CONNECTOR AND BOARD UNIT
20220320771 · 2022-10-06
Inventors
- Takuma HIBINO (Mie, JP)
- Harald Michael Lutsch (Ottrau, DE)
- Masahiro KARITA (Mie, JP)
- Jumpei KAWAHARA (Mie, JP)
Cpc classification
H01R13/6471
ELECTRICITY
H01R13/6594
ELECTRICITY
H01R13/6599
ELECTRICITY
H01R13/629
ELECTRICITY
International classification
H01R13/629
ELECTRICITY
Abstract
A connector to be connected to a circuit board includes a signal terminal, a tubular shield portion for covering an outer periphery of an intermediate part of the signal terminal, a housing for holding the signal terminal, and an alignment plate to be joined to the housing. The signal terminal includes a first end part fixed to the housing and a second end part extending from the first end part toward the circuit board. The second end part includes a connecting portion projecting from an end surface of the shield portion. The alignment plate includes a plate body to be arranged between the housing and the circuit board. The plate body has a first region formed with a positioning hole into which the connecting portion is inserted. The conductive portion is formed of conductive rubber or conductive resin.
Claims
1. A connector to be connected to a circuit board, comprising: At least one signal terminal; a shield portion for at least partly covering an outer periphery of an intermediate part of the signal terminal; a housing for holding and/or positioning the signal terminal; and a t least one alignment plate to be joined to the housing, wherein: the signal terminal includes a first end part to be fixed to the housing and a second end part extending from the first end part substantially toward the circuit board, the second end part includes a connecting portion projecting from an end surface of the shield portion, the alignment plate includes a plate body to be arranged between the housing and the circuit board, the plate body has at least one first region formed with at least one positioning hole, the connecting portion being at least partly inserted into the positioning hole, the first region includes at least one conductive portion to be sandwiched between the end surface of the shield portion and the circuit board, the conductive portion at least partially surrounding the connecting portion.
2. The connector according to claim 1, wherein the conductive portion is formed of or comprises conductive rubber and/or conductive resin.
3. The connector according to claim 1, wherein the shield portion is substantially tubular.
4. The connector according to claim 1, wherein: the signal terminal is a terminal for high-speed communication of 1 Gbps or faster, and the conductive portion surrounds the connecting portion over an entire periphery.
5. The connector according to claim 1, comprising at least one ground terminal arranged substantially side by side with the signal terminal, wherein: the ground terminal includes a first end part connected to the shield portion and a connecting portion projecting from the end surface of the shield portion substantially toward the circuit board.
6. The connector according to claim 1, wherein the signal terminal is a press-fit terminal.
7. The connector according to claim 1, comprising a dielectric between the signal terminal and the shield portion.
8. The connector according to claim 7, wherein: the dielectric includes a projecting portion projecting from the end surface of the shield portion, and the projecting portion is to be at least partly inserted into the positioning hole.
9. The connector according to claim 1, comprising at least one joining portion for holding the plate body on the housing with the conductive portion pressed against the end surface of the shield portion.
10. A board unit, comprising: the connector according to claim 1; and a circuit board.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0032]
[0033]
[0034]
[0035]
[0036]
[0037]
[0038]
[0039]
[0040]
DETAILED DESCRIPTION
[0041] A specific example of at least one embodiment of the present disclosure is described below with reference to the drawings. In figures, the same or similar components are denoted by the same reference signs. Note that the present disclosure is not limited to these illustrations and is intended to be represented by claims and include all changes in the scope of claims and in the meaning and scope of equivalents.
SUMMARY
[0042] With reference to
[0043] As shown in
[0044] As shown in
[0045] In this embodiment, a plurality of terminals 10 including the signal terminals 11 particularly are provided. The plate body 61 particularly is formed with a plurality of positioning holes 62 into which connecting portions 20 of the respective terminals 10 at least partly are to be inserted.
