METHOD AND DEVICE FOR IN PLACE CALENDER ROLLER DENT INSPECTION AND REPAIR
20260071384 · 2026-03-12
Inventors
- Sang Yun Han (Santa Clara, CA, US)
- Andrew Stephen Kalt (Oakland, CA, US)
- Andy Alexander Hilgers (Los Angeles, CA, US)
- Justin Sawkin (San Francisco, CA, US)
- Dennis Huck (Prüm, DE)
- Kathrin Heinz (Bitburg, DE)
- André Jardin (Steffeln, DE)
- Corey Davidson (Bonn, DE)
- Alexander Laub (Bitburg, DE)
- Filippos Tzanetos (Eupen, BE)
- Martin Funk (Neuwied, DE)
- Boris Mirau (Neuwied, DE)
- Emil Husch (Konz, DE)
- Michael Rauer (Neustadt/Wied, DE)
Cpc classification
International classification
Abstract
Systems and methods for mapping and/or repairing the surface of calender roller while the calender roller is still installed in the calender roll system are described. The methods for mapping and repairing a surface of a calender roller may comprise providing a calender roll system comprising a calender roller, mapping a surface profile of the calender roller, identifying a dent area on the surface of the calender roller at least partially based on the surface profile, and depositing a material at the dent area. The systems for mapping and repairing the surface of the calender roller are also described.
Claims
1. A process for repairing a surface of a calender roller, the process comprising: providing a calender roll system comprising a calender roller; mapping a surface profile of the calender roller; identifying a dent area on the surface of the calender roller at least partially based on the surface profile; and depositing a material at the dent area.
2. The process of claim 1, wherein the mapping the surface profile of the calender roller comprises: rotating the calender roller; measuring a first circumferential surface profile of the calender roller at a first longitudinal position; measuring a second circumferential surface profile of the calender roller at a second longitudinal position; and combining the first circumferential surface profile and the second circumferential surface profile to form the surface profile of the calender roller, wherein the first and second longitudinal positions are along a length of the calender roller.
3. The process of claim 2, wherein the rotating the calender roller comprises rotating the calender roller at a circumferential speed in a range of 0.1 m/min to 50 m/min.
4. The process of claim 2, wherein the combining comprises aligning the first and second circumferential surface profiles.
5. The process of claim 1, wherein the mapping the surface profile of the calender roller comprises: measuring a first longitudinal surface profile at a first circumferential position; measuring a second measuring a first longitudinal surface profile at a second circumferential position; combining the first longitudinal surface profile and the second longitudinal surface profile to form the surface profile of the calender roller, wherein the first and second circumferential positions are along a circumference of the calender roller.
6. The process of claim 1, further comprising polishing the deposited material to match the surface of the calender roller.
7. The process of claim 1, further comprising mapping a second surface profile of the calender roller after depositing the material.
8. The process of claim 1, the dent area comprises a deepest point having a depth greater than about 10 m.
9. The process of claim 1, the dent area has an area greater than about 10 mm.sup.2.
10. The process of claim 1, wherein the depositing the material comprises depositing electroplating a metal or an alloy at the dent area.
11. The process of claim 1, wherein the depositing the material comprises contacting the dent area with a metal-containing solution.
12. The process of claim 11, wherein the metal-containing solution comprises Co, Ni, Fe, Mn, Mg, Ti, Al, Ca, Ti, Cr, Cu, Si, V, Zn, Au, Ag, W, or combinations thereof.
13. The process of claim 11, wherein the depositing the material comprises depositing the metal in the metal-containing solution at the dent area.
14. The process of claim 1, further comprising depositing a coating layer over the deposited material.
15. The process of claim 14, wherein the coating layer comprises nickel tungsten.
16. A system for mapping a calender roller, the system comprising: a calender roll system comprising a calender roller, wherein the calender roller comprises a roller surface and a shaft; a surface mapping apparatus comprising a profilometer positioned on a rail parallel to the shaft of the calender roller; an attachment means configured to removably attach the surface mapping apparatus to the calender roll system; and a detecting element configured to coordinate the rotation of the calender roller and the position of the profilometer.
17. The system of claim 16, wherein the detecting element comprises an incremental encoder.
18. The system of claim 16, wherein the detecting element comprises a calender roller encoder.
19. The system of claim 16, wherein the detecting element comprises a rotation recording element and a reference positioned on the roller surface.
20. The system of claim 16, wherein the profilometer comprises a color sensor, a step height sensor, or a combination thereof.
21. The system of claim 16, wherein the mapping apparatus further comprises a defect locating unit.
22. The system of claim 21, wherein the defect locating unit comprises a laser.
23. The system of claim 16, wherein calender roll system comprises a calendered film on the roller surface.
24. A process for repairing and using a calender roller, the process comprising: providing a calender roll system comprising a calender roller; mapping a surface profile of the calender roller; identifying a dent area on the surface of the calender roller at least partially based on the surface profile; depositing a repair material at the dent area, wherein the repair material comprises a metal; and calendering an electrode film material comprising an electrode active material to form an electrode film, wherein the electrode active material comprises the metal, wherein the metal is selected from the group consisting of Co, Ni, Fe, Mn, Mg, Ti, Al, Ca, Ti, Cr, Cu, Si, V, Zn, Au, Ag, W, and combinations thereof.
25. The process of claim 24, wherein the metal is selected from the group consisting of Co, Ni, and combinations thereof.
26. The process of claim 24, wherein the electrode active material is a cathode active material.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
[0041] The following detailed description of certain embodiments presents various descriptions of specific embodiments. However, the innovations described herein can be embodied in a multitude of different ways, for example, as defined and covered by the claims. In this description, reference is made to the drawings where like reference numerals and/or terms can indicate identical or functionally similar elements. It will be understood that elements illustrated in the figures are not necessarily drawn to scale. Moreover, it will be understood that certain embodiments can include more elements than illustrated in a drawing and/or a subset of the elements illustrated in a drawing. Further, some embodiments can incorporate any suitable combination of features from two or more drawings. The headings are provided for convenience only and do not impact the scope or meaning of the claims.
