POLISHING APPARATUS INCLUDING MOVABLE DAMPER

Abstract

A polishing apparatus includes a spindle having a grinder wheel in a lower portion of the spindle, a housing surrounding the spindle, and a movable damper, wherein the movable damper includes a lower bracket provided between a perimeter of the spindle and an inner perimeter of the housing, wherein the spindle passes through the lower bracket, an upper bracket apart from the lower bracket in a vertical direction and provided above the lower bracket, and a first damper provided between the upper bracket and the lower bracket and between the spindle and the housing and configured to move along the lower bracket, wherein the first damper includes a damper plate including an inner plate and an outer plate, an elastic member, and an expander.

Claims

1. A polishing apparatus comprising: a spindle having a grinder wheel in a lower portion of the spindle; a housing surrounding the spindle; and a movable damper, wherein the movable damper includes: a lower bracket provided between a perimeter of the spindle and an inner perimeter of the housing, wherein the spindle passes through the lower bracket; an upper bracket apart from the lower bracket in a vertical direction and provided above the lower bracket; and a first damper provided between the upper bracket and the lower bracket and between the spindle and the housing and configured to move along the lower bracket, wherein the first damper includes a damper plate including an inner plate and an outer plate, an elastic portion provided between the inner plate and the outer plate, and an expander provided between the inner plate and the outer plate, wherein the inner plate is adjacent to the spindle, and the outer plate is adjacent to the inner perimeter of the housing, and wherein the expander is configured to expand or contract.

2. The polishing apparatus of claim 1, wherein the polishing apparatus is configured such that, when the expander expands, the damper plate comes into contact with the spindle and the housing, and when the expander contracts, the damper plate is separated from the spindle and the housing.

3. The polishing apparatus of claim 1, wherein the first damper is configured to move, together with the upper bracket according to rotation of the upper bracket, between the spindle and the housing.

4. The polishing apparatus of claim 1, wherein the polishing apparatus is configured such that, when the expander expands, a gripping force between the inner plate and the spindle and a gripping force between the outer plate and the housing are provided by the expander, and the elastic portion provides a restoring force between the inner plate and the outer plate to restore a distance of separation between the inner plate and the outer plate.

5. The polishing apparatus of claim 1, wherein the polishing apparatus is configured such that, when the expander expands and the damper plate comes into contact with the spindle and the housing, an expansion force applied by the expander between the inner plate and the outer plate is greater than a contractile force applied by the elastic portion between the inner plate and the outer plate.

6. The polishing apparatus of claim 1, wherein the first damper includes an upper linear rail, a lower linear rail, and a guide rail, the guide rail is provided on the lower bracket so that the first damper is configured to move along the lower bracket with respect to the lower bracket, and the upper linear rail and the lower linear rail are respectively provided above and below the inner plate and the outer plate so that the inner plate and the outer plate are configured to move between the spindle and the housing.

7. The polishing apparatus of claim 6, wherein the lower linear rail is provided on the guide rail.

8. The polishing apparatus of claim 1, wherein the first damper is one of a plurality of first dampers that are provided symmetrically with respect to a center of the spindle between the upper bracket and the lower bracket.

9. The polishing apparatus of claim 1, wherein a fluid line connected to the variable portion is provided on the upper bracket and is configured to supply a gas to the expander, and the expander is configured to be pressurized by the fluid line to expand or depressurized by the fluid line to contract.

10. The polishing apparatus of claim 1, further comprising: a driving device and a rotary joint, wherein the driving device is configured to provide power to the upper bracket to cause the upper bracket to rotate relative to the lower bracket, wherein the rotary joint is provided between the driving device and the upper bracket, and wherein a fluid line extends through the rotary joint and is connected to the expander.

11. The polishing apparatus of claim 10, further comprising: at least one vibration sensor provided on the housing or a separate outer wall, the at least one vibration sensor being configured to measure vibration of the spindle; and a controller configured to receive a vibration measurement result of the at least one vibration sensor and control the driving device and the expander based on the received vibration measurement result, wherein the controller is configured to control the driving device to move the first damper, based on the vibration measurement result from the vibration sensor.

12. The polishing apparatus of claim 1, further comprising: a second damper provided between the upper bracket and the lower bracket and between the spindle and the housing, configured to move along the lower bracket, the second damper being positioned apart from the first damper; wherein the second damper is configured to move separately from the first damper.

13. The polishing apparatus of claim 1, wherein a shape of the inner plate matches a portion of a shape of the perimeter of the spindle, and a shape of the outer plate matches a portion of a shape of the inner perimeter of the housing.

14. The polishing apparatus of claim 1, wherein opposing ends of the expander are respectively provided at a center of the inner plate and a center of the outer plate, the elastic portion is apart from the expander, and the elastic portion is symmetrically arranged around the expander, between the inner plate and the outer plate.

15. A polishing apparatus comprising: an upper bracket provided above a spindle, the spindle having a grinder wheel in a lower portion of the spindle; and a first damper provided between the spindle and a housing surrounding the spindle, and provided on a lower surface of the upper bracket, wherein the first damper includes: a damper plate including an inner plate adjacent to the spindle and an outer plate adjacent to an inner perimeter of the housing; a an expander provided between the inner plate and the outer plate; and an elastic portion apart from the expander and provided between the inner plate and the outer plate, wherein a shape of the spindle when viewed in a plan view is a circle, wherein the first damper is configured to move, according to rotation of the upper bracket, between the spindle and the housing, wherein the expander is configured to expand or contract, and wherein the polishing apparatus is configured such that, when the expander expands, the inner plate and the outer plate come into contact with the spindle and the housing, respectively.

