VAPOR CHAMBER STRUCTURE

Abstract

A vapor chamber structure includes an upper plate, a lower plate, a middle layer and a polymer layer. The polymer layer is selectively connected with any of the upper and lower plates. The lower plate and the upper plate are mated with each other to together define a chamber. A working fluid is filled in the chamber. The middle layer is disposed in the chamber. The middle layer has a first face, a second face, multiple perforations and multiple channels. The multiple perforations pass through the first and second faces. The multiple channels are disposed on one of the first and second faces. By means of the above arrangement, the total thickness of the vapor chamber structure is equal to or smaller than 0.25 mm, whereby the vapor chamber can be extremely thinned.

Claims

1. A vapor chamber structure comprising: an upper plate being composed of multiple upper plate bodies, which are laminated with each other, the upper plate having an upper outer face and an upper inner face; a lower plate being composed of multiple lower plate bodies, which are laminated with each other, the lower plate having a lower outer face and a lower inner face, the plate and the upper plate being mated with each other to together define a chamber, a working fluid being filled in the chamber; a middle layer disposed in the chamber, the middle layer having a first face, a second face, multiple perforations and multiple channels, the multiple perforations passing through the first and second faces, the multiple channels being disposed on at least one of the first and second faces; and multiple polymer layers disposed and sandwiched between the multiple upper plate bodies and the multiple lower plate bodies, whereby the total thickness of the vapor chamber structure is equal to or smaller than 0.25 mm.

2. The vapor chamber structure as claimed in claim 1, wherein the multiple channels are longitudinally and transversely formed on the second face of the middle layer to intersect each other.

3. The vapor chamber structure as claimed in claim 1, wherein the multiple channels and the multiple perforations are alternately arranged.

4. The vapor chamber structure as claimed in claim 1, wherein the upper plate has multiple bosses, the multiple bosses being disposed on the upper inner face of the upper plate and raised therefrom, the second face of the middle layer being attached to the multiple bosses.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:

[0019] FIG. 1 is a perspective exploded view of a preferred embodiment of the vapor chamber structure of the present invention;

[0020] FIG. 2 is a sectional assembled view of the preferred embodiment of the vapor chamber structure of the present invention, in which the circled area is enlarged; and

[0021] FIG. 3 is a sectional assembled view of another embodiment of the vapor chamber structure of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] The present invention provides a vapor chamber structure. Please refer to FIGS. 1 and 2. FIG. 1 is a perspective exploded view of a preferred embodiment of the vapor chamber structure of the present invention. FIG. 2 is a sectional assembled view of the preferred embodiment of the vapor chamber structure of the present invention, in which the circled area is enlarged. The vapor chamber structure 1 of the present invention includes an upper plate 11, a lower plate 13, a middle layer 15 and a polymer layer 16. The upper plate 11 has an upper outer face 111, an upper inner face 112 and multiple bosses 113. The multiple bosses 113 are disposed on the upper inner face 112 and raised therefrom. The lower plate 13 has a lower outer face 131 and a lower inner face 132. The lower inner face 132 is opposite to the upper inner face 112. The lower plate 13 and the upper plate 11 are mated with each other to together define a chamber 14. A working fluid (such as pure water) is filled in the chamber 14. The upper plate 11 and the lower plate 13 are made of a material selected from a group consisting of copper, aluminum, stainless steel and commercial pure titanium. The thickness of the upper and lower plates 11, 13 is approximately 0.05 mm. In a preferred embodiment, the vapor chamber structure 1 can be alternatively a heat plate structure.

[0023] The middle layer 15 can be a sheet body or plate body disposed in the chamber 14. The middle layer 15 has a first face 151, a second face 152, multiple perforations 153 and multiple channels 154. The first and second faces 151, 152 are respectively correspondingly in contact and attachment with the lower inner face 132 and the multiple bosses 113. The multiple channels 154 are disposed on the first face 151 or the second face 152 or both the first and second faces 151, 152. In this embodiment, the multiple channels 154 are arranged and disposed on the second face 152 of the middle layer 15 at intervals. That is, the multiple channels 154 are longitudinally and transversely formed on the second face 152 of the middle layer 15 to intersect each other. The longitudinal channels 154 are in communication with the transverse channels 154. Accordingly, under the capillary attraction of the multiple channels 154, the liquid working fluid can quickly flow along the longitudinal and transverse channels 154 back to the lower inner face 132, (that is, the evaporation section). The thickness of the middle layer 15 is about such as 0.05 mm.

