PLATING DEVICE

Abstract

A plating device includes a plating cell that includes a plating tank and a housing surrounding the plating tank, wherein the plating tank is configured to contain a volume of electrolyte, and wherein a wafer can be immersed within the electrolyte. An electrolyte chamber is below the plating cell and is configured to accommodate discharged electrolyte from the plating cell. A connection part is in fluid communication with the plating cell and the electrolyte chamber so that the electrolyte discharged from the plating cell flows to the electrolyte chamber. A resupply part is configured to resupply the plating tank with electrolyte from the electrolyte chamber. The connection part includes a first pipe through which the electrolyte flows at a first flow rate and a second pipe downstream of the first pipe and through which the electrolyte flows at a second flow rate lower than the first flow rate.

Claims

1. A plating device comprising: a plating cell comprising a plating tank and a housing surrounding the plating tank, wherein the plating tank is configured to contain a volume of electrolyte, and wherein the plating cell is configured such that a wafer can be immersed within the electrolyte in the plating tank; an electrolyte chamber below the plating cell and configured to accommodate electrolyte discharged from the plating cell; a connection part in fluid communication with the plating cell and the electrolyte chamber so that the electrolyte discharged from the plating cell flows to the electrolyte chamber; and a resupply part configured to resupply the plating tank with electrolyte from the electrolyte chamber, wherein the connection part comprises: a first pipe through which the electrolyte flows at a first flow rate; and a second pipe downstream of the first pipe and through which the electrolyte flows at a second flow rate lower than the first flow rate.

2. The plating device of claim 1, wherein the second pipe extends from a lower end portion of the first pipe.

3. The plating device of claim 1, wherein an end portion of the second pipe through which the electrolyte is discharged is immersed in the electrolyte in the electrolyte chamber.

4. The plating device of claim 1, wherein a cross-sectional area of the second pipe is smaller than a cross-sectional area of the first pipe.

5. The plating device of claim 1, wherein the first pipe and the second pipe each have a circular cross-sectional configuration, and wherein a diameter of the second pipe is smaller than a diameter of the first pipe.

6. The plating device of claim 1, wherein a flow rate of the electrolyte through the second pipe is changeable.

7. The plating device of claim 6, wherein the flow rate of the electrolyte through the second pipe changes depending on a level of the electrolyte within the first pipe.

8. The plating device of claim 7, wherein the flow rate of the electrolyte through the second pipe decreases when the level of the electrolyte within the first pipe decreases, and wherein the flow rate of the electrolyte through the second pipe increases when the level of the electrolyte within the first pipe increases.

9. The plating device of claim 1, wherein the second pipe comprises: a movable adjusting member that is configured to change a cross-sectional area of the second pipe; and an elastic member configured to apply a biasing force to the adjusting member to move the adjusting member.

10. The plating device of claim 9, wherein the elastic member is configured to apply the biasing force to the adjusting member in a direction that counters fluid pressure in the second pipe generated by a level of the electrolyte within the first pipe.

11. The plating device of claim 9, wherein the adjusting member comprises a hinge plate that is coupled to a lower end portion of the first pipe and that is rotatable about an axis.

12. The plating device of claim 9, wherein one end portion of the elastic member is coupled to an inner surface of the electrolyte chamber and an opposite end portion of the elastic member is in contact with the adjusting member.

13. The plating device of claim 6, further comprising a control unit coupled to the second pipe, wherein the control unit is configured to electronically control the flow rate of the electrolyte through the second pipe.

14. The plating device of claim 1, wherein a level of the electrolyte within the first pipe is higher than a level of the electrolyte within the electrolyte chamber.

15. The plating device of claim 1, wherein the connection part further comprises a bridge chamber, wherein the bridge chamber is connected to an upstream end portion of the first pipe, and wherein the bridge chamber is configured to store the electrolyte discharged from the plating cell.

16. A plating device comprising: a first plating cell comprising a plating tank and a housing surrounding the plating tank, wherein the plating tank is configured to contain a volume of electrolyte, and wherein the plating cell is configured such that a wafer can be immersed within the electrolyte in the plating tank; a second plating cell at a different level than the first plating cell; an electrolyte chamber below the first plating cell and the second plating cell and configured to accommodate electrolyte discharged from the first plating cell and the second plating cell; a first connection part in fluid communication with the first plating cell and the electrolyte chamber so that the electrolyte discharged from the first plating cell flows to the electrolyte chamber; a second connection part in fluid communication with the second plating cell and the electrolyte chamber so that the electrolyte discharged from the second plating cell flows to the electrolyte chamber; and a resupply part configured to resupply the first plating cell and the second plating cell with electrolyte from the electrolyte chamber, wherein at least one of the first connection part and the second connection part comprises: a first pipe through which the electrolyte flows at a first flow rate; and a second pipe downstream of the first pipe and through which the electrolyte flows at a second flow rate lower than the first flow rate.

