HEAT EXCHANGER WITH AERODYNAMIC INEFFICIENCIES FOR INCREASED CRYOCOOLING EFFICIENCY

Abstract

A heat exchanger includes a dividing structure configured to define, at least in part, a first volume and a second volume. The dividing structure is configured to permit a flow of a working fluid from the first volume to the second volume and configured to control a ratio of an upstream pressure in the first volume to a downstream pressure in the second volume by inducing an aerodynamic resistance in a flow of the working fluid between the first volume and the second volume. In certain embodiments, the flow of the working fluid between the first volume and the second volume is along a return flow path defined at least in part by the dividing structure, and the return flow path is a tortuous path or a convoluted path.

Claims

1. A heat exchanger comprising: a dividing structure configured to define, at least in part, a first volume and a second volume, the dividing structure configured to permit a flow of a working fluid from the first volume to the second volume and configured to control a ratio of an upstream pressure in the first volume to a downstream pressure in the second volume by inducing an aerodynamic resistance in the flow of the working fluid between the first volume and the second volume.

2. The heat exchanger of claim 1, wherein the flow of the working fluid between the first volume and the second volume is along a return flow path defined at least in part by the dividing structure, and the return flow path is a tortuous path or a convoluted path.

3. The heat exchanger of claim 2, wherein the tortuous path or the convoluted path of the return flow path comprises a plurality of direction changes.

4. The heat exchanger of claim 1, wherein the flow of the working fluid between the first volume and the second volume is along a return flow path defined at least in part by the dividing structure and the dividing structure comprises structure elements configured to cause the return flow path to change direction a plurality of times.

5. The heat exchanger of claim 4, wherein a cross-sectional area of the return flow path is substantially uniform along a length of the return flow path.

6. The heat exchanger of claim 1, wherein the dividing structure comprises a plurality of structure elements that at least partially define a plurality of path portions between the first volume and the second volume, each path portion of the plurality of path portions being in fluid communication with one of the first volume or a preceding path portion and in fluid communication with one of a subsequent path portion or the second volume via respective orifices defined at least in part by the dividing structure.

7. The heat exchanger of claim 1, further comprising an outer housing and wherein the dividing structure is disposed within the outer housing.

8. The heat exchanger of claim 7, wherein the outer housing comprises an exchange surface disposed at a first end of the outer housing and the exchange surface partially defines the first volume.

9. The heat exchanger of claim 8, further comprising a working fluid source disposed at a second end of the outer housing, the second end being opposite the first end.

10. The heat exchanger of claim 1, wherein the working fluid is cryogenic helium.

11. The heat exchanger of claim 1, wherein the dividing structure is formed of oxygen free copper.

12. The heat exchanger of claim 1, wherein the dividing structure is further configured to prevent a Joule-Thomson coefficient from remaining less than zero in the second volume.

13. The heat exchanger of claim 1, wherein the dividing structure comprises a plurality of protrusions that extend out from a core of the dividing structure and the plurality of protrusions are configured to cause the flow of the working fluid between the first volume and the second volume to be a turbulent flow.

14. The heat exchanger of claim 1, wherein cryogenic expansion is isolated to a non-thermally conductive portion of the heat exchanger.

15. The heat exchanger of claim 1, wherein the dividing structure comprises a plurality of annular plates that are spaced apart from one another and concentrically aligned along a central axis, each annular plate of the plurality of annular plates has a notch formed therein, the notch configured to permit the working fluid to flow therethrough, and the notch of a selected annular plate of the plurality of annular plates is not aligned with at least one of an immediately previous annular plate of the plurality of annular plates or an immediately subsequent annular plot of the plurality of annular plates.

16. A system comprising: a cryogenic chamber; and a heat exchanger, the heat exchanger in thermal communication with the cryogenic chamber, the heat exchanger comprising: a dividing structure configured to define, at least in part, a first volume and a second volume, the dividing structure configured to permit a flow of a working fluid from the first volume to the second volume and configured to control a ratio of an upstream pressure in the first volume to a downstream pressure in the second volume by inducing an aerodynamic resistance in the flow of the working fluid between the first volume and the second volume.

17. The system of claim 16, wherein the flow of the working fluid between the first volume and the second volume is along a return flow path defined at least in part by the dividing structure, and the return flow path is a tortuous path or a convoluted path.

18. The system of claim 16, further comprising an outer housing, the dividing structure disposed within the outer housing, wherein the outer housing comprises an exchange surface disposed at a first end of the outer housing and the exchange surface partially defines the first volume, and further comprising a working fluid source disposed at a second end of the outer housing, the second end being opposite the first end.

19. A method for cooling an interior of an environmental control chamber, the method comprising: providing a dividing structure of a heat exchanger, the dividing structure configured to define, at least in part, a first volume and a second volume, the dividing structure configured to permit a flow of a working fluid from the first volume to the second volume and configured to control a ratio of an upstream pressure in the first volume to a downstream pressure in the second volume by inducing an aerodynamic resistance in the flow of the working fluid between the first volume and the second volume; coupling a working fluid source to the dividing structure via a coupling portion of the dividing structure; coupling a thermal conduit to the heat exchanger, wherein the thermal conduit is in thermal communication with the interior of the environmental control chamber; and causing operation of the working fluid source to cause working fluid to flow through an upstream flow conduit of the heat exchanger to the first volume, interact with the thermal conduit while the working fluid is within the first volume to cause cooling of the interior of the environmental control chamber, and flow through a return flow path of the dividing structure from the first volume to the second volume.

20. The method of claim 19, wherein the environmental control chamber encloses a quantum object confinement apparatus of a quantum charge-coupled device (QCCD)-based quantum computer.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

[0053] Having thus described the invention in general terms, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and wherein:

[0054] FIG. 1 illustrates a cross-sectional view of an example heat exchanger, in accordance with an example embodiment.

[0055] FIG. 2 illustrates an exploded perspective view of at least a portion of an example heat exchanger, in accordance with an example embodiment.

[0056] FIG. 3 illustrates a perspective view of at least a portion of an example heat exchanger with the outer housing shown as transparent, in accordance with an example embodiment.

[0057] FIGS. 4A and 4B provide close-up views of a portion of the return flow path of the example heat exchanger shown in FIG. 1, in accordance with an example embodiment.

[0058] FIG. 5 provides a flowchart illustrating various operations and/or procedures for using a heat exchanger that uses aerodynamic inefficiencies to control a ratio of pressures within a first volume and a second volume of the heat exchanger, in accordance with an example embodiment.

[0059] FIG. 6 provides block diagram of an example system including a heat exchanger, in accordance with an example embodiment.

