EPITAXIAL SILICON WAFER FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING EPITAXIAL SILICON WAFER FOR MANUFACTURING SEMICONDUCTOR DEVICE

Abstract

A manufacturing method of an epitaxial silicon wafer includes forming an epitaxial film made of silicon on a surface of a silicon wafer in a trichlorosilane gas atmosphere; and setting the nitrogen concentration of the surface of the epitaxial film through inward diffusion from a nitride film on the epitaxial film, the nitride film being formed by subjecting the silicon wafer provided with the epitaxial film to heat treatment in a nitrogen atmosphere.

Claims

1. A manufacturing method of an epitaxial silicon wafer, the method comprising: forming an epitaxial film made of silicon on a surface of a silicon wafer in a trichlorosilane gas atmosphere; and setting a nitrogen concentration of the surface of the epitaxial film through inward diffusion from a nitride film on the epitaxial film, the nitride film being formed by subjecting the silicon wafer provided with the epitaxial film through the forming of the epitaxial film to a heat treatment in a nitrogen atmosphere.

2. The manufacturing method of an epitaxial silicon wafer according to claim 1, further comprising removing a native oxide on the surface of the epitaxial film before the nitride film is formed, wherein the setting of the nitrogen concentration is conducted on the silicon wafer after removing the native oxide.

3. The manufacturing method of an epitaxial silicon wafer according to claim 2, wherein the native oxide is removed by subjecting the silicon wafer to a heat treatment in one of an argon atmosphere, an ammonia atmosphere, and a hydrogen atmosphere by using the same heat treatment equipment as used in the setting of the nitrogen concentration.

4. The manufacturing method of an epitaxial silicon wafer according to claim 1, further comprising entirely removing the nitride film.

5. The manufacturing method of an epitaxial silicon wafer according to claim 4, further comprising forming a strain layer on the surface of the epitaxial film exposed after the removing of the nitride film, the strain layer causing a film stress ranging from 10 MPa to 1000 MPa.

6. The manufacturing method of an epitaxial silicon wafer according to claim 1, wherein in the setting of the nitrogen concentration, the heat treatment is conducted so that: a temperature X is in a range from 850° C. to 1400° C., a heat treatment time Y is 1 second or more, and formula (1) below is satisfied:
Y≥1×10.sup.34 exp(−0.084X)  (1).

Description

BRIEF DESCRIPTION OF DRAWING(S)

[0038] FIG. 1 is a cross section showing an epitaxial silicon wafer according to an exemplary embodiment of the invention.

[0039] FIG. 2 is a flowchart showing a manufacturing method of the epitaxial silicon wafer.

[0040] FIG. 3 illustrates an example of a semiconductor substrate, on which a strain layer is formed in a device process experienced by the epitaxial silicon wafer.

[0041] FIG. 4 is a graph showing a relationship between a temperature and time of a heat treatment in a nitrogen-concentration setting step, and occurrence of dislocations according to Examples of the invention.

DESCRIPTION OF EMBODIMENT(S)

[0042] An Exemplary embodiment of the invention will be described below with reference to the attached drawings.

Structure of Epitaxial Silicon Wafer

[0043] As shown in FIG. 1, an epitaxial silicon wafer EW includes a silicon wafer WF, and an epitaxial film EP provided on a surface of the silicon wafer WF.

[0044] A film thickness T of the epitaxial film EP is preferably in a range from 0.1 μm to 20 μm. The film thickness is preferably 0.1 μm or more because STI (Shallow Trench Isolation) structure is usually formed at a depth of 0.1 μm or more from the surface of the epitaxial film EP. Further, the film thickness of 20 μm or less is preferable because, when the film thickness exceeds 20 μm , warpage caused by crystal lattice mismatch between the silicon wafer WF and the epitaxial film EP exerts large influence on the film stress at the surface, whereby it is possible that the effect in reducing the occurrence of dislocations by inward diffusion of nitrogen is impaired. It should be noted that the film thickness T is further preferably more than 3 μm and 10 μm or less.