16. The polishing apparatus of claim 15, wherein the polishing apparatus is configured such that, when the expander expands and the inner plate and the outer plate come into contact with the spindle and the housing, respectively, an expansion force applied by the expander between the inner plate and the outer plate is greater than a contractile force applied by the elastic portion between the inner plate and the outer plate.

17. The polishing apparatus of claim 15, wherein the first damper is one of a plurality of first dampers, and the plurality of first dampers are arranged at equal intervals around the spindle when viewed in plan view.

18. The polishing apparatus of claim 15, further comprising a driving device and a rotary joint, wherein the driving device is configured to provide power to the upper bracket to cause the upper bracket to rotate relative to the housing, wherein the rotary joint is provided between the driving device and the upper bracket, and wherein the driving device is configured to rotate the upper bracket without moving the rotary joint, and wherein a fluid line extends through the rotary joint and is connected to the expander.

19. The polishing apparatus of claim 15, wherein a shape of the inner plate matches a portion of a shape of a perimeter of the spindle, and a shape of the outer plate matches a portion of a shape of an inner perimeter of the housing.

20. A polishing apparatus comprising: a spindle having a grinder in a lower portion of the spindle; a housing surrounding the spindle; and a movable damper, wherein the movable damper includes: a lower bracket provided between a perimeter of the spindle and an inner perimeter of the housing, wherein the spindle passes through the lower bracket; an upper bracket apart from the lower bracket in a vertical direction and provided above the lower bracket; a first damper provided between the upper bracket and the lower bracket and between the spindle and the housing, the first damper being configured to move along the lower bracket; a driving device configured to provide power to the upper bracket to cause the upper bracket to rotate relative to the lower bracket; and a rotary joint provided between the driving device and the upper bracket, wherein the first damper includes: a damper plate including an inner plate adjacent to the spindle and an outer plate adjacent to the inner perimeter of the housing; an expander provided between the inner plate and the outer plate; an elastic portion provided between the inner plate and the outer plate; an upper linear rail; a lower linear rail; a guide rail; and a fluid line connected to the expander, wherein the first damper is configured to move together with the upper bracket, between the spindle and the housing, according to rotation of the upper bracket, wherein the expander is configured to expand or contract, wherein the guide rail is provided on the lower bracket so that the first damper moves along the lower bracket with respect to the lower bracket, wherein the upper linear rail and the lower linear rail are respectively provided above and below the inner plate and the outer plate so that the inner plate and the outer plate are configured to move between the spindle and the housing, wherein the lower linear rail is provided on the guide rail, wherein the fluid line is connected to the expander through the rotary joint, wherein a shape of the inner plate matches a portion of a shape of the perimeter of the spindle and a shape of the outer plate matches a portion of a shape of the inner perimeter of the housing, wherein opposing ends of the expander are respectively provided at a center of the inner plate and a center of the outer plate, wherein the elastic portion is apart from the expander and symmetrically arranged around the expander, wherein the polishing apparatus is configured such that: when the expander expands, the damper plate comes into contact with the spindle and the housing, and when the expander contracts, the damper plate is separated from the spindle and the housing, when the expander expands, the expander provides a gripping force between the inner plate and the spindle and between the outer plate and the housing, and when the expander expands and the damper plate comes into contact with the spindle and the housing, an expansion force applied by the expander between the inner plate and the outer plate is greater than a contractile force applied by the elastic portion between the inner plate and the outer plate, and wherein the expander and the elastic portion are configured to damp relative movement between the outer plate and the inner plate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Embodiments are more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which:

[0011] FIG. 1 is a perspective view schematically illustrating a polishing apparatus including a movable damper according to embodiments;

[0012] FIG. 2A is a cross-sectional view illustrating a polishing apparatus including a movable damper according to embodiments;

[0013] FIG. 2B is a cross-sectional view taken along line A-A of the polishing apparatus including a movable damper according to embodiments of FIG. 2A;

[0014] FIG. 3A is a cross-sectional view illustrating a polishing apparatus including a movable damper according to embodiments;

[0015] FIG. 3B is a cross-sectional view taken along line B-B of the polishing apparatus including a movable damper of FIG. 3A according to embodiments;

[0016] FIGS. 4A to 4C are cross-sectional views illustrating operations of a polishing apparatus including a movable damper according to embodiments;

[0017] FIG. 5 is a cross-sectional view taken along line A-A of the polishing apparatus including a movable damper according to embodiments of FIG. 2A;

[0018] FIG. 6A is a cross-sectional view illustrating a polishing apparatus including a movable damper according to embodiments;

[0019] FIG. 6B is a top plan view of a polishing apparatus including a movable damper according to embodiments;

[0020] FIG. 6C is a plan view illustrating operation of a polishing apparatus including a movable damper according to embodiments; and

[0021] FIG. 7 is a cross-sectional view illustrating a polishing apparatus including a movable damper according to embodiments.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] Hereinafter, embodiments of the inventive concept are described in detail with reference to the accompanying drawings.

[0023] Embodiments of the inventive concept are provided to more completely describe the inventive concept for those skilled in the art, and the following embodiments may be modified in various different forms, and the scope of the inventive concept is not limited to the following embodiments. Rather, these embodiments are provided so that the disclosure are more thorough and complete and will fully convey the spirit of the technical ideas of the inventive concept to those skilled in the art. In addition, the thickness and size of each layer in the drawings may be exaggerated for convenience and clarity of description.