[0060] FIG. 7 provides a schematic diagram of an example controller of an example system including a heat exchanger, in accordance with an example embodiment.

[0061] FIG. 8 provides a schematic diagram of an example computing entity of an example system that includes a heat exchanger, in accordance with an example embodiment.

DETAILED DESCRIPTION OF SOME EXAMPLE EMBODIMENTS

[0062] The present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the invention are shown. Indeed, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. The term or (also denoted /) is used herein in both the alternative and conjunctive sense, unless otherwise indicated. The terms illustrative and exemplary are used to be examples with no indication of quality level. The terms generally and approximately refer to within applicable engineering and/or manufacturing tolerances and/or within user measurement capabilities, unless otherwise indicated. Like numbers refer to like elements throughout.

[0063] A heat exchanger is a device that transfers heat from one medium to another. Heat exchangers may be used in cryogenic cooling systems to transfer heat from a system to be cooled (e.g., via an exchanger surface) to a working fluid, such as liquid nitrogen, liquid helium, and/or the like.

[0064] Conventional cryocoolers often use Joule-Thomson (JT) devices to control a pressure of working fluid between various portions of a heat exchanger. A JT device uses a geometric constriction to reduce the flow of the working fluid through the constriction and therefore expand the working fluid downstream of the constriction. Expanding the working fluid downstream of the constriction acts to further cool the working fluid. However, JT devices are often the site of clogs in the cryocooler, given their small cross-sectional area. These clogs disrupt, and in some cases impede, the flow of working fluid through the JT device of the cryocooler. Additionally, JT devices often have zero or negative cooling effects in certain pressure and temperature regimes, which leads to decreased efficiency of cooling via the heat exchanger. Therefore, technical problems exist with the control of flow of working fluid through a heat exchanger to provide efficient cooling.

[0065] Various embodiments provide technical solutions to these technical problems. For example, various embodiments use a flow path that includes aerodynamic inefficiencies to control the ratio of the pressure of working fluid in various portions of the heat exchanger. For example, aerodynamic resistance is applied to a flow of working fluid within the heat exchanger by causing the working fluid to flow along a tortuous and/or convoluted path. A tortuous and/or convoluted path is a path (e.g., a flow path for the flow of working fluid) that includes a plurality of direction changes. As should be understood, as used herein, the term direction change refers to a change in the direction of the dominant or mean flow of the working fluid. The plurality of direction changes of the flow path may introduce turbulence into the flow. The flow path may be designed to introduce a desired amount of turbulence and/or aerodynamic resistance into the flow of working fluid along the flow path such that the ratio of pressures of working fluid between two volumes connected to one another via the flow path is controlled.

[0066] Notably, the flow path is able to control the ratio of pressures of working fluid between the two volumes connected to one another via the flow path without requiring a constriction along the flow path. For example, in certain embodiments, the cross-sectional area of the flow path (e.g., an area measured in a plane that is perpendicular to the average flow of working fluid at the point where the cross-sectional area is being measured) is substantially and/or approximately uniform along the length of the flow path. The lack of constrictions along the flow path reduces and/or prevents the occurrence of clogs (e.g., frozen/solid matter) along the flow path.

[0067] Moreover, the interaction between the working fluid and the exchange surface may be controlled such that heat exchange may occur more efficiently via the exchange surface compared to conventional heat exchangers. For example, the flow path may enable a flow of working fluid from a first volume proximate the exchange surface to a second volume distant (and downstream) of the exchange surface. By controlling the ratio of pressures of working fluid in the first volume compared to the second volume, the working fluid may be caused to interact with the exchange surface for a longer period of time (than if the ratio of pressures between the first volume and the second volume were not controlled). Thus, for each unit volume of working fluid that interacts with the exchange surface, the working fluid is able to absorb more heat via the exchange surface and provide more efficient cooling.

[0068] Thus, various embodiments provide technical improvements to the fields of heat exchangers and cryogenic cooling.

Example Heat Exchanger and Methods of Use

[0069] FIGS. 1, 2, and 3 illustrate various views of a heat exchanger 100, according to an example embodiment. The heat exchanger 100 comprises a dividing structure 120 that defines, at least in part, a first volume 112 and a second volume 122. The dividing structure 120 further defines, at least in part, a return flow path 130 that enables a flow of working fluid from first volume 112 to the second volume 122. The dividing structure 120 defines the return flow path 130 such that a ratio of an upstream pressure in the first volume 112 to a downstream pressure in the second volume 122 is controlled by inducing an aerodynamic resistance in the flow of working fluid along the return flow path 130 from the first volume 112 to the second volume 122. For example, the return flow path 130 is a tortuous path or a convoluted path including a plurality of direction changes which induce the aerodynamic resistance and/or turbulence in the flow of the working fluid along the return flow path 130.

[0070] In certain embodiments, the dividing structure comprises a plurality of annular plates 126 (e.g., 126A, 126B, . . . 126N) that are spaced apart from one another and concentrically aligned along a central axis 125 of the heat exchanger. Each annular plate 126 of the plurality of annular plates has a notch, orifice, or opening 132 formed therein. The notch, orifice, or opening 132 is configured to permit working fluid to flow therethrough. The notch, orifice, or opening 132 of a selected annular plate 126 of the plurality of annular plates is not aligned with at least one of an immediately previous annular plate of the plurality of annular plates or an immediately subsequent annular plot of the plurality of annular plates. Selection of the misalignment between the notches, orifices, or openings 132 of consecutive annular plates 126 may be used to control the amount of aerodynamic resistance induced in the flow of working fluid through the return flow path 130.

[0071] In various embodiments, the heat exchanger includes a dividing structure 120 and an outer housing 110. The outer housing 110 comprises a sidewall 111 that extends from an open end 118 to a closed end 117 and a closed end wall 113 disposed at the closed end 117. The closed end 117 includes a cooling channel 116 that extends partially through the closed end wall 113. For example, the cooling channel 116 may provide a means for securing a thermal conduit configured to transfer heat to the heat exchanger 100 from a system the heat exchanger is configured to cool such that the thermal conduit is secured in proximity to the exchange surface 114. For example, the exchange surface 114 is an interior surface of the closed end wall 113, in various embodiments. A central bore, cavity, or opening 115 of the outer housing 110 extends along the central axis 125 of the heat exchanger 100 from the open end 118 of the outer housing 110 to the exchange surface 114, in certain embodiments.

