ADJUSTABLE BEARING ASSEMBLIES AND RELATED APPARATUS AND METHODS
20260036163 ยท 2026-02-05
Inventors
Cpc classification
F16C2226/80
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16C33/043
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16C33/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16C17/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16C2226/60
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16C17/246
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16C33/26
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16C2206/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16C2237/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16C25/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F16C25/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16C17/24
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16C33/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16C33/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16C33/26
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
Bearing assemblies and methods of using bearings are provided in the present disclosure. In one embodiment, a bearing ring is provided having o carrier one or more ponents removably coupled therewith. Each carrier component may carry one or more bearing elements. Upon wearing of the bearing elements beyond a desired amount, the carrier components may be removed from the bearing ring.
Claims
1. A bearing assembly, comprising: a bearing ring having a rotational axis; a first carrier configured to be removably coupled to the bearing ring, one or more first bearing elements coupled to the first carrier to define one or more first bearing surfaces at a first fixed position relative to the bearing ring; a second carrier configured to be removably coupled with the bearing ring; and one or more second bearing elements coupled to the second carrier to define one or more second bearing surfaces, wherein the second carrier is structured to position the one or more second bearing surfaces of the one or more second bearing elements at a second fixed position relative to the rotational axis.
2. The bearing assembly of claim 1, wherein the first carrier and the second carrier are configured to be coupled with the same portion of the bearing ring.
3. The bearing assembly of claim 1, wherein the second fixed position is substantially the same as the first fixed position.
4. The bearing assembly of claim 1, wherein the second fixed position is substantially the same as the first fixed position prior to any wear experienced by the one or more first bearing elements.
5. The bearing assembly of claim 1, wherein the bearing ring is configured to receive a plurality of carriers at the same time.
6. The bearing assembly of claim 1, wherein at least one of the one or more first bearing elements or the one or more second bearing elements is received in a pocket in the first carrier or the second carrier.
7. The bearing assembly of claim 1, further comprising a second bearing ring configured to move relative to the bearing ring.
8. The bearing assembly of claim 7, wherein the second bearing ring comprises one or more replaceable carriers having one or more bearing elements coupled thereto.
9. The bearing assembly of claim 1, wherein the first carrier is configured to be replaced with the second carrier once the one or more first bearing elements have experienced a selected amount of wear.
10. A method of using a bearing assembly, the method comprising: positioning a first radial bearing comprising one or more first bearing elements defining a first bearing surface on a carrier in opposition to a second radial bearing comprising one or more second bearing elements defining a second bearing surface; defining a radial gap between the first bearing surface of the first radial bearing and the second bearing surface of the second radial bearing; removing the carrier holding the one or more first bearing elements after the one or more first bearing elements have experienced a selected amount of wear; and replacing the carrier with another carrier holding another set of bearing elements.
11. The method of claim 10, wherein the another set of bearing elements is substantially unworn.
12. The method of claim 10, further comprising allowing the radial gap between the first bearing surface of the first radial bearing and the second bearing surface of the second radial bearing to increase a selected amount until the carrier is replaced by the another carrier.
13. The method of claim 12, further comprising positioning the another set of bearing elements on the another carrier at another radial gap that is substantially similar to the radial gap.
14. The method of claim 10, further comprising positioning the another set of bearing elements on the another carrier at another radial gap that is different than the radial gap.
15. The method of claim 10, wherein the first radial bearing comprises a plurality of removable carriers including the carrier.
16. The method of claim 15, further comprising replacing each of the plurality of removable carriers after the one or more first bearing elements have experienced the selected amount of wear.
17. A method of using a bearing assembly, the method comprising: positioning a first bearing comprising one or more first bearing elements defining a first bearing surface on one or more carriers in opposition to a second bearing; removing the one or more carriers holding the one or more first bearing elements after the one or more first bearing elements have experienced a selected amount of wear; and replacing the one or more carriers with one or more additional carriers holding another set of bearing elements.
18. The method of claim 17, wherein the second bearing comprising one or more second carriers.
19. The method of claim 17, further comprising securing the one or more carriers to the first bearing by sliding the one or more carriers axially into an opening in the first bearing.