[0042] Systems and methods for mapping and/or repairing the surface of calender roller while the calender roller is still installed in the calender roll system are described. As the surface of calender roller is mapped and/or localized imperfections are repaired without being removed from the roll system, the calender roller may be repaired without time consuming and expensive methods that may require removal of the calender roller and repair of the entire or substantially entire surface. Such systems and methods may be particularly beneficial for calendering of electrode film materials (e.g., electrode active materials), which may be particularly hard and regularly cause damage to the roller surface. Such substantially defect free calender rollers may be beneficial for dry electrode film manufacturing processes, where the defects on the calender roll surface may be imparted to the dry electrode films and may cause the degradation of the electrode film performance when used in energy storage devices.
Definitions
[0043] A self-supporting electrode film is an electrode film that incorporates binder matrix structures sufficient to support the film or layer and maintain its shape such that the electrode film or layer can be free-standing. When incorporated in an energy storage device, a self-supporting electrode film or active layer is one that incorporates such binder matrix structures. Generally, and depending on the methods employed, such electrode films are strong enough to be employed in energy storage device fabrication processes without any outside supporting elements, such as a current collector or other film. For example, a self-supporting electrode film can have sufficient strength to be rolled, handled, and unrolled within an electrode fabrication process without other supporting elements. A dry electrode film, such as a cathode electrode film or an anode electrode film, may be self-supporting.
[0044] A solvent-free electrode film is an electrode film that contains no detectable processing solvents, processing solvent residues, or processing solvent impurities. A dry electrode film, such as a cathode electrode film or an anode electrode film, may be solvent-free.
[0045] A wet electrode, wet process electrode, or slurry electrode, is an electrode prepared by at least one step involving a slurry of active material(s), binder(s), and optionally additive(s). A wet electrode may include processing solvents, processing solvent residues, and/or processing solvent impurities.
[0046] Generally described, one or more aspects of the present disclosure relate to systems and processes for mapping and repairing a calender roller in a calender roll system. Processes for repairing a calender roller surface comprises mapping a surface of the calender roller, identifying a surface imperfection, and depositing a material at the surface imperfection. In some embodiments, the processes further comprise mapping the calender roller surface after depositing a material at the identified surface imperfection. In some embodiments, the repairment of the calender roller surface is complete if a depth of the repaired surface imperfection is less than a threshold.
Calender Roll System for Forming an Electrode Film
[0047]
Processes for Mapping and Repairing a Calender Roller Surface
[0048]
Processes for Mapping a Calender Roller Surface
[0049]
[0050] In some embodiments, the sectional surface profiles comprise a circumferential surface profile, a longitudinal surface profile, or a combination thereof. In some embodiments, a circumferential surface profile of a calender roller at a certain position is surface characteristics along the circumference of the roller at the corresponding position. In some embodiments, a longitudinal surface profile of a calender roller at a certain position is surface characteristics along the length of the roller at a certain position. In some embodiments, the surface characteristics comprise the surface contours, textures, variations, roughness, and combinations thereof. In some embodiments, the plurality of positions comprise a plurality of longitudinal positions along a length of the calender roller, a plurality of circumferential positions along a circumference of the calender roller, or a combination thereof.
[0051] In some embodiments, a surface imperfection includes a scratch, a dent, a crack, a pit, a corrosion, a porosity, a stain, a blister, or combinations thereof. In some embodiments, the surface imperfection is a dent. In some embodiments, the surface imperfection is identified when one or more parameters of the surface imperfections is above a threshold. In some embodiments, the parameters of the surface imperfections may comprise the average depth or height, the largest depth or height, the surface area, the volume, and combinations thereof. In some embodiments, a surface imperfection is identified when a recessed area has a largest depth of, of about, of at least, of at least about, 1 m, 2 m, 3 m, 4 m, 5 m, 6 m, 7 m, 8 m, 9 m, 10 m, 11 m, 12 m, 13 m, 14 m, 15 m, 16 m, 17 m, 18 m, 19 m, 20 m, 25 m, 30 m, 40 m, 50 m, or 100 m, or any range of values therebetween. In some embodiments, a surface imperfection is identified when a recessed area has an area of, of about, of at least, of at least about, 1 mm.sup.2, 2 mm.sup.2, 3 mm.sup.2, 4 mm.sup.2, 5 mm.sup.2, 6 mm.sup.2, 7 mm.sup.2, 8 mm.sup.2, 9 mm.sup.2, 10 mm.sup.2, 11 mm.sup.2, 12 mm.sup.2, 13 mm.sup.2, 14 mm.sup.2, 15 mm.sup.2, 16 mm.sup.2, 17 mm.sup.2, 18 mm.sup.2, 19 mm.sup.2, 20 mm.sup.2, 25 mm.sup.2, 30 mm.sup.2, 40 mm.sup.2, 50 mm.sup.2, or 100 mm.sup.2, or any range of values therebetween. In some embodiments, a surface imperfection is identified when a recessed area has an average depth of, of about, of at least, of at least about, 1 m, 2 m, 3 m, 4, 5, 6 m, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16 m, 17 m, 18 m, 19 m, 20 m, 25 m, 30 m, 40 m, 50 m, or 100 m, or any range of values therebetween. In some embodiments, a surface imperfection area is identified when a recessed area has a largest depth of more than about 10 m and an area of more than about 10 mm.sup.2. In some embodiments, the threshold for a surface imperfection is determined by the precision requirements of the thin film formed by the calender rollers.
[0052]
[0053] In some embodiments, the calendar roller rotates continuously throughout the mapping process. In some embodiments, the calendar roller rotates when measuring a circumferential surface profile. In some embodiments, measuring a circumferential surface profile of the calender roller at a certain position comprises measuring the circumferential surface profile of the calender roller while the calender roller rotates for at least 1 full circle, such as 1, 2, 3, 4, 5, 10, or any number of circles therebetween. In some embodiments, the number of circles the calender roller rotates is set by needs. In some embodiments, the completion of the calender roller rotation at the first position triggers the movement of a measuring equipment to the second position. In some embodiments, the calender roller rotates at a circumferential speed of, of about, 0.1 m/min, 1 m/min, 2 m/min, 5 m/min, 10 m/min, 15 m/min, 20 m/min, 25 m/min, 30 m/min, 35 m/min, 36 m/min, 37 m/min, 38 m/min, 39 m/min, 40 m/min, 41 m/min, 42 m/min, 43 m/min, 44 m/min, 45 m/min, 46 m/min, 47 m/min, 48 m/min, 49 m/min, 50 m/min, 55 m/min, 60 m/min, 70 m/min, 80 m/min, 90 m/min, or 100 m/min, or any ranges of values therebetween.
