Bismuth halide compound-PDMS composite material for X-ray shielding and manufacturing method thereof

Abstract

A method for producing a lead-free X-ray shielding material using a bismuth halide compound is provided, the method including a first step of producing porous PDMS (Polydimethylsiloxane); a second step of producing a mixed solution of the bismuth halide compound and THF; and a third step of immersing the porous PDMS into the mixed solution such that the bismuth halide compound is loaded into the porous PDMS to produce a bismuth halide compound-PDMS composite material.

Claims

1. A method for producing a lead-free X-ray shielding material using a bismuth halide compound, the method comprising: a first step of producing porous PDMS (Polydimethylsiloxane); a second step of producing a mixed solution of the bismuth halide compound and THF; and a third step of immersing the porous PDMS into the mixed solution such that the bismuth halide compound is loaded into the porous PDMS to produce a bismuth halide compound-PDMS composite material.

2. The method of claim 1, wherein the first step includes: producing a mixed solution by mixing PDMS, a curing agent, and salt (NaCl); mixing the mixed solution using a centrifuge to bring the salt particles into contact with each other within the PDMS; curing the mixed solution; and immersing the curing product into water to remove the NaCl therefrom to produce the porous PDMS.

3. The method of claim 1, wherein in the second step, the bismuth halide compound includes: bismuth iodide (BiI.sub.3); and one selected from a group consisting of BiF.sub.3 (bismuth trifluoride), BiCl.sub.3 (bismuth trichloride), and BiBr.sub.3 (bismuth tribromide).

4. The method of claim 3, wherein in the second step, the mixed solution is produced at a ratio of the bismuth halide compound and THF including BiI.sub.3 0.8 g: BiBr.sub.3 0.2 g: THF 3 ml, BiI.sub.3 0.8 g: BiCl.sub.3 0.2 g: THF 3 ml, or BiI.sub.3 0.6 g: BiF.sub.3 0.4 g: THF 3 ml.

5. The method of claim 1, wherein in the third step, the porous PDMS has been immersed in the mixed solution for 15 to 20 hours.

6. The method of claim 1, wherein the method further comprises, after the third step, drying the PDMS at 50 to 70 C. for 20 to 60 minutes to remove the THF therefrom such that only the bismuth halide compound is loaded into the PDMS.

7. A bismuth halide compound-PDMS composite material for shielding X-rays, wherein the bismuth halide compound-PDMS composite material is produced by the method of claim 1, wherein the bismuth halide compound has been loaded into the porous PDMS.

8. The bismuth halide compound-PDMS composite material of claim 7, wherein the bismuth halide compound-PDMS composite material contains BiI.sub.3 at a content of 80% by weight and BiBr.sub.3 at a content of 20% by weight based on a total weight of the bismuth halide compound, wherein when a tube voltage is 60 kV, a shielding ratio of the bismuth halide compound-PDMS composite material is 75% or greater.

9. The bismuth halide compound-PDMS composite material of claim 7, wherein the bismuth halide compound contains BiI.sub.3 at a content of 80% and BiCl.sub.3 at a content of 20% by weight based on a total weight of the bismuth halide compound, wherein when a tube voltage is 60 kV, a shielding ratio of the bismuth halide compound-PDMS composite material is 64.5% or greater.

10. The bismuth halide compound-PDMS composite material of claim 7, wherein the bismuth halide compound contains BiI.sub.3 at a content of 60% and BiF.sub.3 at a content of 40% by weight based on a total weight of the bismuth halide compound, wherein when a tube voltage is 60 kV, a shielding ratio of the bismuth halide compound-PDMS composite material is 73% or greater.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a flowchart showing a producing method of the present disclosure.

(2) FIG. 2 is a schematic diagram of a process of producing porous PDMS.

(3) FIG. 3 is a schematic diagram of a process of producing a bismuth halide compound-PDMS composite material.

(4) FIG. 4 is a photo of a bismuth halide compound-PDMS composite material sample based on a content of each of BiI.sub.3, BiBr.sub.3, and BiCl.sub.3 (20%, 40%, 60%, 80%).

(5) FIG. 5 is an experimental graph of a shielding ability of [BiI.sub.3+BiBr.sub.3]-PDMS based on a BiBr.sub.3 content at a tube voltage of 60 kV.

(6) FIG. 6 is an experimental graph of a shielding ability of [BiI.sub.3+BiCl.sub.3]-PDMS based on a BiCl.sub.3 content at a tube voltage of 60 kV.

(7) FIG. 7 is an experimental graph of a shielding ability of [BiI.sub.3+BiF.sub.3]-PDMS according to a BiF.sub.3 content at a tube voltage of 60 kV.