17. The plating device of claim 16, wherein the second plating cell is positioned above the first plating cell, and wherein the second connection part comprises the first pipe and the second pipe.

18. The plating device of claim 16, wherein each of the first connection part and the second connection part comprises the first pipe and the second pipe.

19. The plating device of claim 18, wherein the first connection part second pipe and the second connection part second pipe have an identical shape.

20. A plating device comprising: a first plating cell comprising a plating tank and a housing surrounding the plating tank, wherein the plating tank is configured to contain a volume of electrolyte, and wherein the plating cell is configured such that a wafer can be immersed within the electrolyte in the plating tank; a second plating cell at a different level than the first plating cell; an electrolyte chamber below the first plating cell and the second plating cell and configured to accommodate electrolyte discharged from the first plating cell and the second plating cell; a first connection part in fluid communication with the first plating cell and the electrolyte chamber so that the electrolyte discharged from the first plating cell flows to the electrolyte chamber; a second connection part in fluid communication with the second plating cell and the electrolyte chamber so that the electrolyte discharged from the second plating cell flows to the electrolyte chamber; and a resupply part configured to resupply the first plating cell and the second plating cell with electrolyte from the electrolyte chamber, wherein at least one of the first connection part and the second connection part comprises: a first pipe through which the electrolyte flows at a first flow rate; and a second pipe downstream of the first pipe and through which the electrolyte flows at a second flow rate lower than the first flow rate, and wherein the first pipe and the second pipe are oriented in a same direction, wherein the second pipe extends from a lower end portion of the first pipe, wherein an end portion of the second pipe from which the electrolyte is discharged is immersed in the electrolyte in the electrolyte chamber, and wherein a cross-sectional area of the second pipe is smaller than a cross-sectional area of the first pipe.

Description

BRIEF DESCRIPTION OF THE FIGURES

[0012] These and/or other aspects, features, and advantages of the invention will become apparent and more readily appreciated from the following description of example embodiments, taken in conjunction with the accompanying drawings of which:

[0013] FIG. 1 is a perspective view schematically illustrating a form of a plating device according to a first example embodiment of the present disclosure;

[0014] FIG. 2 is a diagram illustrating a flow of an electrolyte of the plating device according to the first example embodiment of the present disclosure;

[0015] FIG. 3 is a schematic diagram illustrating an arrangement structure of a first pipe, a second pipe, and an electrolyte chamber of a plating device according to a first-first example embodiment of the present disclosure;

[0016] FIG. 4 is a diagram illustrating forms of the first pipe and the second pipe which are formed in the form of a circular pipe;

[0017] FIG. 5 is a perspective view illustrating the form of the second pipe of the plating device according to the first-first example embodiment of the present disclosure;

[0018] FIG. 6 is a schematic diagram illustrating a structure of a first pipe, a second pipe, and an electrolyte chamber of a plating device according to a first-second example embodiment of the present disclosure;

[0019] FIG. 7 is a schematic diagram illustrating an arrangement structure of the first pipe, the second pipe, and the electrolyte chamber when a level of an electrolyte of the first pipe is lower;

[0020] FIG. 8 is a schematic diagram illustrating a structure of the first pipe, the second pipe, and the electrolyte chamber when the second pipe is closed;

[0021] FIG. 9 is a schematic diagram illustrating a structure of the first pipe, the second pipe, and the electrolyte chamber of the plating device according to the first-second example embodiment of the present disclosure, in which an adjusting member is formed in the form of a spherical valve;

[0022] FIG. 10 is a schematic diagram illustrating a structure of the first pipe, the second pipe, and the electrolyte chamber when the second pipe is closed based on a level of an electrolyte of the first pipe;

[0023] FIG. 11 is a schematic diagram illustrating a structure of a first pipe, a second pipe, and an electrolyte chamber of a plating device according to a first-third example embodiment of the present disclosure;

[0024] FIG. 12 is a schematic diagram illustrating an arrangement structure of the first pipe, the second pipe, and the electrolyte chamber when a level of an electrolyte of the first pipe is lower;

[0025] FIG. 13 is a perspective view schematically illustrating a form of a plating device according to a second example embodiment of the present disclosure; and

[0026] FIG. 14 is a structural diagram illustrating a flow of an electrolyte of the plating device according to the second example embodiment of the present disclosure.

DETAILED DESCRIPTION

[0027] Hereinafter, example embodiments will be described in detail with reference to the accompanying drawings. The following description is one of various aspects of example embodiments, and the following description constitutes part of the detailed description of example embodiments. In describing an example embodiment, a specific description of a known function or configuration will be omitted to clarify the gist of the present disclosure.