[0054] In some embodiments, the information of the first and/or second longitudinal position comprises the relative distance of the first and/or second longitudinal position from a start position. In some embodiments, the first circumferential position and the second circumferential position are along a length of the calender roller. In some embodiments, first circumferential position and the second circumferential position are along a line parallel to the shaft of the calender roller. In some embodiments, the first and second circumferential positions are neighboring positions. In some embodiments, the distance between two neighboring positions is not greater than the field of view of a measuring equipment. In some embodiments, the distance between the first and second circumferential positions is, is about, is at most, is at most about, is at least, is at least about, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, 15 mm, 16 mm, 17 mm, 18 mm, 19 mm, 20 mm, 25 mm, 30 mm, 40 mm, or 50 mm, or any range of values therebetween.
[0055]
[0056]
Processes for Repairing a Calender Roller Surface
[0057] In some embodiments, after the surface imperfections are identified and marked, the surface imperfections can be repaired. In some embodiments, the repairment is carried out manually or through automated methods.
[0058]
[0059] In some embodiments, cleaning the imperfection area comprises electrocleaning (i.e., electrochemical cleaning or electrolytic cleaning) the imperfection area. In some embodiments, electrocleaning the imperfection area removes the oils, greases, oxides and other impurities from the imperfection area. In some embodiments, electrocleaning the imperfection area comprises using NaOH for electrocleaning. In some embodiments, cleaning the imperfection area comprises etching the imperfection area. In some embodiments, etching the imperfection area comprises physical etching, chemical etching, or a combination thereof. In some embodiments, chemical etching comprises etching with a hydrochloric acid having a concentration of, of about, of at least, of at least about, of at most, of at most about, 1 wt. %, 5 wt. %, 6.5 wt. %, 7 wt. %, 8 wt. %, 9 wt. %, 10 wt. %, 11 wt. %, 12 wt. %, 13 wt. %, 14 wt. %, or 15 wt. %, or any range of values therebetween. In some embodiments, etching comprises etching the imperfection area to enlarge the imperfection area. In some embodiments, etching comprises etching the imperfection area to deepen the depth of the imperfection area. In some embodiments, etching comprises etching the imperfection area to increase the width to depth ratio of the imperfection area.
[0060] In some embodiments, the metal in the metal-containing solution comprises Co, Ni, Fe, Mn, Mg, Ti, Al, Ca, Ti, Cr, Cu, Si, V, Zn, Au, Ag, W, or combinations thereof. In some embodiments, the metal in the metal-containing solution comprises Co, Ni, Fe, Mn, Mg, Ti, Al, Ti, Cr, Cu, Si, or combinations thereof. In some embodiments, the metal in the metal containing solution comprises tungsten. In some embodiments, the metal in the metal-containing solution comprises cobalt, nickel, tungsten, chrome, copper, or combinations thereof. In some embodiments, the metal-containing solution comprises the sulphate of the metal. In some embodiments, the metal-containing solution comprises nickel sulphate, cobalt sulphate, or a combination thereof. In some embodiments, the metal in the metal-containing solution comprises the metal contained in the electrode film mixture to be calendered by the calender rollers. In some embodiments, the metal in the metal-containing solution is one or more elements contained in the active material in the electrode film mixture to be calendered by the calender rollers. In some embodiments, the metal in the active material of the electrode film mixture comprises Co, Ni, Fe, Mn, Mg, Ti, Al, Ti, Cr, Cu, Si, or combinations thereof. For example, if the calender roller is for calendering an electrode film mixture comprising a lithium nickel manganese cobalt (NMC) film, the metal in the metal containing solution may comprise nickel, cobalt, manganese, or combinations thereof. In some embodiments, as the metal in the metal-containing solution is one or more elements contained in the active material in the electrode film mixture, even if a small amount of the deposited material exfoliates from the roller surface, the calendered film would not be affected or contaminated. In some embodiments, the metal in the metal-containing solution can enhance the properties of the deposited material, such as improving the hardness, Youngs's modulus, toughness, wear resistance, etc. In some embodiments, the metal-containing solution comprises elements help improve the adhesion of the deposited material to the roller surface, etc. In some embodiments, the elemental form of the metal in the metal-containing solution comprises young's modulus of, of about, of at least, of at least about, 100 Gpa, 110 Gpa, 120 Gpa, 130 Gpa, 140 Gpa, 150 Gpa, 160 Gpa, 170 Gpa, 180 Gpa, 190 Gpa, 200 Gpa, 210 Gpa, 220 Gpa, 230 Gpa, 240 Gpa, 250 Gpa, or 300 Gpa, or any range of values therebetween. In some embodiments, the material deposited in the imperfection area comprises the metal in the metal-containing solution. In some embodiments, the material deposited in the imperfection area comprises a metal or an alloy. In some embodiments, the material deposited in the imperfection area comprises Co, Ni, Fe, Mn, Mg, Ti, Al, Ca, Ti, Cr, Cu, Si, V, Zn, Au, Ag, W, or combinations thereof. In some embodiments, the metal deposited in the imperfection area comprises cobalt, nickel, tungsten, or a combination thereof. In some embodiments, the deposited material comprises the metal elements contained in the electrode film mixture to be calendered by the calender rollers. In some embodiments, the deposited material comprises elements that can improve the hardness, Youngs's modulus, toughness, wear resistance, etc. In some embodiments, the deposited material comprises elements that can improve the adhesion to the roller surface.
