THERMAL BARRIER COATED COMPONENT AND METHOD FOR PRODUCING THERMAL BARRIER COATED COMPONENT
20220316401 · 2022-10-06
Inventors
- Yoshifumi OKAJIMA (Tokyo, JP)
- Masahiko MEGA (Tokyo, JP)
- Taiji TORIGOE (Tokyo, JP)
- Atsushi MORIWAKI (Tokyo, JP)
- Hiroshi MAKIGANO (Tokyo, JP)
- Koichi TANIMOTO (Tokyo, JP)
Cpc classification
C23C28/028
CHEMISTRY; METALLURGY
F05D2230/312
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F01D17/085
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2300/514
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
C23C28/02
CHEMISTRY; METALLURGY
F01D5/288
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2220/32
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Y02T50/60
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
F01D21/003
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2300/2118
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2270/80
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2230/90
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2300/611
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F02C7/24
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2220/40
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
C23C4/137
CHEMISTRY; METALLURGY
F05D2260/231
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F02C7/24
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
C23C4/073
CHEMISTRY; METALLURGY
Abstract
The present invention provides a thermal barrier coated component, monitoring or evaluation of the soundness of which is able to be adequately carried out on the basis of the thermal boundary conditions that are detected by a sensor. A thermal barrier coated component according to the present invention comprises: a base material; a first bond coat layer that is a metal bonding layer formed on the base material; a sensor unit that comprises a sensor and a conductive wire, which are formed on the first bond coat layer; a second bond coat layer that is formed on the first bond coat layer so as to cover at least the sensor unit, while having a surface roughness higher than that of the first bond coat layer; and a top coat layer that is formed on the second bond coat layer.
Claims
1. A thermal barrier coated component comprising: a base material; a first bond coat layer that is a metal bonding layer formed on the base material; a sensor unit disposed on the first bond coat layer and including a sensor and a conductive wire; a second bond coat layer that is formed on the first bond coat layer so as to cover at least the sensor unit and has a surface roughness higher than that of the first bond coat layer; and a top coat layer that is formed on the second bond coat layer.
2. The thermal barrier coated component according to claim 1, wherein the second bond coat layer includes more pores than the first bond coat layer.
3. The thermal barrier coated component according to claim 2, wherein the first bond coat layer has a porosity of 0% by volume or more and 5.0% by volume or less, and the second bond coat layer has a porosity of 0.1% by volume or more and 10.0% by volume or less.
4. The thermal barrier coated component according to claim 1, wherein the sensor is any one of a thermocouple sensor, a heat flux sensor, a strain sensor, and a sensor that detects a crack generated in the first bond coat layer, the second bond coat layer, and the top coat layer.
5. The thermal barrier coated component according to claim 1, wherein the second bond coat layer is thinner than the first bond coat layer.
6. A method for producing a thermal barrier coated component, comprising: a step of forming a first bond coat layer, which is a metal bonding layer, on a base material; a step of disposing a sensor unit including a sensor and a conductive wire on the first bond coat layer; a step of forming a second bond coat layer having a surface roughness higher than that of the first bond coat layer on the first bond coat layer so as to cover at least the sensor unit; and a step of forming a top coat layer on the second bond coat layer.
7. The method for producing a thermal barrier coated component according to claim 6, wherein in the step of forming the first bond coat layer, the first bond coat layer is formed by either a high velocity oxygen fuel spraying or a low pressure plasma spraying, and in the step of forming the second bond coat layer, the second bond coat layer is formed by an atmospheric plasma spraying.
8. The method for producing a thermal barrier coated component according to claim 6, wherein the step of disposing the sensor unit is to spray and draw the sensor on the first bond coat layer.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0019]
[0020]
[0021]
[0022]
DESCRIPTION OF EMBODIMENTS
[0023] Hereinafter, embodiments of a thermal barrier coated component and a method for producing the thermal barrier coated component according to the present invention will be described in detail with reference to the drawings. In addition, the present invention is not limited to this embodiment.
[0024]
[0025] In the thermal barrier coated component 100, as shown in
[0026] The thermal barrier coating 20 has a first bond coat layer 21, a second bond coat layer 22, and a top coat layer 23.
