PZN-BASED LARGE-SIZE TERNARY HIGH-PERFORMANCE SINGLE CRYSTAL, GROWING METHOD AND MOLTEN SALT FURNACE THEREOF
20230108035 · 2023-04-06
Inventors
Cpc classification
C30B29/32
CHEMISTRY; METALLURGY
C30B9/06
CHEMISTRY; METALLURGY
C30B19/08
CHEMISTRY; METALLURGY
C01G33/006
CHEMISTRY; METALLURGY
International classification
C30B29/32
CHEMISTRY; METALLURGY
C30B9/06
CHEMISTRY; METALLURGY
Abstract
The present invention provides a PZN-based large-size ternary high-performance single crystal, a growing method and a molten salt furnace. The PZN-based large-size ternary high-performance single crystal is represented by formula (1-x-y)Pb(B′.sub.1/2B″.sub.1/2)O.sub.3-yPb(Zn.sub.1/3Nb.sub.2/3)O.sub.3-xPbTiO.sub.3, wherein B′ is Mg, Fe, Sc, Ni, In, Yb, Lu and/or Ho, B″ is Nb, Ta and/or W, 0.4<x<0.6, 0.1<y<0.4, 0.1<1-x-y<0.4. The present invention adjusts the convective change of the melt through the rotation of the top seed and the bottom crucible, overcoming the problems of serious crystal inclusions and poor crystal quality during the growth process, and can adapt the change of the crystal diameter to the thermal inertia of the heat preservation system, thus effectively reducing crystal inclusions and improving the yield of the crystal.
Claims
1. A PZN-based large-size ternary high-performance single crystal represented by formula (1-x-y)Pb(B′.sub.1/2B″.sub.1/2)O.sub.3-yPb(Zn.sub.1/3Nb.sub.2/3)O.sub.3-xPbTiO.sub.3, wherein B′ is Mg, Fe, Sc, Ni, In, Yb, Lu and/or Ho, B″ is Nb, Ta and/or W, 0.4<x<0.6, 0.1<y<0.4, 0.1<1-x-y<0.4.
2. A method for preparing the PZN-based large-size ternary high-performance single crystal according to claim 1, comprising the steps of: mixing of raw materials (S1), including weighing raw materials according to the stoichiometric ratio of the single crystal, adding a flux to the raw materials, mixing the raw materials and the flux evenly and grinding the same, and loading the resultant into a crucible for subsequent use, positioning of seed (S2), including transferring the crucible containing the raw materials and flux to a molten salt furnace, fixing a seed on a seed rod, adjusting the position of the seed rod in the molten salt furnace so that the molten salt furnace, crucible and seed are centered on a line; crystal growth (S3), including heating the materials in the crucible to a molten state and maintaining the same at a constant temperature to obtain a melt, then moving the seed rod to adjust the seed to meet the liquid level of the melt, followed by cooling to a temperature below the saturation point for crystal growth, wherein during the growth process, the convective changes of the melt are adjusted by rotating the seed rod and crucible; cooling and annealing (S4), including lifting the crystal from the melt when the crystal grows to a preset size, and cooling and annealing the crystal to obtain the final PZN-based large-size ternary high-performance single crystal.
3. The method for preparing the PZN-based large-size ternary high-performance single crystal according to claim 2, wherein the seed in the step S2 has the same composition as the PZN-based large-size ternary high-performance single crystal prepared by cooling and annealing in the step S4, and wherein the growth orientation of the seed is [111] or [001].
4. The method for preparing the PZN-based large-size ternary high-performance single crystal according to claim 2, wherein the flux is one of two mixtures of PbO and B.sub.2O.sub.3 or PbO and PbF.sub.2.
5. A molten salt furnace for use in the method for preparing the PZN-based large-size ternary high-performance single crystal according to claim 2, comprising a furnace body provided with a cylindrical inner cavity, wherein a rotary motor is provided at the bottom of the furnace body and a rotary crucible base driven by the rotary motor is provided at the bottom of the cylindrical inner cavity of the furnace body, wherein a seed rod position adjustment device is provided on the outer side of the furnace body, and wherein the bottom of the seed rod position adjustment device fixes a seed rod inserted into the cylindrical inner cavity of the furnace body and drives the seed rod to rotate the crucible base.