[0024] In this specification, a first direction refers to an X direction, a second direction refers to a Y direction, and the first direction and the second direction may be perpendicular. A third direction may be a Z direction and may be perpendicular to each of the first direction and the second direction. A horizontal plane or plane refers to the X-Y plane. An upper surface of an object refers to a surface located in a positive third direction based on the object, and a lower surface of the object refers to a surface located in a negative third direction based on the object. Use of such ordinarl numbers (first, second, etc.) may be altered such that a term (e.g., direction) that is referenced with a particular ordinarl number (e.g., first) in a particular claim may be described elsewhere with a different ordinarl number (e.g., second) in the specification or another claim.

[0025] Throughout the specification, when a component is described as including a particular element or group of elements, it is to be understood that the component is formed of only the element or the group of elements, or the element or group of elements may be combined with additional elements to form the component, unless the context indicates otherwise. The term consisting of, on the other hand, indicates that a component is formed only of the element(s) listed.

[0026] It will be understood that when an element is referred to as being connected or coupled to or on another element, it can be directly connected or coupled to or on the other element or intervening elements may be present. In contrast, when an element is referred to as being directly connected or directly coupled to another element, or as contacting or in contact with another element (or using any form of the word contact), there are no intervening elements present at the point of contact.

[0027] Spatially relative terms, such as beneath, below, lower, above, upper, top, bottom, and the like, may be used herein for ease of description to describe one element's or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as below or beneath other elements or features would then be oriented above the other elements or features. Thus, the term below can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0028] An item, layer, or portion of an item or layer described as extending or as extending lengthwise in a particular direction has a length in the particular direction and a width perpendicular to that direction, where the length is greater than the width.

[0029] FIG. 1 is a perspective view schematically illustrating a polishing apparatus 1 including a movable damper according to embodiments. FIG. 2A is a cross-sectional view illustrating the polishing apparatus 1 including a movable damper according to embodiments. FIG. 2B is a cross-sectional view taken along line A-A of the polishing apparatus 1 including a movable damper according to embodiments of FIG. 2A. FIG. 3A is a cross-sectional view illustrating the polishing apparatus 1 including a movable damper according to embodiments. FIG. 3B is a cross-sectional view taken along line B-B of the polishing apparatus including a movable damper of FIG. 3A according to embodiments. In detail, FIGS. 2A and 2B illustrate a case in which a variable portion 130 does not expand (e.g., is not in an expanded state), and FIGS. 3A and 3B illustrate a case in which the variable portion 130 expands (e.g., is in an expanded state).

[0030] Referring to FIG. 1, the polishing apparatus 1 including a movable damper may include a spindle 200, a housing 300 surrounding the spindle 200, and a movable damper 100 partially inserted between the spindle 200 and the housing 300.

[0031] The spindle 200 may include a grinding wheel 210 that contacts a substrate W at the bottom thereof to perform polishing of the substrate W. The spindle 200 may have, for example, a cylindrical shape and a circular planar shape. The grinding wheel 210 may have a plurality of polishing blades protruding downward from a lower surface thereof. The polishing blades may contact one surface of the substrate W through rotation provided by the spindle, thereby polishing the one surface of the substrate W.

[0032] The polishing blades may include polishing particles and a binder. The polishing particles may include diamond, cubic boron nitride (CBN), calcium carbonate, emery, novaculite, ferric oxide, ceramic, alumina, glass, silica, silicon carbide or zirconia. In an embodiment, the polishing particles may include diamond. The polishing particles may be provided to be mixed with the binder. For example, the binder may encapsulate the polishing particles.

[0033] The spindle 200 may be configured to make a translational movement in a vertical direction (a Z-axis direction) or on the X-Y plane with respect to the substrate W. The translational movement may be provided by moving the entire polishing apparatus 1 including the movable damper including the spindle 200, moving the spindle 200, or moving a chuck CK on which the substrate W is placed.

[0034] The housing 300 surrounds the perimeter of the spindle 200 but may be apart from the perimeter of the spindle 200. Some components of the spindle 200 may be connected to the housing 300, and the spindle 200 may be configured to move up and down relative to the housing 300. For example, the spindle 200 may have a spindle bracket 220 protruding from the periphery of the spindle 200, and the housing 300 may have a groove 310G recessed in an outer diameter direction on the inner perimeter of the housing 300 and a vertical guide 310 extending vertically inside the groove 310G. The vertical guide 310 of the housing 300 may pass through the spindle bracket 220. The spindle bracket 220, the groove 310G, and the vertical guide 310 may be collectively referred to as a first joint JT1. Through a separate power supply device that is not shown, the spindle bracket 220 may move up and down on the vertical guide 310. Accordingly, the spindle 200 is configured to have a constraint on a horizontal movement with respect to the housing 300 through a first joint JT1, and at the same time, the spindle 200 may be configured to perform a relative vertical movement with respect to the housing 300. However, this is merely an example, and the inventive concept is not limited by a detailed connection method between the housing 300 and the spindle 200 described above.