[0027] The first bond coat layer 21 and the second bond coat layer 22 function as bond coat layers that suppress delamination between the base material 10 and the top coat layer 23 and that improve corrosion resistance and oxidation resistance. The first bond coat layer 21 is a metal bonding layer formed on the surface 10a of the base material 10. The first bond coat layer 21 is formed of, for example, an MCrAlY alloy (where M is Co, Ni, or a combination of these elements). In the present embodiment, the first bond coat layer 21 is formed on the surface 10a of the base material 10 by spraying using particles of an MCrAlY alloy or the like as a spraying material. More specifically, the first bond coat layer 21 is formed by either a high velocity oxygen fuel spraying (HVOF) or a low pressure plasma spraying (LPPS).
[0028] The second bond coat layer 22 is a metal bonding layer formed on a surface 21a of the first bond coat layer 21 opposite to the base material 10 while covering the sensor unit 30. In the present embodiment, the second bond coat layer 22 is formed over the entire surface of the first bond coat layer 21. The second bond coat layer 22 is formed of the same material as the first bond coat layer 21, for example, an MCrAlY alloy (where M is Co, Ni, or a combination of these elements). The thickness of the second bond coat layer 22 is smaller than the thickness of the first bond coat layer 21. That is, the second bond coat layer 22 is formed to be thinner than the first bond coat layer 21.
[0029] In the present embodiment, the second bond coat layer 22 is formed on the surface 21a of the first bond coat layer 21 by spraying using particles of an MCrAlY alloy or the like as a spraying material. More specifically, the second bond coat layer 22 is formed by an atmospheric plasma spraying (APS). Accordingly, the second bond coat layer 22 is formed while more air is entrained compared to the first bond coat layer 21, so that the second bond coat layer 22 includes more pores inside. That is, the second bond coat layer 22 has a higher porosity than the first bond coat layer 21. The surface roughness of the second bond coat layer 22 is higher than that of the first bond coat layer because minute irregularities are easily formed on a surface portion of the second bond coat layer 22 due to the pores. As a result, the degree of adhesion to the top coat layer 23 is improved on a surface 22a of the second bond coat layer 22 opposite to the first bond coat layer 21. The second bond coat layer 22 preferably has a porosity (% by volume) of 0.1% by volume or more and 10.0% by volume or less. On the other hand, the first bond coat layer 21 has a porosity (% by volume) of about 0% by volume or more and 5.0% by volume or less. In addition, the porosity of the first bond coat layer 21 and the second bond coat layer 22 is not limited to this.
[0030] The top coat layer 23 is formed on the surface 22a of the second bond coat layer 22 opposite to the first bond coat layer 21. The top coat layer 23 is a layer containing ceramic as a main component. As the ceramic, for example, a material containing zirconia as a main component is used. The top coat layer 23 is formed on the surface 22a of the second bond coat layer 22, for example, by spraying using particles of a zirconia-based material as a spraying material. More specifically, the top coat layer 23 is formed by the atmospheric plasma spraying. The top coat layer 23 may be formed by a vapor deposition method such as an electron beam physical vapor deposition method.
[0031] The sensor unit 30 is disposed in bond coat layers, that is, between the first bond coat layer 21 and the second bond coat layer 22. The sensor unit 30 includes a sensor 31, a conductive wire 32, a wire cable 33, and an insulating layer 34.
[0032] The sensor 31 is a sensor that detects thermal boundary conditions for evaluating the thermal barrier coated component 100. The sensor 31 is, for example, a thermocouple sensor, a heat flux sensor, a strain sensor, and a sensor that detects cracks generated in the thermal barrier coating 20 (first bond coat layer 21, second bond coat layer 22, and top coat layer 23). That is, the sensor detects the temperature, heat flux, strain, crack generation timing, and the like of the thermal barrier coating 20, thereby detecting values serving as various thermal boundaries of the thermal barrier coated component 100 used for a long time in a high-temperature environment. The conductive wire 32 extending in a direction along the surface 10a of the base material 10 and the wire cable 33 connected to the conductive wire 32 by spot welding are connected to the sensor 31. The sensor 31, the conductive wire 32, and the wire cable 33 are disposed on the first bond coat layer 21 in a state of being covered with the insulating layer 34 and are covered with the second bond coat layer 22. In the present embodiment, the sensor 31 is drawn on the first bond coat layer 21 via the insulating layer 34 by spraying using particles of a sensor material as a spraying material.