[0045] The nitrogen concentration of the surface of the epitaxial film EP is preferably in a range from 5.0×10.sup.13 atoms/cm.sup.3 to 5.0×10.sup.15 atoms/cm.sup.3, more preferably in a range from 1×10.sup.14 atoms/cm.sup.3 to 3×10.sup.15 atoms/cm.sup.3. It is preferable that nitrogen is introduced at or below solid solubility limit of silicon crystal. However, in view of the possibility of generating defects in the epitaxial film EP derived from nitrogen due to long-duration heat treatment in the device process, the above concentration range is preferable. The nitrogen concentration is preferably measured at a depth D of 80 nm to 200 nm from the surface, more preferably at the depth D of 100 nm.

[0046] The nitrogen concentration measured at the depth D of 3 μm from the surface of the epitaxial film EP is preferably 5.0×10.sup.13 atoms/cm.sup.3 or more. The point at the depth D of 3 μm is within the epitaxial film EP when the film thickness T of the epitaxial film EP exceeds 3 μm, and within the silicon wafer WF when the film thickness T is 3 μm or less.

[0047] With the nitrogen concentration of 5.0×10.sup.13 atoms/cm.sup.3 or more at the point of the depth D of 3 μm (irrespective of whether the point is within the silicon wafer WF), even when nitrogen in the surface of the epitaxial film EP is released through outward diffusion by the heat treatment during the device process or the like, nitrogen is fed to the surface of the epitaxial film EP from the depth D of 3 μm, thereby reducing dislocations.

[0048] Oxygen concentration of the silicon wafer WF is preferably in a range from 10×10.sup.17 atoms/cm.sup.3 to 15×10.sup.17 atoms/cm.sup.3 (ASTM1979). With the oxygen concentration being set within the above range, the sufficient strength of the epitaxial film EP can be ensured and defects due to oxygen can be reduced on the epitaxial film EP.

Manufacturing Method of Epitaxial Silicon Wafer

[0049] As shown in FIG. 2, a manufacturing method of the epitaxial silicon wafer EW having the above properties includes wafer-preparation step S1, epitaxial-film formation step S2, native oxide removal step S3, nitrogen-concentration setting step S4, nitride-film removal step S5, strain-layer formation step S6, and heat-treatment step S7.

[0050] It should be noted that at least one of the native oxide removal step S3, the nitride-film removal step S5, the strain-layer formation step S6, and the heat-treatment step S7 may be omitted.

[0051] In the wafer-preparation step S1, a silicon single crystal ingot pulled up by CZ (Czochralski) method, MCZ (Magnetic-field-applied Czochralski) method or the like is subjected to necessary steps selected from slicing, chamfering, grinding, lapping, etching, polishing, washing, heat treatment such as DK (Donor Killer) treatment, and the like to be formed into the silicon wafer WF having a mirror-polished surface.

[0052] In the epitaxial-film formation step S2, the epitaxial film EP having a predetermined film thickness T is formed on the silicon wafer WF to provide the epitaxial silicon wafer EW. At this time, the epitaxial film is formed in a gas atmosphere (e.g. trichlorosilane) at a treatment temperature ranging from 1150 to 1280 degrees C. It should be noted that necessary dopant(s) such as boron and phosphorus may be added.

[0053] In the native oxide removal step S3, a native oxide formed on the epitaxial film EP is removed. The removal of the native oxide during the native oxide removal step S3 may be conducted by, for instance, loading the epitaxial silicon wafer EW in heat treatment equipment, which is to be used in the nitrogen-concentration setting step S4, and subjecting the epitaxial silicon wafer EW to a heat treatment in an atmosphere of one of argon atmosphere, ammonia atmosphere and hydrogen atmosphere.

[0054] The heat treatment temperature is preferably in a range from 1000 to 1350 degrees C. in any of the argon atmosphere, ammonia atmosphere, hydrogen atmosphere, or a mixture atmosphere of combination of at least two of the argon atmosphere, ammonia atmosphere, and hydrogen atmosphere. When the temperature is lower than 1000 degrees C., it is possible that the native oxide is not completely removed. Meanwhile, the upper limit is 1350 degrees C. in view of the performance limitations of the heat treatment equipment. The heat treatment time is preferably in a range from 1 second to 60 seconds. In order to completely remove the native oxide, the epitaxial silicon wafer is preferably subjected to heat treatment of 1 or more seconds. Further, the heat treatment time is preferably as short as possible in view of productivity. When the heat treatment temperature is in a range from 1000 to 1350 degrees C., it is believed that the native oxide can be sufficiently removed by a heat treatment of 60 seconds or less.