[0061] In some embodiments, depositing the material at the imperfection area and/or forming a coating layer comprise electroplating. In some embodiments, electroplating comprises contacting the imperfection area with a pre-plating solution before contacting the imperfection area with a metal-containing solution. In some embodiments, the pre-plating solution comprises acid of the metal to be deposited, such as nickel acid or cobalt acid. In some embodiments, electroplating comprises depositing the metal in the metal-containing solution with an electric current. In some embodiments, the electroplating is performed at a temperature of, of about, of at least, of at least about, of at most, of at most about, 15 C., 20 C., 25 C., 26 C., 27 C., 28 C., 29 C., 30 C., 31 C., 32 C., 33 C., 34 C., 35 C., 36 C., 37 C., 38 C., 39 C., 40 C., 41 C., 42 C., 43 C., or 45 C., 45 C., 50 C., 55 C., or 60 C., any range of values therebetween, for example, 15 C.-60 C., 15 C.-50 C., 35 C.-50 C., or 35 C.-40 C. In some embodiments, the electroplating is performed with a current density of, of about, of at least, of at least about, of at most, of at most about, 0.5, 0.6, 0.7, 0.9, 0.9, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2, 2.1, 2.2, 2.3, 2.4, 2.5, 3, 4, or 5, any range of values therebetween. In some embodiments, a large current density in electroplating may lead to porous plated material and/or burned spots. In some embodiments, a small current density in electroplating may lead to longer plating time. In some embodiments, the electroplating is performed with a stable or substantially stable current density and/or at a stable or substantially stable temperature. In some embodiments, the electroplating comprises activating the surface of the imperfection area before supplying the power. In some embodiments, activating the surface comprises contacting the surface of the imperfection area with a sulfuric acid having a concentration of, of about, of at least, of at least about, of at most, of at most about, 1 wt. %, 5 wt. %, 10 wt. %, 11 wt. %, 12 wt. %, 13 wt. %, 14 wt. %, 15 wt. %, 16 wt. %, 17 wt. %, 18 wt. %, 19 wt. %, 20 wt. %, 30 wt. %, or any range of values therebetween.
[0062] In some embodiments, forming a coating layer over the deposited material comprises depositing a coating layer. In some embodiments, the forming a coating layer over the deposited metal comprises electroplating with a solution containing the material to be deposited. In some embodiments, the coating layer comprises a material harder than the material deposited at the imperfection area. In some embodiments, the coating layer comprises a material having a higher wear resistance than the deposited metal. In some embodiments, the coating layer comprises a material having a hardness of, of about, of at least, of at least about, of at most, of at most about, 45 Rc, 48 Rc, 49 Rc, 50 Rc, 51 Rc, 52 Rc, 53 Rc, 54 Rc, 55 Rc, 56 Rc, 57 Rc, 58 Rc, 59 Rc, 60 Rc, 65 Rc, or 70 Rc, or any range of values therebetween. In some embodiments, the coating layer prevents wear of the deposited metal. In some embodiments, the coating layer comprises nickel tungsten. In some embodiments, the coating layer comprises a thickness of, of about, of at least, of at least about, of at most, of at most about, 0.1 m, 0.5 m, 1 m, 1.5 m, 2 m, 2.5 m, 3 m, 3.5 m, 4 m, 5 m, 6 m, 7 m, 8 m, 9 m, 10 m, 15 m, or 20 m, or any range of values therebetween, such as 0.1-20 m, 0.1-10 m, 1-10 m, or 1-5 m. In some embodiments, the surface of the coating layer is higher than the surface surrounding the imperfection area. In some embodiments, the surface of the coating layer is, is about, is at least, is at least about, is at most, is at most about, 1 m, 2 m, 3 m, 4 m, 5 m, 6 m, 7 m, 8 m, 9 m, 10 m, 11 m, 12 m, 13 m, 14 m, 15 m, 16 m, 17 m, 18 m, 19 m, or 20 m, or any range of values therebetween, higher than the surface of the area surrounding the imperfection area. In some embodiments, the coating layer is further polished to match the surface surrounding the imperfection area.
[0063] In some embodiments, the polishing comprises sanding the repaired area. In some embodiments, sanding comprises using a sanding belt, a sanding block, or a combination thereof. In some embodiments, the sanding block comprises a flat surface or a curved surface matching the surface of the roller surface. In some embodiments, the polishing comprises polishing with a high grit compound. In some embodiments, the high grit compound comprises, comprises about, comprises at least, comprises at least about, comprises at most, comprises at most about, 100 grits, 500 grits, 1000 grits, 1500 grits, 1600 grits, 2000 grits, 2400 grits, 2500 grits, 3000 grits, 5000 grits, or 10000, or any range of values therebetween. In some embodiments, the high grit compound comprises a size of, of about, of at least, of at least about, of at most, of at most about, 0.1 m, 0.2 m, 0.3 m, 0.4 m, 0.5 m, 0.6 m, 0.7 m, 0.8 m, 0.9 m, 1 m, 1.5 m, 2 m, 2.5 m, 03 m, 4 m, 5 m, or 10 m, or any range of values therebetween. In some embodiments, the polishing does not change the roughness of roller surface surrounding the imperfection area which is not repaired. In some embodiments, the polished surface comprises an average roughness (Ra) of, of about, of at most, of at most about, 0.01 m, 0.02 m, 0.03 m, 0.04 m, 0.05 m, 0.06 m, 0.07 m, 0.08 m, 0.09 m, 0.1 m, 0.2, 0.3 m, 0.4 m, 0.5, 0.6 m, 0.8 m, or 1 m, or any range of values therebetween. In some embodiments, the polished area has a shininess and roughness matching the surrounding surface. In some embodiments, the roughness of the polished surface can be a level required by manufacturing requirements in the following calendering process.
[0064] In some embodiments, the depth of the imperfection area after repairing and polishing is reduced to, to about, to less than, to less than about, 0.1 m, 0.5 m, 1 m, 1.5 m, 2 m, 2.5 m, 3 m, 3.5 m, 4 m, 5 m, 6 m, 7 m, 8 m, 9 m, 10 m, 15 m, or 20 m, or any range of values therebetween. In some embodiments, the depth of the imperfection area after repairing and polishing is reduced to, to about, to less than, to less than about, 90%, 80%, 70%, 60%, 50%, 40%, 35%, 30%, 25%, 20%, 15%, 10%, 5%, or 0%, or any range of values therebetween, of the depth of the imperfection area before repairing. In some embodiments, the imperfection area after repairing and polishing has a surface higher than the surrounding surface.