[0046] In the following description, a side where the second end parts 11b of the signal terminals 11 are arranged with respect to the housing 40 is referred to as a rear side and an opposite side thereof is referred to as a front side in the connector 1. That is, the side of the first end parts 11a of the signal terminals 11 is referred to as the front side and the sides of the second end parts 11b is referred to as the rear side. A penetrating direction of the signal terminals 11 through the housing 40 is referred to as a front-rear direction. Further, a side where the circuit board 90 is arranged with respect to the connector 1 is referred to as a lower side, and an opposite side thereof is referred to as an upper side. In a plan view of the connector 11 from above, a direction orthogonal to both the front-rear direction and a vertical direction is referred to as a lateral direction. In figures, “FR” denotes a front side of the connector, “RR” denotes a rear side of the connector, “LH” denotes a left side of the connector, “RH” denotes a right side of the connector, “UP” denotes an upper side of the connector, and “LWR” denotes a lower side of the connector.
[0047] In the connector 1 of the embodiment, the one or more positioning holes 621 are formed in one or more first regions 61a of the plate body 61 in the alignment plate 60 as shown in
[0048] The configuration of the connector 1 is exemplarily described in detail below.
[0049] (Signal Terminals)
[0050] The signal terminal 11 particularly is a terminal for communication to which a communication signal is transmitted. A communication speed is, for example, 100 Mbps or faster. The communication speed may be 1 Gbps or faster and further 2.5 Gbps or faster. In this embodiment, the signal terminal 11 is a terminal for high-speed communication of 1 Gbps or faster.
[0051] As shown in
[0052] The signal terminals 11 are made of a conductive material. The conductive material is preferably a metal having a high conductivity. The material of the signal terminals 11 is, for example, copper, copper alloy, stainless steel or the like.
[0053] An unillustrated plating layer particularly may be provided on the surface of the signal terminal 11. A material of the plating layer is, for example, tin, tin alloy, silver, silver alloy or the like. An underlayer may be provided between the plating layer and the signal terminal 11. A material of the underlayer is, for example, nickel, nickel alloy or the like.
[0054] The signal terminal 11 particularly substantially has a bar-like shape. In this embodiment, as shown in
[0055] (First End Parts, Second End Parts)
[0056] As shown in
[0057] As shown in
[0058] As shown in
[0059] (Connecting Portions)
[0060] As shown in
[0061] (Shield Portions)
[0062] As shown in
[0063] The shield portion 31 has a shielding property of substantially shielding noise particularly leaking from the signal terminals 11. In this embodiment, the shield portion 31 collectively covers around a pair of the signal terminals 11. One shield portion 30 particularly is constituted by the pair of signal terminals 11 and the shield portion 31.
[0064] (Dielectrics)
[0065] In this embodiment, at least one dielectric 35 at least partly is provided between the signal terminals 11 and the shield portion 31 as shown in
[0066] The dielectric 35 particularly is designed to match impedance at a frequency of a communication signal transmitted to the signal terminals 11.
[0067] In this embodiment, the dielectric 35 particularly is filled between the pair of signal terminals 11 and the shield portion 31.
[0068] As shown in
[0069] A projection amount of the projecting portion 35a is, for example, about 0.5 mm. An upper limit of the projection amount of the projecting portion 35a particularly is equal to or less than a depth of the positioning hole 621. The projection amount of the projecting portion 35a is a length projecting from the end surface of the shield portion 31. The projection amount of the projecting portion 35a is substantially equal to a length of the projecting portion 35a to be inserted into the positioning hole 621. A depth of the positioning hole 621 is equal to a thickness of the first region 61a formed with the positioning hole 621, out of the plate body 61. The projection amount of the projecting portion 35a is, for example, about 50% or more and 100% or less of the depth of the positioning hole 621.
[0070] If the dielectric 35 includes the projecting portion 35a, the projecting portion 35a at least partly is to be inserted into the positioning hole 621 with the connecting portions 21 of the signal terminals 11 inserted in the positioning hole 621. By at least partly interposing the projecting portion 35a between the connecting portions 21 and the inner peripheral surface of the positioning hole 621, the contact of the connecting portions 21 and the inner peripheral surface of the positioning hole 621 can be suppressed.