6. The molten salt furnace according to claim 5, wherein the crucible base is supported at the bottom of the cylindrical inner cavity through a support rod, wherein a lower end of the support rod extends to the outside of the furnace body and is fixedly provided with a first bevel gear, and wherein an end of output shaft of the rotary motor is connected to a second bevel gear meshed with the first bevel gear.
7. The molten salt furnace according to claim 6, wherein the crucible base includes a mounting seat fixedly connected to the support rod, and a cover fitted with the top of the mounting seat and supporting the crucible; wherein at least three guide blocks and buffer springs equal to the number of the guide blocks are evenly distributed inside the mounting seat along the circumferential direction, the buffer springs passing through horizontal through holes formed in the guide blocks, the guide blocks are further provided with an installation groove in which a limit block and an elastic pressing strip are arranged and a pressing plate, the installation groove is configured to guide the limit block in a vertical direction, wherein the elastic pressing strip is fitted with the upper surface of the guide blocks, which upper surface is provided with a guide groove for the two ends of the elastic pressing strip to slide, wherein the pressing plate is fitted with the top of the guide blocks to seal the top of the guide groove, and the elastic pressing strip provides a vertical downward pressing force for the limit block through elastic deformation; wherein a protrusion and two abutting surfaces located on either side of the protrusion in the length direction of the buffer springs are provided on the bottom of the limit block, wherein the abutting surfaces are fitted with the buffer springs, the protrusion is inserted between two adjacent turns of the buffer springs when the buffer springs are stationary, and the cross section of the protrusion in the radial direction of the buffer springs is an isosceles trapezoid; and wherein an inner side of the cover is provided with baffle plates equal to the number of the buffer springs, wherein the baffle plates are arranged between two adjacent buffer springs to press the buffer springs on one side during the relative rotation of the mounting base and the cover.
8. The molten salt furnace according to claim 6, wherein the seed rod position adjustment device includes a base on which a lifting fixing plate is vertically arranged, wherein a first lifting rod and a second lifting rod are provided in parallel on either side of the lifting fixing plate, a first driving gear opposite to the first lifting rod and a second driving gear opposite to the second lifting rod are provided on the top of the lifting fixing plate, wherein the first lifting rod is provided with a counterweight slider that slides up and down and the second lifting rod is provided with a lifting slider that slides up and down, the counterweight slider and the lifting slider being controlled by a lifting rack meshed with the first driving gear and the second driving gear of a lifting driving component, and wherein the lifting slider is connected to an adjustment arm, the bottom of the adjustment arm fixing the seed rod.
9. The molten salt furnace according to claim 8, wherein the adjustment arm comprises a left and right adjustment joint having one end connected to the lifting slider and the other end connected to one end of a front and rear adjustment joint, the bottom of the front and rear adjustment joint fixing the seed rod.
10. The molten salt furnace according to claim 9, wherein the other end of the front and rear adjustment joint is provided with a connecting seat connected to a motor fixing bracket on which a servo motor is arranged, an output shaft of the servo motor being connected to the seed rod through a coupling.