[0055] In the nitrogen-concentration setting step S4, the epitaxial silicon wafer EW, from which the native oxide is removed, is subjected to a heat treatment in a nitrogen atmosphere to form a nitride film on the epitaxial film EP and the nitrogen concentration of the surface of the epitaxial film EP is set through inward diffusion from the nitride film. At this time, the nitrogen concentration in the silicon wafer WF is set as well as the nitrogen concentration on and inside of the surface of the epitaxial film EP.

[0056] In the nitrogen-concentration setting step S4, it is preferable that the heat treatment is conducted such that the temperature X (degrees C.) is in a range from 850 degrees C. to 1400 degrees C., and the heat treatment time Y (seconds) is 1 second or more and satisfies the following formula (1).

Y≥1×10.sup.34 exp(−0.084X)  (1)

[0057] The heat treatment may be conducted in any manner (e.g. batch process using a vertical furnace, rapid heating/cooling heat treatment using a single wafer processing furnace, and the like) as long as the nitrogen concentration of the epitaxial film EP can be set in the above-described range. The atmosphere gas for the heat treatment may consist of ammonia or may be a mixture gas of argon and ammonia. The heat treatment equipment used for the nitrogen-concentration setting step S4 is preferably the same heat treatment equipment as used in the native oxide removal step S3, since the nitride film can be formed only by changing the atmosphere in the heat treatment equipment after removing the native oxide.

[0058] In the nitride-film removal step S5, the nitride film used for the setting of the nitrogen concentration of the epitaxial film EP is entirely removed. In the nitride-film removal step S5, a part of the epitaxial film EP near the surface thereof may be removed together with the nitride film. At this time, the nitrogen concentration of the surface of the epitaxial film EP after the removal of the nitride film (and the part of the surface of the epitaxial film EP) needs to be kept at a level capable of reducing the occurrence of dislocations when a strain layer is formed. The nitride film is exemplarily removed by polishing and/or etching.

[0059] In the strain-layer formation step S6, the strain layer causing a film stress ranging from 10 MPa to 1000 MPa is formed on the surface of the epitaxial film EP exposed after the nitride-film removal step S5.

[0060] The strain layer is partially formed on the surface of the epitaxial film EP to form a part of devices. Specifically, as shown in FIG. 3, the strain layer is SiGe film, SiC film or the like, which causes film stress in a plane direction (shown by arrows TE) of the surface of the epitaxial film EP and forms a source region SC and a drain region DR at a part except for a part immediately below a gate region GT. The strain layer as shown in FIG. 3 is not exhaustive, but may be in any form and may be formed in any manner as long as the film stress is caused.

[0061] It should be noted that the epitaxial silicon wafer EW of the exemplary embodiment is subjected to the device process, a part of which may be the strain-layer formation step S6.

[0062] The heat-treatment step S7 is performed, for instance, under the same conditions as the heat treatment in the device process. Since the nitrogen concentration of the surface of the epitaxial film EP is set within the above range, the occurrence of dislocations can be reduced even when a film stress ranging from 10 MPa to 1000 MPa is caused by the strain layer in the heat-treatment step S7.

Advantages of Exemplary Embodiment(s)

[0063] As described above, since the nitrogen concentration of the surface of the epitaxial film EP of the epitaxial silicon wafer EW is set at 5.0×10.sup.13 atoms/cm.sup.3 or more, the occurrence of the dislocations can be reduced even when the strain layer is formed on the epitaxial film EP.

[0064] Further, since the inward diffusion from the nitride film formed on the epitaxial film EP is used in order to set the nitrogen concentration of the epitaxial silicon wafer EW, the nitrogen concentration of the surface of the epitaxial film EP can be increased to a level capable of reducing the occurrence of the dislocations in the manufacturing method of the invention.

EXAMPLES

[0065] Next, the invention will be described in more detail below with reference to Examples. However, it should be noted that the scope of the invention is by no means limited by these Examples.

