Method for preparing copper-plated titanium alloy wire reinforced aluminum-based composite material

Abstract

The present disclosure discloses a method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material, including steps of: etching a cleaned TC4 wire; then electroplating a copper layer to obtain a copper-plated titanium alloy wire; performing heat treatment with two-step slow cooling on the copper-plated titanium alloy wire by using a heat treatment furnace; and, cladding a single-layer and single-pass ER5356 aluminum alloy on an aluminum alloy substrate by an arc additive manufacturing technology, then flatly spreading the heat-treated copper-plated titanium alloy wire in the center of the cladding layer to form an intermediate layer, and finally cladding a single-layer and single-pass ER5356 aluminum alloy matrix on the surface of the intermediate layer. In the present invention, by using copper as a transition interlayer of the aluminum-titanium interface, the generation of brittle intermetallic compounds between aluminum and titanium can be completely suppressed.

Claims

1. A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material, comprising the following steps of: step 1: pretreating a TC4 wire, comprising etching a cleaned TC4 wire; wherein, in the step 1, pretreating the TC4 wire comprises: grinding the surface of the TC4 wire by a piece of sand paper, then pickling with H2SO4, degreasing with NaOH, cleaning with ethyl alcohol, drying, and finally etching, wherein the concentration of H2SO4 is 5 wt % to 10 wt %, and the concentration of NaOH is 1 wt % to 3 wt %; and the cleaned TC4 wire is etched using an etching solution, the etching temperature is 35 C. to 50 C. and the etching time is 15 min to 30 min; the etching solution is composed of 10 wt %-15 wt % HF aqueous solution, 10 wt % NH4HF2, 70 wt % ethylene glycol and 5 wt %-10 wt % H20 and the total mass percentage of the etching solution is 100%; wherein the volume concentration of the HF aqueous solution is 40%, thereby forming an etched TC4 wire; step 2: electroplating a copper layer on the etched TC4 wire to obtain a copper-plated titanium alloy wire; wherein the etched TC4 wire has a diameter of 0.2 mm to 0.5 mm and a copper-plated layer of the copper-plated titanium alloy wire has a thickness of 50 m to 80 m: wherein, in the step 2, during electroplating the copper layer on the etched TC4 wire, an electroplating solution is composed of 55 wt %-83 wt % CuSO4.Math.5H20, 14 wt %-42 wt % H2SO4, <1 wt % emulsifier, <1 wt % sodium sulfonate and <1 wt % sodium chloride, and the total mass percentage of the electroplating solution is 100%, the electroplating temperature is 60 C. to 80 C., the electroplating current is 0.01 A to 0.09 A and the electroplating time is 30 min to 120 m; step 3: performing heat treatment with two-step slow cooling on the copper-plated titanium alloy wire by using a heat treatment furnace, comprising raising the furnace temperature to 820 C. to 880 C. at 100 C/min, keeping the temperature for 15 min to 60 min, then performing two-stage slow cooling, and finally cooling to room temperature along with the furnace; wherein, in the step 3, before raising the furnace temperature to 820 C. to 880 C., the furnace temperature is raised to 740 C. at 10 C./min and kept for 10 min, the cooling speed in the two-stage slow cooling is 5 C./min and the temperature is cooled from 820 C.-880 C. to 740 C. and kept for 5 min in a first stage and cooled from 740 C. to 500 C. in a second stage; and step 4: cladding a single-layer and single-pass ER5356 aluminum alloy on an aluminum alloy substrate by an arc additive manufacturing technology, then spreading the heat-treated copper-plated titanium alloy wire in the center of the single-layer to form an intermediate layer and finally cladding the single-layer and single-pass ER5356 aluminum alloy matrix on the surface of the intermediate layer.

2. The method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material according to claim 1, wherein, in the step 4, during cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate by the arc additive manufacturing technology, a used raw material is an ER5356 aluminum alloy wire, the ER5356 aluminum alloy wire feeding speed is 600 mm/min, a current is 60 A to 100 A, and a flow of pure argon as a protective gas is 15 L/min.