[0028] The words and terminologies used in the specification and claims are not to be construed as limited to common or dictionary meanings but construed as meanings and conceptions coinciding with the technical spirit of the present disclosure under a principle that the inventor(s) may appropriately define the conception of the terminologies to explain the disclosure in the optimum manner. Therefore, the example embodiments described in the specification and the configurations illustrated in the drawings are no more than the most preferred example embodiments of the present disclosure and do not fully cover the spirit of the present disclosure. Accordingly, it should be understood that there may be various equivalents and modifications that may replace those when this application is filed.

[0029] Like reference numerals or letters in each drawing attached to the specification may refer to components or elements performing substantially like functions. For convenience of description and understanding, the same reference numeral or letter may be used for description in different example embodiments. In other words, even though elements with the same reference numeral are illustrated in a plurality of drawings, all of the plurality of drawings may not represent a single example embodiment.

[0030] In the following description, a singular expression includes a plural expression unless apparently otherwise defined by context. It should be understood that terms such as comprise or include and consist of are intended to indicate the presence of a feature, a number, a step, an operation, an element, a component, or a combination thereof which are described in the specification and not intended to previously exclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof.

[0031] In addition, expressions such as upper side, upper portion, above, lower side, lower portion, below, side surface, front surface, and rear surface hereinafter are represented based on a direction illustrated in a drawing and may be represented otherwise when the direction of a corresponding object changes.

[0032] Further, in describing elements of example embodiments, terms such as first, second, A, B, (a), (b), and the like may be used. Such a term is used merely for distinguishing one element from other elements, and the essence, sequence, or order of the corresponding element is not limited by the term. When it is described that an element is coupled, combined, or connected to or with another element, it should be understood that the element may be directly coupled or connected to another element, or other elements may be coupled, combined,or connected between each element.

[0033] An element included in one example embodiment and another element including a common function will be described using an identical designation in other example embodiments. Unless otherwise stated, a description in one example embodiment may be applied to other example embodiments, and specific descriptions within a duplicate scope will be omitted.

[0034] FIG. 1 is a perspective view schematically illustrating a form of a plating device according to a first example embodiment of the present disclosure. FIG. 2 is a diagram illustrating a flow of an electrolyte P of the plating device according to the first example embodiment of the present disclosure. Elements of FIGS. 1 and 2 are illustrated for convenience of description and clarity of understanding, and the size and shape of the elements and a ratio between the elements are examples.

[0035] Referring to FIGS. 1 and 2, the plating device according to the first example embodiment of the present disclosure may include a plating cell 10, an electrolyte chamber 20, a connection part 30, and a resupply part 40.

[0036] According to an example embodiment, plating a wafer (not shown) may be performed in the plating cell 10. The plating cell 10 may function as a space where the wafer is plated, and thus, may be formed to provide an electrolyte bath in which the wafer may be immersed in an electrolyte.

[0037] According to an example embodiment, the plating cell 10 may be formed in a plural number. When being formed in the plural number, the plating cell 10 may plate a plurality of wafers simultaneously, and thus a speed of processing plating may be improved. For example, a pair of plating cells 10 may be disposed to be spaced apart in a horizontal direction but is not limited thereto. The pair of plating cells 10 spaced apart in the horizontal direction may be set under an identical plating condition. The plurality of plating cells 10 may have a form of being seated and supported on a cell frame 15 supporting these plating cells.

[0038] According to an example embodiment, the plating cell 10 may include a plating tank 11 and a housing 12.

[0039] According to an example embodiment, the plating tank 11 may be the electrolyte bath accommodating the electrolyte so that the wafer may be immersed in the electrolyte that is maintained at a predetermined depth and may include a weir wall for confining the electrolyte. The housing 12 may surround and support the plating tank 11 and form an overall frame of the plating cell 10. For example, the plating tank 11 may have a form in which an upper portion thereof is opened, and the wafer may be immersed through an upper opening of the plating tank 11. The wafer for which plating through the electrolyte is completed may exit through the upper opening of the plating tank 11.

[0040] According to an example embodiment, a predetermined space may be formed between the plating tank 11 and the housing 12. For example, the plating tank 11 may be arranged in the form of a circular bath, and the housing 12 may be spaced apart from the plating tank 11 by a predetermined distance and have a form surrounding the plating tank 11. The electrolyte may be continuously supplied from the resupply part 40 to the plating tank 11, and the electrolyte overflowing from the plating tank 11 may be accommodated in the space between the plating tank 11 and the housing 12.