[0024] The multiple perforations 153 pass through the first and second faces 151, 152. The multiple perforations 153 and the multiple channels 154 are alternately arranged or not alternately arranged. In this embodiment, the multiple perforations 153 and the multiple channels 154 are, but not limited to, horizontally alternately arranged for illustration. Accordingly, by means of the design of the channels 154 formed on one face or both faces of the middle layer 15 and the perforations 153 passing through the middle layer 15 of the present invention, the multiple channels 154 are for the liquid working fluid to flow back and the multiple perforations 154 serve as vapor passages for the evaporated working fluid. Therefore, the present invention has the capillary structure with both the vapor circulation passages and the capillary attraction for making the liquid working fluid to flow back. This solves the problem that the capillary structure can be hardly disposed in the narrow internal chamber 14 of the thinned heat dissipation unit. Moreover, the middle layer 15 serves as a support structure for the vapor chamber structure 1 so that the chamber 14 of the vapor chamber structure 1 can keep complete without being squeezed and deformed to lose the vapor-liquid circulation function. In a modified embodiment, the multiple perforations 153 and the multiple channels 154 are vertically overlapped and alternately arranged. In another modified embodiment, the multiple channels 154 are transversely or longitudinally formed on the second face 152 of the middle layer 15.

[0025] The polymer layer 16 is such as artificial polymer (such as PE, PVC, Nylon, Dacron, ABS and SBR) or inorganic polymer (such as quartz, asbestos, mica or graphite). The polymer layer 16 is selectively connected with the upper plate 11 or the lower plate 13. The polymer layer 16 is selectively formed on the surface (such as the surface of the upper outer face 111, the surface of the upper inner face 112, the surface of the lower inner face 132 or the surface of the lower outer face 131) of the upper plate 11 or the lower plate 13 by means of painting, printing, adhesion or attachment. In this embodiment, the polymer layer 16 is formed on the surface of the lower outer face 131 of the lower plate 13 by means of painting. The total thickness of the vapor chamber structure 1 is, but not limited to, equal to 0.25 mm. In practice, the total thickness of the vapor chamber structure 1 can be smaller than 0.25 mm.

[0026] FIG. 3 is a sectional assembled view of another embodiment of the vapor chamber structure of the present invention, and the structure is partially identical to the above embodiments and thus will not be redundantly described hereinafter. The embodiment is different from the above embodiments in that the polymer layer 16 is disposed and sandwiched between the upper plate 11 and/or the lower plate 13. In addition, the upper plate 11 (and/or the lower plate 13) are composed of multiple upper plate bodies 110 (and/or multiple lower plate bodies 130), which are laminated with each other.

[0027] In still another modified embodiment, the structure is partially identical to the above embodiments and thus will not be redundantly described hereinafter. The modified embodiment is different from the above embodiments in that the vapor chamber structure 1 further includes a hydrophilic layer. The hydrophilic layer is selectively disposed on the upper inner face or the lower inner face or the second face of the middle layer and the surface of the multiple channels.

[0028] In conclusion, the various capillary structures employed by the conventional techniques are applied to the extremely thin vapor chamber under limitation. Therefore, the vapor chamber can be hardly successfully thinned. According to the design of the vapor chamber structure 1 of the present invention, the total thickness of the vapor chamber structure 1 of the present invention is equal to or smaller than 0.25 mm. Therefore, the vapor chamber structure 1 of the present invention effectively improves the shortcoming of the conventional vapor chamber that in the thinning process, the capillary structure cannot be extremely thinned.

[0029] The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in such as the form or layout pattern or practicing step of the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.