[0071] Since the contact of the connecting portions 21 with the conductive portion 70 in the first region 61a where the positioning hole 621 is formed particularly can be suppressed by the projecting portion 35a, electrical insulation between the connecting portions 21 and the conductive portion 70 is easily ensured.
[0072] If the projection amount of the projecting portion 35a satisfies at least one of about 0.5 mm or more and about 50% or more of the depth of the positioning hole 621, the contact of the connecting portions 21 and the inner peripheral surface of the positioning hole 621 can be effectively suppressed by the projecting portion 35a. That is, electrical insulation between the connecting portions 21 and the conductive portion 70 can be ensured.
[0073] (Ground Terminals)
[0074] As shown in
[0075] The ground terminals 12 are made of a conductive material. The aforementioned material of the signal terminals 11 particularly can be utilized as the material of the ground terminals 12. Similarly to the signal terminals 11, the ground terminals 12 particularly may include a plating layer and an underlayer described above.
[0076] The ground terminal 12 particularly substantially has a rod- or bar-like shape. In this embodiment, the ground terminal 12 is bent at an angle different from 0° or 180°, particularly substantially at 90°, into an L shape as shown in
[0077] (First End Parts, Connecting Portions)
[0078] As shown in
[0079] The connecting portion 22 particularly substantially projects from the end surface of the shield portion 31 toward the circuit board 90 shown in
[0080] In this embodiment, the first end parts 12a of the respective ground terminals 12 particularly are connected to both left and right sides of the shield portion 31. The first end parts 12a are embedded in the shield portion 31. The first end parts 12a do not reach the housing 40.
[0081] In this embodiment, the ground terminal 12 is bent at an angle different from 0° or 180°, particularly substantially at 90°, downward at a longitudinal intermediate part thereof. Specifically, the first end part 12a substantially is along the front-rear direction, and the connecting portion 22a is along the vertical direction.
[0082] The connecting portion 22 particularly is connected to the circuit board 90 through a positioning hole 622 formed in the plate body 61 of the alignment plate 60 shown in
[0083] The number and arrangement of the ground terminals 12 can be appropriately selected. For example, the connecting portions 22 of the ground terminals 12 may be arranged not only on both left and right sides of the connecting portions 21, but also on front and rear sides of the connecting portions 21 to surround the connecting portions 21 of the signal terminals 11.
[0084] (Other Terminals)
[0085] In this embodiment, one or more other terminals 13 particularly are provided as the plurality of terminals 10 besides the signal terminal(s) 11 and the ground terminal(s) 12 as shown in
[0086] Power for operating the circuit board 90 shown in
[0087] Control signals for controlling the circuit board 90 particularly are transmitted to the control terminal(s).
[0088] Out of the plurality of terminals 10, some of the other terminals 13 are not shown in
[0089] The one or more other terminals 13 are configured similarly to the aforementioned signal terminals 11. However, the one or more other terminals 13 particularly differ from the signal terminals 11 in being not covered by the shield portions 31.
[0090] The other terminal 13 includes a first end part to be fixed through the housing 40 and a second end part extending from the first end part toward the circuit board 90 shown in
[0091] The second end part particularly includes a connecting portion 23. The connecting portion 23 is connected to the circuit board 90 through a positioning hole 623 formed in the plate body 61 of the alignment plate 60.
[0092] A tip part of the first end part of the other terminal 13, i.e. a front end part of the terminal 13, particularly is exposed from the housing 40. The front end part of each terminal 13 particularly is electrically connected or connectable to each wire of the corresponding communication cable. For example, if the terminal 13 is the power supply terminal, a power supply wire of the communication cable is electrically connected to the terminal 13. If the terminal 13 is the control terminal, a control wire of the communication cable is electrically connected to the terminal 13.
[0093] The signal terminals 11, the ground terminal(s) 12 and the other terminal(s) 13 may be collectively called the “terminals 10” below. The connecting portion(s) 21 of the signal terminal(s) 11, the connecting portion(s) 22 of the ground terminal(s) 12 and/or the connecting portion(s) 23 of the other terminal(s) 13 may be collectively and merely called “connecting portions 20” below.