DETAILED DESCRIPTION OF THE INVENTION

(8) For simplicity and clarity of illustration, elements in the figures are not necessarily drawn to scale. The same reference numbers in different figures represent the same or similar elements, and as such perform similar functionality. Further, descriptions and details of well-known steps and elements are omitted for simplicity of the description. Furthermore, in the following detailed description of the present disclosure, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be understood that the present disclosure may be practiced without these specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of the present disclosure.

(9) Examples of various embodiments are illustrated and described further below. It will be understood that the description herein is not intended to limit the claims to the specific embodiments described. On the contrary, it is intended to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the present disclosure as defined by the appended claims.

(10) A shape, a size, a ratio, an angle, a number, etc. disclosed in the drawings for illustrating embodiments of the present disclosure are illustrative, and the present disclosure is not limited thereto. The same reference numerals refer to the same elements herein. Further, descriptions and details of well-known steps and elements are omitted for simplicity of the description. Furthermore, in the following detailed description of the present disclosure, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be understood that the present disclosure may be practiced without these specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of the present disclosure.

(11) The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the present disclosure. As used herein, the singular forms a and an are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms comprises, comprising, includes, and including when used in this specification, specify the presence of the stated features, integers, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, operations, elements, components, and/or portions thereof. As used herein, the term and/or includes any and all combinations of one or more of the associated listed items. Expression such as at least one of when preceding a list of elements may modify the entirety of list of elements and may not modify the individual elements of the list. When referring to C to D, this means C inclusive to D inclusive unless otherwise specified.

(12) Unless otherwise defined, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this inventive concept belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

(13) In one example, when a certain embodiment may be implemented differently, a function or operation specified in a specific block may occur in a sequence different from that specified in a flowchart. For example, two consecutive blocks may actually be executed at the same time. Depending on a related function or operation, the blocks may be executed in a reverse sequence.

(14) In descriptions of temporal relationships, for example, temporal precedent relationships between two events such as after, subsequent to, before, etc., another event may occur therebetween unless directly after, directly subsequent or directly before is not indicated.

(15) The features of the various embodiments of the present disclosure may be partially or entirely combined with each other, and may be technically associated with each other or operate with each other. The embodiments may be implemented independently of each other and may be implemented together in an association relationship.

(16) For an example, porous PDMS is immersed in a bismuth halide compound solution to produce a bismuth halide compound-PDMS composite material. Then, the shielding performance of the bismuth halide compound-PDMS composite material is identified based on a comparing result thereof with that of a composite material using only BiI.sub.3.

Example: Method for Producing Bismuth Halide Compound-PDMS Composite Material

(17) FIG. 1 is a flow chart showing the producing method of the present disclosure, FIG. 2 is a schematic diagram of the process of producing porous PDMS, FIG. 3 is a schematic diagram of the process of producing the bismuth halide compound-PDMS composite material, and FIG. 4 is a photo of a bismuth halide compound-PDMS composite material sample based on a content of each of BiI.sub.3, BiBr.sub.3, and BiCl.sub.3 (20%, 40%, 60%, 80%).

(18) Referring to FIG. 1, FIG. 2, FIG. 3, and FIG. 4, PDMS (Polydimethylsiloxane), a curing agent, and salt (NaCl) were mixed with each other to produce a mixed solution. At this time, a ratio of PDMS:curing agent:salt was 10:1:15 (mass ratio).

(19) Afterwards, the mixed solution was subjected to mixing at 8,000 rpm using a centrifuge for 20 minutes. This process was repeated three times, and then excess PDMS was removed therefrom to allow the salt particles to contact each other within the PDMS.

(20) After the reaction was completed, the PDMS was heat-treated at 60 C. for 18 hours and a cured PDMS was cut into a coin shape with a diameter of 25 mm and a thickness of 3 mm.

(21) The coin-shaped PDMS was immersed in water at 60 C. for 18 hours to remove the water-soluble salt particles therefrom to produce the porous PDMS.

(22) Then, the bismuth halide compound of BiI.sub.3 and one of BiBr.sub.3, BiCl.sub.3 and BiF.sub.3 was mixed with a THF solution (BiI.sub.3 0.8 g: BiBr.sub.3 0.2 g: THF 3 ml, BiI.sub.3 0.8 g: BiCl.sub.3 0.2 g: THF 3 ml or BiI.sub.3 0.6 g: BiF.sub.3 0.4 g: THF 3 ml) to produce a mixed solution which was a bismuth halide compound solution as an adsorption target. At this time, each of BiBr.sub.3, BiCl.sub.3, and BiF.sub.3 was contained at weight ratios of 20%, 40%, 60%, and 80%.

(23) Finally, the porous PDMS was immersed in the bismuth halide compound solution as the mixed solution as the adsorption target for 18 hours such that the bismuth halide compound was loaded into the porous PDMS. To remove THF therefrom, the PDMS was dried at 60 C. for 30 minutes.