Description
DESCRIPTION OF THE DRAWINGS
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[0070] List of reference signs: 1. Furnace body; 101. Casing; 102. Thermal insulation jacket; 103. High-temperature furnace wire; 104. Wire winding tube; 105. Thermal insulation cover; 106. Heat preservation cover; 107. Thermal insulation bottom plate; 108. Crucible base; 1081. Mounting seat; 1082. Cover; 10821. Baffle plate; 1083. Guide block; 1084. Buffer spring; 1085. Installation groove; 1086. Pressing plate; 1087. Limit block; 10871. Protrusion; 10872. Abutting surface; 1088. Elastic pressing strip; 1089. Annular groove; 109. Crucible; 110. Support rod; 111. Thermocouple; 112. Furnace body balance adjustment device; 113. Sealing block; 114. First bevel gear; 115. Locking block; 116. Motor support; 117. Bevel gear II; 118. Rotary motor; 2. Seed rod module; 201. Seed collet; 202. Seed rod; 203. Guide bearing; 204. Coupling; 205. Connecting seat; 206. Motor fixing bracket; 207. Servo motor; 3. Seed rod position adjustment device; 31. Adjustment arm; 3101. Left and right adjustment joint; 3102, Front and rear adjustment joint; 3104. Left and right adjustment seat; 3105. Left and right rack; 3106. Left and right adjustment gear; 3103. Left and right adjustment bolt; 3107. Connecting head; 3108. Left and right adjustment shaft; 3109. Connecting body; 3110. Front and rear adjustment seat; 3114. Front and rear adjustment screw rod; 3112. Front and rear adjustment slider; 3111. Front and rear adjustment bolt; 3113. Front and rear adjustment screw rod lock nut; 3114. Front and rear adjustment screw rod; 32. Lifting adjustment seat; 3201. First lifting rod; 3202. Second lifting rod; 3203. Base; 3204. lifting fixing plate; 3205. Lifting rod fixing seat; 3206. First driving gear; 3207. Second driving gear; 3208. First driven gear; 3209. Second driven gear; 3210. Gearbox; 3211. First transmission gear; 3212. Second transmission gear; 3213. Transmission shaft; 3214. Driving shaft; 3215. Driven shaft; 3216. Lifting drive motor; 3217. Long shaft sleeve; 3218. Bearing; 3219. Short shaft sleeve; 33. Lifting rack; 34. Counterweight slider; 35. Lifting slider.
DETAILED DESCRIPTION
[0071] To further illustrate the technical means adopted by the present invention to achieve the objects of the present invention and effects thereof, the specific embodiments, features and effects of the PZN-based large-size ternary high-performance single crystal, the growth method and the molten salt furnace proposed by the present invention are described in detail as follows.
Example 1
[0072] A method of preparing a PZN-based large-size ternary high-performance single crystal represented by formula 0.3Pb(In.sub.1/2Nb.sub.1/2)O.sub.3-0.2Pb(Zn.sub.1/3Nb.sub.2/3)O.sub.3-0.5PbTiO.sub.3 through TSSG process using PbO and B.sub.2O.sub.3 as flux in a molten salt furnace comprising a rotatable seed rod and a rotatable crucible, the method comprises the following steps:
[0073] S1 of weighing raw materials PbO, In.sub.2O.sub.3, ZnO, Nb.sub.2O.sub.5, TiO.sub.2 and B.sub.2O.sub.3 according to the stoichiometric ratio of the formula of the crystal, mixing the raw materials with the flux, grinding the mixture and loading the resultant into the crucible;
[0074] S2 of fixing a seed on the seed rod, and adjusting the seed rod left and right such that the molten salt furnace, the crucible and the seed are centered on a line;
[0075] S3 of heating the raw materials to 1050° C. to melt, keeping the temperature constant for 3 days to obtain a melt, adjusting the seed to meet the liquid level of the melt, finding the saturation temperature and then cooling to below the supersaturation temperature for crystal growth, wherein the cooling rate is 3° C./day, and wherein during the growth process, the convective change of the melt is adjusted by rotating the seed rod and crucible;
[0076] S4 of lifting the crystal from the melt when the temperature drops to 950° C. and the crystal grows to a preset size, and cooling and annealing the crystal to obtain the PZN-based large-size single crystal, wherein the annealing cooling rate is 20° C./h, and the temperature after annealing is 25° C.
[0077] The growth orientation of the PIN-PZN-PT ternary high-performance single crystal prepared in Example 1 is (111), and the size is 40 mm×40 mm×15 mm.
Example 2
[0078] Example 2 is the same with Example 1 except that the single crystal is represented by formula 0.35Pb(In.sub.1/2Nb.sub.1/2)O.sub.3-0.2Pb(Zn.sub.1/3Nb.sub.2/3)O.sub.3-0.45PbTiO.sub.3, meaning that the weighing ratio of the raw materials is changed accordingly.
[0079] The growth orientation of the PIN-PZN-PT ternary high-performance single crystal prepared is (001), and the size is 30 mm×40 mm×15 mm.
Example 3
[0080] Example 3 is the same with Example 1 except that the single crystal is represented by formula 0.25Pb(In.sub.1/2Nb.sub.1/2)O.sub.3-0.2Pb(Zn.sub.1/3Nb.sub.2/3)O.sub.3-0.55PbTiO.sub.3, meaning that the weighing ratio of the raw materials is changed accordingly.