[0072] In various embodiments, the heat exchanger 100 comprises a dividing structure 120. In various embodiments, the dividing structure 120 defines, at least in part (e.g., defines in coordination with the outer housing 110) a first volume 112 and a second volume 122. The first volume 112 and the second volume 122 are in fluid communication with one another via a return flow path 130 defined, at least in part, by the dividing structure 120. For example, the dividing structure 120 permits, enables, and/or controls a flow of working fluid from the first volume 112 to the second volume 122. For example, the dividing structure 120 comprises a flow control portion 145 configured to control the flow of working fluid between the first volume 112 and the second volume 122.

[0073] In various embodiments, the first volume 112 is proximate a first end 142 of the dividing structure 120. For example, the first volume 112 is disposed between the first end 142 of the dividing structure 120 and the exchange surface 114, in certain embodiments.

[0074] A second end 144 of the dividing structure 120 is disposed opposite the first end 142 of the dividing structure (along the central axis 125). In an example embodiment, a seating portion 146 of the dividing structure 120 is disposed between the first end 142 and the second end 144 of the dividing structure 120. For example, the seating portion 146 may be configured to mechanically couple the outer housing 110 to the dividing structure 120. For example, an engagement portion 119 of the sidewall 111 proximate the open end 118 of the outer housing 110 may be configured to mechanically engage a seat 147 of the seating portion 146 of the dividing structure 120. In various embodiments, the outer housing 110 may be secured to the dividing structure 120 via a fiction fit, threaded coupling, adhesive, and/or the like between the engagement portion 119 of the sidewall 111 of the outer housing 110 and the seat 147 of the dividing structure 120. In an example embodiment, the outer housing 110 is secured to the dividing structure 120 so as to prevent working fluid from leaking out of the heat exchanger 100 via the junction between the outer housing 110 and the dividing structure 120.

[0075] The second end 144 of the dividing structure 120 houses a coupling portion 148 of the heat exchanger 100, in certain embodiments. For example, the coupling portion 148 of the dividing structure 120 may be configured to be couple to a working fluid source 160. For example, the heat exchanger 100 may be placed into fluid communication with the working fluid source 160 via the coupling portion 148 of the dividing structure 120. For example, the working fluid source 160 may be a source of compressed gas or liquid working fluid. In various embodiments, the working fluid is helium (e.g., helium-4), nitrogen, and/or another cryogen.

[0076] In various embodiments, the dividing structure 120 defines, at least in part, an upstream flow conduit 150. During operation of the heat exchanger, an upstream flow 102 flows through the upstream flow conduit from the working fluid source 160 toward the exchange surface 114. The working fluid of the upstream flow 102 reaches the first volume 112 disposed proximate the exchange surface 114. While the working fluid is within the first volume 112, the working fluid may interact with the exchange surface 114 to receive heat therefrom and to provide a cooling effect thereto.

[0077] The flow 104 of working fluid out of the first volume 112 provides working fluid to the return flow path 130. The return flow path 130 fluidly connects the first volume 112 to the second volume 122. For example, the second volume 122 may be a decompression chamber. A downstream flow conduit 152 returns a downstream flow 108 of working fluid to the working fluid source 160, in various embodiments. In an example embodiment, cryogenic expansion of the working fluid is isolated to a non-thermally conductive portion of the heat exchanger 100, such as in the second volume 122.

[0078] If a flow path between the first volume 112 and the second volume 122 exists that enables a laminar and/or uncontrolled flow of working fluid, a rate of the flow 104 of working fluid out of the first volume would be controlled by a ratio of the upstream pressure in the first volume 112 and the downstream pressure in the second volume 122. For example, the rate of the flow 104 would attempt to balance the upstream pressure and the downstream pressure so as to reduce any pressure differential therebetween.

[0079] However, this would result in the working fluid interacting with the exchange surface 114 for only a short period of time. Thus, each unit volume of working fluid that cycled from the working fluid source 160, along the upstream flow conduit 150, through the first volume 112, to the second volume 122, and back to the working fluid source via the downstream flow conduit 152 would only be able to absorb a small amount of heat due to the small amount of time the unit volume of working fluid interacted with the exchange surface 114.

[0080] In various embodiments, the return flow path 130 is configured to control the flow 104 of working fluid out of the first volume 112. For example, the return flow path 130 is configured to induce aerodynamic resistance in a flow of working fluid along the return flow path 130. In various embodiments, the return flow path 130 is a tortuous or convoluted path including a plurality of direction changes. As the working fluid flowing along the return flow path 130 interacts with the plurality of direction changes, aerodynamic inefficiencies, aerodynamic resistance, and/or turbulence is induced in the flow of the working fluid.

[0081] For example, each of the plurality of direction changes along the return flow path 130 cause the dominant or mean flow direction of the working fluid to change by at least 30 degrees. In some instances, one or more of the plurality of direction changes along the return flow path 130 cause the dominant or mean flow direction of the working fluid to change by at least 60 degrees. In certain embodiments, one or more of the plurality of direction changes along the return flow path 130 cause the dominant or mean flow direction of the working fluid to change by approximately 90 degrees or more.

[0082] These changes in the direction of the dominant or mean flow of the working fluid introduce erratic flows, eddies, and/or the like in the flow of the working fluid. These erratic flows, eddies, and/or the like result in the working fluid experiencing aerodynamic resistance as the working fluid flows along the return flow path 130. The aerodynamic resistance and/or turbulence of the flow of the working fluid through the return flow path 130 limits the speed or rate with which the working fluid is able to flow through the return flow path 130. This enables the return flow path 130 to control a ratio of the upstream pressure in the first volume 112 to the downstream pressure in the second volume 122.

[0083] In various embodiments, the dividing structure 120 is configured to prevent a Joule-Thomson coefficient from remaining less than zero in the second volume 122. For example, the dividing structure defines, at least in part a return flow path 130 between the first volume 112 and the second volume that is configured to prevent a Joule-Thomson coefficient from remaining less than zero in the second volume 122.

[0084] In various embodiments, the dividing structure 120 comprises a flow control portion 145 that extends from the first end 142 of the dividing structure toward the seating portion 146 of the dividing structure 120. In an example embodiment, the flow control portion 145 of the dividing structure 120 extends from the first end 142 of the dividing structure to the seating portion 146 of the dividing structure 120.

[0085] The flow control portion 145 comprises a core section 124 that defines, at least in part, the upstream flow conduit 150 therethrough. For example, the core section 124 defines a portion of the upstream flow conduit 150 through the flow control portion 145.