[0035] The housing 300 is apart from the periphery of the spindle 200, and at least a portion of the movable damper 100 may be inserted between the housing 300 and the spindle 200. The movable damper 100 may include a first damper structure M1 (e.g., a first damper) and a second damper structure M2 (e.g., a second damper). The first damper structure M1 and the second damper structure M2 are positioned between the housing 300 and the spindle 200, and when the variable portion 130 provided in each of the first damper structure M1 and the second damper structure M2 (see, e.g., FIGS. 2 and 3) does not expand (e.g., is not in an expanded state), the first damper structure M1 and the second damper structure M2 may be apart from the spindle 200 and the housing 300 between the spindle 200 and the housing 300. For example, when the variable portion 130 of each of the first damper structure M1 and the second damper structure M2 is not in an expanded state, the first damper structure M1 and the second damper structure M2 are not in contact with the spindle 200 and the housing 300, and remain between the spindle 200 and the housing 300. FIG. 1 is a drawing illustrating inserting the movable damper 100 between the housing 300 and the spindle 200 and is an exploded perspective view illustrating the movable damper 100, the housing 300, and the spindle 200 disassembled from each other. A detailed description of the movable damper 100 will be provided later.

[0036] Referring to FIGS. 2A, 2B, 3A, and 3B, the movable damper 100 may include the first damper structure M1, the second damper structure M2, a lower bracket 160, an upper bracket 170, a controller 410, and a fluid supply device 420.

[0037] The first damper structure M1 may include an inner plate 110N, an outer plate 110T, an elastic portion 120 and a variable portion 130 provided between the inner plate 110N and the outer plate 110T, an upper linear moving device 140U (e.g., an upper linear rail) provided above the inner plate 110N and the outer plate 110T, a lower linear moving device 140B (e.g., a lower linear rail) provided below the inner plate 110N and the outer plate 110T, and a guide rail 150 provided between the lower bracket 160 and the lower linear moving device 140B. A configuration of the second damper structure M2 may be the same as that of the first damper structure M1.

[0038] The lower bracket 160 may have a ring shape so that the spindle 200 is positioned to penetrate the lower bracket 160. An inner perimeter 160N of the lower bracket 160 may be apart from a perimeter 200T of the spindle 200. At the same time, the outer perimeter 160T of the lower bracket 160 may be spaced from an inner perimeter 300N of the housing 300. That is, the lower bracket 160 may be apart from the spindle 200 and the housing 300 and provided between the spindle 200 and the housing 300. Alternatively, at least a portion of the inner perimeter 160N of the lower bracket 160 may contact the perimeter 200T of the spindle 200, or at least a portion of the outer perimeter 160T of the lower bracket 160 may contact the inner perimeter 300N of the housing 300. That is, at least a portion of the lower bracket 160 may be in contact with the spindle 200 and/or the housing 300.

[0039] A planar shape (e.g., a shape when viewed in a plan view from a vertical direction) of the spindle 200 may be circular. A planar shape of the inner perimeter 300N of the housing 300 may be circular. Similarly, planar shapes of the outer perimeter 160T of the lower bracket 160 and the inner perimeter 160N of the lower bracket 160 may be circular. For example, the planar shape of the inner perimeter 300N of the housing 300, the planar shape of the spindle 200, the planar shape of the outer perimeter 160T of the lower bracket 160, and the planar shape of the inner perimeter 160N of the lower bracket 160 may be concentric circles when viewed in a plan view. For example, a first center C1, which is the center of the planar shape of the spindle 200, may substantially match the center of the concentric circle. However, in some cross-sections, the shape of the perimeter 200T of the spindle 200 and the shape of the inner perimeter 300N of the housing 300 may not be circular. The first center C1 of the spindle 200 may refer to an imaginary line extending in the third direction (the Z-axis direction) passing through the center of the planar shape of the spindle 200, as shown in FIGS. 2A and 3A.

[0040] The first damper structure M1 may be provided on a lower surface of the upper bracket 170 between the housing 300 and the spindle 200. The inner plate 110N and the outer plate 110T may be collectively referred to as a damper plate 110. An upper end of the damper plate 110 may be connected to the upper linear moving device 140U provided on a lower surface of the upper bracket 170.

[0041] The inner plate 110N and the outer plate 110T included in the damper plate 110 may be moved away from or closer to each other by the upper linear moving device 140U. The inner plate 110N may be guided to move closer to or away from the perimeter 200T of the spindle 200 by the upper linear moving device 140U. Similarly, the outer plate 110T may be guided to move closer to or away from the inner perimeter 300N of the housing 300 by the upper linear moving device 140U. The inner plate 110N and the outer plate 110T may each have a corresponding weight in the range of, for example, 0.200 kg to 5 kg. However, the inventive concept is not limited by the weight examples of the inner plate 110N and the outer plate 110T.

[0042] The upper linear moving device 140U may extend in the first direction (the X-axis direction) in the same manner as the lower linear moving device 140B illustrated in FIG. 2B, when the first damper structure M1 and the second damper structure M2 are positioned in the 3 o'clock direction and the 9 o'clock direction, respectively, with respect to the first center C1 of the spindle 200. Because the upper linear moving device 140U extends in the first direction (the X-axis direction), the inner plate 110N and the outer plate 110T may move in the first direction (the X-axis direction).

[0043] For example, the upper linear moving device 140U may include a linear rail and a rail block configured to be movable within the linear rail, and the rail block may be configured to move back and forth in one direction relative to the linear rail within the linear rail. Also, a portion of the damper plate 110 may be connected to the rail block, or the rail block may be a portion of the damper plate 110. However, the configuration of the upper linear moving device 140U described above is only an example, and the inventive concept is not limited by the configuration of the upper linear moving device 140U.