[0041] According to an example embodiment, the plating cell 10 may further include a discharge pipe 16. The discharge pipe 16 may convey the electrolyte P discharged from the plating cell 10 to the connection part 30. For example, the discharge pipe 16 may be connected to a bottom surface of the housing 12 of the plating cell 10. The discharge pipe 16 may discharge the electrolyte overflowing from the plating tank 11 and being accommodated in the space between the plating tank 11 and the housing 12 to the connection part 30. The discharge pipe 16 may be disposed to extend in a vertical direction. In this case, one end portion of the discharge pipe 16 may be coupled to the bottom surface of the housing 12 and in communication with the space between the plating tank 11 and the housing 12, and another end portion may be coupled to the connection part 30 and in communication with the connection part 30. The another end portion of the discharge pipe 16 may be coupled to a bridge chamber 33 of the connection part 30. The discharge pipe 16 may be formed in a plural number corresponding to the number of the plurality of plating cells 10. For example, one discharge pipe 16 may be connected to one plating cell 10.

[0042] According to an example embodiment, the electrolyte chamber 20 may store the electrolyte discharged from the plating cell 10. The electrolyte discharged after plating the wafer is performed in the plating cell 10 may be stored in the electrolyte chamber 20 to be reused or processed. The electrolyte stored in the electrolyte chamber 20 may be resupplied to the plating cell 10 through the resupply part 40 or may be discharged to the outside.

[0043] According to an example embodiment, a storage space in which the electrolyte may be stored may be provided within the electrolyte chamber 20. The electrolyte chamber 20 may have a cuboidal or cylindrical shape in general, but the electrolyte chamber 20 may have any shapes provided with an accommodation space for storing the electrolyte and is not particularly limited.

[0044] According to an example embodiment, since the electrolyte stored in the electrolyte chamber 20 is in a chemically highly activated state, the electrolyte chamber 20 may be formed of a material with high corrosion resistance. For example, the electrolyte chamber 20 may be formed to include a chemical-resistant plastic material such as polypropylene (PP), polyvinyl chloride (PVC), or polytetrafluoroethylene (PTFE). A capacity of an internal space of the electrolyte chamber 20 may be formed suitably based on the type and number of a processed wafer and a plating tank.

[0045] According to an example embodiment, the connection part 30 and the resupply part 40 may be connected to the electrolyte chamber 20. The electrolyte chamber 20 may receive and store the electrolyte supplied from the connection part 30 and discharge the stored electrolyte through the resupply part 40. The electrolyte accommodated in the storage space of the electrolyte chamber 20 may have a predetermined level (water level), and an upper portion of the stored electrolyte may be in a state where a void is formed and air is present.

[0046] According to an example embodiment, the electrolyte chamber 20 may be disposed below the plating cell 10 based on the vertical direction. The electrolyte chamber 20 may be connected to the plating cell 10 above through the connection part 30, and the electrolyte may pass through the connection part 30 from the plating cell 10 and flow into the electrolyte chamber 20 due to gravity without separate power.

[0047] According to an example embodiment, the connection part 30 may guide the electrolyte from the plating cell 10 to the electrolyte chamber 20 so that the electrolyte discharged from the plating cell 10 may be stored in the electrolyte chamber 20. The connection part 30 may have a form extending from the plating cell 10 to the electrolyte chamber 20. The connection part 30 may enable communication between an internal space of the plating cell 10 and the internal space of the electrolyte chamber 20. The connection part 30 may be connected to the electrolyte chamber 20 in a form extending from an upper side of the electrolyte chamber 20 to the internal space of the electrolyte chamber 20.

[0048] According to an example embodiment, the connection part 30 may include a first pipe 31 and a second pipe 32. The connection part 30 may further include the bridge chamber 33.

[0049] According to an example embodiment, the bridge chamber 33 may provide a space in which the electrolyte discharged from the plating cell 10 is primarily accommodated. The bridge chamber 33 may be connected to the discharge pipe 16 through which the electrolyte is discharged from the plating cell 10. The discharge pipe 16 may be coupled to an upper side of the bridge chamber 33 and may enable communication between the plating cell 10 and the bridge chamber 33.

[0050] According to an example embodiment, the bridge chamber 33 may, for example, have a form extending in the horizontal direction at a predetermined length and width, and the electrolyte may be accommodated at a predetermined level within the bridge chamber 33. The first pipe 31 may be coupled to an end portion of a side of the bridge chamber 33, and thus the electrolyte within the bridge chamber 33 may flow into the first pipe 31.

[0051] According to an example embodiment, the first pipe 31 and the second pipe 32 may be formed to guide the electrolyte to the electrolyte chamber 20. The first pipe 31 and the second pipe 32 may have a form extending in the vertical direction. The second pipe 32 may be disposed downstream of the first pipe 31 based on a flow direction of the electrolyte. For example, the second pipe 32 may be disposed below the first pipe 31 based on the vertical direction which is the flow direction of the electrolyte. The second pipe 32 may extend from a lower end portion of the first pipe 31.