[0094] In this embodiment, any of the plurality of terminals 10 including the signal terminals 11 particularly is a press-fit terminal. If the terminal 10 is a press-fit terminal, the connecting portion 20 includes a press-fit portion. The press-fit portion is provided in a part of the connecting portion 20 to be at least partly inserted into a through hole 92h formed in the circuit board 90 as shown in
[0095] The press-fit portion particularly substantially is resiliently deformed by being press-fit into the through hole 92h. By the contact of the press-fit portion with the inner peripheral surface of the through hole 92h, the connecting portion 20 and the through hole 92h are electrically connected. That is, each terminal 10 is electrically connected to the circuit board 90.
[0096] (Housing)
[0097] As shown in
[0098] (Terminal Holding Portion)
[0099] The terminal holding portion 41 is a part for holding the one or more, particularly the plurality of terminals 10. The terminal holding portion 41 particularly substantially has a block shape. In this embodiment, the terminal holding portion 41 has a rectangular parallelepiped shape long in the lateral direction.
[0100] As shown in
[0101] The receptacle 43 particularly projects from or at the front surface of the terminal holding portion 41.
[0102] A connector on the communication cables at least partly is to be fit or inserted into the receptacle 43.
[0103] In
[0104] (Side Wall Portions)
[0105] The one or more side wall portions 45 are provided on a lateral side, particularly on both left and right sides of the terminal holding portion 41. The side wall portions 45 are parts extended laterally (to left and right) from the terminal holding portion 41. The terminal holding portion 41 and the side wall portions 45 particularly are integrally or unitarily molded.
[0106] As shown in
[0107] (Alignment Plate)
[0108] As shown in
[0109] (Plate Body)
[0110] The plate body 61 is to be arranged between the housing 40 and the circuit board 90. Specifically, the plate body 61 is located at intermediate position(s) of path(s) of the terminal(s) 10 from the housing 40 to the circuit board 90.
[0111] In the case of this embodiment, the plate body 61 particularly is arranged behind the terminal holding portion 41. As shown in
[0112] In this embodiment, the plate body 61 particularly is formed with a plurality of positioning holes 62 including the positioning holes 621. Besides the positioning holes 621, the plurality of positioning holes 62 include the one or more positioning holes 622 into which the one or more connecting portions 22 of the respective one or more ground terminals 12 at least partly are inserted or insertable and/or the one or more positioning holes 623 into which the one or more connecting portions 23 of the respective one or more other terminals 13 at least partly are inserted or insertable.
[0113] The plate body 61 particularly substantially has a plate-like shape. In this embodiment, the plate body 61 particularly substantially has a rectangular shape long in the lateral direction. A thickness of the plate body 61 is, for example, about 1 mm or more and/or about 2 mm or less.
[0114] (First Region)
[0115] As shown in
[0116] In this embodiment, a part of the plate body 61 particularly is constituted by the first regions 61a. The plate body 61 includes the first regions 61a and a second region 61b excluding the first regions 61. The second region 61b particularly is a region where the positioning holes 623 are formed.
[0117] In this embodiment, the first region 61a particularly substantially is a rectangular block in a plan view. As shown in
[0118] The plate body 61 particularly is provided with the first regions 61a, the number of which corresponds to the number of the shield modules 30. In this embodiment, three first regions 61a particularly are arranged substantially side by side in the lateral direction. Adjacent ones of the first regions 61a may be linked or may not be linked. In this embodiment, adjacent ones of the first regions 61a are not linked to each other.
[0119] As shown in
[0120] The one or more first regions 61a are to be in contact with the end surface(s) of the shield portion(s) 31 and/or the surface of the circuit board 90. A circuit pattern 92 to be described later particularly is formed on the surface of the circuit board 90.