[0044] The planar shape of the inner plate 110N (e.g., the shape when viewed in a plan view from the vertical direction as shown, e.g., in FIG. 2B) may be a shape that matches a portion of the perimeter of the spindle 200. For example, the planar shape of the inner plate 110N may have a shape of an arc that is the same as a portion of the perimeter 200N of the spindle 200. When the inner plate 110N moves and comes into contact with the perimeter 200N of the spindle 200, the inner plate 110N may be in substantially uniform contact with the perimeter 200N of the spindle 200. That is, the curvature of the perimeter 200N of the spindle 200 may substantially match the curvature of the inner surface of the inner plate 110N.

[0045] The planar shape of the outer plate 110T may match a portion of the inner perimeter 300N of the housing 300. For example, the planar shape of the outer plate 110T may have an arc shape that is the same as a portion of the inner perimeter 300N of the housing 300. When the outer plate 110T moves and comes into contact with the inner perimeter 300N of the housing 300, the outer plate 110T may be in substantially uniform contact with the inner perimeter 300N of the housing 300. That is, the curvature of the inner perimeter 300N of the housing 300 may substantially match the curvature of the outer surface of the outer plate 110T.

[0046] The variable portion 130 (e.g., an expander, a pleated expander, an expander-compressor a turbo-expander, or an accordion expander) may be provided between the inner plate 110N and the outer plate 110T. Opposing ends of the variable portion 130 may be located at the center of the inner plate 110N and the center of the outer plate 110T, respectively. The variable portion 130 may be configured to expand or contract using a fluid supplied from the outside. For example, the variable portion 130 may be a damper for vibration absorption. That is, the variable portion 130 is provided between the inner plate 110N and the outer plate 110T, so that a relative movement occurring between the inner plate 110N and the outer plate 110T may be damped. The variable portion 130 may be, for example, a pneumatic damper including a cylinder into which air is introduced, a piston extending inside the cylinder, a spring, etc., or may be a tube that expands in one direction by pressurization of gas or contracts by depressurization. For example, the variable portion may be a collapsible tube or cylinder having a pleated shape or an accordion shape.

[0047] For example, the variable portion 130 may include a damper, such as an oil damper, a gas damper, a pneumatic damper, or a friction damper. In this description, the variable portion 130 is described as, for example, a pneumatic damper, but the inventive concept is not limited thereto.

[0048] The variable portion 130 may expand or contract through a first fluid line 172. When pressurized fluid is supplied through the first fluid line 172, the variable portion 130 may expand, and when the fluid is discharged from the variable portion 130 through the first fluid line 172, the variable portion 130 may contract. The fluid may be supplied from a fluid supply device 420 provided externally, or the fluid may be discharged to the fluid supply device 420. The first fluid line 172 may be a tube through which the fluid may flow, a line formed in the movable damper 100, or a combination thereof. The first fluid line 172 may be connected from the rotary joint 181 to be described below to a variable portion 130. The rotary joint 181 may be connected to the fluid supply device 420 by an external fluid line 171.

[0049] A direction in which the variable portion 130 contracts or expands may match a relative movement direction between the inner plate 110N and the outer plate 110T. That is, the direction in which the variable portion 130 contracts or expands may match the direction of relative movement of the damper plate 110 guided by the upper linear moving device 140U. For example, when the relative movement direction between the inner plate 110N and the outer plate 110T is a radial direction based on the first center C1 which is the center of the spindle 200, the direction in which the variable portion 130 contracts or expands may also be the radial direction based on the first center C1 of the spindle 200.

[0050] For example, as illustrated in FIG. 2B, in the first damper structure M1, the variable portion 130 may contract or expand in the first direction (the X-axis direction) matching the radial direction toward the first center C1 of the spindle 200, and similarly, the relative movement direction between the inner plate 110N and the outer plate 110T may be the first direction (the X-axis direction). The relative movement between the damper plates 110 guided by the upper linear moving device 140U may also be made in the first direction (the X-axis direction). A first virtual axis VLX is a virtual line in the first direction (the X-axis direction) passing through the first center C1 of the spindle 200 to describe the rotation of the movable damper 100 and is described below together with the description of FIG. 4A.

[0051] With respect to the radial direction based on the first center C1 of the spindle 200, a distance between one surface of the inner plate 110N adjacent to the perimeter 200T of the spindle 200 and one surface of the outer plate 110T adjacent to the inner perimeter 300N of the housing 300 may be referred to as a plate width MW. As illustrated in FIG. 2B, the plate width MW when the variable portion 130 does not fully expand (e.g., is in a contracted state) may be referred to as a first plate width MW1. As illustrated in FIG. 3B, the plate width MW when the variable portion 130 expands (e.g., is in an expanded state) may be referred to as a second plate width MW2. With respect to the radial direction based on the first center C1 of the spindle 200, a width between the perimeter 200T of the spindle 200 and the inner perimeter 300N of the housing 300 may be referred to as a first width W1.

[0052] The first width W1 may be greater than the first plate width MW1 when the variable portion 130 does not expand. The inner plate 110N and the outer plate 110T may not contact either of the perimeter 200T of the spindle 200 and the inner perimeter 300N of the housing 300. However, the spindle 200 may vibrate due to the polishing process of the substrate W described above. In this case, even if the variable portion 130 does not expand, the inner plate 110N or the outer plate 110T may each come into contact with the perimeter 200T of the spindle 200 and the inner perimeter 300N of the housing 300.