[0086] The flow control portion 145 further comprises structure elements configured to define, at least in part, the return flow path 130. In an example embodiment, the return flow path 130 is defined by the structure elements of the flow control portion 145 and the sidewall 111 of the outer housing 110. In various embodiments, the structure elements are configured to cause the return flow path to change directions a plurality of times between the first volume 112 and the second volume 122. For example, in various embodiments, the structure elements comprise a plurality of protrusions that extend outward from the core section 124 of the flow control portion 145 of the dividing structure 120 so as to cause the return flow path 130 to change direction.

[0087] FIGS. 1-4B illustrate an example dividing structure 120 where the structure elements are a plurality of annular plates 126 (e.g., 126A, 126B, . . . , 126N, 126X, 126Y, 126Z) that are spaced apart from one another and concentrically aligned along the central axis 125. For example, a path portion or groove 134 (e.g., 134A, 134B, 134C) may be disposed between adjacent annular plates 126. Each of the annular plates 126 includes a notch, orifice, or opening 132 (e.g., 132A, 132C). Adjacent path portions or grooves 134 are in fluid communication with one another via the notch, orifice, or opening 132 in the annular plate 126 that separates the adjacent path portions or grooves 134.

[0088] For example, each annular plate 126 defines, at least in part, a respective notch, orifice, or opening 132 configured to permit and/or enable the flow of working fluid through the annular plate 126. In various embodiments, the notches, orifices, or openings 132 are not configured to constrict the flow of working fluid therethrough. For example, the notches, orifices, or openings 132 may be sized so as to not substantially decrease a cross-sectional area of the return flow path (measured in a plane perpendicular to the dominant flow of the working fluid at the location where the measurement is taken).

[0089] For example, each path portion or groove 134 is in direct fluid communication with one of the first volume 112 or with a preceding path portion or groove and in direct fluid communication with one of a subsequent path portion or groove or with the second volume 122 with a respective notch, orifice, or opening 132 in a respective annular plate 126. For example, a first path portion or groove 134A is in direct fluid communication with the first volume 112 via the notch, orifice, or opening 132A in a first annular plate 126A and in direct fluid communication with a second path portion or groove 134B via the notch, orifice, or opening in a second annular plate 126B (which is out of the illustrated view). For example, a second path portion or groove 134B is in direct fluid communication with the first path portion or groove 134A via the notch, orifice, or opening in the second annular plate 126B and in direct fluid communication with a third path portion or groove 134C via the notch, orifice, or opening 132C in a third annular plate 126C. A final path portion or groove 134M is in direct fluid communication with the second volume 122 via the notch, orifice, or opening in the final annular plate 126N.

[0090] In certain embodiments, the notch, orifice, or opening 132 of a selected annular plate 126 is not aligned with at least one of an immediately previous annular plate of the plurality of annular plates or an immediately subsequent annular plate of the plurality of annular plates. For example, the notch, orifice, or opening formed and/or defined in the second annular plate 126B is not aligned with the notch, orifice, or opening formed and/or defined in the immediately preceding annular plate (the first annular plate 126A) and is not aligned with the notch, orifice, or opening formed and/or defined in the immediately subsequent annular plate (the third annular plate 126C).

[0091] FIG. 4A illustrates an example annular plate 126J having a notch, orifice, or opening 132J formed and/or defined therein. The dashed notch, orifice, or opening 132(J+1)/132(J1) illustrates the angular relationship of the notch, orifice, or opening 132(J+1)/132(J1) in the immediately preceding annular plate (annular plate 126(J+1), which is not explicitly shown) and/or the immediately subsequent annular plate (annular plate 126(J1), which is not explicitly shown). As shown, the notch, orifice, or opening 132J is misaligned with the notch, orifice, or opening 132(J+1)/132(J1). For example, a non-zero misalignment angle is present between the angular position of the notch, orifice, or opening 132J and the angular position of the notch, orifice, or opening 132(J+1)/132(J1). In various embodiments, the misalignment angle is greater than zero and less than 360 degrees. In certain embodiments, the misalignment angle is in a range of 90 degrees to 270 degrees. In some embodiments, the misalignment angle is in a range of 120 to 210 degrees. In the illustrated embodiment, the misalignment angle is approximately 180 degrees. In various embodiments, the misalignment angle is selected to provide a desired or selected ratio between the upstream pressure in the first volume 112 and the downstream pressure in the second volume 122.

[0092] FIG. 4B illustrates an example of how the plurality of annular plates 126 having misaligned notches, orifices, or openings 132 cause the return flow path 130 to include a plurality of direction changes. In particular, FIG. 4B provides a zoomed-in representation of area 180 shown in FIG. 1. Annular plates 126X, 126Y, 126Z extend outward from the core section 124 of the dividing structure 120 and are separated from one another by respective path portions or grooves 134. For example, path portion or groove 134XY separates annular plates 126X, 126Y and path portion or groove 134YZ separates annular plates 126Y, 126Z.

[0093] A first portion of the flow 106A of working fluid flowing through path portion or groove 134XY is out of the plane of the page. However, to reach the path portion or groove 134YZ, the flow direction of the working fluid must change as illustrated by flow 106B to flow through the notch, orifice, or opening 132 formed and/or defined in annular plate 126Y. Once the working fluid reaches path portion or groove 134YZ, the flow direction of the working fluid must change again as illustrated by flow 106C pointing into the plane of the page to flow through the path portion or groove 134YZ to reach the notch, orifice, or opening formed and/or defined in annular plate 126Z. Thus, the flow direction of the working fluid flowing along the return flow path 130 changes a plurality of times between the first volume 112 and the second volume 122.

[0094] In various embodiments, the dividing structure 120 and/or the outer housing 110 are formed of oxygen free copper or another material having substantial thermal conductivity at cryogenic temperatures. In various embodiments, the dividing structure 120 is formed (e.g., cast, milled, and/or the like) as one integral structure. In certain embodiments, the dividing structure 120 is formed of multiple structures that are adhered, welded, and/or the like to one another so as to provide the dividing structure.

[0095] As shown in FIG. 4B, the annular plates 126 may extend out from the core section 124 of the dividing structure 120 such that, when the engagement portion 119 of the outer housing 110 is seated on and/or engaged with the seat 147, the annular plates 126 are in physical contact with the interior surface of the sidewall 111. In some embodiments, the annular plates 126 are in sealed physical contact with the interior surface of the sidewall 111 such that working fluid is not permitted to flow through any gaps between the annular plates 126 and the interior surface of the sidewall 111. For example, in certain embodiments, the dividing structure 120 and the outer housing 110 define the return flow path 130.