3. The method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material according to claim 2, wherein, in the step 4, cladding the single-layer and single-pass ER5356 aluminum alloy matrix on the surface of the intermediate layer is the same as cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a process flowchart of performing heat treatment with two-step slow cooling on the copper-plated titanium alloy wire in the method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material according to the present disclosure;

(2) FIG. 2 is a microscopically structure diagram of the copper-plated titanium alloy wire according to Example 1 of the present disclosure;

(3) FIG. 3 is a scanning energy spectrum chart of the cross section of the copper-plated titanium alloy wire according to Example 1 of the present disclosure;

(4) FIG. 4 is an SEM chart of the copper-plated titanium alloy wire reinforced aluminum-based composite material according to Example 1 of the present disclosure; and

(5) FIG. 5 is an SEM chart of the copper-plated titanium alloy wire reinforced aluminum-based composite material according to Comparison example 1 of the present disclosure;

(6) in which: 1: TC4 wire; 2: copper-plated layer; and, 3: ER5356 aluminum alloy matrix.

DETAILED DESCRIPTION OF THE PRESENT DISCLOSURE

(7) The present disclosure will be described below in detail by specific examples with reference to the accompanying drawings.

(8) A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

(9) At step 1, a TC4 wire is pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.2 mm to 0.5 mm by a piece of sand paper, then pickling with H.sub.2SO.sub.4 with a concentration of 5 wt % to 10 wt %, degreasing with NaOH with a concentration of 1 wt % to 3 wt %, cleaning with ethyl alcohol, drying and finally etching, where the etching temperature is 35 C. to 50 C.; the etching time is 15 min to 30 min; the etching solution is prepared from 10 wt %-15 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 5 wt %-10 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution is 40%.

(10) At step 2, the etched TC4 wire 1 is electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution is composed of 55 wt %-83 wt % CuSO.sub.4.Math.5H.sub.2O, 14 wt %-42 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components is 100%; in the electroplating process of the copper layer, the deposition temperature is 60 C. to 80 C., the deposition current is 0.01 A to 0.09 A, and the deposition time is 30 min to 120 min; and, the copper-plated layer 2 of the copper-plated titanium alloy wire has a thickness of 50 m to 80 m.

(11) At step 3, referring to FIG. 1, heat treatment with two-step slow cooling is performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min, and then raising the temperature to 820 C. to 880 C. and keeping the temperature for 15 min to 60 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling is 5 C./min, and the temperature is cooled from 820 C.-880 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

(12) At step 4, a single-layer and single-pass ER5356 aluminum alloy is cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material is an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed is 600 mm/min, the current is 60 A to 100 A, and the flow of pure argon as a protective gas is 15 L/min; then, the heat-treated copper-plated titanium alloy wire is flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix is cladded on the surface of the intermediate layer, where the used process is the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Example 1

(13) A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

(14) At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.2 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 5 wt %, degreasing with NaOH with a concentration of 2 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 35 C.; the etching time was 15 min; the etching solution was prepared from 10 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 10 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

(15) At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 55 wt % CuSO.sub.4.Math.5H.sub.2O, 42 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 60 C., the deposition current was 0.01 A, and the deposition time was 120 min.

(16) At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 820 C. at 10 C./min and keeping the temperature for 30 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 820 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

(17) The microstructure of the copper-plated titanium alloy wire after the heat treatment with two-step slow cooling was observed, where the cross section structure was shown in FIG. 2, with the TC4 wire 1 inside and the copper-plated layer 2 outside. The elements in the cross section of the copper-plated titanium alloy wire were detected. By taking the outermost layer of the copper-plated titanium alloy wire was taken as an origin and gradually extending inward, a scanning energy spectrum chart of the cross section of the copper-plated titanium alloy wire was shown in FIG. 3. It could be seen from FIG. 3 that, from the inside to the outside of the copper-plated titanium alloy wire, the content of Cu gradually decreased, while the content of Ti, Al and V gradually increased; and near the interface between the TC4 wire 1 and the copper-plated layer 2, the content of Ti, Al and V increased sharply, while the content of Cu decreased sharply decreased, almost to zero. It indicated that the copper-plated layer 2 could hinder the contact of the aluminum alloy matrix with the TC4 wire 1 and completely suppress the generation of brittle intermetallic compounds between aluminum and titanium.