[0053] Because the first plate width MW1 is smaller than the first width W1, even if vibration of the spindle 200 occurs due to the polishing process when the variable portion 130 does not expand, the first damper structure M1 does not apply force to the spindle 200 and the housing 300. When the variable portion 130 expands, the second plate width MW2 may be equal to the first width W1, and also, due to the force of the variable portion 130 to expand, the damper plates 110 may apply force to the spindle 200 and the housing 300, respectively.

[0054] The damper plates 110 may each include a material having friction. For example, the inner plate 110N and the outer plate 110T may each have a material having friction in a portion that contacts the spindle 200 and a portion that contacts the housing 300, respectively. For example, a surface of at least a portion of the inner plate 110N and the outer plate 110T may be covered with a high-friction polymer material, such as rubber.

[0055] As the damper plate 110 comes into contact with the spindle 200 and the housing 300 due to the expansion of the variable portion 130, a force sufficient to damp vibration of the spindle 200 may be applied to the spindle 200 and the housing 300 by the damper plate 110. The variable portion 130 may apply a force in a direction in which the inner plate 110N and the outer plate 110T move away from each other. In other words, due to the force of the variable portion 130 to expand, a force applied by the inner plate 110N to the perimeter 200T of the spindle 200 and a force applied by the outer plate 110T to apply to the inner perimeter 300N of the housing 300 may be generated.

[0056] In order to sufficiently damp the movement of the spindle 200 vibrating relative to the housing 300, the force applied by the inner plate 110N and the outer plate 110T to the spindle 200 and the housing 300 is required. For example, due to the expansion of the variable portion 130, the inner plate 110N and the outer plate 110T may apply a force of about 10 N to 200 N to the spindle 200 and the housing 300. The magnitude of the force applied by the inner plate 110N and the outer plate 110T to the spindle 200 and the housing 300 is an example and the inventive concept is not limited thereto.

[0057] As the magnitude of the force that the damper plate 110 applies to the spindle 200 and the housing 300 increases, the pressure of the fluid inside the variable portion 130 may increase, so the characteristics of the variable portion 130 operating as a damper may change. Therefore, the degree of expansion of the variable portion 130 or the amount of the pressure of the fluid pressurized in the variable portion 130 needs to be adjusted depending on the vibration characteristics occurring in the spindle 200. Therefore, the pressure of the fluid within the variable portion 130 needs to be adjusted depending on the direction, size, and characteristics of the vibration occurring in the spindle 200. This may vary depending on factors, such as the amount of polishing per unit time of the substrate W of the spindle 200.

[0058] The elastic portion 120 may be provided between the damper plates 110. That is, the elastic portion 120 may be provided between the inner plate 110N and the outer plate 110T. The elastic portion 120 may be provided apart from the variable portion 130 provided between the inner plate 110N and the outer plate 110T. Opposing ends of the elastic portion 120 may be connected to the inner plate 110N and the outer plate 110T, respectively. The elastic portion 120 may be, for example, a spring or a string including a polymer material, but any suitable material having elasticity may be used.

[0059] The elastic portions 120 may be symmetrically provided based on the variable portion 130 on the inner plate 110N and the outer plate 110T. For example, as can be seen from FIGS. 2A and 2B, four elastic portions 120 may be provided on the inner plate 110N and the outer plate 110T based on the variable portion. The elastic portion 120 may provide elastic force to each of the inner plate 110N and the outer plate 110T. For example, the elastic portions 120 may be positioned radially symmetrically about a center of the variable portion 130 when viewed from the X direction.

[0060] In a state in which the variable portion 130 does not expand at all, the elastic portion 120 may provide a small amount of contractile force between the inner plate 110N and the outer plate 110T. Alternatively, in a state in which the variable portion 130 does not expand at all, the elastic portion 120 may not provide a separate force between the inner plate 110N and the outer plate 110T. When the variable portion 130 expands, the elastic portion 120 may provide a sufficiently large contractile force between the inner plate 110N and the outer plate 110T. However, the contractile force provided by the elastic portion 120 between the inner plate 110N and the outer plate 110T may be smaller than an expansion force provided by the variable portion 130 between the inner plate 110N and the outer plate 110T.

[0061] Herein, the expansion force provided by the variable portion 130 may refer to a force applied by the variable portion 130 in a direction in which the inner plate 110N and the outer plate 110T move away from each other. The expansion force of the variable portion 130 may vary depending on the amount of fluid supplied from the fluid supply device 420 or pressure of the fluid, and because the fluid supply device 420 is controlled by the controller 410, the expansion force of the variable portion 130 may be controlled by the controller 410.

[0062] When the variable portion 130 expands, the expansion force that the variable portion 130 applies to the inner plate 110N and the outer plate 110T is greater than the contractile force that the elastic portion 120 applies to the inner plate 110N and the outer plate 110T. The expansion of the variable portion 130 may secure a gripping force between the perimeter 200T of the spindle 200 and the inner plate 110N, securing gripping force between the inner perimeter 300N of the housing 300 and the outer plate 110T and for damping vibration between the inner plate 110N and the outer plate 110T. The elastic portion 120 may provide restoring force to separate the inner plate 110N and the outer plate 110T from the perimeter 200T of the spindle 200 and the inner perimeter 300N of the housing 300 when the variable portion 130 contracts.

[0063] The gripping force between the perimeter 200T of the spindle 200 and the inner plate 110N may refer to frictional force between the perimeter 200T of the spindle 200 and the inner plate 110N that occurs due to normal force that the inner plate 110N receives from the perimeter 200T of the spindle 200. The gripping force between the inner perimeter 300N of the housing 300 and the outer plate 110T may refer to frictional force between the inner perimeter 300N of the housing 300 and the outer plate 110T that occurs due to normal force that the outer plate 110T receives from the inner perimeter 300N of the housing 300.