[0052] According to an example embodiment, the first pipe 31 and the second pipe 32 may, for example, have the form of a circular pipe which is generally adopted as the shape of a pipe. Each pipe may be formed to include a corrosion-resistant material such as polyvinyl chloride (PVC) and polypropylene (PP), similar to the electrolyte chamber 20.

[0053] According to an example embodiment, the first pipe 31 may be formed in a form penetrating an upper cover of the electrolyte chamber 20. Therefore, the first pipe 31 may have a form in which a portion thereof is positioned outside the electrolyte chamber 20 and another portion thereof is positioned inside the electrolyte chamber 20.

[0054] According to an example embodiment, the second pipe 32 may be formed in a form connected to a lower portion of the first pipe 31 but may have a different flow rate from the first pipe 31.

[0055] According to an example embodiment, a flow rate is a quantified element of a velocity and an amount of an electrolyte moving through a pipe and refers to a rate at which a volume of fluid flows within a predetermined time period. Generally, the flow rate may be measured in units of liters per minute (L/min) or gallons per minute (GPM). The flow rate may be calculated as a product of a cross-sectional area of a pipe through which a fluid flows and a flow velocity of the fluid, and therefore, the flow rate may be higher as the cross-sectional area of the pipe is larger.

[0056] According to an example embodiment, when a flow rate of an electrolyte within a pipe is excessively high, the electrolyte may flow in a turbulent flow state and bubbles may be generated within the pipe, and in contrast, when a flow rate of an electrolyte flowing through a pipe is excessively low, a fluid may settle and impurities may accumulate. Therefore, the first pipe 31 and the second pipe 32 of the plating device according to the first example embodiment of the present disclosure may be formed to have a suitable flow rate based on a concentration of the electrolyte and a form of the pipe. For example, the electrolyte may flow at a first flow rate through the first pipe 31, and the electrolyte may flow at a second flow rate through the second pipe 32.

[0057] Here, the first flow rate and the second flow rate may be set according to the need based on the above description but may be a numerical value having a predetermined range rather than a specified one numerical value and also a concept for representing a relative difference in flow velocity.

[0058] According to an example embodiment, the second flow rate of the second pipe 32 may be lower than the first flow rate of the first pipe 31. By adopting this configuration, bubble generation in the electrolyte chamber 20 may be prevented, which is described below with reference to FIGS. 5 to 7 in detail.

[0059] According to an example embodiment, the resupply part 40 may be formed to resupply the electrolyte stored in the electrolyte chamber 20 back to the plating cell 10. The resupply part 40 may include a filter 41, a pump 42, and a resupply pipe 43.

[0060] According to an example embodiment, the resupply pipe 43 may have a form of a pipeline extending from the electrolyte chamber 20 to the plating cell 10 and may likewise be formed of a corrosion-resistant material. The pump 42 may provide power and form hydraulic pressure so that the electrolyte flowing inside the resupply pipe 43 may move against gravity, and the filter 41 may remove impurities such as a fine particle, a bubble, and a metallic residue in the electrolyte.

[0061] FIG. 3 is a schematic diagram illustrating an arrangement structure of the first pipe 31, a second pipe 32a, and the electrolyte chamber 20 of a plating device according to a first-first example embodiment of the present disclosure. FIG. 4 is a diagram illustrating forms of the first pipe 31 and the second pipe 32a which are formed in the form of a circular pipe. FIG. 5 is a perspective view illustrating the form of the second pipe 32a of the plating device according to the first-first example embodiment of the present disclosure.

[0062] Referring to FIGS. 3 to 5, the second pipe 32a of the plating device according to the first-first example embodiment of the present disclosure may extend from a lower end portion of the first pipe 31. The electrolyte may flow at a first flow rate through the first pipe 31, and the electrolyte may flow at a second flow rate lower than the first flow rate through the second pipe 32a. The electrolyte may flow vertically downwards due to gravity. The second pipe 32a may have a cross-sectional area smaller than a cross-sectional area of the first pipe 31. In this case, the second flow rate of the second pipe 32a being lower than the first flow rate of the first pipe 31 may result from a shape characteristic of the cross-sectional area of the second pipe 32a being smaller than the cross-sectional area of the first pipe 31.

[0063] According to an example embodiment, each of the first pipe 31 and the second pipe 32a may have the form of a circular pipe. A diameter D2 of the second pipe 32a may be formed as smaller than a diameter D1 of the first pipe 31 and thus the cross-sectional area of the second pipe 32a may be smaller than the cross-sectional area of the first pipe 31. The second pipe 32a may extend from the lower end portion of the first pipe 31, but a central axis of the second pipe 32a and a central axis of the first pipe 31 may match in the vertical direction.