[0065] In some embodiments, the surface area of the imperfection area after repairing and polishing is reduced to, to about, to less than, to less than about, 0.1 mm.sup.2, 0.5 mm.sup.2, 1 mm.sup.2, 1.5 mm.sup.2, 2 mm.sup.2, 2.5 mm.sup.2, 3 mm.sup.2, 3.5 mm.sup.2, 4 mm.sup.2, 5 mm.sup.2, 6 mm.sup.2, 7 mm.sup.2, 8 mm.sup.2, 9 mm.sup.2, 10 mm.sup.2, 15 mm.sup.2, 20 mm.sup.2, 25 mm.sup.2, 30 mm.sup.2, 35 mm.sup.2, 40 mm.sup.2, 45 mm.sup.2, or 50 mm.sup.2, or any range of values therebetween. In some embodiments, the surface area of the imperfection area after repairing and polishing is reduced to, to about, to less than, to less than about, 90%, 80%, 70%, 60%, 50%, 40%, 35%, 30%, 25%, 20%, 15%, 10%, 5%, or 0%, or any range of values therebetween, of the surface area of the imperfection area before repairing.
[0066] In some embodiments, the material depositing, polishing and/or repairment is limited to the imperfection area. In some embodiments, only the identified imperfection area and the surrounding area is repaired. In some embodiments, the repaired area is, is about, is less than, is less than about, 10%, 5%, 1%, 0.1%, 0.05%, 0.01%, 0.005%, 0.001%, or 0.0001%, or any range of values therebetween, of the surface area of calender roller.
[0067] In some embodiments, the imperfection area has a depth-to-width aspect ratio of, of at most, of at most about, , , 1/7, , 1/9, or 1/10, or any range of values therebetween. In some embodiments, the imperfection area has a high depth-to-width aspect ratio such that repeated electroplating and polishing processes are helpful. In some embodiments, a high depth-to-width aspect ratio is, is about, is at least, is at least about, , , , , 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, or 20, or any range of values therebetween.
System for Mapping a Calender Roller Surface
[0068] Some embodiments of the present disclosure relate to a system for mapping a calender roller surface. In some embodiments, the system comprises a calender roll system and a surface mapping apparatus. In some embodiments, the calendar roller system comprises a calender roller comprising a roller surface and a shaft. In some embodiments, the surface mapping apparatus comprises a measuring unit positioned on a rail. In some embodiments, the system comprises a motor configured to move the measuring unit along the rail. In some embodiments, the rail is parallel to the shaft. In some embodiments, the system comprises an attachment means configured to removably attach the surface mapping apparatus to the calender roll system. In some embodiments, the surface mapping apparatus further comprises a detecting element configured to coordinate the rotation of the calender roller and the position of the measuring unit. In some embodiments, the detecting element comprises a sensor and an incremental encoder. In some embodiments, the detecting element comprises a calender roller encoder, alone, in addition to or instead of an outside encoder. In some embodiments, the calender roller encode is an incremental encoder or absolute encoder from the calender roller.
[0069] In some embodiments, the detecting element comprises a sensor and an incremental encoder.
[0070] In some embodiments, the sensor 1008 may detect the completion of one rotation circle of the calendar roller by detecting a reference on the roller surface.
[0071]
[0072] In some embodiments, the detecting element can link the position of the measuring unit and the rotation of the calender roller without an external sensor or external encoder. In some embodiments, the detecting element comprises a calender roller encoder to detect the completion of a rotation circle. In some embodiments, after the calender roller encoder detects that the calender roller completes a rotation circle, it triggers the motor to move the measuring unit to a next position.
[0073] In some embodiments, a system for mapping a calender roller surface comprises a mapping apparatus to measure the longitudinal surface profile.
[0074] In some embodiments, the system comprises a defect locating unit. In some embodiments, when a surface imperfection is detected and located, the defect locating unit may mark the identified imperfection for further repair. In some embodiments, the defect locating unit comprises a laser, or other appropriate marker. In some embodiments, the defect locating unit is configured to locate the surface imperfections once the parameters and threshold (e.g., average or largest depth, surface area) of the surface imperfections are provided.
[0075] In some embodiments, the measuring unit comprises a profilometer, capacitive sensor, a digital microscope, a camera, or any other sensor that can collect surface profile data, or combinations thereof. In some embodiments, the profilometer comprises contact profilometer or a contactless profilometer. In some embodiments, the profilometer comprises a laser profilometer. In some embodiments, the measuring unit has a certain range field of view (FOV). In some embodiments, the measuring unit comprises a field of view (FOV) of, of about, of at least, of at least about, of at most, of most about, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, 15 mm, 20 mm, 25 mm, 30 mm, 35 mm, 40 mm, or 50 mm, or any range of values therebetween. In some embodiments, the measuring unit comprises a resolution of, of about, of at least, of at least about, of at most, of most about, 0.01 m, 0.05 m, 0.1 m, 0.15 m, 0.2 m, 0.25 m, 0.3 m, 0.35 m, 0.4 m, 0.5 m, 0.6 m, 0.7 m, 0.8 m, 0.9 m, 1 m, 1.5 m, 2 m, 5 m, or 10 m, or any range of values therebetween.
[0076] In some embodiments, the system for mapping the calender roller surface comprises 1, 2, 3, 4, 5, or 10 mapping apparatus. In some embodiments, the system comprises one mapping apparatus at the top of the calender roller and another mapping apparatus at the bottom of the calender roller.
[0077] In some embodiments, the system for mapping the calender roller surface is configured to measure the surface profile of the calendar roller with a calendered film on the roller surface.
System for Repairing a Calender Roller Surface
[0078] Some embodiments of the present disclosure relate to a system for repairing a calender roller surface. In some embodiments, the repairing system comprises a calender roll system and a surface repairing apparatus. In some embodiments, the calendar roll system comprises a calender roller comprising a roller surface and a shaft. In some embodiments, the surface repairing apparatus comprises electroplating unit. In some embodiments, the surface repairing apparatus further comprises a polishing unit.