[0081] The growth orientation of the PIN-PZN-PT ternary high-performance single crystal prepared is (001), and the size is 50 mm×40 mm×20 mm.
Example 4
[0082] Example 4 is the same with Example 1 except that the single crystal is represented by formula 0.15Pb(In.sub.1/2Nb.sub.1/2)O.sub.3-0.35Pb(Zn.sub.1/3Nb.sub.2/3)O.sub.3-0.5PbTiO.sub.3, meaning that the weighing ratio of the raw materials is changed accordingly.
[0083] The growth orientation of the PIN-PZN-PT ternary high-performance single crystal prepared is (111), and the size is 40 mm×30 mm×20 mm.
Example 5
[0084] Example 5 is the same with Example 1 except that the single crystal is represented by formula 0.35Pb(In.sub.1/2Nb.sub.1/2)O.sub.3-0.15Pb(Zn.sub.1/3Nb.sub.2/3)O.sub.3-0.5PbTiO.sub.3, meaning that the weighing ratio of the raw materials is changed accordingly.
[0085] The growth orientation of the PIN-PZN-PT ternary high-performance single crystal prepared is (111), and the size is 40 mm×50 mm×10 mm.
Example 6
[0086] Example 6 is the same as Example 1 except that the flux is a composite of PbO and BaTiO.sub.3 in a mass ratio of 4:0.9.
[0087] The growth orientation of the PIN-PZN-PT ternary high-performance single crystal prepared is (111), and the size is 40 mm×40 mm×15 mm.
Example 7
[0088] Example 7 is the same as Example 1 except that the flux is a composite of PbO and PbF.sub.2 in a mass ratio of 5:1.
[0089] The growth orientation of the PIN-PZN-PT ternary high-performance single crystal prepared is (111), and the size is 40 mm×40 mm×15 mm.
Example 8
[0090] Example 8 is the same as Example 1 except that the flux is a composite of PbO, B.sub.2O.sub.3 and BaTiO.sub.3 in a mass ratio of 4:0.7:1.
[0091] The growth orientation of the PIN-PZN-PT ternary high-performance single crystal prepared is (001), and the size is 30 mm×50 mm×15 mm.
[0092] The yield and piezoelectric constant d.sub.33 of the PIN-PZN-PT ternary high-performance single crystal prepared in Examples 1-8 are indicated in Table 1. It can be seen that the yields of Examples 1-8 are all above 95% and the d.sub.33 is between 2650-2728 pC/N. In contrast, the d.sub.33 of the PZN-PT binary single crystal is around 2100 pC/N. The d.sub.33 of the PIN-PZN-PT ternary single crystal prepared in the prior art is between 2500-2600 pC/N, and the yield is lower than 95% of the present invention, indicating that the PIN-PZN-PT ternary high-performance single crystal prepared by the present invention has better piezoelectric performance and higher quality.
TABLE-US-00001 TABLE 1 Yield and Piezoelectric Constant of Examples 1-8 Example Yield (%) d.sub.33 (pC/N) 1 96.5 2720 2 96.1 2680 3 96.2 2715 4 95.8 2728 5 96.1 2685 6 95.5 2676 7 95.3 2655 8 95.6 2670
Examples 9-16
[0093] Examples 9-16 are the same as Examples 1-8 except that the single crystal is represented by formula 1-x-yPb(Lu.sub.1/2Nb.sub.1/2)O.sub.3-yPb(Zn.sub.1/3Nb.sub.2/3)O.sub.3-xPbTiO.sub.3 and that in step S1 the PbO, MgO, ZnO, Nb.sub.2O.sub.5, TiO.sub.2 and B.sub.2O.sub.3 are weighed according to the stoichiometric ratio of the foresaid formula.
[0094] The growth orientation and size of the PLuN-PZN-PT ternary high-performance single crystal prepared in Examples 9-16 are the same as those in Examples 1-8, respectively.
[0095] The yield and piezoelectric constant d.sub.33 of the PLuN-PZN-PT ternary high-performance single crystal prepared in Examples 9-16 are indicated in Table 2. It can be seen that the yield has little change compared with Examples 1-8, and d.sub.33 is between 2560-2620 pC/N, which is lower than that of Examples 1-8, but still higher than the piezoelectric constant of the PLuN-PZN-PT single crystal prepared in the prior art.