(24) In a reference example, porous PDMS having only BiI.sub.3 loaded therein was prepared using the same method.

Experimental Example: Shielding Ability Experiment of Bismuth Halide Compound-PDMS Composite Material Based on Type of Bismuth Halide Compound

(25) FIG. 5 is an experimental graph of the shielding ability of [BiI.sub.3+BiBr.sub.3]-PDMS based on a BiBr.sub.3 content at a tube voltage of 60 kV. FIG. 6 is an experimental graph of the shielding ability of [BiI.sub.3+BiCl.sub.3]-PDMS based on a BiCl.sub.3 content at a tube voltage of 60 kV. FIG. 7 is an experimental graph of the shielding ability of [BiI.sub.3+BiF.sub.3]-PDMS based on a BiF.sub.3 content at a tube voltage of 60 kV.

(26) Referring to FIG. 5, FIG. 6, and FIG. 7, it was identified that the shielding ability of [BiI.sub.3 and one of BiBr.sub.3, BiCl.sub.3, and BiF.sub.3]-PDMS composite material was better than that of a BiI.sub.3 alone-PDMS composite material.

(27) First, a 3 mm thick specimen was irradiated with X-ray at 60 kV tube voltage. In this case, the BiI.sub.3-based BiBr.sub.3-PDMS composite material had the lowest shielding ratio of 58.2% when the BiBr.sub.3 weight ratio was 40% and had the highest shielding ratio of 75.88% when the BiBr.sub.3 weight ratio was 20%.

(28) Next, the BiI.sub.3-based BiCl.sub.3-PDMS composite material had the lowest shielding ratio of 51.71% when the BiCl.sub.3 weight ratio was 40% and had the highest shielding ratio of 64.85% when the BiCl.sub.3 weight ratio was 20%.

(29) Subsequently, the BiI.sub.3-based BiF.sub.3-PDMS composite material had the lowest shielding ratio of 53.81% when the BiF.sub.3 weight ratio was 80% and had the highest shielding ratio of 73.27% when the BiF.sub.3 weight ratio was 40%.

(30) Each of BiBr.sub.3, BiCl.sub.3, and BiF.sub.3 plays an auxiliary role in filling an empty space between dispersed BiI.sub.3 more densely, resulting in a synergy effect that can enhance performance. It was identified that under the same condition, the shielding ratio of using the material using only BiI.sub.3 was measured to be 61.72% to 69.27%, while the shielding ability was improved up to 75% by using the compound of the bismuth halides without a repeated loading process.

(31) TABLE-US-00001 TABLE 1 Content (BiI.sub.3- Shielding Based) 1 2 3 4 5 avg +error error ability BiBr.sub.3 20% 13.54 9.39 9.14 9.67 11.62 10.67 1.92 2.48 75.88% BiBr.sub.3 40% 18.40 17.72 18.25 19.02 19.08 18.49 0.00 1.36 58.20% BiBr.sub.3 60% 9.94 15.94 9.58 15.16 16.26 13.38 0.00 6.68 69.76% BiBr.sub.3 80% 12.56 12.15 12.92 8.62 11.68 11.59 1.24 3.06 73.81%

(32) TABLE-US-00002 TABLE 2 Content (BiI.sub.3- Shielding Based) 1 2 3 4 5 avg +error error ability BiCl.sub.3 20% 14.36 16.41 16.02 16.78 14.18 15.55 2.60 0.00 64.85% BiCl.sub.3 40% 21.89 21.97 20.52 20.24 22.19 21.36 0.00 1.94 51.71% BiCl.sub.3 60% 22.86 23.12 23.03 22.55 22.28 22.77 0.84 0.00 48.54% BiCl.sub.3 80% 16.34 15.67 18.44 21.56 21.22 18.65 0.34 5.55 57.85%

(33) TABLE-US-00003 TABLE 3 Content (BiI.sub.3- Shielding Based) 1 2 3 4 5 avg +error error ability BiF.sub.3 20% 13.87 13.32 13.05 13.81 13.22 13.45 0.65 0.16 69.59% BiF.sub.3 40% 12.17 12.22 11.52 11.80 11.42 11.83 0.80 0.00 73.27% BiF.sub.3 60% 14.35 12.33 13.43 14.21 15.34 13.93 0.00 3.00 68.51% BiF.sub.3 80% 21.34 20.58 21.91 19.50 19.07 20.48 2.84 0.00 53.71%

(34) A description of the presented embodiments is provided so that a person skilled in the art of any of the present disclosure may use or practice the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art of the present disclosure. The general principles defined herein may be applied to other embodiments without departing from the scope of the present disclosure. Thus, the present disclosure should not be limited to the embodiments as presented herein, but should be interpreted in the widest scope consistent with the principles and novel features as presented herein.