[0064] According to an example embodiment, a lower end portion of the second pipe 32a may be positioned below a level of the electrolyte within the electrolyte chamber 20. In other words, an end portion of the second pipe 32a may be in a state immersed in the electrolyte. By adopting this configuration, even though a bubble 25 is present on a surface of the electrolyte accommodated in the first pipe 31, the bubble 25 may not flow into the electrolyte stored in the electrolyte chamber 20. For example, an entire portion of the second pipe 32a may be in a state immersed in the electrolyte and positioned below the level of the electrolyte within the electrolyte chamber 20.

[0065] While the plating device according to the first-first example embodiment of the present disclosure is operated, a flow of the electrolyte from the first pipe 31 to the second pipe 32a may be maintained continuously. In this case, as the second flow rate of the second pipe 32a has a smaller value than the first flow rate of the first pipe 31, a level of the electrolyte within the first pipe 31 may be maintained higher than the level of the electrolyte stored in the electrolyte chamber 20. In other words, since the second flow rate of the second pipe 32a is low, a flow velocity of the electrolyte of the first flow rate within the first pipe may be faster than a discharge speed of the electrolyte from the lower end portion of the second pipe 32a, which is immersed in the electrolyte, and thus, the level of the electrolyte within the first pipe may be maintained in a state rising higher than the level of the electrolyte in the electrolyte chamber 20. By adopting this configuration, the bubble 25 may stay at an upper portion of the first pipe 31, and the possibility that the bubble 25 flows into the electrolyte chamber 20 may be further reduced.

[0066] FIG. 6 is a schematic diagram illustrating a structure of the first pipe 31, a second pipe 32b, and the electrolyte chamber 20 of a plating device according to a first-second example embodiment of the present disclosure. FIG. 7 is a schematic diagram illustrating an arrangement structure of the first pipe 31, the second pipe 32b, and the electrolyte chamber 20 when a level of an electrolyte of the first pipe 31 is lower. FIG. 8 is a schematic diagram illustrating a structure of the first pipe 31, the second pipe 32b, and the electrolyte chamber 20 when the second pipe 32b is closed.

[0067] Referring to FIGS. 6 to 8, in the plating device according to the first-second example embodiment of the present disclosure, a flow rate of the second pipe 32b may change. The flow rate of the second pipe 32b may change as a cross-sectional area of the second pipe 32b mechanically changes. In this case, the flow rate of the second pipe 32b may change depending on a level of an electrolyte within the first pipe 31. Specifically, when the level of the electrolyte within the first pipe 31 becomes lower, the flow rate of the second pipe 32b may decrease. In contrast, when the level of the electrolyte within the first pipe 31 becomes higher, the flow rate of the second pipe 32b may increase.

[0068] To achieve this technical feature, the second pipe 32b of the plating device according to the first-second example embodiment of the present disclosure may include an adjusting member 36 and an elastic member 35. The adjusting member 36 may be formed to be movable, and the flow rate of the second pipe 32b may change as the adjusting member 36 moves. For example, as the adjusting member 36 moves, the cross-sectional area of the second pipe 32b may change and the flow rate of the second pipe 32b may change.

[0069] According to an example embodiment, the elastic member 35 may pressurize the adjusting member 36 and move the adjusting member 36. The elastic member 35 may pressurize the adjusting member 36 using elastic force. The elastic member 35 may be formed to include, for example, a plurality of compression springs and each of the plurality of springs may have different elastic moduli in some cases. The elastic member 35 may pressurize the adjusting member 36 in a direction a2 resisting a water pressure a1 generated due to the level of the electrolyte within the first pipe 31. For this, an end portion of the elastic member 35 may be coupled to an inner surface of the electrolyte chamber 20 and supported. In this case, another end portion of the elastic member 35 may be in contact with the adjusting member 36 and pressurize the adjusting member 36. For example, the elastic member 35 may pressurize the adjusting member 36 in a vertically upward direction resisting the water pressure generated due to the level of the electrolyte within the first pipe 31.

[0070] According to an example embodiment, the adjusting member 36 may be coupled to a lower end portion of the first pipe 31. The adjusting member 36 may be formed in the form of a hinge plate coupled to the lower end portion of the first pipe 31 and be flapped like a hinge based on an axis 37. Depending on the rotational movement of the adjusting member 36, the cross-sectional area of the second pipe 32b may change. When the adjusting member 36 rotates and moves upwards, the cross-sectional area of the second pipe 32b may decrease, and when the adjusting member 36 rotates and moves downwards, the cross-sectional area of the second pipe 32b may increase. As the cross-sectional area of the second pipe 32b increases/decreases, the flow rate of the second pipe 32b may change proportionally.