20. The method of claim 17, further comprising installing the one or more carriers holding the one or more first bearing elements that have experienced the selected amount of wear in another bearing ring.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] Further features of the subject matter of the instant disclosure, its nature, and various advantages will be more apparent from the following detailed description and the accompanying drawings, which illustrate various exemplary embodiments, are representations, and are not necessarily drawn to scale, wherein:
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DETAILED DESCRIPTION
[0044] The present disclosure relates generally to bearing assemblies that enable radial bearing surfaces to be radially adjustable. The bearing assemblies may include bearing surfaces comprising superhard materials. Superhard, as used herein, refers to any material having a hardness that is at least equal to or exceeds a hardness of tungsten carbide (e.g., polycrystalline diamond, boron nitride, silicon carbide, mixtures of the foregoing, or any suitable material). In one embodiment, a bearing apparatus may include polycrystalline diamond inserts or compacts defining a plurality of surfaces that move relative to one another (or relative to some other surface or mechanical component). Bearing assemblies of the present disclosure enable extended use of bearing elements and, therefore, extended life of the bearing assemblies, through simple and efficient maintenance of the assemblies.
[0045] Referring to
[0046] In one embodiment the bearing ring 102 may be formed of a metal material (e.g., titanium, Incoloy, Inconel, steel, stainless steel or any suitably metal alloy). Similarly, the carrier component 104 may be formed of a metal material. In some embodiments, the bearing elements 106 may be formed of superhard materials. For example, the bearing elements 106 may include polycrystalline cubic boron nitride, polycrystalline diamond or other superhard materials. In some embodiments, the bearing elements 106 may include a superhard table defining a bearing surface 108 of the bearing element 106. In some embodiments, the bearing element 106 may comprise a polycrystalline diamond compact (PDC) including a polycrystalline diamond (PCD) table to which a substrate is bonded. In some embodiments, the interface between the table and the substrate may be substantially flat or planar. In other embodiments, the interface may be domed or curved. In other embodiments, the interface between the table and the substrate may include a plurality of raised features or recessed features (e.g., dimples, grooves, ridges, etc.). In some embodiments, the substrate may comprise a cobalt-cemented tungsten carbide substrate bonded to the table. When a polycrystalline diamond table is formed together with the substrate, the bearing element 106 may be referred to polycrystalline diamond compact, or PDC.
[0047] In certain embodiments, the table may exhibit a maximum thickness (e.g., from the bearing surface to the interface between the table and the substrate) that is approximately 0.1 inch or greater. In other embodiments, the table may exhibit a maximum thickness of as great as 0.5 inch or greater. Examples of bearing elements having various thicknesses and various configurations are described in U.S. Pat. No. 9,080,385, issued Jul. 14, 2015 to Gonzalez et al., the disclosure of which is hereby incorporated by reference in its entirety.
[0048] The PCD table includes a plurality of directly bonded-together diamond grains exhibiting diamond-to-diamond bonding therebetween (e.g., sp3 bonding), which define a plurality of interstitial regions. A portion of, or substantially all of, the interstitial regions of the PCD table may include a metal-solvent catalyst or a metallic infiltrant disposed therein that is infiltrated from the substrate or from another source during fabrication. For example, the metal-solvent catalyst or metallic infiltrant may be selected from iron, nickel, cobalt, and alloys of the foregoing. In some embodiments, the PCD table may further include thermally-stable diamond in which the metal-solvent catalyst or metallic infiltrant has been partially or substantially completely depleted from a selected surface or volume of the PCD table (e.g., to a selected depth from the bearing surface), such as via an acid leaching process. Thermally-stable PCD may also be sintered with one or more alkali metal catalysts. In some embodiments, the catalyst-depleted region may exhibit a depth that is substantially conformal with an outer surface of the PCD table. In other embodiments, the catalyst-depleted region may generally extend a desired depth from a plane extending through the uppermost portions of the table.
[0049] In some embodiments, PDCs which may be used as the bearing elements 106 may be formed in an HPHT process. For example, diamond particles may be disposed adjacent to the substrate and subjected to an HPHT process to sinter the diamond particles to form the PCD table and bond the PCD table to the substrate, thereby forming the PDC. The temperature of the HPHT process may be at least about 1000 C. (e.g., about 1200 C. to about 1600 C.) and the cell pressure, or the pressure in the pressure-transmitting medium (e.g., a refractory metal can, graphite structure, pyrophyllite, etc.), of the HPHT process may be at least 4.0 GPa (e.g., about 5.0 GPa to about 12 GPa or about 7.5 GPa to about 11 GPa) for a time sufficient to sinter the diamond particles.