[0096] FIG. 5 provides a flowchart illustrating various processes and/or procedures for using a heat exchanger 100 as part of an environmental control system 45 configured to control at least a temperature and/or heat distribution within at least a portion of an environmental control chamber 40 (as shown in FIG. 6). Starting at step 502, a dividing structure 120 is provided. For example, a dividing structure comprising a flow control portion 145, a seating portion 146, and a coupling portion 148 may be provided. In various embodiments, the flow control portion 145 comprises a plurality of structural elements (e.g., protrusions and/or annular plates that extend outward from a core section 124 of the dividing structure 120) that define, at least in part a return flow path 130 that is a tortuous or convoluted path including a plurality of direction changes.

[0097] In various embodiments, a dividing structure 120 having structure elements that define, at last in part, a return flow path 130 configured to introduce an amount of aerodynamic resistance, aerodynamic inefficiency, and/or turbulence into the flow of working fluid flowing through the return flow path 130 to provide a desired or selected ratio between the upstream pressure in the first volume 112 and the downstream pressure in the second volume 122. For example, when the structure elements are annular plates 126 comprising misaligned notches, orifices, and/or openings 132, the misalignment angle that characterizes and/or quantifies the misalignment between the notches, orifices, or openings 132 of consecutive annular plates 126 and/or a number or quantity of annular plates 126 may be selected so as to cause an amount of aerodynamic resistance, aerodynamic inefficiency, and/or turbulence in the flow of working fluid flowing through the return flow path 130 to provide a desired or selected ratio between the upstream pressure in the first volume 112 and the downstream pressure in the second volume 122.

[0098] At step 504, the dividing structure is secured within an outer housing 110. For example, the engagement portion 119 of the sidewall 111 proximate the open end 118 of the outer housing 110 may be mechanically engaged with the seat 147 of the seating portion 146 of the dividing structure 120. In various embodiments, the outer housing 110 may be secured to the dividing structure 120 via a friction fit, threaded coupling, adhesive, and/or another mechanical securing technique appropriate for the application. In an example embodiment, the outer housing 110 is secured to the dividing structure 120 so as to prevent working fluid from leaking out of the heat exchanger 100 via the junction between the outer housing 110 and the dividing structure 120.

[0099] In some embodiments, the dividing structure 120 is provided such that the dividing structure is already secured within the outer housing 110. For example, the dividing structure 120 is secured within the outer housing 110 prior to the dividing structure 120 being provided, in certain embodiments.

[0100] At step 506, the heat exchanger 100 is coupled to the working fluid source 160. For example, upstream flow conduit 150 of the dividing structure 120 may be coupled to an appropriate component of the working fluid source 160 for providing working fluid from the working fluid source 160 to the heat exchanger 100 (e.g., to the first volume 112). For example, the downstream flow conduit 152 of the dividing structure 120 may be coupled to an appropriate component of the working fluid source 160 to provide working fluid from the heat exchanger 100 (e.g., from the second volume 122) to the working fluid source 160.

[0101] At step 508, the heat exchanger 100 is coupled to an appropriate component of the environmental control system 45 for causing cooling of at least a portion of an interior of the environmental control chamber 40. For example, a thermal conduit may be secured within the cooling channel 116 so as to provide for and/or enable thermal communication of the heat exchanger 100 (e.g., via the exchange surface 114) to an appropriate component of the environmental control system 45 for causing cooling of at least a portion of an interior of the environmental control chamber 40. For example, the thermal conduit may act as a cold finger or be placed into thermal communication with a cold head disposed within the environmental control chamber 40.

[0102] At step 510, operation of the working fluid source may be caused. In various embodiments, the working fluid source 160 may be operated (e.g., by controller 30 and/or a component of the environmental control system 45) to provide working fluid to the heat exchanger 100 to provide a closed cooling system (e.g., a cooling system where the working fluid is enclosed within the cooling system and reused). For example, the working fluid source 160 may be operated to cause (e.g., via operation of a pump of the working fluid source) working fluid to flow through the upstream flow conduit 150 of the heat exchanger to the first volume 112. While in the first volume 112, the working fluid interacts with the thermal conduit, via the exchange surface 114, to cause cooling of the interior of the environmental control chamber (e.g., via the thermal path provided via the thermal conduit. The working fluid flows through the return flow path 130 of the dividing structure from the first volume 112 to the second volume 122. The working fluid returns to the working fluid source 160 from the second volume 122 (e.g., via the downstream flow conduit 152).

[0103] The temperature and/or heat distribution within the environmental control chamber 40 is controlled through the operation of the closed cooling system. The system 200 (e.g., quantum computer 210) may be operated to perform experiments, controlled quantum state evolutions, quantum computations, and/or the like, as appropriate for the application in the controlled temperature environment provided within the environmental control chamber 40.

Technical Advantages

[0104] Conventional cryocoolers often use Joule-Thomson (JT) devices to control a pressure of working fluid between various portions of a heat exchanger. A JT device uses a geometric constriction to reduce the flow of the working fluid through the constriction and therefore expand the working fluid downstream of the constriction. Expanding the working fluid downstream of the constriction acts to further cool the working fluid. However, JT devices are often the site of clogs in the cryocooler, given their small cross-sectional area. These clogs disrupt, and in some cases impede, the flow of working fluid through the JT device of the cryocooler. Additionally, JT devices often have zero or negative cooling effects in certain pressure and temperature regimes, which leads to decreased efficiency of cooling via the heat exchanger. Therefore, technical problems exist with the control of flow of working fluid through a heat exchanger to provide efficient cooling.

[0105] Various embodiments provide technical solutions to these technical problems. For example, various embodiments use a flow path that includes aerodynamic inefficiencies to control the ratio of the pressure of working fluid in various portions of the heat exchanger. For example, aerodynamic resistance is applied to a flow of working fluid within the heat exchanger by causing the working fluid to flow along a tortuous and/or convoluted path. A tortuous and/or convoluted path includes a plurality of direction changes. The plurality of direction changes of the flow path may introduce turbulence into the flow. The flow path may be designed to introduce a desired amount of turbulence and/or aerodynamic resistance into the flow of working fluid along the flow path such that the ratio of pressures of working fluid between two volumes connected to one another via the flow path is controlled.

[0106] Notably, the flow path is able to control the ratio of pressures of working fluid between the two volumes connected to one another via the flow path without requiring a constriction along the flow path. For example, in certain embodiments, the cross-sectional area of the flow path (e.g., an area measured in a plane that is perpendicular to the average flow of working fluid at the point where the cross-sectional area is being measured) is substantially and/or approximately uniform along the length of the flow path. The lack of constrictions along the flow path reduces and/or prevents the occurrence of clogs (e.g., frozen/solid matter) along the flow path.