[0071] In this case, the elastic member 35 may be formed to include the plurality of springs pressurizing the adjusting member 36 with each different elastic modulus, which have a form in contact with a lower surface of the adjusting member 36 in parallel to rotate the adjusting member 36.

[0072] According to an example embodiment, when the level of the electrolyte within the first pipe 31 is maintained relatively high (h1), the adjusting member 36 may be maintained in a state rotated downwards by a predetermined angle by the water pressure a1 generated due thereto, and a cross-sectional area 38 of the second pipe 32b may be maintained in a state increased proportionally thereto (see FIG. 6).

[0073] According to an example embodiment, when the level of the electrolyte within the first pipe 31 becomes low (h2), the water pressure a1 generated due thereto may also decrease, and the adjusting member 36 may be rotated upwards by a predetermined angle, and accordingly, the cross-sectional area 38 of the second pipe 32b may decrease (see FIG. 7).

[0074] According to an example embodiment, when the water pressure a1 generated due to the level of the electrolyte within the first pipe 31 may not exceed pressurizing force of the elastic member 35 pressurizing the adjusting member 36, the adjusting member 36 may be closed to be a form blocking an end portion of the first pipe 31, and in this case, the second pipe 32b may be maintained in a closed state (see FIG. 8).

[0075] As above, a technical feature in which the flow rate of the second pipe 32b may decrease when the level of the electrolyte within the first pipe 31 becomes low and the flow rate of the second pipe 32b may increase when the level of the electrolyte within the first pipe 31 becomes higher may be achieved through a simple mechanical configuration.

[0076] FIG. 9 is a schematic diagram illustrating a structure of the first pipe 31, the second pipe 32b, and the electrolyte chamber 20 of the plating device according to the first-second example embodiment of the present disclosure, in which the adjusting member 36 is formed in the form of a spherical valve. FIG. 10 is a schematic diagram illustrating a structure of the first pipe 31, the second pipe 32b, and the electrolyte chamber 20 when the second pipe 32b is closed based on a level of an electrolyte of the first pipe 31.

[0077] Referring to FIGS. 9 and 10, the adjusting member 36 may be formed in the form of a spherical valve, and in this case, the elastic member 35 may be formed in the form of a single spring pressurizing the adjusting member 36 in the form of the spherical valve from below. An end portion of the elastic member 35 may be supported by an inner surface of the electrolyte chamber 20, and another end portion of the elastic member 35 may be in contact with the adjusting member 36 and pressurize the adjusting member 36. In this case, a discharge end portion 381 of the second pipe 32b may have a structure formed toward a lateral direction but is not limited thereto.

[0078] Similarly, according to an example embodiment, the elastic member 35 may pressurize the adjusting member 36 in a direction resisting water pressure based on a level of an electrolyte within the first pipe 31, which may be a vertically upward direction. The adjusting member 36 may move upwards and downwards due to pressurizing force by the elastic member 35 and the water pressure based on the level of the electrolyte within the first pipe 31, and in this process, a cross-sectional area of a space 371 between the adjusting member 36 and a lower end portion 39 of the first pipe 31 may change. Accordingly, a flow rate of the second pipe 32b may change.

[0079] According to an example embodiment, when the level of the electrolyte within the first pipe 31 is maintained at a predetermined level or higher, the adjusting member 36 may be pressurized downwards and the space 371 between the adjusting member 36 and the lower end portion 39 of the first pipe 31 may be maintained to be wide, and thus the electrolyte may flow smoothly to the discharge end portion 381 through the space 371 (see FIG. 9).

[0080] In contrast, when the level of the electrolyte within the first pipe 31 decreases, the adjusting member 36 may be pressurized upwards by the elastic member 35 and the adjusting member 36 may block a lower end portion of the first pipe 31, and thus a case in which the second pipe 32b itself is closed may also occur (see FIG. 10).

[0081] FIG. 11 is a schematic diagram illustrating a structure of the first pipe 31, a second pipe 32c, and the electrolyte chamber 20 of a plating device according to a first-third example embodiment of the present disclosure. FIG. 12 is a schematic diagram illustrating an arrangement structure of the first pipe 31, the second pipe 32c, and the electrolyte chamber 20 when a level of an electrolyte of the first pipe 31 is lower. The form of a control unit 50 and the form of the second pipe 32c changed depending thereon illustrated in FIGS. 11 and 12 are examples, and the control of the second pipe 32c by the control unit 50 may include other various aspects as described below.

[0082] Referring to FIGS. 11 and 12, in the plating device according to the first-third example embodiment of the present disclosure, a flow rate of the second pipe 32c may also change, similarly to the above example embodiment.

[0083] To implement this, the plating device according to the first-third example embodiment of the present disclosure may further include the control unit 50 coupled to the second pipe 32c to electronically control the flow rate of the second pipe 32c.