[0050] In some embodiments, the diamond particles may exhibit an average particle size of about 50 m or less, such as about 30 m or less, about 20 m or less, about 10 m to about 20 m, about 10 m to about 18 m, about 12 m to about 18 m, or about 15 m to about 18 m. In some embodiments, the average particle size of the diamond particles may be about 10 m or less, such as about 2 m to about 5 m or submicron. In some embodiments, the diamond particles may exhibit multiple sizes and may comprise, for example, a relatively larger size and at least one relatively smaller size. As used herein, the phrases relatively larger and relatively smaller refer to particle sizes (by any suitable method) that differ by at least a factor of two (e.g., 30 m and 15 m). According to various embodiments, the mass of diamond particles may include a portion exhibiting a relatively larger size (e.g., 30 m, 20 m, 15 m, 12 m, 10 m, 8 m) and another portion exhibiting at least one relatively smaller size (e.g., 6 m, 5 m, 4 m, 3 m, 2 m, 1 m, 0.9 m, 0.8 m, 0.7 m, 0.6 m, 0.5 m, less than 0.5 m, 0.4 m, 0.3 m, 0.2 m, 0.1 m, less than 0.1 m). For example, in one embodiment, the diamond particles may include a portion exhibiting a relatively larger size between about 10 m and about 40 m and another portion exhibiting a relatively smaller size between about 0.5 m and 4 m. In some embodiments, the diamond particles may comprise three or more different sizes (e.g., one relatively larger size and two or more relatively smaller sizes), without limitation. The PCD table so-formed after sintering may exhibit an average diamond grain size that is the same or similar to any of the foregoing diamond particle sizes and distributions. More details about diamond particle sizes and diamond particle size distributions that may be employed are disclosed in U.S. Pat. No. 9,346,149, the disclosure of which is incorporated by reference herein in its entirety.
[0051] In some embodiments, the diamond grains of the resulting table may exhibit an average grain size that is equal to or less than approximately 12 m and include cobalt content of greater than about 7 weight percent (wt. %) cobalt. In some other embodiments, the diamond grains of the resulting table may exhibit an average grain size that is equal to or greater than approximately 20 m and include cobalt content of less than approximately 7 wt. %. In some embodiments, the diamond grains of the resulting table may exhibit an average grains size that is approximately 10 m to approximately 20 m.
[0052] In some embodiments, tables may comprise PCD sintered at a pressure of at least about 7.5 GPa, may exhibit a coercivity of 115 Oe or more, a high-degree of diamond-to-diamond bonding, a specific magnetic saturation of about 15 G.Math.cm.sup.3/g or less, and a metal-solvent catalyst content of about 7.5 wt. % or less. The PCD may include a plurality of diamond grains directly bonded together via diamond-to-diamond bonding to define a plurality of interstitial regions. At least a portion of the interstitial regions or, in some embodiments, substantially all of the interstitial regions may be occupied by a metal-solvent catalyst, such as iron, nickel, cobalt, or alloys of any of the foregoing metals. For example, the metal-solvent catalyst may be a cobalt-based material including at least 50 wt. % cobalt, such as a cobalt alloy.
[0053] The metal-solvent catalyst that occupies the interstitial regions may be present in the PCD in an amount of about 7.5 wt. % or less. In some embodiments, the metal-solvent catalyst may be present in the PCD in an amount of about 3 wt. % to about 7.5 wt. %, such as about 3 wt. % to about 6 wt. %. In other embodiments, the metal-solvent catalyst content may be present in the PCD in an amount less than about 3 wt. %, such as about 1 wt. % to about 3 wt. % or a residual amount to about 1 wt. %. By maintaining the metal-solvent catalyst content below about 7.5 wt. %, the PCD may exhibit a desirable level of thermal stability.
[0054] Generally, as the sintering pressure that is used to form the PCD increases, the coercivity may increase and the magnetic saturation may decrease. The PCD defined collectively by the bonded diamond grains and the metal-solvent catalyst may exhibit a coercivity of about 115 Oe or more and a metal-solvent catalyst content of less than about 7.5 wt. % as indicated by a specific magnetic saturation of about 15 G.Math.cm.sup.3/g or less. In a more detailed embodiment, the coercivity of the PCD may be about 115 Oe to about 250 Oe and the specific magnetic saturation of the PCD may be greater than 0 G.Math.cm.sup.3/g to about 15 G.Math.cm.sup.3/g. In an even more detailed embodiment, the coercivity of the PCD may be about 115 Oe to about 175 Oe and the specific magnetic saturation of the PCD may be about 5 G.Math.cm.sup.3/g to about 15 G.Math.cm.sup.3/g. In yet an even more detailed embodiment, the coercivity of the PCD may be about 155 Oe to about 175 Oe and the specific magnetic saturation of the PCD may be about 10 G.Math.cm.sup.3/g to about 15 G.Math.cm.sup.3/g. The specific permeability (i.e., the ratio of specific magnetic saturation to coercivity) of the PCD may be about 0.10 or less, such as about 0.060 to about 0.090. Despite the average grain size of the bonded diamond grains being less than about 30 m, the metal-solvent catalyst content in the PCD may be less than about 7.5 wt. % resulting in a desirable thermal stability.