[0121] (Conductive Portions)
[0122] The first region 61a includes the conductive portion 70. The conductive portion 70 surrounds at least parts of the connecting portion(s) 21 at least partly inserted into the positioning hole 621. The conductive portion 70 has a shielding property of shielding an electromagnetic field particularly leaking from the connecting portions 21. In this embodiment, the entire first region 61a particularly is constituted by the conductive portion 70. That is, the conductive portion 70 is arranged to surround the connecting portions 21 over entire periphery.
[0123] A material of the conductive portion 70 particularly is or comprises conductive rubber and/or conductive resin having conductivity and flexibility. The conductive rubber particularly is a composite material in which a conductive filler (such as metal particles) is dispersed in a rubber material. The conductive resin particularly is a composite material in which a conductive filter is dispersed in a resin material. The rubber material is, for example, natural rubber, synthetic rubber or the like.
[0124] The conductive rubber or conductive resin is softer than metals. The conductive portion 70 formed of or comprising the conductive rubber and/or conductive resin can be resiliently deformed. As shown in
[0125] A hardness of the conductive portion 70 is, for example, about 20 or more and/or about 70 or less. The hardness is a Shore A hardness. If the hardness of the conductive portion 70 is about 20 or more, the excessive deformation of the conductive portion 70 is easily suppressed. If the hardness of the conductive portion 70 is about 70 or less, the resilient deformability of the conductive portion 70 is easily ensured. Thus, the conductive portion 70 is easily held in close contact with each of (the end surface of) the shield portion 31 and the circuit board 90.
[0126] A compression rate of the conductive portion 70 is, for example, about 70% or more and/or about 90% or less. The compression rate of the conductive portion 70 is a percentage of a thickness t1 after compression to a thickness t0 before compression of the conductive portion 70, i.e. [t1/t0]×100. The smaller the value of the compression rate, the larger the compression amount of the conductive portion 70. The larger the value of the compression rate, the smaller the compression amount of the conductive portion 70. If the compression rate of the conductive portion 70 is about 70% or more, it is possible to suppress the generation of an excessive compressive stress in the conductive portion 70. If the compression rate of the conductive portion 70 is about 90% or less, close contact by the compressive deformation of the conductive portion 70 is easily ensured.
[0127] A part of the plate body 61 except the conductive portions 70 is formed of electrically insulating resin. In this embodiment, in the plate body 61 shown in
[0128] (Supporting Portions)
[0129] As shown in
[0130] As shown in
[0131] (Joining Portions)
[0132] In this embodiment, the one or more joining portions 66 are configured to hold the plate body 61 with the first region(s) 61a pressed against the end surfaces of the shield portion(s) 31.
[0133] The joining portion 66 particularly includes an arm portion 66a fixed to the supporting portion 65 and/or a hook-shaped hooking portion 66b on or near the tip of the arm portion 66a. The arm portion 66a substantially extends upward from the upper surface of the supporting portion 65.
[0134] As shown in
[0135] With the connecting portion(s) 21 of the signal terminal(s) 11 at least partly inserted in the positioning hole(s) 621 (
[0136] Further, particularly by stopping the upper surface(s) of the supporting portion(s) 65 in contact with the lower rib(s) 461, an upward movement of the plate body 61 is restricted so that the first region(s) 61a is/are not excessively pressed against the end surfaces of the shield portion(s) 31. In this way, the plate body 61 is positioned in the vertical direction.
[0137] (Circuit Board)
[0138] As shown in
[0139] <Board>
[0140] The board 91 is made of or comprises electrically insulating resin. A material of the board 91 is, for example, a glass epoxy resin.
[0141] <Circuit Pattern>
[0142] The circuit pattern 92 particularly includes a signal circuit 921 and a ground circuit 922. The signal circuit 921 and the ground circuit 922 are provided with one or more through holes 92h. As shown in
[0143] The ground circuit 922 particularly is formed on a surface of the circuit board 90 substantially facing the conductive portion(s) 70. When the connector 1 is connected to the circuit board 90, the conductive portion(s) 70 and the ground circuit 922 are electrically connected by the contact of the conductive portion(s) 70 and the ground circuit 922. Then, the shield portions 31 and the ground circuit 922 are electrically connected via the conductive portion(s) 70.