TABLE-US-00002 TABLE 2 Yield and Piezoelectric Constant of Examples 9-16 Example Yield (%) d.sub.33 (pC/N) 9 96.3 2618 10 96.1 2576 11 96.0 2610 12 95.6 2620 13 95.9 2580 14 95.5 2570 15 95.2 2560 16 95.4 2565
Example 17
[0096] Example 17 is the same as Example 1 except that the single crystal is represented by formula 0.2Pb(In.sub.1/2Ta.sub.1/2)O.sub.3-0.3Pb(Zn.sub.1/3Nb.sub.2/3)O.sub.3-0.5PbTiO.sub.3 and that in step S1 the PbO, In.sub.2O.sub.3, Ta.sub.2O.sub.5, ZnO, Nb.sub.2O.sub.5, TiO.sub.2 and B.sub.2O.sub.3 are weighed according to the stoichiometric ratio of the foresaid formula.
[0097] The growth orientation and size of the PLuN-PZN-PT ternary high-performance single crystal prepared in Example 17 are the same as those in Example 1, respectively. The yield of the single crystal is 95.6%, and the piezoelectric constant d.sub.33 is 2380 pC/N.
Example 18
[0098] Example 18 is the same as Example 1 except that the single crystal is represented by formula 0.3Pb(Sc1/2Nb1/2)O3-0.2Pb(Zn1/3Nb2/3)O3-0.5PbTiO3 and that in step S1 the PbO, Sc2O3, ZnO, Nb2O5, TiO2 and B2O3 are weighed according to the stoichiometric ratio of the foresaid formula.
[0099] The growth orientation and size of the PScN-PZN-PT ternary high-performance single crystal prepared in Example 17 are the same as those in Example 1, respectively. The yield of the single crystal is 95.8%, and the piezoelectric constant d.sub.33 is 1960 pC/N.
Examples 19-32
[0100] Examples 19-32 are the same as Example 1 except for the PIN-PZN-PT preparation conditions as indicated in Table 3.
TABLE-US-00003 TABLE 3 Preparation Conditions of Examples 19-32 Constant Growth Annealing Constant temperature Cooling endpoint Annealing endpoint temperature time rate temperature rate temperature Example (° C.) (day) (° C./day) (° C.) (° C./hour) (° C.) 19 950 6 2 900 15 20 20 1020 5 3 900 15 25 21 1080 4 4 950 25 30 22 1150 3 5 950 30 25 23 1050 1 3 950 20 25 24 1050 6 3 950 20 25 25 1050 3 1 950 20 25 26 1050 3 8 950 20 25 27 1050 3 10 950 20 25 28 1050 3 3 900 20 25 29 1050 3 3 1000 20 25 30 1050 3 3 950 10 25 31 1050 3 3 950 50 25 32 1050 3 3 950 20 10
[0101] The growth orientation and size of the PIN-PZN-PT ternary high-performance single crystal prepared in Examples 19-32 are the same as those in Example 1, respectively.
[0102] The yield and piezoelectric constant d.sub.33 of the PIN-PZN-PT ternary high-performance single crystal prepared in Examples 19-32 are indicated in Table 4. It can be seen from Examples 19-22 and Example 1 that with the increase of constant temperature, the yield and d.sub.33 first increase and then decrease, and the yield and d.sub.33 are relatively higher in the range of 1020-1080° C. It can be seen from Examples 23-27 and Example 1 that prolonging the constant temperature time and reducing the cooling rate are helpful to improve the yield and d.sub.33; the constant temperature time is preferably 2-3 days and the cooling rate is preferably 2-5° C./day considering the shortening of the growth cycle. It can be seen from Examples 28-32 and Example 1 that too high or too low growth endpoint temperature is detrimental to the performance of the single crystal. As the cooling rate decreases, the yield of the single crystal and d.sub.33 first increase and then decrease. When the annealing endpoint temperature decreases, the single crystal yield and d.sub.33 decrease. Therefore, the growth endpoint temperature is preferably 950-1050° C., the annealing cooling rate is preferably 15-30° C./h, and the annealing endpoint temperature is preferably 20-30° C.