[0079]
[0080] In some embodiments, the system for repairing a calender roller surface comprises an automated electroplating unit and polishing unit above the calender roller surface. In some embodiments, the automated electroplating unit and/or the polishing unit comprises a microactuator that is configured to provide micro actuation. In some embodiments, the roller rotates to a next position after the surface imperfection is repaired and polished. In some embodiments, the roller rotates during the repair and polishing. In some embodiments, the electroplating solvent is provided continuously throughout the electroplating process.
Electrode Film Mixtures, Electrode Films, and Energy Storage Devices
[0081] In some embodiments, the powders and/or films utilized in systems and methods described may be a dry electrode material/mixture. In some embodiments, the powders and/or films utilized in systems and methods described may be a wet electrode material/mixture. In some embodiments, the dry electrode material is used to form an electrode film, such as a cathode electrode film or an anode electrode film. In some embodiments, an electrode is formed from the electrode film and a current collector. In some embodiments, the electrode film includes an active material. In some embodiments, the electrode film further comprises at least one binder. In some embodiments, the electrode film comprises the active material in an amount of, of about, of at least, or at least about, 70 wt. %, 75 wt. %, 80 wt. %, 81 wt. %, 82 wt. %, 83 wt. %, 84 wt. %, 85 wt. %, 86 wt. %, 87 wt. %, 88 wt. %, 89 wt. %, 90 wt. %, 91 wt. %, 92 wt. %, 93 wt. %, 94 wt. %, 95 wt. %, 96 wt. %, 97 wt. %, 98 wt. %, 99 wt. % or 100 wt. %, or any range of values therebetween. The electrode film can be used in the formation of an energy storage device.
[0082] In some embodiments, the electrode and/or current collector comprises an adhesive layer. The dry electrode film adheres to the adhesive layer. In some embodiments, the adhesive layer comprises a carbon coating. In some embodiments, the carbon coating comprises an electrically conductive carbon coating or layer. In some embodiments, the electrode and/or current collector comprises an electrode foil and an insulator (e.g., carbon coating) disposed over all, substantially all or a portion of the current collector. In some embodiments, the current collector comprises a single adhesive layer. In some embodiments, the adhesive layer is a patterned adhesive layer. In some embodiments, the adhesive layer comprises a plurality of adhesive elements separated from one another. In some embodiments, the adhesive layer is size-on-size with an electrode film disposed over the adhesive layer. In some embodiments, the adhesive layer is larger than an electrode film disposed over the adhesive layer. In some embodiments, an adhesive layer is disposed over a current collector to form a coated current collector, and an electrode film is disposed over the coated current collector to form an electrode.
[0083] In some embodiments, an electrode film material and/or electrode film includes active cathode material. The active cathode material can form the dry electrode material (e.g., powder) discussed herein. In some embodiments, cathode active materials can comprise, for example, a metal oxide, metal sulfide, or a lithium metal oxide. The lithium metal oxide can be, for example, a lithium nickel manganese cobalt oxide (NMC), a lithium manganese oxide (LMO), a lithium iron phosphate (LFP), a lithium cobalt oxide (LCO), a lithium titanate (LTO), and/or a lithium nickel cobalt aluminum oxide (NCA). In some embodiments, cathode active materials can comprise, for example, a layered transition metal oxide (such as LiCoO.sub.2 (LCO), Li(NiMnCo)O.sub.2 (NMC) and/or LiNi.sub.0.8Co.sub.0.15Al.sub.0.05O.sub.2 (NCA)), a spinel manganese oxide (such as LiMn.sub.2O.sub.4 (LMO) and/or LiMn.sub.1.5Ni.sub.0.5O.sub.4 (LMNO)), an olivine (such as LiFePO.sub.4), silicon, silicon oxide (SiO.sub.x), aluminum, tin, tin oxide (SnO.sub.x), manganese oxide (MnO.sub.x), molybdenum oxide (MoO.sub.2), molybdenum disulfide (MoS.sub.2), nickel oxide (NiO.sub.x), or copper oxide (CuO.sub.x). The cathode active material can comprise sulfur or a material including sulfur, such as lithium sulfide (Li.sub.2S), or other sulfur-based materials, or a mixture thereof.
[0084] In some embodiments, the electrode film material and/or anode electrode film includes an anode active material. The anode active material can form the dry electrode material (e.g., powder) discussed herein. In some embodiments, anode active materials can include, for example, an insertion material (such as carbon, graphite, and/or graphene), an alloying/dealloying material (such as silicon, silicon oxide, tin, and/or tin oxide), a metal alloy or compound (such as SiAl, and/or SiSn), and/or a conversion material (such as manganese oxide, molybdenum oxide, nickel oxide, and/or copper oxide). The anode active materials can be used alone or mixed together to form multi-phase materials (such as SiC, SnC, SiOx-C, SnOx-C, SiSn, Si-SiOx, Sn-SnOx, Si-SiOx-C, Sn-SnOx-C, SiSnC, SiOx-SnOx-C, Si-SiOx-Sn, or Sn-SiOx-SnOx). Anode active materials include common natural graphite, synthetic or artificial graphite, surface modified graphite, spherical-shaped graphite, flake-shaped graphite and blends or combinations of these types of graphite, metallic elements and its compound as well as metal-C composite for anode.
[0085] In some embodiments, an electrode film material and/or electrode film comprises a carbon material configured to reversibly intercalate lithium ions. The carbon material can form a portion of the dry electrode material (e.g., powder) discussed herein. In some embodiments, the electrode film comprises the carbon material in a total amount of, of about, of at most, or at most about, 20 wt. %, 15 wt. %, 10 wt. %, 9 wt. %, 8 wt. %, 7 wt. %, 6 wt. %, 5 wt. %, 4 wt. %, 3 wt. %, 2 wt. %, 1 wt. %, or any range of values therebetween. In some embodiments, the lithium intercalating carbon is selected from a graphitic carbon, graphite, hard carbon, soft carbon and combinations thereof. For example, the electrode film of the electrode can include a binder material, one or more of graphitic carbon, graphite, graphene-containing carbon, hard carbon and soft carbon, and an electrical conductivity promoting material. In some embodiments, an electrode is mixed with lithium metal and/or lithium ions.
