holes V2 in each of the second mounting hole groups V2g is greater than or equal to N. A distance between any two adjacent first mounting holes V1 in each first mounting hole group V1g is equal to a distance between any two adjacent second mounting holes V2 in each second mounting hole group V2g, and a distance between any two adjacent first mounting hole groups V1g is equal to a distance between any two adjacent second mounting hole groups V2g.
[0101] In one example, each of some second mounting hole groups V2g includes N second mounting holes V2, and each of the other second mounting hole groups V2g includes N+1 second mounting holes V2. For example, the second mounting hole group V2g including the N second mounting holes V2 is referred to as a first kind of mounting hole group, and the second mounting hole group V2g including the N+1 second mounting holes V2 is referred to as a second kind of mounting hole group. The N second mounting holes V2 in the first kind of mounting hole group are staggered from the N+1 second mounting holes V2 in the second kind of mounting hole group. With such the staggering arrangement, the distance between the injection plate 40 and the carrying surface can be finely adjusted.
[0102] By taking N=2 as an example, each first mounting hole group V1g includes two first mounting holes V1, each first kind of mounting hole group includes two second mounting holes V2, and each second kind of mounting hole group includes three second mounting holes V2. As shown in FIG. 13, in a case that the mounting plate 40a is located at a fixed position in the accommodating groove Sp, when the two second mounting holes V2 at the left side and the middle in each second kind of mounting hole group are respectively aligned with the two first mounting holes V1 in the corresponding first mounting hole group V1g in one-to-one correspondence, there is a first distance between the injection plate 40 and the carrying surface. When two second mounting holes V2 in each first kind of mounting hole group are respectively aligned with two first mounting holes V1 in the corresponding first kind of mounting hole group V1g in one-to-one correspondence, there is a second distance between the injection plate 40 and the carrying surface. When the two second mounting holes V2 on the right side and in the middle in each second kind of mounting hole group are respectively aligned with the two first mounting holes V1 in the corresponding first mounting hole group V1g in one-to-one correspondence, there is a third distance between the injection plate 40 and the carrying surface. For example, for any one second mounting hole group V2g, when an interval between any two adjacent second mounting holes V2 is D and a perpendicular bisector of a line connecting any two adjacent second mounting holes V2 in each second kind of mounting hole group passes through one corresponding second mounting hole V2 in each first mounting hole group, a difference between the first distance and the second distance and a difference between the second distance and the third distance are both D/2. For example, D is set to 20 mm, the movement of the injection plate 40 with a step of 10 mm can be achieved.
[0103] It should be noted that the above example is schematically illustrated by taking N=2 as an example. Alternatively, N may be another value, which is not illustrated here.
[0104] As shown in FIG. 7, the injection plate 40 may further be provided with a lifting handle to lift the injection plate 40 out of the accommodating groove Sp or to place the injection plate 40 in the accommodating groove Sp.
[0105] As shown in FIG. 3, the electrochemical deposition apparatus further includes an injection plate mounting member 60 disposed on the inner wall of the process groove body 10. For example, the injection plate mounting member 60 may be mounted on the inner wall of the process groove body 10 through fasteners such as screws. The fasteners used to mount the injection plate mounting member 60 may be made of titanium metal or an organic material such as polyetheretherketone (PEEK), to avoid the erosion from the plating solution. FIG. 14 is a schematic view of an injection plate mounting member provided in some embodiments of the present disclosure. As shown in FIGS. 13 and 14, one of the mounting plate 40a and the injection plate mounting member 60 is provided with protrusions 61, and the other one is provided with clamping grooves 62, and the protrusions 61 are disposed in the corresponding clamping grooves 62, so that the position of the mounting plate 40a may be fixed. The clamping grooves 62 extend along a depth direction of the accommodating groove Sp. In the electrochemical deposition process, the mounting plate 40a and the injection plate 40 are fixedly connected together, and then the injection plate 40 and the mounting plate 40a connected together are placed in the accommodating groove Sp along the depth direction of the accommodating groove Sp, and the protrusions 61 are inserted into the corresponding clamping grooves 62. With such the engagement between the clamping grooves 62 and the protrusions 61, the mounting plate 40a and the injection plate 40 can be conveniently removed from the accommodating groove Sp, so that the injection plate 40 can be conveniently maintained, or the relative position between the mounting plate 40a and the injection plate 40 can be conveniently adjusted.