[0033] As described above, the base material 10 is formed with the through-hole 11, and the wire cable 33 is pulled out from the through-hole 11 to a side opposite to the surface 10a of the base material 10. The wire cable 33 pulled out from the through-hole 11 is connected to a voltmeter (not shown) disposed outside, and an electromotive force generated by the sensor 31 is output to the voltmeter. Accordingly, various evaluations of the thermal barrier coated component 100 can be performed on the basis of the thermal boundary conditions measured by the sensor 31. Additionally, in a case where the thermal barrier coated component 100 is the “component coated with a thermal barrier coating” itself applied to an actual machine, the soundness of the thermal barrier coated component 100 can be monitored on the basis of the thermal boundary conditions measured by the sensor 31.
[0034] Next, a method for producing the thermal barrier coated component according to the embodiment will be described with reference to
[0035] The first bond coat layer forming step ST1 is a step of forming the first bond coat layer 21 on the base material 10 as shown in
[0036] The sensor unit disposing step ST2 is a step of disposing the sensor unit 30 on the first bond coat layer 21. In the sensor unit disposing step ST2, after a part of the insulating layer 34 is formed on the first bond coat layer 21, the sensor 31 is drawn on the first bond coat layer 21 via the insulating layer 34 by spraying using the particles serving as the material of the sensor 31 as a spraying material. Then, the conductive wire 32 is connected to the sensor 31, and the wire cable 33 is spot-welded to the conductive wire 32 to pull out the wire cable 33 from the through-hole 11. After that, by forming the remaining insulating layer 34 around the sensor 31, the conductive wire 32, and the wire cable 33, the sensor unit 30 is disposed on the first bond coat layer 21 as shown in
[0037] The second bond coat layer forming step ST3 is a step of forming the second bond coat layer 22 on the first bond coat layer 21 so as to cover the sensor unit 30. In the second bond coat layer forming step ST3, a film is formed on the entire surface 21a of the first bond coat layer 21 including the top of the sensor unit 30 by spraying using particles of an MCrAlY alloy or the like as a spraying material. More specifically, the second bond coat layer 22 is formed by the atmospheric plasma spraying. As a result, the second bond coat layer 22 includes more pores than the first bond coat layer 21, and minute irregularities are easily formed on a surface portion of the second bond coat layer 22 due to the pores, resulting in higher surface roughness. By the above first bond coat layer forming step ST1 to the second bond coat layer forming step ST3, the first bond coat layer 21 and the second bond coat layer 22 serving as bond coat layers are formed on the base material 10, and the sensor unit 30 is disposed in the bond coat layers (between the first bond coat layer 21 and the second bond coat layer 22).
[0038] The top coat layer forming step ST4 is a step of forming the top coat layer 23 on the bond coat layer. In the present embodiment, as described above, the second bond coat layer 22 is formed on the entire surface 21a of the first bond coat layer 21 including the sensor unit 30. For this reason, in the top coat layer forming step ST4, the top coat layer 23 is formed on the second bond coat layer 22. More specifically, the top coat layer 23 is formed on the second bond coat layer 22 by the atmospheric plasma spraying. In addition, the top coat layer 23 may be formed on the second bond coat layer 22 by using the vapor deposition method such as the electron beam physical vapor deposition method.
[0039] The polishing step ST5 is a step of polishing a surface 23a of the top coat layer 23 opposite to the bond coat layer to smoothen the surface 23a. The polishing step ST5 can be performed using a polishing tool. Accordingly, the thermal barrier coated component 100 shown in
[0040] As described above, in the thermal barrier coated component 100 and the method for producing the thermal barrier coated component according to the embodiment, the second bond coat layer 22 having a surface roughness higher than that of the first bond coat layer 21 is formed on the first bond coat layer 21 so as to cover the sensor unit 30, and the top coat layer 23 is formed on the second bond coat layer 22. For this reason, the degree of adhesion between the second bond coat layer 22 and the top coat layer 23 can be improved.