[0064] The gripping force between the perimeter 200T of the spindle 200 and the inner plate 110N and the gripping force between the inner perimeter 300N of the housing 300 and the outer plate 110T when the variable portion 130 expands enable the perimeter 200T of the spindle 200 to be continuously affixed to the inner plate 110N and enable the inner perimeter 300N of the housing 300 to be continuously affixed to the outer plate 110T although vibration occurs in the spindle 200 due to the polishing process described above.

[0065] The lower linear moving device 140B may be provided at a lower end of the damper plate 110. The inner plate 110N may be guided to move closer to or farther away from the perimeter 200T of the spindle 200 by the lower linear moving device 140B. Similarly, the outer plate 110T may be guided to move closer to or farther away from the inner perimeter 300N of the housing 300 by the lower linear moving device 140B.

[0066] For example, as shown in FIG. 2B, when the first damper structure M1 and the second damper structure M2 are positioned in the 3 o'clock direction and the 9 o'clock direction, respectively (e.g., when viewed in a plan view from a vertical direction oriented such that the Y direction is the 12 o'clock direction and the X direction is the 3 o'clock direction), with respect to the first center C1 of the spindle 200, the lower linear moving device 140B may extend parallel to the first direction (the X-axis direction). Because the lower linear moving device 140B extends parallel to the first direction (the X-axis direction), the inner plate 110N and the outer plate 110T may move in the first direction (the X-axis direction). A detailed description of the configuration of the lower linear moving device 140B may be substantially the same as the description of the configuration of the upper linear moving device 140U given above.

[0067] The moving direction guided by the lower linear moving device 140B may match the moving direction guided by the upper linear moving device 140U. For example, as shown in FIG. 2B, when the first damper structure M1 and the second damper structure M2 are positioned in the 3 o'clock direction and the 9 o'clock direction, respectively, with respect to the first center C1 of the spindle 200, the upper linear moving device 140U and the lower linear moving device 140B may guide the damper plate 110 to move in the first direction.

[0068] In some embodiments, the moving direction guided by the lower linear moving device 140B and the upper linear moving device 140U, an extending direction of the elastic portion 120, and an extending direction of the variable portion 130 may all be parallel to each other. For example, as shown in FIG. 2B, when the first damper structure M1 and the second damper structure M2 are positioned in the 3 o'clock direction and the 9 o'clock direction, respectively, with respect to the first center C1 of the spindle 200, the upper linear moving device 140U and the lower linear moving device 140B may guide the damper plate 110 to move in the first direction, the elastic portion 120 may extend in the first direction, and the variable portion 130 may also extend in the first direction.

[0069] The guide rail 150 may be provided between the lower bracket 160 and the lower linear moving device 140B. The guide rail 150 may guide the relative movement between the lower linear moving device 140B and the lower bracket 160. For example, as shown in FIG. 2B, the guide rail 150 may move along a rail groove RG. That is, because the first damper structure M1 including the lower linear moving device 140B is provided on the guide rail 150, the first damper structure M1 may move along the rail groove RG. Similarly, the second damper structure M2 may move along the rail groove RG.

[0070] The rail groove RG may be provided on the lower bracket 160. The guide rail 150 may move along the rail groove RG, which is a groove formed beneath the lower bracket 160. As shown in FIG. 2A, a bearing may be provided between the rail groove RG and the guide rail 150 so that the guide rail 150 moves on the rail groove RG. In some other embodiments, the guide rail 150 may be configured to move along a rail protruding upward from the lower bracket 160. That is, the guide rail 150 guides the movement of the first damper structure M1 along an upper surface of the lower bracket 160, and a detailed configuration of the guide rail 150 of the inventive concept is not limited by the description given above.

[0071] The upper bracket 170 may have a disc shape covering an upper surface of the spindle 200 from a planar perspective. Alternatively, the upper bracket 170 may be provided above the spindle 200 in a planar view (e.g., in a plan view) and may have a shape extending from the upper end of the first damper structure M1 and the upper end of the second damper structure M2 in the shape of a bar passing through the first center C1 of the spindle 200.

[0072] The rotary joint 181 and a driving device 182 may be provided vertically above the center of the upper bracket 170, that is, a point at which the first center C1 of the spindle 200 and the upper bracket 170 meet. The driving device 182 may be, for example, an electric motor. The driving device 182 may transmit rotational power to the rotary joint 181 through a driving shaft 183. The rotational power by the driving device 182 may rotate the upper bracket 170 to move the positions of the first damper structure M1 and the second damper structure M2 connected to the upper bracket 170. According to the rotation of the upper bracket 170, the first damper structure M1 and the second damper structure M2 may be moved together with the upper bracket 170.

[0073] The rotary joint 181 may be configured so that other components are not affected by the rotational movement from the components that rotate due to the driving device 182. At the same time, the rotary joint 181 may be configured to transfer fluid between a rotating component and a fixed component. For example, the rotary joint 181 may be configured so that the first fluid line 172 connected to the rotary joint 181 from the fluid supply device 420 is not affected by (e.g., does not move because of) the rotational movement of the upper bracket 170 by the driving device 182. Accordingly, through the rotary joint 181, the fluid may be transmitted among the external fluid line 171 that does not rotate, the first upper bracket 170configured to rotate by the driving device 182, the first damper structure M1, and the second damper structure M2.