[0107] Moreover, the interaction between the working fluid and the exchange surface may be controlled such that heat exchange may occur more efficiently via the exchange surface compared to conventional heat exchangers. For example, the flow path may enable a flow of working fluid from a first volume proximate the exchange surface to a second volume distant (and downstream) of the exchange surface. By controlling the ratio of pressures of working fluid in the first volume compared to the second volume, the working fluid may be caused to interact with the exchange surface for a longer period of time (than if the ratio of pressures between the first volume and the second volume were not controlled). Thus, for each unit volume of working fluid that interacts with the exchange surface, the working fluid is able to absorb more heat via the exchange surface and provide more efficient cooling.

[0108] Thus, various embodiments provide technical improvements to the fields of heat exchangers and cryogenic cooling.

Example System Including a Heat Exchanger

[0109] Various embodiments provide a system that includes a heat exchanger 100. One example system including a heat exchanger 100, in accordance with an example embodiment, is a quantum computer (e.g., a quantum charge-coupled device (QCCD)-based quantum computer) that use quantum objects (e.g., neutral or ionic atoms; neutral, ionic, or multipolar molecules; quantum dots; and/or other quantum particles) for storing quantum information, performing quantum computations, performing experiments, and/or the like. In various scenarios, the quantum objects are confined by a quantum object confinement apparatus within an environmental control chamber. At least a portion of the interior of the environmental control chamber may be cooled to cryogenic temperatures (e.g., temperatures less than 125 K.). Maintaining the quantum objects at cryogenic temperatures may reduce the effect of vibrational motion of the quantum objects on the storage of quantum information, performance of quantum computations, and/or the like that include use of the quantum objects. For example, a heat exchanger 100 may be thermally coupled the environmental control chamber.

[0110] FIG. 6 provides a schematic diagram of an example quantum computer system 200 that includes a heat exchanger 100 configured for cooling at least a portion of an interior of an environmental control chamber 40 to cryogenic temperatures.

[0111] In the illustrated embodiment, the quantum computer system 200 includes a quantum object confinement apparatus 70 (e.g., an ion trap, neutral atom trap, and/or the like) configured to confine a plurality of quantum objects. In various embodiments, the quantum objects are used as qubits of the quantum computer 210.

[0112] In various embodiments, the quantum computer system 200 comprises a classical (e.g., semiconductor-based) computing entity 10 and a quantum computer 210. In various embodiments, the quantum computer 210 comprises a controller 30, an environmental control chamber 40 enclosing a confinement apparatus 70, an environmental control system 45 configured to control one or more properties of the environment within the environmental control chamber 40 (e.g., temperature, heat distribution, pressure, etc.), one or more manipulation sources 64, one or more voltage sources 50, an optics collection system 80, one or more sensors (e.g., calibration sensors and/or the like) and/or the like. In various embodiments, the controller 30 is configured to control the operation of (e.g., control one or more drivers configured to cause operation of) the manipulation sources 64, voltage sources 50, environmental control system 45, and/or the like. In various embodiments, the controller 30 is configured to receive sensor signals (e.g., electrical signals) generated and provided by one or more photodetectors of the optics collection system 80 and/or other sensors of the system.

[0113] In an example embodiment, the one or more manipulation sources 64 may comprise one or more lasers (e.g., optical lasers, microwave sources and/or masers, and/or the like), magnetic field and/or magnetic field gradient sources, or another manipulation source. In various embodiments, the one or more manipulation sources 64 may be disposed within the environmental control chamber 40, outside of the environmental control chamber 40, and/or a combination thereof.

[0114] In various embodiments, the one or more manipulation sources 64 are configured to manipulate and/or cause a controlled quantum state evolution of one or more quantum objects confined by the confinement apparatus 70. In various embodiments, one or more manipulation sources 64 are configured to generate and/or provide one or more manipulation signals configured for performing laser cooling, quantum object initialization and/or state preparation, shelving operations, single qubit gates, two-qubit gates, fluorescence measurement operations, and/or other operations on the quantum objects confined by the confinement apparatus 70.

[0115] In various embodiments, the confinement apparatus 70 is an ion trap, such as a surface ion trap, Paul ion trap, and/or the like. In various embodiments, the quantum objects are ions, atoms, molecules, quantum particles, and/or the like.

[0116] In an example embodiment, the one or more manipulation sources may be located outside of the environmental control chamber 40 and may each provide a manipulation signal (e.g., laser beam, microwave signals, and/or the like) to one or more regions and/or target locations of the confinement apparatus 70 via corresponding beam path systems 66. In various embodiments, at least one beam path system 66 comprises a modulator configured to modulate the manipulation signal being provided to the confinement apparatus 70 via the beam path system 66. In various embodiments, the manipulation sources 64, active components of the beam path systems 66 (e.g., modulators, etc.), and/or other components of the quantum computer 210 are controlled by the controller 30.

[0117] In various embodiments, the quantum computer 210 comprises one or more voltage sources 50. For example, the voltage sources may be arbitrary wave generators (AWG), digital analog converters (DACs), and/or other voltage signal generators. For example, the voltage sources 50 may comprise a plurality of control voltage drivers and/or voltage sources and/or at least one RF driver and/or voltage source. The voltage sources 50 may be electrically coupled to the corresponding potential generating elements (e.g., control electrodes and/or RF electrodes) of the confinement apparatus 70, in an example embodiment. For example, the controller 30 may control operation of the one or more voltage sources 50 to cause the confinement apparatus 70 to confine the quantum object at a target location for performance of various quantum state manipulations thereon. For example, in some embodiments, the controller 30 controls operation of the confinement apparatus 70 by controlling operation of the voltage sources 50 configured to provide respective voltage signals to respective electrodes, for example, of the confinement apparatus 70.

[0118] In various embodiments, the quantum computer system 200 includes an environmental control system 45 configured to control one or more properties of the environment within the environmental control chamber 40. In various embodiments, the environmental control chamber 40 is a cryostat and/or vacuum chamber. For example, the environmental control system 45 includes a cryogenic cooling and/or vacuum system, in various embodiments. For example, the environmental control system 45 may include a cryogenic cooling system that includes a heat exchanger 100, according to various embodiments.

[0119] In various embodiments, the quantum computer 210 comprises an optics collection system 80 configured to collect and/or detect photons (e.g., stimulated emission) generated by quantum objects (e.g., during reading/measurement procedures). The optics collection system 80 may comprise one or more optical elements (e.g., lenses, mirrors, waveguides, fiber optics cables, and/or the like) and one or more sensors, such as photodetectors. In various embodiments, the photodetectors may be photodiodes, photomultipliers, charge-coupled device (CCD) sensors, complementary metal oxide semiconductor (CMOS) sensors, Micro-Electro-Mechanical Systems (MEMS) sensors, and/or other photodetectors that are sensitive to light at an expected fluorescence wavelength of the qubits (e.g., quantum objects) of the quantum computer 210. In various embodiments, the sensors (e.g., photodetectors) are in electronic communication with the controller 30 via one or more A/D converters 725 (see FIG. 7) and/or the like.