[0086] In some embodiments, an electrode film material and/or electrode film includes a conductive additive. The conductive additive material can form a portion of the dry electrode material (e.g., powder) discussed herein. In some embodiments, the conductive additive may comprise a conductive carbon additive. In some embodiments, the conductive carbon additive comprises a carbon black, carbon nanotubes, such as single-walled carbon nanotubes (SWCNTs) and multi-walled carbon nanotubes (MWCNTs). In some embodiments, the electrode film comprises the conductive additive in a total amount of, of about, of at most, or at most about, 10 wt. %, 9 wt. %, 8 wt. %, 7 wt. %, 6 wt. %, 5 wt. %, 4 wt. %, 3 wt. %, 2 wt. %, 1 wt. %, 0.5 wt. %, 0.25 wt. %, 0.1 wt. %, or any range of values therebetween. In some embodiments, each of the conductive additive is in an amount of, of about, of at most, or at most about, 10 wt. %, 9 wt. %, 8 wt. %, 7 wt. %, 6 wt. %, 5 wt. %, 4 wt. %, 3 wt. %, 2 wt. %, 1 wt. %, 0.5 wt. %, 0.25 wt. %, 0.1 wt. %, of the electrode film, or any range of values therebetween. In some embodiments, the conductive additive is carbon black.
[0087] In some embodiments, the electrode film material and/or electrode film includes a binder. The binder can form a portion of the dry electrode material (e.g., powder) discussed herein. In some embodiments, binders can include polytetrafluoroethylene (PTFE), a polyolefin, polyalkylenes, polyethers, styrene-butadiene, co-polymers of polysiloxanes and polysiloxane, branched polyethers, polyvinylethers, a carboxymethylcellulose (CMC), co-polymers thereof, and/or combinations thereof. In some embodiments, the polyolefin can include polyethylene (PE), polypropylene (PP), polyvinylidene fluoride (PVDF), co-polymers thereof, and/or combinations thereof. For example, the binder can include polyvinylene chloride, poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), poly(ethylene oxide) (PEO), poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), polydimethylsiloxane (PDMS), polydimethylsiloxane-coalkylmethylsiloxane, co-polymers thereof, and/or combinations thereof. In some embodiments, the binder may include a thermoplastic. In some embodiments, the binder comprises a fibrillizable and/or fibrillized polymer. In certain embodiments, the binder comprises, consists essentially, or consists of a single fibrillizable and/or fibrillized binder, such as PTFE. In some embodiments, the binder comprises, consists essentially, or consists of PVDF. In some embodiments, the electrode film comprises a binder in an amount of, of about, of at most, or at most about, 20 wt. %, 19 wt. %, 18 wt. %, 17 wt. %, 16 wt. %, 15 wt. %, 14 wt. %, 13 wt. %, 12 wt. %, 11 wt. %, 10 wt. %, 9 wt. %, 8 wt. %, 7 wt. %, 6 wt. %, 5 wt. %, 4 wt. %, 3 wt. %, 2 wt. %, 1 wt. %, 0.5 wt. %, 0.25 wt. %, 0.1 wt. %, or any range of values therebetween.
[0088] In some embodiments, the electrode film is prepared by a dry electrode fabrication process. As used herein, a dry electrode fabrication process can refer to a process in which no or substantially no solvents are used to form a dry electrode film. For example, components of the active layer or electrode film, including carbon materials and binders, may comprise, consist of, or consist essentially of dry particles. The dry particles for forming the active layer or electrode film may be combined to provide a dry particle active layer mixture. In some embodiments, the active layer or electrode film may be formed from the dry particle active layer mixture such that weight percentages of the components of the active layer or electrode film and weight percentages of the components of the dry particles active layer mixture are substantially the same. In some embodiments, the active layer or electrode film formed from the dry particle active layer mixture using the dry fabrication process may be free from, or substantially free from, any processing additives such as solvents and solvent residues resulting therefrom. In some embodiments, the resulting active layer or electrode films are self-supporting films formed using the dry process from the dry particle mixture. In some embodiments, the resulting active layer or electrode films are free-standing films formed using the dry process from the dry particle mixture. A process for forming an active layer or electrode film can include fibrillizing the fibrillizable binder component(s) such that the film comprises fibrillized binder. In further embodiments, a free-standing active layer or electrode film may be formed in the absence of a current collector. In still further embodiments, an active layer or electrode film may comprise a fibrillized polymer matrix such that the film is self-supporting. It is thought that a matrix, lattice, or web of fibrils can be formed to provide mechanical structure to the electrode film.
[0089] In some embodiments, the electrode film mixture can be calendered in a calender apparatus as disclosed herein to form a free-standing fibrillized electrode film. In some embodiments, a calendered mixture forms a free-standing dry particle film free or substantially free from any liquids, solvents, and resulting residue therefrom. In some embodiments, calendering the electrode film mixture may damage the calender roller surface, especially when the electrode film mixture comprises a hard material, such as cathode active material. In some embodiments, the electrode film is an anode electrode film. In some embodiments, the electrode film is a cathode electrode film. In some embodiments, the process for fabricating an electrode film is a dry process, where no liquids or solvents are used and the listed raw materials are dry (e.g. one or more are dry powders) such that the resulting electrode film is free or substantially free of any liquids, solvents, and resulting residues.
[0090] In some embodiments, an energy storage device comprises a separator, an anode electrode, a cathode electrode, an electrolyte, and a housing, wherein the electrolyte, separator, anode electrode and cathode electrode are disposed within the housing and the separator is positioned between the anode and cathode electrodes. In some embodiments, the cathode comprises the blended cathode active material described herein. In some embodiments, an energy storage device is formed by placing an electrolyte, a separator, an anode electrode, and the cathode electrode within a housing, wherein the separator is placed between the anode electrode and the cathode electrode. In some embodiments the energy storage device is a battery. In some embodiments the energy storage device is a lithium-ion battery. In some embodiments, the energy storage device comprises an anode electrode positioned between two cathode electrodes.