[0106] In one example, two protrusions 61 are provided on the mounting plate 40a and two clamping grooves 62 are provided on the injection plate mounting member 60, although other numbers of protrusions 61 and clamping grooves 62 are possible.
[0107] In FIGS. 13 and 14, as an example, the injection plate mounting member 60 is provided with the clamping grooves and the mounting plate 40a is provided with the protrusions 61, but in another example, the injection plate mounting member 60 may be provided with the protrusions and the mounting plate 40a may be provided with the clamping grooves.
[0108] In some embodiments, as shown in FIG. 3, the process groove body 10 is provided with a liquid circulation outlet V4 communicated with the accommodating groove Sp. The electrochemical deposition apparatus further includes: a filter screen 90 and a circulation assembly 92, the filter screen 90 is located at the liquid circulation outlet V4, and is configured to filter the plating solution discharged from the accommodating groove Sp to the liquid circulation outlet V4. An edge of the filter screen 90 may be fixed on the inner surface of the side wall of the process groove body 10 by using a pressing plate 91.
[0109] An inlet of the circulation assembly 92 is connected to the liquid circulation outlet V4, and an outlet of the circulation assembly 92 is communicated with the first liquid inlet 401 of the injection plate 40. With such the arrangement of the circulation assembly 92, the circulation flow of the plating solution in the accommodating groove Sp can be realized.
[0110] As shown in FIG. 3, the circulation assembly 92 may include: a first junction box 921 and a second junction box 922, wherein an inlet of the first junction box 921 is communicated with the liquid circulation outlet V4, an outlet of the first junction box 921 is communicated with an inlet of the second junction box 922, and an outlet of the second junction box 922 may be communicated with the second liquid inlet 42a of the injection plate 40 through lines 923 (as shown in FIGS. 1 and 2), and further with the first liquid inlet 401.
[0111] As shown in FIG. 3, the groove body 10 may further be provided with a waste liquid outlet V6. After a certain period of the electrochemical deposition process, the waste liquid outlet V6 may be opened to discharge waste liquid in the accommodating groove Sp.
[0112] FIG. 15 is a schematic perspective view of a substrate carrier provided in some embodiments of the present disclosure. FIG. 16 is a cross-sectional view taken along a line B-B of FIG. 15. As shown in FIG. 15, the substrate carrier 30 includes: a carrying plate 31 and a supporting plate 32, the carrying plate 31 has a first carrying sub-surface S11, and the supporting plate 31 has a hollow structure V5. The hollow structure V5 is provided to reduce the overall weight of the substrate carrier 30, so as to facilitate the pick-and-place of the substrate carrier 30. A shape of the hollow structure V5 is not limited. For example, the hollow structure V5 may be a rectangular hole, a circular hole, or other holes with an irregular shape penetrating through the carrying plate 31.
[0113] The supporting plate 32 covers the hollow structure V5, and has a second carrying sub-surface S12, and the second carrying sub-surface S12 and the first carrying sub-surface S11 together form the carrying surface S1 for carrying the substrate to be plated. A thickness of the supporting plate 32 is smaller than that of the carrying plate 31.
[0114] The carrying plate 31 and the supporting plate 32 are made of an insulating material, for example, an acrylic material, polypropylene (PP), polymethyl methacrylate (PMMA), or the like. The carrying plate 31 may be fixedly adhered to the supporting plate 32 by an adhesive.
[0115] As shown in FIG. 15, the substrate carrier 30 further includes: a conductive ring 33, and a pull-up structure 35. The conductive ring 33 is disposed on the carrying plate 31 and surrounds the supporting plate 32. The pull-up structure 35 is fixedly connected to the carrying plate 31. The substrate carrier 30 in the embodiment of the present disclosure may simultaneously carry two substrates, so that the electrochemical deposition process may be performed on the two substrates at the same time, thereby improving the production efficiency. That is, the substrate carrier 30 includes two carrying surfaces. In this case, the substrate carrier 30 includes the carrying plate 31 and two supporting plates 32, and conductive rings 33 are disposed on two opposite sides of the carrying plate 31.
