Optoelectronic module having an OLED and method for producing an optoelectronic module

Abstract

The invention relates to an optoelectronic module, comprising a housing (11) having a first housing part (11) having a first cover surface (11a) and an opening (4); a mechanically flexibly designed organic light source (2) having an illuminating surface (2a); and a cover element (3) which is mounted on the illuminating surface (2a) and has a light-transmissive surface (3a) facing away from the illuminating surface (2a), wherein the organic light source (2) is introduced at least at some points into the opening (14), the first cover surface (11a) is curved and/or bowed, the size of the illuminating surface (2a) is at least 1 cm.sup.2, preferably at least 5 cm.sup.2, and the distance between the illuminating surface (2a) and the first cover surface (11a) is at most 1 cm, preferably at most 5 mm.

Claims

1. An optoelectronic device comprising: a housing having a first housing part comprising a first cover surface; a mechanically flexible organic light emitting diode having a light emission surface emitting light produced by the organic light emitting diode; and a mechanically flexible cover element being applied to the light emission surface and comprising a light passage surface facing away from the light emission surface, wherein the organic light emitting diode is introduced into the housing at least in places, and wherein a distance between the light emission surface and the first cover surface is at most 1 cm.

2. The optoelectronic device according to claim 1, wherein the cover element is adhesively bonded to the light emission surface.

3. The optoelectronic device according to claim 1, wherein the cover element comprises a foil.

4. The optoelectronic device according to claim 1, wherein the cover element has a protruding region which projects laterally beyond the light emission surface.

5. The optoelectronic device according to claim 1, wherein the cover element is connected to the housing.

6. The optoelectronic device according to claim 1, wherein the cover element has a protruding region which is connected to the housing.

7. The optoelectronic device according to claim 1, wherein the housing comprises the first housing part and a second housing part.

8. The optoelectronic device according to claim 1, wherein the housing comprises the first housing part and a second housing part, and wherein the first housing part and the second housing part are connected to one another in a mechanically detachable manner.

9. The optoelectronic device according to claim 1, wherein the housing comprises the first housing part and a second housing part, and wherein the second housing part has a second cover surface which is curved or arched.

10. The optoelectronic device according to claim 1, wherein the first housing part has a first cover surface which is curved or arched.

11. The optoelectronic device according to claim 1, wherein the organic light emitting diode is bendable in a non-destructive manner around at least one first axis.

12. The optoelectronic device according to claim 11, wherein the organic light emitting diode is bendable at a radius of curvature which is at least 50 times an extent of the organic light emitting diode along a further axis.

13. The optoelectronic device according to claim 1, wherein the cover element is bendable in a non-destructive manner around at least one first axis.

14. The optoelectronic device according to claim 13, wherein the cover element is bendable at a radius of curvature which is at least 50 times the extent of the cover element along a further axis.

15. The optoelectronic device according to claim 1, wherein the housing comprises an opening in which the organic light emitting diode is introduced at least in places.

16. The optoelectronic device according to claim 1, further comprising a mechanically flexible circuit board, which is arranged in places at a mounting surface of the organic light emitting diode facing away from the light emission surface and which is electrically conductively connected to the organic light emitting diode.

17. The optoelectronic device according to claim 16, wherein the circuit board is bendable in a non-destructive manner around at least one first axis.

18. The optoelectronic device according to claim 16, wherein the organic light emitting diode, the cover element and the circuit board are bendable in a non-destructive manner around at least one first axis.

19. An optoelectronic device comprising: a housing having a first housing part comprising a first cover surface; a mechanically flexible organic light emitting diode having a light emission surface emitting light produced by the organic light emitting diode; and a cover element being applied to the light emission surface and comprising a light passage surface facing away from the light emission surface, wherein the organic light-emitting diode is arranged at least in places in the housing, wherein a size of the light emission surface is at least 1 cm.sup.2, and wherein a distance between the light emission surface and the first cover surface is at most 1 cm.

20. An optoelectronic device comprising: a housing having a first housing part comprising a first cover surface; a mechanically flexible organic light source having an illuminating surface; and a mechanically flexible cover element being applied to the illuminating surface and comprising a light passage surface facing away from the illuminating surface, wherein the organic light-emitting diode is arranged at least in places in the housing, and wherein the organic light source is bendable at a radius of curvature which is at least 10 times the extent of the organic light source along a further axis.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) In the following, the optoelectronic module described here and the method described here are described in more detail on the basis of the embodiments and the associated figures.

(2) FIGS. 1A and 1B show exemplary embodiments of an optoelectronic module described here on the basis of schematic sectional representations.

(3) FIG. 2 shows an exemplary embodiment of an optoelectronic module described here on the basis of a schematic plan view.

(4) FIG. 3 shows an exemplary embodiment of an optoelectronic module described here on the basis of a schematic sectional view.

(5) Identical, equivalent or equivalently acting elements are indicated with the same reference numerals in the figures. The figures and the size ratios of the elements shown in the figures are not necessarily true to scale. Individual elements can rather be illustrated exaggeratedly large for the purpose of better clarification und/or comprehension.