Manufacturing Method of Samples

Experimental Example 1

[0066] A 2-μm thick epitaxial film was grown on a silicon wafer, which was mirror-polished after being cut from a 300-mm silicon single crystal grown by Czochralski (CZ) method, at a temperature of approximately 1100 degrees C.

[0067] Subsequently, as shown in Table 1, the silicon wafer was subjected to the native oxide removal step, as necessary, and the heat treatment (nitrogen-concentration setting step) in a nitrogen atmosphere under conditions shown in Table 1. The silicon wafer was subjected to the treatment in an RTA (Rapid Thermal Annealing) furnace when the treatment time was 180 seconds or less, or to the treatment in a vertical furnace when the treatment time was more than 180 seconds. After the heat treatment, the formed nitride film was entirely removed to provide the epitaxial silicon wafers according to Experimental Example 1 under 25 conditions shown in Table 1.

[0068] It should be noted that heat treatment equipment used in the nitrogen-concentration setting step was also used in the native oxide removal step to apply a heat treatment for 60 seconds in a hydrogen atmosphere of 1000 degrees C.

Experimental Examples 2, 3

[0069] Epitaxial silicon wafers according to Experimental Example 2 were obtained under 25 conditions shown in Table 1 in the same process as in Experimental Example 1 except that the epitaxial film was grown to be 4-μm thick.

[0070] Epitaxial silicon wafers according to Experimental Example 3 were obtained under 25 conditions shown in Table 1 in the same process as in Experimental Example 1 except that the epitaxial film was grown to be 6-μm thick.

TABLE-US-00001 TABLE 1 Nitrogen-concentration Result of setting step Native Nitrogen three- Temperature oxide concentration point X (degrees Time removal at 3 μm depth bending Conditions C.) Y(sec.) step (atoms/cm.sup.−3) test 1 800 3600 Yes <LOD (limit of NG detection) 2 800 10800 Yes <LOD NG 3 850 12 Yes <LOD NG 4 850 120 Yes <LOD NG 5 850 300 Yes <LOD NG 6 850 600 Yes <LOD NG 7 850 1200 No <LOD NG 8 850 1200 Yes 5.1 × 10.sup.13 OK 9 850 3600 Yes 5.5 × 10.sup.13 OK 10 850 10800 Yes 5.8 × 10.sup.13 OK 11 900 6 Yes <LOD NG 12 900 18 No <LOD NG 13 900 18 Yes 5.0 × 10.sup.13 OK 14 900 180 No <LOD NG 15 900 180 Yes 1.1 × 10.sup.14 OK 16 900 1200 Yes 1.3 × 10.sup.14 OK 17 950 6 No <LOD NG 18 950 6 Yes 1.2 × 10.sup.14 OK 19 950 60 Yes 2.5 × 10.sup.14 OK 20 1000 6 No <LOD NG 21 1000 6 Yes 3.9 × 10.sup.14 OK 22 1000 18 Yes 5.0 × 10.sup.14 OK 23 1100 6 No <LOD NG 24 1100 6 Yes 1.5 × 10.sup.15 OK 25 1200 6 Yes 3.0 × 10.sup.15 OK

Evaluation

Nitrogen Concentration of Epitaxial Silicon Wafer

[0071] The nitrogen concentration of the top layer of the epitaxial film of the epitaxial silicon wafer prepared through the process of Experimental Examples 1, 2, 3 (specifically, the concentration at the depth of 3 μm from the surface of the epitaxial film) was measured using an SIMS.

[0072] The measurements were the same as in Experimental Examples 1, 2, 3. The results are shown in Table 1.

[0073] It should be noted that, since the thickness of the epitaxial film in Experimental Example 1 was 2 μm, the results in Table 1 show the nitrogen concentration in the silicon wafer. Since the thicknesses of the epitaxial films in Experimental Examples 2, 3 were 4 μm and 6 μm, respectively, the results in Table 1 show the nitrogen concentration in the epitaxial film. The lower limit of detection was 5.0×10.sup.13 atoms/cm.sup.3.

[0074] As shown in Table 1, the nitrogen concentrations under the conditions 7, 12, 14, 17, 20 and 23, in which the native oxide removal step was not conducted, were less than the lower limit of detection. In contrast, all of the nitrogen concentrations under conditions 8, 13, 15, 18, 21 and 24, in which the nitrogen-concentration setting step under the same conditions as in the conditions 7, 12, 14, 17, 20 and 23 and the native oxide removal step were conducted, were the lower limit of detection or more.