[0116] As shown in FIG. 15, the pull-up structure 35 includes: a handle 353 and a first sealing plate 351 and a second sealing plate 352 opposite to each other. The first sealing plate 351 and the second sealing plate 352 are connected to two opposite surfaces of the carrying plate 31, respectively. The first sealing plate 351 and the second sealing plate 352 are the same in shape, size and material, and the first sealing plate 351 and the second sealing plate 352 may be fixedly connected to the carrying plate 31 by fasteners such as screws. The handle 353 is provided between the first sealing plate 351 and the second sealing plate 352 and is connected to the first sealing plate 351 and the second sealing plate 352. The handle 353 may be provided with a first ring 354. In the electrochemical deposition process, the first ring 354 may be grasped by using a manipulator, so as to place the substrate carrier 30 in the accommodating groove Sp. After the electrochemical deposition process is completed, the first ring 354 may be grasped by using the manipulator again, so as to get the substrate carrier 30 out of the accommodating groove Sp.
[0117] In one example, the handle 353, the first ring 354, the first sealing plate 351 and the second sealing plate 352 may be made of a material with a relative great strength, such as a stainless steel.
[0118] As shown in FIG. 15, the substrate carrier 30 further includes a conductive block 36 disposed on the pull-up structure 35 and electrically connected to the conductive ring 33. In one example, at least a portion of the conductive block 36 is located between the first sealing plate 351 and the second sealing plate 352 and at the end of the handle 353. When the first sealing plate 351 and the second sealing plate 352 are made of conductive materials, insulating layers may be disposed between the conductive block 36 and the first sealing plate 351 and between the conductive block 36 and the second sealing plate 352. In one example, as shown in FIG. 15, the carrying plate 31 may be further provided with a connecting member 34 located on a side of the conductive ring 33 close to the handle 353, the connecting member 34 and the conductive ring 33 may have a one-piece structure. The conductive block 36 may be electrically connected to the connecting member 34 by a conductive structure such as a wire, a flexible cable, or the like.
[0119] In one example, the conductive block 36 and the conductive ring 33 may both be made of copper, which has good conductivity.
[0120] In the electrochemical deposition process, the substrate is fixed on the carrying plate 31, the seed layer on the substrate is electrically connected to the conductive ring 33 by using a conductive tape or other conductive members. The negative electrode of the power supply is connected to the conductive block 36, so that the negative voltage provided by the power supply is transmitted to the conductive ring 33 through the conductive block 36, and in turn to the seed layer on the substrate.
[0121] In some embodiments, the conductive block 36 may also be physically connected to the driving assembly 20, so that the conductive block 36 moves under the control of the driving assembly 20 and therefore, the entire substrate carrier 30 moves.
[0122] As described above, the driving assembly 20 includes the first displacement unit 21 and the second displacement unit 22, and the second displacement unit 22 includes the second sliding block 223. In this case, as shown in FIG. 17, one of the conductive block 36 and the second sliding block 223 is provided with a limiting protrusion 2231, and the other one of the conductive block 36 and the second sliding block 223 is provided with a limiting groove, and the limiting protrusion 2231 is located in the limiting groove, so that the movement of the conductive block 36 is driven by the movement of the second sliding block 223, and the movement of the entire substrate carrier 30 is driven.
[0123] In one example, as shown in FIG. 17, the conductive block 36 is provided with a weight-reducing groove 36a or a hollow structure, to reduce the overall weight of the substrate carrier 30.
[0124] As shown in FIG. 2, in some embodiments, the electrochemical deposition apparatus further includes an electrode structure 50 connected to the positive electrode of the power supply, thereby forming an electric field between the electrode structure 50 and the substrate. As described above, two substrates may be simultaneously carried on two opposite sides of the substrate carrier 30. In this case, the electrochemical deposition apparatus may include two electrode structures 50 respectively disposed on two opposite sides of the substrate carrier 30.
[0125] FIG. 18 is a schematic perspective view of an electrode structure provided in some embodiments of the present disclosure. FIG. 19 is a schematic perspective view illustrating an electrode structure, at a different angle, provided in some embodiments of the present disclosure. As shown in FIGS. 18 and 19, each electrode structure 50 includes: a support frame 51 and at least one metal mesh structure 52 arranged on the support frame 51. The at least one metal mesh structure 52 and the support frame 51 may be made of titanium, so as to avoid or prevent the support frame 51 from being corroded by the plating solution.
[0126] As shown in FIG. 18 and FIG. 19, each electrode structure 50 includes one metal mesh structure 52, the support frame 51 includes a support border 511, and an edge of the metal mesh structure 52 is connected to the support border 511. In addition, the support frame 51 may further include a support bar 512, and two ends of the support bar 512 are connected to the support border 511.