TABLE-US-00004 TABLE 4 Yield and Piezoelectric Constant of Examples 19-32 Example Yield (%) d.sub.33 (pC/N) 19 93.2 2656 20 94.5 2695 21 95.2 2688 22 94.5 2705 23 93.5 2672 24 96.4 2718 25 96.0 2715 26 95.2 2686 27 94.8 2672 28 94.5 2674 29 93.5 2655 30 95.6 2695 31 94.2 2665 32 95.5 2685
[0103] The structure of the molten salt furnace for preparing crystal according to the present invention will be described.
[0104] The present invention discloses specific structure of a molten salt furnace for preparing a PZN-based large-size ternary high-performance single crystal, comprising a furnace body provided with a cylindrical inner cavity, wherein a rotary motor is provided at the bottom of the furnace body and a rotary crucible base driven by the rotary motor is provided at the bottom of the cylindrical inner cavity of the furnace body, wherein a seed rod position adjustment device is provided on the outer side of the furnace body, and wherein the seed rod position adjustment device is suspended with a seed rod movably inserted into the cylindrical inner cavity of the furnace body, and the crucible base and the seed rod rotate in opposite directions.
[0105] The specific description is as follows in conjunction with the accompanying drawings.
[0106] As shown in
[0107] As shown in
[0108] As shown in
[0109] As shown in
[0110] As shown in
[0111] As shown in
[0112] As shown in
[0113] As shown in
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[0115] In the present invention, the casing 101 is made of stainless steel, and the crucible base 108 is made of corundum mullite. The furnace body 1 and the base 3203 are fixed on the ground after adjusting their balance. The thermal insulation cover 105 is provided with a viewing window and a lighting window.
[0116] As shown in
[0117] To alleviate the situation that the materials inside the crucible 109 are unstable due to inertia in the start stage when the crucible base 108 drives the crucible 109 to rotate, and the end stage when the crucible base 108 stops rotating by the rotary motor, as a preferred embodiment of the above-mentioned embodiments, as shown in
[0118] When the rotary motor 118 is started, the support rod 110 drives the mounting base 1081 to rotate, while the cover 1082 remains stationary due to inertia, and the buffer springs 1084 rotate synchronously with the guide blocks 1083 and the mounting seat 1081 under the effect of the limit block 1087. During the rotation, one side of the buffer springs 1084 first collides with the baffle plates 10821 provided on the cover 1082, so that the baffle plates 10821 are pushed relatively softly by the elasticity of the springs. During this pushing process, the portion of the buffer springs 1084 on the side of the protrusion 10871 of the limit block 1087 is pressed. The process described above is the first-stage buffering startup process. When one side of the buffer springs 1084 is compressed to a certain degree, the outer diameter will increase to an appropriate extent relative to that before being compressed. With the above increase, the buffer springs 1084 compress the limit block 1087 upward through the abutting surfaces 10872, so that the limit block 1087 obtains the trend of upward movement. Under this trend, and with the guidance of the inclined surface of the side wall of the protrusion 10871, the protrusion 10871 moves upward under the compression of the buffer springs 1084, thereby releasing the blocking effect on the buffer springs 1084. Of course, in the above process, since the limit block 1087 is pressed by the elastic pressing strip 1088, the movement process is also soft, so that the buffer springs 1084 press the baffle plates 10821 relatively softly. This process is the second-stage buffering startup process. The buffering process is over until the baffle plates 10821 come into contact with the guide blocks 1083, and normal power transmission is realized. The limit block 1087 will reinsert the protrusion 10871 between the two turns of the buffer springs after the buffer springs 1084 are stabilized. The substances in the crucible 109 obtain a more stable state due to the two-stage buffering, which ensures the growth environment of the crystal.