(18) At step 4, a ER5356 aluminum alloy was cladded in a single-layer and single-pass manner on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 60 A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix 3 was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Comparison Example 1

(19) A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

(20) At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.2 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 5 wt %, degreasing with NaOH with a concentration of 2 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 35 C.; the etching time was 15 min; the etching solution was prepared from 10 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 10 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

(21) At step 2, the etched TC4 wire 1 was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 55 wt % CuSO.sub.4.Math.5H.sub.2O, 42 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 60 C., the deposition current was 0.01 A, and the deposition time was 120 min.

(22) At step 3, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 60 A, and the flow of pure argon as a protective gas was 15 L/min; then, the copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

(23) Compared with Example 1, in Comparison example 1, the heat treatment with two-step slow cooling was deleted, and other processes were the same.

(24) The microstructures of the copper-plated titanium alloy wire reinforced aluminum-based composite materials prepared in Example 1 and Comparison example 1 were observed, and the observation results were shown in FIGS. 4 and 5, including the TC4 wire 1, the copper-plated layer 2 and the ER5456 aluminum alloy matrix 3. It could be seen that the copper-plated titanium alloy wire reinforced aluminum-based composite material prepared in Example 1 had a good interface state between titanium and copper and had no cracks, while the copper-plated titanium alloy wire reinforced aluminum-based composite material prepared in Comparison example 1 was not subjected to heat treatment with two-step slow cooling and had obvious cracks at the titanium-copper interface. It indicated that the heat treatment with two-step slow cooling could alleviate the shrinkage of the copper-plated titanium alloy wire, release the residual stress and avoid the formation of micro-cracks at the titanium-copper interface.

Example 2

(25) A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

(26) At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.3 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 6 wt %, degreasing with NaOH with a concentration of 1 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 40 C.; the etching time was 20 min; the etching solution was prepared from 12 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 8 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

(27) At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 60 wt % CuSO.sub.4.Math.5H.sub.2O, 37 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 70 C., the deposition current was 0.03 A, and the deposition time was 100 min.

(28) At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 840 C. at 10 C./min and keeping the temperature for 30 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 840 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

(29) At step 4, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 70 A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Example 3

(30) A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

(31) At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.4 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 7 wt %, degreasing with NaOH with a concentration of 1 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 45 C.; the etching time was 25 min; the etching solution was prepared from 13 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 7 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

(32) At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 65 wt % CuSO.sub.4.Math.5H.sub.2O, 33 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 70 C., the deposition current was 0.05 A, and the deposition time was 90 min.

(33) At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 860 C. at 10 C./min and keeping the temperature for 30 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 860 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

(34) At step 4, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 80 A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Example 4

(35) A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

(36) At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.5 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 7 wt %, degreasing with NaOH with a concentration of 3 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 45 C.; the etching time was 25 min; the etching solution was prepared from 13 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 7 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

(37) At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 70 wt % CuSO.sub.4.Math.5H.sub.2O, 26 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 68 C., the deposition current was 0.06 A, and the deposition time was 80 min.

(38) At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 880 C. at 10 C./min and keeping the temperature for 30 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 880 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

(39) At step 4, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 90 A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Example 5

(40) A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

(41) At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.5 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 8 wt %, degreasing with NaOH with a concentration of 1 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 48 C.; the etching time was 28 min; the etching solution was prepared from 15 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 5 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

(42) At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 78 wt % CuSO.sub.4.Math.5H.sub.2O, 20 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 70 C., the deposition current was 0.07 A, and the deposition time was 70 min.

(43) At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 840 C. at 10 C./min and keeping the temperature for 15 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 840 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

(44) At step 4, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 100A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Example 6

(45) A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

(46) At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.2 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 9 wt %, degreasing with NaOH with a concentration of 2 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 50 C.; the etching time was 30 min; the etching solution was prepared from 15 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 5 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

(47) At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 80 wt % CuSO.sub.4.Math.5H.sub.2O, 17 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 80 C., the deposition current was 0.08 A, and the deposition time was 30 min.