EXAMPLES
[0091] Example embodiments of the present disclosure, including processes, materials and/or resultant products, are described in the following examples.
Example 1Dents on Calender Roller Surface
[0092]
Example 2Generating a Surface Profile of a Calender Roller
[0093]
Example 3Repeatability Study of Generating a Surface Profile of a Calender Roller
[0094]
Example 4Surface Profile of a Calender Roller Before and After Repair
[0095]
[0096]
[0097]
Example 5Study of Polishing the Repaired Calender Roller Surface
[0098] The sample surface was repaired with electroplating a nickel tungsten for 5 m on the sample surface. Sanding and polishing were performed for 25 minutes. Table 1 summarizes the sanding and polishing steps and Table 2 summarizes the roughness at each step. As illustrated in Table 2, the average roughness (Ra) and total height of the roughness profile (Rt) are greatly reduced and matching the original roughens before electroplating.
TABLE-US-00001 TABLE 1 Step 1 Step 2 Step 3 Sanding Steps 500 grit 1600 grit 3000 grit (5-6 minutes) (5-6 minutes) (5-6 minutes) Polishing Steps 2 m 0.5 m 0.1 M (3.5 minutes) (3.5 minutes) (1 min)
TABLE-US-00002 TABLE 2 Ra (m) Rt (m) Ra_1 Ra_2 Rt_1 Rt_2 (inside) (Boundary) (inside) (boundary) Before electroplating 0.056 0.052 0.965 1.512 (roller surface) After electroplating 1.136 1.603 3.454 4.203 After Sanding 0.072 0.069 1.740* 3.208* After Polishing 0.051 0.054 1.342 1.456
Example 6Study of Location of the Encoder
[0099]
[0100] While certain embodiments of the inventions have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the disclosure. Indeed, the novel methods and systems described herein may be embodied in a variety of other forms. Furthermore, various omissions, substitutions and changes in the systems and methods described herein may be made without departing from the spirit of the disclosure. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the disclosure. Accordingly, the scope of the present inventions is defined only by reference to the appended claims.
[0101] Features, materials, characteristics, or groups described in conjunction with a particular aspect, embodiment, or example are to be understood to be applicable to any other aspect, embodiment or example described in this section or elsewhere in this specification unless incompatible therewith. All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and/or all of the steps of any method or process so disclosed, may be combined in any combination, except combinations where at least some of such features and/or steps are mutually exclusive. The protection is not restricted to the details of any foregoing embodiments. The protection extends to any novel one, or any novel combination, of the features disclosed in this specification (including any accompanying claims, abstract and drawings), or to any novel one, or any novel combination, of the steps of any method or process so disclosed.
[0102] Furthermore, certain features that are described in this disclosure in the context of separate implementations can also be implemented in combination in a single implementation. Conversely, various features that are described in the context of a single implementation can also be implemented in multiple implementations separately or in any suitable subcombination. Moreover, although features may be described above as acting in certain combinations, one or more features from a claimed combination can, in some cases, be excised from the combination, and the combination may be claimed as a subcombination or variation of a subcombination.
[0103] Moreover, while operations may be depicted in the drawings or described in the specification in a particular order, such operations need not be performed in the particular order shown or in sequential order, or that all operations be performed, to achieve desirable results. Other operations that are not depicted or described can be incorporated in the example methods and processes. For example, one or more additional operations can be performed before, after, simultaneously, or between any of the described operations. Further, the operations may be rearranged or reordered in other implementations. Those skilled in the art will appreciate that in some embodiments, the actual steps taken in the processes illustrated and/or disclosed may differ from those shown in the figures. Depending on the embodiment, certain of the steps described above may be removed, others may be added. Furthermore, the features and attributes of the specific embodiments disclosed above may be combined in different ways to form additional embodiments, all of which fall within the scope of the present disclosure. Also, the separation of various system components in the implementations described above should not be understood as requiring such separation in all implementations, and it should be understood that the described components and systems can generally be integrated together in a single product or packaged into multiple products. For example, any of the components for an energy storage system described herein can be provided separately, or integrated together (e.g., packaged together, or attached together) to form an energy storage system.
[0104] For purposes of this disclosure, certain aspects, advantages, and novel features are described herein. Not necessarily all such advantages may be achieved in accordance with any particular embodiment. Thus, for example, those skilled in the art will recognize that the disclosure may be embodied or carried out in a manner that achieves one advantage or a group of advantages as taught herein without necessarily achieving other advantages as may be taught or suggested herein.
[0105] For purpose of this disclosure, in some embodiments, primary particles may be smallest distinct entities from which larger structures, clusters, or aggregates are formed. Conditional language, such as can, could, might, or may, unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments include, while other embodiments do not include, certain features, elements, and/or steps. Thus, such conditional language is not generally intended to imply that features, elements, and/or steps are in any way required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without user input or prompting, whether these features, elements, and/or steps are included or are to be performed in any particular embodiment.
[0106] Conjunctive language such as the phrase at least one of X, Y, and Z, unless specifically stated otherwise, is otherwise understood with the context as used in general to convey that an item, term, etc. may be either X, Y, or Z. Thus, such conjunctive language is not generally intended to imply that certain embodiments require the presence of at least one of X, at least one of Y, and at least one of Z.
[0107] Language of degree used herein, such as the terms approximately, about, generally, and substantially as used herein represent a value, amount, or characteristic close to the stated value, amount, or characteristic that still performs a desired function or achieves a desired result. For example, the terms approximately, about, generally, and substantially may refer to an amount that is within less than 10% of, within less than 5% of, within less than 1% of, within less than 0.1% of, and within less than 0.01% of the stated amount, depending on the desired function or desired result.
[0108] The scope of the present disclosure is not intended to be limited by the specific disclosures of preferred embodiments in this section or elsewhere in this specification, and may be defined by claims as presented in this section or elsewhere in this specification or as presented in the future. The language of the claims is to be interpreted broadly based on the language employed in the claims and not limited to the examples described in the present specification or during the prosecution of the application, which examples are to be construed as non-exclusive.