[0144] Although not shown in this embodiment, various circuits such as a power supply circuit and a control circuit particularly are formed as the circuit pattern 92 besides the signal circuit 921 and the ground circuit 922. Each circuit is provided with one or more through holes.
[0145] I order to effectively shield an electromagnetic field leaking from a signal terminal, there is provided a connector 1 to be connected to a circuit board 90 which includes at least one signal terminal 11, a (particularly substantially tubular) shield portion 31 for at least partly covering an outer periphery of an intermediate part of the signal terminal 11, a housing 40 for holding or positioning the signal terminal 11, and/or at least one alignment plate 60 to be directly or indirectly joined to the housing 40. The signal terminal 11 includes a first end part 11a to be fixed to the housing 40 and a second end part 11b extending from the first end part 11a toward the circuit board 90. The second end part 11b includes a connecting portion 22 projecting from an end surface of the shield portion 31. The alignment plate 60 includes a plate body 61 to be arranged between the housing 40 and the circuit board 90. The plate body 61 has a first region 61a formed with a positioning hole 621 into which the connecting portion 22 is inserted. The first region 61a includes a conductive portion 70 to be at least partly sandwiched between the end surface of the shield portion 31 and the circuit board 90 and configured to at least partially surround the connecting portion 22. The conductive portion 70 particularly is formed of conductive rubber or conductive resin.
Effects
[0146] The connector 1 and the board unit 100 of this embodiment have the following effects.
Main Effects
[0147] The connector 1 and the board unit 100 of this embodiment can effectively shield an electromagnetic field particularly leaking from the signal terminals 11 for the following reason.
[0148] In the connector 1, the plate body 61 of the alignment plate 60 is formed with the one or more positioning holes 621 into which the respective one or more connecting portions 21 of the signal terminal(s) 11 at least partly are inserted. The one or more positioning holes 621 are formed in the one or more first regions 61a of the plate body 61. When the one or more connecting portions 21 of the one or more signal terminals 11 at least partly are inserted into the one or more positioning holes 621, the connecting portion(s) 21 at least partly is/are surrounded by the conductive portion(s) 70 of the first region(s) 61a. Circumferential part(s) of the connecting portion(s) 21 covered by the conductive portion(s) 70 can be shielded.
[0149] Particularly, if the connecting portion(s) 21 is/are surrounded over the substantially entire periphery as in this embodiment, noise leaking particularly from the connecting portion(s) 21 can be suppressed more. Even if the signal terminal(s) 11 particularly is/are terminal(s) for high-speed communication, high shielding performance supporting the Gigabit Ethernet standards can be ensured since the leakage of the noise from the connecting portion(s) 21 can be more effectively shielded.
[0150] If the signal terminal(s) 11 particularly is/are terminals for communication, e.g. below 1 Gbps, the conductive portion(s) 70 particularly may be arranged to partially circumferentially surround the connecting portion(s) 21. In the case of arranging the conductive portion(s) 70 partially around the connecting portion(s) 21, the conductive portion(s) 70 may be arranged around circumferential parts of the connecting portion(s) 21 largely affected by noise leaking from the connecting portion(s) 21.
[0151] In this embodiment, as shown in
[0152] However, if the one or more signal terminals 11 particularly are terminals for high-speed communication of 1 Gbp or faster, particularly 2.5 Gbps or faster, a wavelength of an electromagnetic field leaking from the signal terminal(s) 11 is short. The electromagnetic field having a short wavelength has such a property as to spread around from the parts not surrounded by the conductive portion(s) 70. Therefore, if the one or more signal terminals 11 are terminals for high-speed communication, the connecting portions 21 are preferably surrounded over the entire periphery by the conductive portions 70.