[0084] According to an example embodiment, the control unit 50 may be an electrically controlled valve that receives electrical signals to be opened and closed. For example, the control unit 50 may be a motorized valve that adjusts an opening angle of the second pipe 32c using an electric motor. In this case, by adjusting the opening angle of the second pipe 32c coupled to a lower end portion of the first pipe 31, the flow rate of the second pipe 32c may be controlled. In this case, the second pipe 32c may include a plurality of control plates 325 formed in such a manner that opening angles thereof are controlled by the control unit 50.

[0085] According to an example embodiment, when a level of an electrolyte within the first pipe 31 is maintained at a predetermined level or higher, the control unit 50 may drive the control plates 325 of the second pipe 32c to rotate in an opening direction, and thus the flow rate of the second pipe 32c may increase (see FIG. 11).

[0086] In contrast, when the level of the electrolyte within the first pipe 31 decreases, the control unit 50 may drive the control plates 325 of the second pipe 32c to rotate in a closing direction (inward), and thus the flow rate of the second pipe 32c may decrease (see FIG. 12).

[0087] In some embodiments, the control unit 50 may include a solenoid valve that controls opening and closing a valve using electromagnetic force or a piezo valve with a manner of opening and closing a valve finely as a piezoelectric material moves based on electrical signals but is not limited thereto.

[0088] FIG. 13 is a perspective view schematically illustrating a form of a plating device according to a second example embodiment of the present disclosure. FIG. 14 is a structural diagram illustrating a flow of an electrolyte of the plating device according to the second example embodiment of the present disclosure. Elements of FIGS. 13 and 14 are illustrated for convenience of description and clarity of understanding, and the size and shape of the elements and a ratio between the elements are examples.

[0089] The plating device according to the second example embodiment of the present disclosure may be different from the above example embodiments in that a plurality of plating cells (a first plating cell and a second plating cell) are arranged in the vertical direction, and excluding this, the descriptions of the elements regarding the plating device in the above example embodiments may also be applied to this example embodiment. Therefore, a common description will be omitted and a difference is mainly described hereinafter.

[0090] Referring to FIGS. 13 and 14, the plating device according to the second example embodiment of the present disclosure may include a plating cell 210, an electrolyte chamber 220, a connection part 230, and a resupply part 240.

[0091] According to another example embodiment, the plating cell 210 may include a first plating cell 211 and a second plating cell 212. The second plating cell 212 may be disposed to be spaced apart from the first plating cell 211 in the vertical direction. The second plating cell 212 may be disposed above the first plating cell 211. Accordingly, the second plating cell 212 may be placed to be spaced further apart from the electrolyte chamber 220 in the vertical direction than the first plating cell 211.

[0092] According to another example embodiment, the connection part 230 may include a first connection part 231 and a second connection part 232. The first connection part 231 may connect the first plating cell 211 and the electrolyte chamber 220 (i.e., the first connection part 231 is in fluid communication with the first plating cell 211 and the electrolyte chamber 220). The second connection part 232 may connect the second plating cell 212 and the electrolyte chamber 220 (i.e., the second connection part 232 is in fluid communication with the second plating cell 212 and the electrolyte chamber 220). The first connection part 231 and the second connection part 232 may extend from the first plating cell 211 and the second plating cell 212, respectively, to the electrolyte chamber 220, and accordingly, the second connection part 232 may be formed to have a longer vertical movement path of an electrolyte than the first connection part 231.

[0093] According to another example embodiment, a lower end portion of the first connection part 231 and a lower end portion of the second connection part 232 may be positioned within the electrolyte chamber 220.

[0094] According to another example embodiment, the resupply part 240 may include a filter 241, a pump 242, and a resupply pipe 243.

[0095] In the plating device according to the second example embodiment of the present disclosure, the first pipe and the second pipe described above may be disposed in at least one of the first connection part 231 and the second connection part 232. For example, the first pipe and the second pipe may be provided in the second connection part 232 which has the longer vertical movement path of the electrolyte. For another example, the first pipe and the second pipe described above may be provided in both the first connection part 231 and the second connection part 232. In addition, the second pipe formed in each of the first connection part 231 and the second connection part 232 may be arranged to have an identical size and shape, which thus may ensure fairness and efficiency.

[0096] Example embodiments are described above by particular elements such as specific components and the example embodiments and drawings but are provided in order to help overall understanding. In addition, the present disclosure is not limited to the above-described example embodiments, and those of ordinary skill in the art to which the present disclosure pertains may perform various modifications and variations from the above description. Therefore, the scope of the present disclosure should not be determined as limited to the above-described example embodiments, and the claims described later and the equivalents thereof or modifications equivalent thereto all fall within the scope of the present disclosure.