(6) An exemplary embodiment of an optoelectronic module described here is explained in more detail with reference to the schematic sectional representations of FIGS. 1A and 1B. FIG. 1A shows an exemplary embodiment of an optoelectronic module, while FIG. 1B—for the purpose of explanation—only shows the housing associated with the optoelectronic module of FIG. 1A.

(7) The optoelectronic module comprises a housing having a first housing part 11 comprising a first cover surface 11a and a second housing part 12 comprising a second cover surface 12a. The first cover surface 11a and the second cover surface 12a have a convex curvature in the exemplary embodiment as shown. Furthermore, the first housing part 11 and the second housing part 12 are formed in one piece.

(8) In the first housing part 11 there is an opening 14, which extends completely through the first housing part 11 in a stacking direction running obliquely to a thickness of the first housing part 11. An inner side surface 11b, which is arranged in the opening 14, of the first housing part 11 can be formed in a onefold-contiguous manner and frames the opening 14.

(9) Inside the opening 14, a mechanically flexible organic light source 2 having an illuminating surface 2a facing away from the second cover surface 12a and a mounting surface 12c facing the second cover surface 12a is arranged on the second cover surface 12a. The organic light source 2 can be a surface light source, whose illuminating surface 2a can have a size of at least 1 cm.sup.2.

(10) The opening 14 can be of flat design. In particular, a distance between the illuminating surface 2a and the first cover surface 11a is at most 1 cm, preferably at most 5 mm.

(11) A cover element 3 having a light passage surface 3a facing away from the illuminating surface 2a is arranged on the illuminating surface 2a of the organic light source 2. According to the exemplary embodiment shown in FIG. 1A, the cover element 3 is a foil which is adhesively bonded onto the illuminating surface 2a by means of a connecting means 51 (not shown in FIG. 1A), which can be a pressure-sensitive adhesive.

(12) The cover element 3 also has a protruding region 31 which projects laterally beyond the illuminating surface 2a. The protruding region 31 of the cover element 3 can be connected to the first housing part 11 and/or the second housing part 12 in regions by the connecting means 51.

(13) Furthermore, a slot 40 is arranged between the first housing part 11 and the second housing part 12. In the stacking direction, the slot 40 has a smaller extension than the first housing part 11 and/or the second housing part 12. The slot 40 can in particular be a gap or a joint between the first housing part 11 and the second housing part 12.

(14) A first region 41 of a mechanically flexible circuit board is arranged at the mounting surface 2c of the organic light source 2. The circuit board merges into a second region 42, which is guided through the slot 40 to a lower side of the housing facing away from the first cover surface 11a and/or from the second cover surface 12a. In this case, it is possible that the second region 42 is introduced into the slot 40 in the first place during the production of the optoelectronic module and subsequently, the organic light source 2 located on the first region 41 is connected to the housing by the cover element 3 and/or a further connecting means 52.

(15) A further connecting means 52 can also be arranged between the second cover surface 12a and the mounting surface 2c, which can be, for example, an adhesive and/or a potting.

(16) The illuminating surface 2a and/or the light passage surface 3a are formed to be curved and/or bent. The illuminating surface 2a and the light passage surface 3a follow a continued contour 13a (see FIG. 1B) of the first cover surface 11a at least in regions. In particular, at least in places, the illuminating surface 2a and/or the light passage surface 3a can have the same curvature as the continued contour 13a of the first cover surface 11a.

(17) For the purpose of clarification, FIG. 1B shows only the first housing part 11 and the second housing part 12, wherein the continued contour 13a of the first cover surface 11a is indicated. In particular, the continued contour 13a is provided by a further surface which complements the first cover surface 11 a in the region of the opening 14 to a onefold-contiguous surface.

(18) With reference to the plan view of the light passage surface 3a as shown in FIG. 2, a further exemplary embodiment of the optoelectronic module described here is explained in more detail. The organic light source 2 is introduced into the opening 14 within the first housing part 11. In this case, a side surface 2b of the organic light source 2 directly adjoins the inner side surface 11b of the first housing part 11 at least in places. In particular, the inner side surface 11b and the side surface 2b of the organic light source 2 serve as a stop for mounting the organic light source 2 within the opening 14.

(19) A further exemplary embodiment of an optoelectronic module described here is explained in more detail with reference to the schematic sectional illustration of FIG. 3. In the exemplary embodiment as shown, the first housing part 11 and the second housing part 12 are formed from two separate parts and are connected to one another by connecting elements 6 in a mechanically detachable manner. The connecting elements 6 can be screws which engage in the bores of the first housing part 11 and/or in the second housing part 12.

(20) The invention is not restricted to the exemplary embodiments by the description made with reference to exemplary embodiments. The invention rather comprises any novel feature and any combination of features, including in particular any combination of features in the patent claims, even if this feature or this combination is not itself explicitly indicated in the patent claims or exemplary embodiments.

LIST OF REFERENCE SIGNS

(21) 11 first housing part 11a first cover surface 11b inner side surface 12 Second housing part 12a second cover surface 13a continued contour 14 opening 2 organic light source 2a illuminating surface 2b side surface of the organic light source 2c mounting surface 3 cover element 3a light passage surface 40 slot 41 first region of the circuit board 42 second region of the circuit board 51 connecting means 52 further connection means 6 connector element