[0127] In one example, an insulating protective layer (not shown) is disposed on the support border 511 and/or the support bar 512. For example, the insulating protective layer is provided on the support border 511.
[0128] As shown in FIGS. 18 and 19, each electrode structure 50 may further include: an energizing portion 53 configured to apply an electric signal and a transmission portion 54. Each metal mesh structure 52 is electrically connected to the energizing portion 53 through the transmission portion 54. For example, as shown in FIGS. 18 and 19, each electrode structure 50 includes one metal mesh structure 52 electrically connected to the energizing portion 53 through two transmission portions 54. For example, each transmission portion 54 extends in the depth direction of the accommodating groove Sp, and an extending direction of the energizing portion 53 intersects with (for example, perpendicular to) the extending direction of the transmission portion 54.
[0129] In some embodiments, at least one of the energizing portion 53 and the transmission portion 54 includes: a conductive main body and a protective layer wrapping the conductive main body, wherein an electric conductivity of the conductive main body is greater than that of the protective layer. The protective layer is used for preventing the conductive main body from reacting with metal ions in the plating solution, and an activity of the protective layer is less than that of the conductive main body. For example, at least one of the energizing portion 53 and the transmission portion 54 is a titanium-clad copper structure in which a main component of the conductive body is copper and a main component of the protective layer is titanium metal. For example, the energizing portion 53 and the transmission portion 54 are both of a titanium-clad copper structure.
[0130] FIG. 20 is a schematic perspective view of an electrode structure 50 provided in further embodiments of the present disclosure. The electrode structure 50 shown in FIG. 20 is similar to that in FIGS. 18 and 19, and the electrode structure 50 in FIGS. 18 to 20 includes the support frame 51, the metal mesh structure 52 disposed on the support frame 51, and the energizing portion 53 and the transmission portion 54, where each metal mesh structure 52 is connected to the energizing portion 53 through the transmission portion 54. Unlike in FIGS. 18 and 19, in FIG. 20, the electrode structure 50 includes a plurality of metal mesh structures 52 insulated from each other, and the support frame 51 includes at least one support portion 51a electrically connected to each metal mesh structure 52.
[0131] When each electrode structure 50 includes the plurality of metal mesh structures 52, voltages applied to the plurality of metal mesh structures 52 may be controlled respectively, so as to improve the uniformity of the electric field at different positions corresponding to the plurality of metal mesh structures 52, thereby improving the uniformity of film formation on the substrate.
[0132] For example, in the electrochemical deposition process, marginal discharge easily occurs at the electrode structure 50, so that the intensity of the electric field at the edge of the electrode structure 50 is greater than that in the middle of the electrode structure 50. In order to avoid this phenomenon, the plurality of metal mesh structures 52 in the electrode structure 50 in the embodiment of the present disclosure may include: a central metal mesh structure 52a and at least one edge metal mesh structure 52b surrounding the central metal mesh structure 52a, the central metal mesh structure 52a and the at least one edge metal mesh structure 52b are separated by an insulating frame 581. The uniformity of film formation is improved by controlling the voltages applied to the central metal mesh structure 52a and the at least one edge metal mesh structure 52b, respectively.
[0133] In FIG. 20, each support portion 51a may be made of titanium metal. An insulating protective layer may be disposed on the at least one support portion 51a. For example, the insulating protective layer may be disposed on the support portion 51a for supporting the edge metal mesh structure 52b. In addition, a protective jacket may be provided on the transmission portion 54 connected to the central metal mesh structure 52a, so as to prevent the transmission portion 54 from reacting with the plating solution.
[0134] In some embodiments, as shown in FIGS. 18 to 20, the energizing portion 53 is provided with a second ring 56. In the electrochemical deposition process, the second ring 56 may be grasped by using the manipulator, so as to place the substrate carrier 30 in the accommodating groove Sp. After the electrochemical deposition process is completed, the second ring 56 may be grasped by using the manipulator again, so as to get the substrate carrier 30 out of the accommodating groove Sp.