[0075] Accordingly, it has been demonstrated that the native oxide removal step before the nitrogen-concentration setting step promotes the inward diffusion of nitrogen into the epitaxial film to increase the nitrogen concentration to a desired level.

[0076] It can be assumed that the samples with the nitrogen concentration of the lower limit of detection or more in Table 1 have the nitrogen concentration of the lower limit of detection or more in the surface of the epitaxial film. The reason for the above is as follows.

[0077] With the use of outward diffusion from the silicon wafer, the nitrogen concentration becomes lower toward the surface of the epitaxial silicon wafer. However, in Experimental Examples, with the use of inward diffusion from the nitride film formed on the surface of the epitaxial silicon wafer, the nitrogen concentration becomes higher toward the top layer.

Effect in Reducing Occurrence of Dislocations in Epitaxial Silicon Wafer

[0078] Stress-applying test was conducted on the epitaxial silicon wafers according to Experimental Example 2.

[0079] Initially, a measurement sample of 3-cm length and 1.5-cm width was cut out from each of epitaxial silicon wafers. Next, a linear impression with 100-nm depth, 50-μm width and 1-mm length was formed on the surface of each measurement sample (i.e. on the surface of the epitaxial film). Then, a three-point bending test was conducted on each measurement sample with a distance between supports being 2 cm at a test temperature of 800 degrees C. At this time, 2N load was applied so that tensile stress acts on the surface of the measurement sample.

[0080] Subsequently, each measurement sample having been cooled to the ambient temperature was light-etched by approximately 1 μm to check the presence of dislocation pits generated from the linear impression using an optical microscope.

[0081] The results are shown in Table 1. It should be noted that “NG” indicates that the dislocation pits were detected and “OK” indicates that the dislocation pits were not detected.

[0082] As shown in Table 1, the dislocation pits were detected in all the samples with the nitrogen concentration of less than the lower limit of detection at the depth of 3 μm from the surface of the epitaxial film. In contrast, the dislocation pits were not detected in all the samples with the nitrogen concentration of the epitaxial film having the lower limit of detection or more at the depth of 3 μm from the surface.

[0083] This is speculated to be because a high nitrogen concentration increases critical stress for the occurrence of dislocations and, consequently, reduces the occurrence of dislocations, which is caused at the linear impression formed on the surface of the silicon wafer as a result of concentration of the stress applied in the three-point bending test. It is also supposed that the same results are obtained in Examples 1,3 because of the same nitrogen concentration.

[0084] From the above, it has been demonstrated that the nitrogen concentration of 5.0×10.sup.13 atoms/cm.sup.3 or more measured at the depth of 3 μm from the surface of the epitaxial film can reduce the occurrence of dislocations.

[0085] Further, it is speculated that the above range of the nitrogen concentration at the depth of 3 μm allows nitrogen to be supplied from the 3-μm depth to the surface of the epitaxial film even when nitrogen in the surface of the epitaxial film is released through outward diffusion due to the heat treatment during the device process or the like, resulting in the reduction of the occurrence of dislocations.

Mathematical Formulation of Heat Treatment Conditions in Nitrogen Concentration Setting Step

[0086] The relationship between temperature X and time Y of the heat treatment during the nitrogen-concentration setting step is plotted in a graph shown in FIG. 4 for the conditions other than 7, 12, 14, 17, 20, and 23 in Table 1, in which the native oxide removal step is not conducted. In the graph, the result “NG” of the three-point bending test is plotted in “x”, whereas the result “OK” is plotted in “ο.”

[0087] The border between “OK” and “NG” is approximated by a linear line represented by a formula (2) below, where the left and right sides with respect to the linear line are “NG” region and “OK” region, respectively.

Y=1×10.sup.34 exp(−0.084X)   (2)

[0088] As a result, it has been found that the heat treatment during the nitrogen-concentration setting step, which satisfies the above formula (1), allows the nitrogen concentration at the depth of 3 μm from the surface of the epitaxial film to be 5.0×10.sup.13 atoms/cm.sup.3 or more.