METHOD OF PROVIDING AN ELECTRICALLY CONDUCTIVE LAYER TO A PLASTIC HOUSING BY INSERTION MOLDING OF A CONDUCTIVE FILM

Abstract

A method of providing an electrically conductive layer to a plastic splice housing for electromagnetically shielded cable harnesses includes providing an electrically conductive film and a mold, inserting the film into the mold, and injecting plastic into the mold so that the plastic bonds with the electrically conductive film, thereby forming an integrated conductive layer on the plastic housing suitable for electromagnetic shielding.

Claims

1. A method of providing an electrically conductive layer to a plastic housing, in particular a splice housing for electromagnetically shielded cable harnesses, the method comprising the steps of: a) providing an electrically conductive film and a mold; b) inserting the film into the mold; and c) injecting plastic into the mold so that the plastic bonds with the electrically conductive film.

2. The method according to claim 1, wherein the mold has a 3D-contour and wherein the film conforms to the 3D-contour during step c) due to the injected plastic.

3. The method according to claim 2, wherein the film is pre-formed to at least partially conform to the 3D-contour of the mold prior to step b).

4. The method according to claim 2, wherein after step c) the film completely covers the 3D-contour of the mold.

5. The method according to claim 2, wherein the film after step c) does not completely cover the 3D-contour of the mold.

6. The method according to claim 1, wherein the film is an in-mold label.

7. The method according to claim 1, wherein the film comprises aluminum.

8. The method according to claim 1, wherein the film has a thickness in a range of 0.1 mm to 5 mm.

9. The method according to claim 1, wherein a ratio of a thickness of the plastic to a thickness of the electrically conductive film is in a range 1:1 to 10:1 after step c).

10. The method according to claim 9, wherein the ratio of the thickness of the plastic to the thickness of the electrically conductive film is in a range 3:1 to 7:1 after step c).

11. The method according to claim 10, wherein the ratio of the thickness of the plastic to the thickness of the electrically conductive film is 5:1 after step c).

12. The method according to claim 1, wherein the film comprises fixation means configured to form a form fit connection with the plastic.

13. The method according to claim 12, wherein the fixation means comprises teeth.

14. The method according to claim 1, wherein the film comprises a perforation.

15. A splice housing for electromagnetically shielded cable harnesses, comprising two halves formed by a method comprising: a) providing an electrically conductive film and a mold; b) inserting the film into the mold; and c) injecting plastic into the mold so that the plastic bonds with the electrically conductive film.

16. A cable harness, comprising a splice housing according to claim 15.

17. A vehicle comprising a cable harness according to claim 16.

18. A splice housing for an electromagnetically shielded cable harnesses, comprising: an outer housing made from injection molded plastic; and an interior conductive film, bonded to interior walls of the outer housing by an injection molding process.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In the following, preferred embodiments of the disclosure are disclosed by reference to the accompanying figures.

[0041] FIG. 1 illustrates an isometric view of a splice housing half according to some embodiments.

[0042] FIGS. 2a to 2c show steps of the injection molding a film in the splice housing half according to some embodiments.

[0043] FIG. 3 shows a top view of the splice housing half of FIG. 1 according to some embodiments.

DETAILED DESCRIPTION

[0044] In the following, preferred embodiments of the present disclosure are described in detail with respect to the figures.

[0045] FIG. 1 illustrates a half of a splice housing. The splice housing half 1 has its inner surface completely covered by the conductive film 10, which adheres to the plastic housing 12, formed by injection molding. The skilled person will understand that a correspondingly shaped second half may be connected to form a complete splice housing.

[0046] The conductive film 10 completely covers the inner surface, thus ensuring full electromagnetic shielding. The bonding of the film to the plastic housing 12 during the injection molding process can create a strong, durable connection. Such a continuous integration of the conductive film can enhance the overall performance and reliability of the splice housing. The method also simplifies manufacturing by combining film application and housing formation in a single step.

[0047] FIGS. 2a to 2c show steps of the injection molding the film. In FIG. 2a, a pre-formed conductive film 20 is inserted into the mold 200. In FIG. 2b, the mold 200 is closed and molten plastic 202 is introduced into the mold via injection molding, thus establishing a bond between the film 20 and the plastic 202. FIG. 2c shows the demolded housing 22 with a conductive film 20 on its outer side.

[0048] With such a process the injection molding process can ensure precise application and bonding of the conductive film. [0049] Step A: Inserting the pre-formed conductive film 20 into mold 200 can ensure that the film is correctly positioned before plastic injection. [0050] Step B: Closing the mold 200 and injecting molten plastic 202 bonds the film 20 to the plastic 202 as it solidifies, creating a strong, uniform layer. [0051] Step C: The demolded housing 22 showcases the conductive film 20 securely attached to its outer side, providing effective electromagnetic shielding. Such a method offers several advantages, including enhanced durability of the bond between the film and the plastic, simplified manufacturing by combining film application and molding in one step, and the ability to produce complex shapes with an integrated electromagnetic shielding.

[0052] FIG. 3 depicts a plastic part provided with a conductive film. The plastic 32 has an adhering conductive film 30. FIG. 3 illustrates the effectiveness of the bonding process. The plastic part 32 is uniformly covered by conductive film 30, indicating a strong adhesion between the two materials.

[0053] While the invention has been described with reference to an exemplary embodiment(s), it will be understood by those skilled in the art that various changes may be made, and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to configure a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention is not limited to the disclosed embodiment(s), but that the invention will include all embodiments falling within the scope of the appended claims.

[0054] As used herein, one or more includes a function being performed by one element, a function being performed by more than one element, e.g., in a distributed fashion, several functions being performed by one element, several functions being performed by several elements, or any combination of the above.

[0055] It will also be understood that, although the terms first, second, etc., are, in some instances, used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first contact could be termed a second contact, and, similarly, a second contact could be termed a first contact, without departing from the scope of the various described embodiments. The first contact and the second contact are both contacts, but they are not the same contact.

[0056] The terminology used in the description of the various described embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the description of the various described embodiments and the appended claims, the singular forms a, an, and the are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term and/or as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. It will be further understood that the terms includes, including, comprises, and/or comprising, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

[0057] As used herein, the term if is, optionally, construed to mean when or upon or in response to determining or in response to detecting, depending on the context. Similarly, the phrase if it is determined or if [a stated condition or event] is detected is, optionally, construed to mean upon determining or in response to determining or upon detecting [the stated condition or event] or in response to detecting [the stated condition or event], depending on the context.

[0058] Additionally, while terms of ordinance or orientation may be used herein these elements should not be limited by these terms. All terms of ordinance or orientation, unless stated otherwise, are used for purposes distinguishing one element from another, and do not denote any particular order, order of operations, direction or orientation unless stated otherwise.

TABLE-US-00001 Listing of Reference Numbers 1 splice housing half 10, 20, 30 conductive film 12, 22 plastic housing 32 plastic 200 mold 202 molten plastic