[0120] In various embodiments, the quantum computer may include various other sensors configured for measuring voltage, current, optical power, magnetic fields, and/or the like at various locations within the quantum computer. The sensors may be used to perform image current detection, calibration of voltage signals or manipulation signals, and/or the like.

[0121] In various embodiments, a computing entity 10 is configured to allow a user to provide input to the quantum computer 210 (e.g., via a user interface of the computing entity 10) and receive, view, and/or the like output from the quantum computer 210. The computing entity 10 may be in communication with the controller 30 of the quantum computer 210 via one or more wired or wireless networks 20 and/or via direct wired and/or wireless communications. In an example embodiment, the computing entity 10 may translate, configure, format, and/or the like information/data, quantum computing algorithms (e.g., quantum circuits), and/or the like into a computing language, executable instructions, command sets, and/or the like that the controller 30 can understand, execute, and/or implement.

[0122] In various embodiments, the controller 30 is configured to control operation of the voltage sources 50, environmental control system 45 system controlling various environmental properties (e.g., temperature, heat distribution, pressure, and/or the like) within the environmental control chamber 40, manipulation sources 64, beam path systems 66, and/or other systems configured to manipulate and/or cause a controlled evolution of quantum states of one or more quantum objects confined by the confinement apparatus, and/or read/measure a quantum (e.g., qubit) state of one or more quantum objects confined by the confinement apparatus. In various embodiments, the controller 30 controls operation of the confinement apparatus 70 via controlling operation of the one or more voltage sources 50 to cause desired sequences of voltage signals to be applied to electrodes of the confinement apparatus 70. For example, the controller 30 may cause a controlled evolution of quantum states of one or more quantum objects within the confinement apparatus to execute a quantum circuit and/or algorithm.

Example Controller

[0123] In various embodiments, an environmental control system 45 including a heat exchanger 100 is incorporated into a quantum computer 210 or other atomic and/or quantum system. In various embodiments, a quantum computer 210 or other atomic and/or quantum system further comprises a controller 30 configured to control various elements of the quantum computer 210 or other atomic and/or quantum system. For example, the controller 30 may be configured to control the voltage sources 50, an environmental control system 45 controlling the temperature, heat distribution, pressure, and/or other environmental properties within the environmental control chamber 40, manipulation sources 64, magnetic field generators, active components of beam path systems 66, and/or other systems configured to manipulate and/or cause a controlled evolution of quantum states of one or more quantum objects confined by the confinement apparatus 70, cause the quantum computer 210 to perform a quantum circuit and/or computation, and/or read/measure a quantum state of one or more quantum objects confined by the confinement apparatus 70. For example, the controller 30 may be configured to control operation of the confinement apparatus 70 (e.g., via controlling one or more voltage sources 50 configured to provide voltage signals to various potential generating elements/electrodes of the confinement apparatus, in an example embodiment).

[0124] As shown in FIG. 7, in various embodiments, the controller 30 may comprise various controller elements including processing device 705, memory 710, driver controller elements 715, a communication interface 720, analog-digital (A/D) converter elements 725, and/or the like.

[0125] For example, the processing device 705 may comprise processing elements, programmable logic devices (CPLDs), microprocessors, coprocessing entities, application-specific instruction-set processors (ASIPs), integrated circuits, application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), programmable logic arrays (PLAs), hardware accelerators, other processing devices and/or circuitry, and/or the like, and/or controllers. The term circuitry may refer to an entirely hardware embodiment or a combination of hardware and computer program products. In an example embodiment, the processing device 705 of the controller 30 comprises a clock and/or is in communication with a clock.

[0126] For example, the memory 710 may comprise non-transitory memory such as volatile and/or non-volatile memory storage such as one or more of as hard disks, ROM, PROM, EPROM, EEPROM, flash memory, MMCs, SD memory cards, Memory Sticks, CBRAM, PRAM, FeRAM, RRAM, SONOS, racetrack memory, RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, RIMM, DIMM, SIMM, VRAM, cache memory, register memory, and/or the like. In various embodiments, the memory 710 may store qubit records corresponding the qubits of quantum computer (e.g., in a qubit record data store, qubit record database, qubit record table, and/or the like), a calibration table, an executable queue, computer program code (e.g., in a one or more computer languages, specialized controller language(s), and/or the like), and/or the like. In an example embodiment, execution of at least a portion of the computer program code stored in the memory 710 (e.g., by a processing device 705) causes the controller 30 to perform one or more steps, operations, processes, procedures and/or the like described herein for controlling one or more components of the quantum computer 210 or other atomic system (e.g., environmental control system 45, voltages sources 50, manipulation sources 64, magnetic field generators, and/or the like) to cause a controlled evolution of quantum states of one or more quantum objects, perform a quantum circuit and/or quantum computation, detect/measure the quantum state of one or more quantum objects, and/or the like.

[0127] In various embodiments, the driver controller elements 715 may include one or more drivers and/or controller elements each configured to control one or more drivers. In various embodiments, the driver controller elements 715 may comprise drivers and/or driver controllers. For example, the driver controllers may be configured to cause one or more corresponding drivers to be operated in accordance with executable instructions, commands, and/or the like scheduled and executed by the controller 30 (e.g., by the processing device 705). In various embodiments, the driver controller elements 715 may enable the controller 30 to operate a manipulation source 64. In various embodiments, the drivers may be laser drivers; vacuum component drivers; cryogenic cooling system drivers; drivers for controlling the flow of current and/or voltage applied to longitudinal, RF, and/or other electrodes used for maintaining and/or controlling the confinement potential of the confinement apparatus (and/or other driver for providing driver action sequences and/or control signals to potential generating elements of the confinement apparatus); and/or the like. For example, the drivers may control and/or comprise control and/or RF voltage drivers and/or voltage sources that provide voltages and/or electrical signals to the potential generators (e.g., control electrodes and/or RF electrodes).

[0128] In various embodiments, the controller 30 comprises means for communicating and/or receiving signals from one or more detectors such as optical receiver components (e.g., cameras, MEMs cameras, CCD cameras, photodiodes, photomultiplier tubes, and/or the like). For example, the controller 30 may comprise one or more analog-digital converter elements 725 configured to receive signals from one or more detectors, optical receiver components, calibration sensors, photodetectors of an optics collection system 80, and/or the like.