[0135] In some embodiments, as shown in FIG. 20, the electrode structure 50 may further include a first reinforcing block 58 disposed on the energizing portions 53 and a second reinforcing block 59 connected to the transmission portions 54 corresponding to the different metal mesh structures 52. The first reinforcing block 58 and the second reinforcing block 59 may improve structural stability of the electrode structure 50. The first reinforcing block 58 and the second reinforcing block 59 may be made of an insulating material.
[0136] As shown in FIG. 3, the electrochemical deposition apparatus may further include an electrode mounting member 70 disposed on the inner wall of the process groove body 10. For example, the electrode mounting member 70 may be mounted on the inner wall of the process groove body 10 by fasteners such as screws. The fasteners used to mount the electrode mounting member 70 may be made of titanium metal or an organic material such as polyetheretherketone (PEEK), to avoid the erosion from the plating solution.
[0137] FIG. 21 is a schematic perspective view of an electrode mounting member provided in some embodiments of the present disclosure. As shown in FIGS. 18 to 21, the electrode mounting member 70 includes a mounting groove 71, and the support frame 51 is further provided with a side wing 57, which may be inserted into the mounting groove 71, so as to clamp the electrode structure 50 in the accommodating groove Sp. The side wing 57 and the support frame 51 may be made of the same material.
[0138] The electrode mounting member 70 may be provided with a plurality of mounting grooves 71 arranged along the normal direction of the carrying surface. In the electrochemical deposition process, the side wing 57 may be inserted into different mounting grooves 71 according to specific process requirements, so that a distance between the electrode structure and the substrate may be adjusted, and therefore, the thickness of the layer formed on the substrate may be adjusted.
[0139] In addition, two electrode mounting members 70 are correspondingly provided for each electrode structure 50 and are configured to fix both ends of the electrode structure 50, respectively, to improve the stability of the electrode structure 50 provided in the accommodating groove Sp.
[0140] FIG. 22 is a schematic view of a portion of an electrochemical deposition apparatus provided in some embodiments of the present disclosure. As shown in FIG. 22, a third mounting member 72 is further disposed on the inner wall of the process groove body 10. The third mounting member 72 may be disposed on a side of the electrode mounting member 70 away from the bottom wall of the process groove body 10. A conductive portion 73 is fixed on the third mounting member 72 and is located on a side of the third mounting member 72 away from the bottom wall of the process groove body 10. An end of the energizing portion 53 of the electrode structure 50 is pressed against the conductive portion 73. The conductive portion 73 may be connected to the positive electrode of the power supply to transmit the anode voltage to electrode structure 50.
[0141] In some embodiments, as shown in FIG. 22, the process groove body 10 may be provided with a toggle clamp 80, and the toggle clamp 80 may include: a fixing base 81, a hand grip 82 and a pressing head 83, wherein the fixing base 81 is fixed on the side wall of the process groove body 10 as a carrying part of the toggle clamp 80. The hand grip 82 is configured to drive the pressing head 83 to move along the depth direction of the accommodating groove Sp so as to press the pressing head on the energizing portion 53 or move the pressing head 83 away from the energizing portion 53. For example, the hand grip 82 includes an operation portion 821 and a link portion 822, the operation portion 821 is held by an operator, and the link portion 822 is connected to the pressing head 83 and is rotatably connected to the fixing base 81. The lowering and raising of the pressing head 83 are controlled by controlling the raising and lowering of the operation portion 821. In the electrochemical deposition process, the toggle clamp 80 may be used to further fix the electrode structure 50, so as to ensure the stability of the electrode structure 50 disposed in the accommodating groove Sp.
[0142] As shown in FIG. 22, a cushion pad 55 is disposed on a surface of the energizing portion 53 close to the pressing head 83 and is configured to buffer the pressure from the toggle clamp, so as to prevent the electrode structure 50 from being damaged by a transient action force of the toggle clamp.
[0143] In the embodiment of the present disclosure, two toggle clamps may be correspondingly provided for each electrode structure 50. In addition, as described above, the substrate carrier 30 may simultaneously carry two substrates. In this case, two electrode structures 50 may be disposed in the accommodating groove Sp, and the circulation assembly 92 is disposed on two opposite sides of the process groove body 10.
[0144] It should be understood that the above embodiments are merely exemplary embodiments adopted to explain the principles of the present disclosure, and the present disclosure is not limited thereto. It will be apparent to one of ordinary skill in the art that various changes and modifications may be made therein without departing from the spirit and scope of the present disclosure, and such changes and modifications also fall within the scope of the present disclosure.