[0153] Using a configuration in which the one or more connecting portions 21 of the signal terminal(s) 11 were surrounded over the entire periphery by the conductive portion(s) 70 as a model, an electric field distribution near the connecting portions 21 was simulated and shielding performance was evaluated. The electric field distribution was analyzed in cases where a frequency of a communication signal transmitted to the signal terminals 11 was 1 Ghz, 2.5 Ghz and 4 Ghz. As a result of the analysis, it was confirmed in any of the cases that the leakage of an electromagnetic field from the connecting portions 21 could be sufficiently suppressed by the conductive portion(s) 70. If the connecting portion(s) 21 particularly are surrounded over the entire periphery by the conductive portion(s) 70, it is thought to be possible to obtain shielding performance based on the Gigabit Ethernet standards, e.g. IEEE802.3ch.
[0154] The one or more conductive portions 70 particularly are formed of or comprise conductive rubber or conductive resin. Thus, the conductive portions 70 are resiliently deformed with the first regions 61a sandwiched between (particularly the end surfaces of) the shield portions 31 and the circuit board 90, whereby the conductive portions 70 are easily held in close contact with both the end surfaces of the shield portions 31 and the circuit board 90. By the close contact of the conductive portion(s) 70 with (the end surfaces of) the shield portions 31 and the circuit board 90, it is possible to suppress the leakage of noise through clearances between the conductive portions 70 and (the end surfaces of) the shield portions 31 and between the conductive portions 70 and the circuit board 90.
[0155] If the end surfaces of the shield portions 31 are directly held in contact with the circuit board 90 unlike this embodiment, the following trouble occurs. The shield portions 31 are made of metal. The shield portions 31 are hardly resiliently deformed. Further, the circuit board 90 may be warped in manufacturing. Thus, even if the end surfaces of the shield portions 31 are held in contact with the circuit board 90, tiny clearances are formed between the end surfaces of the shield portions 31 and the circuit board 90 and noise leaks through these clearances. It is considered to connect the shield portions 31 and the circuit board 90 by soldering to fill up these clearances, but solder connection is necessary.
[0156] In this embodiment, solder connection particularly is unnecessary since the conductive portions 70 are held in close contact with both (particularly the end surfaces of) the shield portions 31 and the circuit board 90 due to the resilient deformation of the conductive portions 70.
[0157] The one or more connecting portions 22 of the one or more ground terminals 12 particularly are arranged side by side with the connecting portion(s) 21 of the signal terminal(s) 11. The leakage of noise from the connecting portion(s) 21 of the signal terminal(s) 11 can be suppressed by the one or more ground terminals 12. In this embodiment, the connecting portions 22 of the ground terminals 12 particularly are arranged on both left and right sides of the connecting portions 21 of the signal terminals 11. The leakage of noise toward both left and right sides from the connecting portions 21 of the signal terminals 11 can be suppressed by the ground terminals 12.
[0158] By the one or more joining portions 66, the plate body 61 can be held on the housing 40 with the first region(s) 61a pressed against (particularly the end surface(s) of) the shield portion(s) 31. It is possible to maintain the state where the conductive portion(s) 70 and (the end surfaces of) the shield portion(s) 31 are held in close contact, suppress the formation of clearances between the conductive portion(s) 70 and (the end surfaces of) the shield portion(s) 31 and effectively suppress noise leaking through the clearances between the conductive portion(s) 70 and (the end surfaces of) the shield portion(s) 31.
Other Effects
[0159] The connector 1 and the board unit 100 of this embodiment particularly can connect the plurality of terminals 10 including the signal terminals 11 and the circuit board 90 without using solder. Since the terminals 10 particularly are press-fit terminals, the connecting portions 20 can be connected only by being press-fit into the through holes 92h of the circuit board 90.
[0160] The plurality of terminals 10 may not be press-fit terminals. In this case, solder connection may be performed after the connecting portions 20 are inserted into the through holes 92h of the circuit board 90.
[0161] From the foregoing, it will be appreciated that various exemplary embodiments of the present disclosure have been described herein for purposes of illustration, and that various modifications may be made without departing from the scope and spirit of the present disclosure. Accordingly, the various exemplary embodiments disclosed herein are not intended to be limiting, with the true scope and spirit being indicated by the following claims.