[0129] In various embodiments, the controller 30 may comprise a communication interface 720 for interfacing and/or communicating with a computing entity 10. For example, the controller 30 may comprise a communication interface 720 for receiving executable instructions, command sets, and/or the like from the computing entity 10 and providing output received from the quantum computer 210 (e.g., from an optics collection system 80 comprising one or more photodetectors) and/or the result of a processing the output to the computing entity 10. In various embodiments, the computing entity 10 and the controller 30 may communicate via a direct wired and/or wireless connection and/or one or more wired and/or wireless networks 20.

Example Computing Entity

[0130] FIG. 8 provides an illustrative schematic representative of an example computing entity 10 that can be used in conjunction with embodiments of the present invention. In various embodiments, a computing entity 10 is configured to allow a user to provide input to the quantum computer 210 (e.g., via a user interface of the computing entity 10) and receive, display, analyze, and/or the like output from the quantum computer 210.

[0131] As shown in FIG. 8, a computing entity 10 can include an antenna 812, a transmitter 804 (e.g., radio), a receiver 806 (e.g., radio), and a processing device 808 that provides signals to and receives signals from the transmitter 804 and receiver 806, respectively. The signals provided to and received from the transmitter 804 and the receiver 806, respectively, may include signaling information/data in accordance with an air interface standard of applicable wireless systems to communicate with various entities, such as a controller 30, other computing entities 10, and/or the like.

[0132] In this regard, the computing entity 10 may be capable of operating with one or more air interface standards, communication protocols, modulation types, and access types. For example, the computing entity 10 may be configured to receive and/or provide communications using a wired data transmission protocol, such as fiber distributed data interface (FDDI), digital subscriber line (DSL), Ethernet, asynchronous transfer mode (ATM), frame relay, data over cable service interface specification (DOCSIS), or any other wired transmission protocol. Similarly, the computing entity 10 may be configured to communicate via wireless external communication networks using any of a variety of protocols, such as general packet radio service (GPRS), Universal Mobile Telecommunications System (UMTS), Code Division Multiple Access 2000 (CDMA2000), CDMA2000 1X (1xRTT), Wideband Code Division Multiple Access (WCDMA), Global System for Mobile Communications (GSM), Enhanced Data rates for GSM Evolution (EDGE), Time Division-Synchronous Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), Evolved Universal Terrestrial Radio Access Network (E-UTRAN), Evolution-Data Optimized (EVDO), High Speed Packet Access (HSPA), High-Speed Downlink Packet Access (HSDPA), IEEE 802.11 (Wi-Fi), Wi-Fi Direct, 802.16 (WiMAX), ultra-wideband (UWB), infrared (IR) protocols, near field communication (NFC) protocols, Wibree, Bluetooth protocols, wireless universal serial bus (USB) protocols, and/or any other wireless protocol. The computing entity 10 may use such protocols and standards to communicate using Border Gateway Protocol (BGP), Dynamic Host Configuration Protocol (DHCP), Domain Name System (DNS), File Transfer Protocol (FTP), Hypertext Transfer Protocol (HTTP), HTTP over TLS/SSL/Secure, Internet Message Access Protocol (IMAP), Network Time Protocol (NTP), Simple Mail Transfer Protocol (SMTP), Telnet, Transport Layer Security (TLS), Secure Sockets Layer (SSL), Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Datagram Congestion Control Protocol (DCCP), Stream Control Transmission Protocol (SCTP), HyperText Markup Language (HTML), and/or the like.

[0133] Via these communication standards and protocols, the computing entity 10 can communicate with various other entities using concepts such as Unstructured Supplementary Service information/data (USSD), Short Message Service (SMS), Multimedia Messaging Service (MMS), Dual-Tone Multi-Frequency Signaling (DTMF), and/or Subscriber Identity Module Dialer (SIM dialer). The computing entity 10 can also download changes, add-ons, and updates, for instance, to its firmware, software (e.g., including executable instructions, applications, program modules), and operating system. In various embodiments, the computing entity 10 comprises a network interface 820 configured to communicate via one or more wired and/or wireless networks 20.

[0134] In various embodiments, the processing device 808 may comprise processing elements, programmable logic devices (CPLDs), microprocessors, coprocessing entities, application-specific instruction-set processors (ASIPs), integrated circuits, application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), programmable logic arrays (PLAs), hardware accelerators, other processing devices and/or circuitry, and/or the like. The term circuitry may refer to an entirely hardware embodiment or a combination of hardware and computer program products.

[0135] The computing entity 10 may also comprise a user interface device comprising one or more user input/output interfaces (e.g., a display 816 and/or speaker/speaker driver coupled to a processing device 808 and a touch screen, keyboard, mouse, and/or microphone coupled to a processing device 808). For instance, the user output interface may be configured to provide an application, browser, user interface, interface, dashboard, screen, webpage, page, and/or similar words used herein interchangeably executing on and/or accessible via the computing entity 10 to cause display or audible presentation of information/data and for interaction therewith via one or more user input interfaces. The user input interface can comprise any of a number of devices allowing the computing entity 10 to receive data, such as a keypad 818 (hard or soft), a touch display, voice/speech or motion interfaces, scanners, readers, or other input device. In embodiments including a keypad 818, the keypad 818 can include (or cause display of) the conventional numeric (0-9) and related keys (#, *), and other keys used for operating the computing entity 10 and may include a full set of alphabetic keys or set of keys that may be activated to provide a full set of alphanumeric keys. In addition to providing input, the user input interface can be used, for example, to activate or deactivate certain functions, such as screen savers and/or sleep modes. Through such inputs the computing entity 10 can collect information/data, user interaction/input, and/or the like.

[0136] The computing entity 10 can also include volatile storage or memory 822 and/or non-volatile storage or memory 824, which can be embedded and/or may be removable. For instance, the non-volatile memory may be ROM, PROM, EPROM, EEPROM, flash memory, MMCs, SD memory cards, Memory Sticks, CBRAM, PRAM, FeRAM, RRAM, SONOS, racetrack memory, and/or the like. The volatile memory may be RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, RIMM, DIMM, SIMM, VRAM, cache memory, register memory, and/or the like. The volatile and non-volatile storage or memory can store databases, database instances, database management system entities, data, applications, programs, program modules, scripts, source code, object code, byte code, compiled code, interpreted code, machine code, executable instructions, and/or the like to implement the functions of the computing entity 10.

Conclusion

[0137] Many modifications and other embodiments of the invention set forth herein will come to mind to one skilled in the art to which the invention pertains having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the invention is not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.