[0119] When the rotary motor 118 stops, the support rod 110 controls the mounting seat 1081 to stop rotating, while the cover 1082 continues to rotate due to inertia, so that the baffle plates 10821 move from the position where they are fitted with the limit block 1087 to the position where they press the buffer springs 1084 on the other side. After the baffle plates 10821 come into contact with the buffer springs 1084 on the other side, the movement is made relatively soft due to the buffering effect of the buffer springs 1084. During this process, the portion of the buffer springs 1084 on the other side of the protrusion 10871 is pressed, and the above process is the first-stage buffering stop process. When the other side of the buffer springs 1084 is compressed to a certain degree, likewise, the outer diameter will increase to an appropriate extent relative to that before being compressed. With the above increase. With such increase, the buffer springs 1084 will press the limit block 1087 upward through the abutting surfaces 10872, so that the limit block 1087 obtains the trend of upward movement again. Under this trend, and with the guidance of the inclined surface of the side wall of the protrusion 10871, the protrusion 10871 moves upward under the compression of the buffer springs 1084, thereby releasing the blocking effect on the buffer springs 1084. Likewise, in the above process, since the limit block 1087 is pressed by the elastic pressing strip 1088, the movement process is also soft, so that the buffer springs 1084 press the baffle plates 10821 relatively softly. This process is the second-stage buffering stop process. The buffering process is over until the baffle plates 10821 fit with the guide blocks 1083 on the other side, and the cover 1082 drives the crucible to stop rotating. The limit block 1087 will reinsert the protrusion 10871 between the two turns of the buffer springs after the buffer springs 1084 are stabilized.
[0120] During the above start and stop process, the buffer springs realize buffering at different stages through the reciprocating action in the through holes of the guide blocks 1083. On the one hand, the limit block 1087 realizes the limit effect on the springs, on the other hand, it also promotes the secondary buffering. The multi-stage buffering effectively improves the stability of the environment in the crucible, ensuring the stability of the crystal production environment. Except for the buffer springs 1084 and the elastic pressing strip 1088, the above structure can be made of corundum mullite, with low structural complexity and easy processing.
[0121] The mounting seat 1081 and the cover 1082 can be directly fitted, and horizontal positioning can be achieved by the peripheral fit, and there is no need for fixing in the height direction. In order to reduce difficulty in installing the pressing plate 1086, the pressing plate 1086 can also be pressed vertically and downward through the cover. In this case, it is only necessary to provide a protruding portion on the pressing plate 1086 which inserts into a concave portion in the guide blocks 1083 to realize the limit in the horizontal direction.
[0122] To ensure that the position of the buffer springs 1084 are more in line with the movement track of the baffle plate 10821, an annular groove 1089 may be provided in the mounting seat 1081. Installing the buffer springs 1084 in the annular groove 1089 can make the buffer springs 1084 obtain an appropriate radian and better fit with the baffle 10821.
[0123] The working principle of the molten salt furnace for preparing PZN-based large-size ternary high-performance single crystal is described below. First, clean the crucible 109 and put it on the crucible base 108, load the composite flux and raw materials into the crucible 109, install the seed on the seed collet 201, adjust the adjustment arm 31 of the seed rod position adjustment device 3 to center the seed rod; then start the temperature control system to heat up and melt the raw materials, and after the raw materials are all melted, adjust the temperature to a suitable temperature by controlling the temperature control system, and then start the lifting adjustment seat 32 for seeding; after the seed contacts the liquid surface, adjust the temperature according to the weight and the diameter of the seed contacting the liquid surface, until the seed basically does not change within a period of time, indicating that the seeding is successful; set the crystal growth process parameters, run the automatic growth program for automatic growth; after the automatic growth is complete, run the cooling program to control the temperature control system to cool the crystal; and take out the crystal when the temperature in the furnace drops to room temperature.
[0124] 1) The molten salt furnace of the present invention meets the reality of using composite flux, effectively reducing the growth temperature and the volatilization of raw materials, so that the raw materials can be grown at a lower temperature. This reduces the volatilization of raw materials while reducing the corrosion of platinum crucibles, realizing stable growth of crystals, and ensuring the uniformity of the quality of each grown crystal.
[0125] 2) The molten salt furnace according to the present invention controls the heating gradient through the temperature control system to realize accurate control of the temperature in the furnace. The top seed rod rotates under the drive of the servo motor, and the crucible rotates reversely under the action of the bottom rotary motor to achieve melt convection, so as to make the change of crystal diameter adapt to the thermal inertia of the thermal insulation system in the furnace, effectively reducing the crystal inclusions and improving the yield of the crystal.
[0126] The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Although the present invention has been illustrated above with preferred embodiments, it is not intended to be limited thereto. Any person skilled in the art can make some changes or modifications to equivalent embodiments by using the above disclosed technical contents without departing from the scope of the technical solution of the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention still fall within the scope of the technical solutions of the present invention.