[0041] Here,
[0042] On the other hand, in the thermal barrier coated component 100 of the embodiment, as described above, the second bond coat layer 22 is interposed between the top coat layer 23 and the sensor unit 30, so that the degree of adhesion between the second bond coat layer 22 and the top coat layer 23 can be improved. As a result, even when there is a heat elongation difference between the sensor 31 and the conductive wire 32 of the sensor 31, and the top coat layer 23, it is possible to prevent the top coat layer 23 from being delaminated from the second bond coat layer 22 and to realize long-term use of the thermal barrier coated component 100 in a high-temperature environment. Therefore, according to the embodiment, it is possible to obtain the thermal barrier coated component 100 capable of appropriately monitoring or evaluating soundness on the basis of the thermal boundary conditions detected by the sensor 31.
[0043] Additionally, the second bond coat layer 22 includes more pores than the first bond coat layer 21. By virtue of this configuration, the surface roughness of the second bond coat layer 22 can be made higher than the surface roughness of the first bond coat layer 21. In addition, the surface roughness of the second bond coat layer 22 may be higher than that of the first bond coat layer 21 regardless of the porosity, and may be capable of improving the degree of adhesion to the top coat layer 23.
[0044] Additionally, the second bond coat layer 22 is thinner than the first bond coat layer 21. By virtue of this configuration, even when the second bond coat layer 22 is provided, it is possible to suppress increase of thickness of the entire layers formed on the base material 10.
[0045] Additionally, the first bond coat layer forming step ST1 forms the first bond coat layer 21 via the high velocity oxygen fuel spraying and the low pressure plasma spraying, and the second bond coat layer forming step ST3 forms the second bond coat layer 22 via the atmospheric plasma spraying.
[0046] By virtue of this configuration, the porosity of the second bond coat layer 22 formed by the atmospheric plasma spraying can be increased as compared to the first bond coat layer 21 formed by the high velocity oxygen fuel spraying and the low pressure plasma spraying. As a result, the surface roughness of the second bond coat layer 22 can be made higher than the surface roughness of the first bond coat layer 21. In addition, the first bond coat layer 21 and the second bond coat layer 22 may be formed by other techniques as long as the surface roughness of the second bond coat layer 22 is higher than that of the first bond coat layer 21, and the degree of adhesion to the top coat layer 23 can be improved. For example, by using a material different from that of the first bond coat layer 21 for the second bond coat layer 22 or by applying a surface treatment to the surface 22a of the second bond coat layer 22, the surface roughness of the second bond coat layer 22 may be made higher than the surface roughness of the first bond coat layer 21.
[0047] Additionally, in the sensor unit disposing step ST2, the sensor 31 is sprayed onto and drawn on the first bond coat layer 21. By virtue of this configuration, the sensor 31 can be easily disposed on the first bond coat layer 21. In addition, the sensor 31 and the conductive wire 32 may be disposed by other techniques as long as the sensor 31 and the conductive wire 32 are provided between the first bond coat layer 21 and the second bond coat layer 22 via the insulating layer 34.
[0048] In the present embodiment, the second bond coat layer 22 is formed over the entire surface of the first bond coat layer 21, but the second bond coat layer 22 may be formed at least in a range covering the sensor unit 30. In that case, the top coat layer 23 may be formed on the second bond coat layer 22 that covers the sensor unit 30 and on a portion of the first bond coat layer 21 on which the second bond coat layer 22 is not formed.
REFERENCE SIGNS LIST
[0049] 10: Base material
[0050] 10a, 21a, 22a, 23a: Surface
[0051] 11: Through-hole
[0052] 20: Thermal barrier coating
[0053] 21: First bond coat layer
[0054] 22: Second bond coat layer
[0055] 23: Top coat layer
[0056] 30: Sensor unit
[0057] 31: Sensor
[0058] 32: Conductive wire
[0059] 33: Wire cable
[0060] 34: Insulating layer
[0061] 100: Thermal barrier coated component