[0055] In one embodiment, diamond particles having an average particle size of about 18 m to about 20 m are positioned adjacent to a cobalt-cemented tungsten carbide substrate and subjected to an HPHT process at a temperature of about 1390 C. to about 1430 C. and a cell pressure of about 7.8 GPa to about 8.5 GPa. The PCD so-formed as a PCD table bonded to the substrate may exhibit a coercivity of about 155 Oe to about 175 Oe, a specific magnetic saturation of about 10 G.Math.cm.sup.3/g to about 15 G.Math.cm.sup.3/g, and a cobalt content of about 5 wt. % to about 7.5 wt. %.
[0056] In one or more embodiments, a specific magnetic saturation constant for the metal-solvent catalyst in the PCD may be about 185 G.Math.cm.sup.3/g to about 215 G.Math.cm.sup.3/g. For example, the specific magnetic saturation constant for the metal-solvent catalyst in the PCD may be about 195 G.Math.cm.sup.3/g to about 205 G.Math.cm.sup.3/g. It is noted that the specific magnetic saturation constant for the metal-solvent catalyst in the PCD may be composition dependent.
[0057] Generally, as the sintering pressure is increased above 7.5 GPa, a wear resistance of the PCD so-formed may increase. For example, the Gratio may be at least about 4.010.sup.6, such as about 5.010.sup.6 to about 15.010.sup.6 or, more particularly, about 8.010.sup.6 to about 15.010.sup.6. In some embodiments, the Gratio may be at least about 30.010.sup.6. The Gratio is the ratio of the volume of workpiece cut (e.g., between about 470 in.sup.3 of barre granite to about 940 in.sup.3 of barre granite) to the volume of PCD worn away during the cutting process.
[0058] The material characteristics discussed herein, as well as other characteristics that may be provided in a cutting element 152, including processes for measuring and determining such characteristics, as well as methods of making such cutting elements, are described in U.S. Pat. Nos. 7,866,418, 8,297,382, and 9,315,881, the disclosure of each of which is incorporated by reference herein in its entirety.
[0059] In some embodiments, the table may comprise high density polycrystalline diamond. For example, in some embodiments, the table may comprise approximately 95 percent diamond by volume (vol. %) or greater. In some embodiments, the table 170 may comprise approximately 98 vol. % diamond or greater. In some embodiments, the table 170 may comprise approximately 99 vol. % diamond or greater. In other embodiments, the table may comprise polycrystalline diamond or relatively low diamond content. For example, in some embodiments, the table may comprise less than 95 percent diamond by volume (vol. %).
[0060] In some embodiments, the table may be integrally formed with the substrate such as discussed above. In some other embodiments, the table may be a pre-formed table that has been HPHT bonded to the substrate in a second HPHT process after being initially formed in a first HPHT process. For example, the table may be a pre-formed PCD table that has been leached to substantially completely remove the metal-solvent catalyst used in the manufacture thereof and subsequently HPHT bonded or brazed to the substrate in a separate process.
[0061] The substrate may be formed from any number of different materials, and may be integrally formed with, or otherwise bonded or connected to, the table. Materials suitable for the substrate may include, without limitation, cemented carbides, such as tungsten carbide, titanium carbide, chromium carbide, niobium carbide, tantalum carbide, vanadium carbide, or combinations thereof cemented with iron, nickel, cobalt, or alloys thereof.
[0062] As discussed above, in some embodiments, the table may be leached to deplete a metal-solvent catalyst or a metallic infiltrant therefrom in order to enhance the thermal stability of the table. For example, when the table is a PCD table, the table may be leached to remove at least a portion of the metal-solvent catalyst, that was used to initially sinter the diamond grains to form a leached thermally-stable region from a working region thereof (e.g., the bearing surface) to a selected depth. The leached thermally-stable region may extend inwardly from the working surface to a selected depth. In some embodiments, the entire table may be leached such that it is substantially completely devoid of metal-solvent catalyst material. The leaching may be performed in a suitable acid, such as aqua regia, nitric acid, hydrofluoric acid, or mixtures of the foregoing.