(48) At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 840 C. at 10 C./min and keeping the temperature for 45 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 840 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

(49) At step 4, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 70 A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

Example 7

(50) A method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material is provided, including the following steps.

(51) At step 1, a TC4 wire was pretreated, including: grinding the surface of the TC4 wire having a diameter of 0.4 mm by a piece of sand paper with 60 meshes, then pickling with H.sub.2SO.sub.4 with a concentration of 10 wt %, degreasing with NaOH with a concentration of 3 wt %, cleaning with ethyl alcohol with a concentration of 95%, drying and finally etching, where the etching temperature was 50 C.; the etching time was 30 min; the etching solution was prepared from 15 wt % HF aqueous solution, 10 wt % NH.sub.4HF.sub.2, 70 wt % ethylene glycol and 5 wt % H.sub.2O; and, the volume concentration of the HF aqueous solution was 40%.

(52) At step 2, the etched TC4 wire was electroplated with a copper layer to obtain a copper-plated titanium alloy wire, where the electroplating solution was composed of 83 wt % CuSO.sub.4.Math.5H.sub.2O, 15 wt % H.sub.2SO.sub.4, and <1 wt % emulsifier, sodium sulfonate and sodium chloride, and the total mass percentage of the above components was 100%; and, the deposition temperature was 80 C., the deposition current was 0.09 A, and the deposition time was 40 min.

(53) At step 3, heat treatment with two-step slow cooling was performed on the copper-plated titanium alloy wire by using a heat treatment furnace, including: raising the furnace temperature to 740 C. at 10 C./min and keeping the temperature for 10 min to ensure that the contact surface between the copper-plated layer and the titanium alloy wire was in close contact and to eliminate the micro-voids generated between the copper-plated layer and the surface of the titanium alloy wire during the electroplating process of the copper layer, and then raising the temperature to 840 C. at 10 C./min and keeping the temperature for 60 min; then, performing two-stage slow cooling, where the cooling speed in the two-stage slow cooling was 5 C./min, and the temperature was cooled from 840 C. to 740 C. and kept for 5 min in the first stage and cooled from 740 C. to 500 C. in the second stage; and finally cooling to the room temperature along with the furnace.

(54) At step 4, a single-layer and single-pass ER5356 aluminum alloy was cladded on an aluminum alloy substrate by an arc additive manufacturing technology, where the used raw material was an ER5356 aluminum alloy wire having a diameter of 1.2 mm, the wire feeding speed was 600 mm/min, the current was 80 A, and the flow of pure argon as a protective gas was 15 L/min; then, the heat-treated copper-plated titanium alloy wire was flatly spread in the center of the cladding layer to form an intermediate layer; and finally, a single-layer and single-pass ER5356 aluminum alloy matrix was cladded on the surface of the intermediate layer, where the used process was the same as the process of cladding the single-layer and single-pass ER5356 aluminum alloy on the aluminum alloy substrate.

(55) The mechanical properties of the ER5356 aluminum alloy matrix, the TC4 wire without copper plated (having a diameter of 0.2 mm) and the copper-plated titanium alloy wire reinforced aluminum-based composite materials prepared in Examples 1-7 were tested, and the test results were shown in Table 1 below:

(56) TABLE-US-00001 TABLE 1 List of mechanical properties of the aluminum alloy matrix, the TC4 wire without copper plated and the samples prepared in Examples 1-7 Maximum Heat treatment time temperature for at the maximum Bending Impact Test samples heat treatment/ C. temperature/min strength/Mpa energy/J Aluminum alloy \ \ 619 14 matrix TC4 wire without \ \ 726 32 copper plated Example 1 820 30 826 53 Example 2 840 30 849 65 Example 3 860 30 911 56 Example 4 880 30 805 47 Example 5 840 15 805 48 Example 6 840 45 917 59 Example 7 840 60 852 53 - .

(57) It could be seen from Table 1 that the copper-plated titanium alloy wire reinforced aluminum-based composite material prepared by the method of the present disclosure was good in strength and ductility.