[0063] Referring still to
[0064] In
[0065] Referring to
[0066] As seen in
[0067] In some embodiments, a kit may be provided in association with an apparatus that employs a radial bearing, the kit including an original bearing assembly (e.g., bearing assembly 100 shown in
[0068] The bearing assembly 100 may be configured with different numbers of carrier components than depicted in
[0069] Referring briefly to
[0070] In one embodiment the bearing ring 202 may comprise of a metal material (e.g., steel or stainless steel). Similarly, the carrier component 204 may comprise of a metal material. In some embodiments, the bearing elements 206 may comprise one or more superhard, superabrasive material. For example, the bearing elements 206 may include polycrystalline cubic boron nitride, polycrystalline diamond or other superabrasive materials. In some embodiments, the bearing elements 206 may include a superhard, superabrasive table defining a bearing surface 208 of the bearing element 206. In some embodiments, the bearing element 206 may comprise a polycrystalline diamond compact (PDC) including a polycrystalline diamond (PCD) table to which a substrate is bonded such as has been described hereinabove.
[0071] The bearing assembly 200 may be employed to adjust or reduce a gap that develops due to wear of bearing elements 206 and/or 106 (as described above with respect to the outer bearing assembly 100 depicted in
[0072] Referring now to
[0073] The bearing elements 306 may be coupled with an adjustment mechanism 310 configured to radially adjust one or more of the bearing elements 306 (towards or away from a rotational axis) relative to the bearing ring 302, altering the radial position of the bearing surface 308 of one or more of the bearing element 306s. For example, as shown in
[0074] As seen in
[0075] In various embodiments, one or more anti-rotation features may be provided to inhibit rotation of the bearing element 306 relative to the bearing ring 302 about an associated longitudinal axis 336 (e.g., that extends through the fastener 312 and the bearing element 306). For example, in one embodiment, a pin member 338 may be disposed in a channel 340 formed in the bearing ring 302 and in a corresponding channel 342 formed in the bearing element 306 (e.g., in the base 324). The pin member 338 enables the bearing element 306 to be displaced radially (e.g., along the axis 336) without rotating about the axis 336 relative to the bearing ring 302. In other embodiments, other types of anti-rotation features or mechanisms may be employed, including the use of nonsymmetrical geometries in the bearing element 306 (e.g., a non-cylindrically shaped bearing element, an abutment shoulder or keyed feature) and corresponding or mating features formed in the associated pocket 318 of the bearing ring 302.
[0076] Thus, the adjustment mechanism 310 may be used to place the bearing surface 308 of one or more bearing elements 306 substantially at a specified radial position (e.g., substantially at radius R5). Such an adjustment may take place after wear of the bearing element 306 creates an undesirable radial clearance or gap, so as to place the bearing assembly back within a desired tolerance or specification (e.g., a selected gap), extending the service life of the bearing elements 306. In other embodiments, adjustment of the bearing elements 306 may be employed to place the bearing assembly 300 within a desired tolerance for a given application or use of the bearing assembly 300.
[0077] Referring to
[0078] While the adjustment mechanisms are shown in connection with an outer bearing assembly (such as shown in
[0079] Further, it is noted that various embodiments described herein may be combined to provide a bearing apparatus used in various types of machinery. For example, an outer bearing assembly (such as shown in
[0080] In one embodiment, adjustment mechanisms (e.g., 310 or 350) may be combined with, or implemented into, a carrier component (e.g., 104, 204). In other words, considering
[0081] In yet other embodiments, bearing elements may be fixed relative to a carrier component, and the carrier components (e.g., 104, 204) may be configured to be radially adjustable relative to a bearing ring using one or more adjustment mechanisms (e.g., 310, 350). Thus, multiple bearing elements may be adjusted relative to a bearing ring simultaneously by adjusting a single carrier component via the adjustment mechanism(s) 310, 350.
[0082] Referring to
[0083] As seen in
[0084] Referring to
[0085] Thus, for example, with reference to
[0086] In addition to providing adjustment for a bearing apparatus after the specified amount of wear occurs in bearing elements (e.g., such as exhibited in
[0087] While certain embodiments and details have been included herein for purposes of illustrating aspects of the instant disclosure, it will be apparent to those skilled in the art that various changes in the systems, apparatuses, and methods disclosed herein may be made without departing from the scope of the instant disclosure, which is defined, in part, in the appended claims. The words including and having, as used herein including the claims, shall have the same meaning as the word comprising. Additionally, it should be noted that aspects, features or elements of a given embodiment may be combined with aspects, features or elements of other embodiments without limitation.