[0074] The rotary joint 181 may include, for example, a housing that connects a rotating component and the fluid, a rotary shaft connected to the rotating component, a seal that seals the fluid not to leak around the rotary shaft, a bearing for rotational movement, and a path through which the fluid moves within the rotary joint 181. However, the inventive concept is not limited by the configuration of the rotary joint 181 described above.

[0075] The controller 410 may control the polishing apparatus 1 including a movable damper. For example, the controller 410 may control the spindle 200 and the housing 300 together with the movable damper 100, or the controller 410 may exchange signals with a separate controller that controls the spindle 200 and the housing 300, while directly controlling the movable damper 100.

[0076] The controller 410 may control, for example, the driving device 182 and the fluid supply device 420. The controller 410 may control the movable damper 100 based on operation information of the spindle 200 and the housing 300. While performing a polishing process using the spindle 200 that has already been set, the movable damper 100 may be moved in a direction to minimize vibration of the spindle 200 that occurs during the corresponding process.

[0077] For example, the vibration of the spindle 200 may mainly have a component in the first direction (the X-axis direction). In this case, the controller 410 may control the driving device 182 so that, in the movable damper 100, the first damper structure M1 is positioned in the 3 o'clock direction and the second damper structure M2 is positioned in the 9 o'clock direction with respect to the first center C1 of the spindle 200, as shown in FIGS. 2A and 2B, in order to damp the vibration in the first direction. Alternatively, for the same case, unlike FIGS. 2A and 2B, the controller 410 may control the driving device 182 so that the first damper structure M1 is positioned in the 9 o'clock direction and the second damper structure M2 is positioned in the 3 o'clock direction.

[0078] With the first damper structure M1 and the second damper structure M2 positioned at the intended positions, the controller 410 may control the fluid supply device 420 to apply the fluid to the variable portion 130 through the external fluid line 171 and the first fluid line 172. For example, the first damper structure M1 may be positioned in the 3 o'clock direction and the second damper structure M2 may be positioned in the 9 o'clock direction with respect to the first center C1 of the spindle 200. When the first damper structure M1 and the second damper structure M2 are expanded by the expansion of the variable portion 130, the first damper structure M1 and the second damper structure M2 may be fixed in place between the perimeter 200T of the spindle 200 and the inner perimeter 300N of the housing 300. In this state, if vibration occurs due to, for example, performing of the polishing process of the spindle 200, the vibration in the first direction may be primarily damped by the movable damper 100 including the first damper structure M1 and the second damper structure M2.

[0079] For example, the vibration of the spindle 200 may mainly have a component in the second direction (the Y-axis direction). In this case, in order to damp the vibration in the second direction, the controller 410 may control the driving device 182 so that, in the movable damper 100, the first damper structure M1 is positioned in the 12 o'clock direction and the second damper structure M2 is positioned in the 6 o'clock direction with respect to the first center C1 of the spindle 200, as shown in FIG. 4B. Alternatively, for the same case, unlike FIG. 4B, the controller 410 may control the driving device 182 so that the first damper structure M1 is positioned in the 6 o'clock direction and the second damper structure M2 is positioned in the 12 o'clock direction. The vibration direction of the spindle 200 described above may vary depending on various factors, such as, for example, the physical properties of the substrate W, a surface condition of the substrate W, hardness characteristics of a plurality of blades provided on the grinding wheel 210, a rotation speed of the spindle 200, and the amount of polishing of the substrate W per hour of the spindle 200.

[0080] For example, when the first damper structure M1 is positioned in the 12 o'clock direction and the second damper structure M2 is positioned in the 6 o'clock direction with respect to the first center C1 of the spindle 200, the controller 410 may control the fluid supply device 420 to apply the fluid to the variable portion 130 through the external fluid line 171 and the first fluid line 172. When the first damper structure M1 and the second damper structure M2 are expanded by the expansion of the variable portion 130, the first damper structure M1 and the second damper structure M2 may be fixed in place between the perimeter 200T of the spindle 200 and the inner perimeter 300N of the housing 300. In this state, if vibration occurs due to, for example, performing of the polishing process of the spindle 200, the vibration in the second direction may be primarily damped by the movable damper 100 having the first damper structure M1 and the second damper structure M2.

[0081] For example, a main vibration of the spindle 200 may have components in the first direction and the second direction at similar levels. In this case, the controller 410 may control the driving device 182 so that, in the movable damper 100, the first damper structure M1 is positioned in the 1 to 2 o'clock direction and the second damper structure M2 is positioned in the 7 to 8 o'clock direction with respect to the first center C1 of the spindle 200, as shown in FIG. 4A, in order to damp vibration directed in an oblique direction from the first direction. That is, the controller 410 may control the driving device 182 so that a first angle AG1 is 45 from the first virtual axis VLX extending in the X direction and passing through the first center C1. The first angle AG1 refers to an angle formed by the first virtual axis VLX and a line extending from the center of the first damper structure M1 and the center of the second damper structure M2 on a plane (e.g., the X-Y plane) based on the first center C1.

[0082] Alternatively, as shown in FIG. 4C, the controller 410 may control the driving device 182 so that the second damper structure M2 is positioned in the 4 to 5 o'clock direction and the first damper structure M1 is positioned in the 10 to 11 o'clock direction based on the first center C1 of the spindle 200. That is, the controller 410 may control the driving device 182 so that the first angle AG1 is 135 from the first virtual axis VLX based on the first center C1.

[0083] For example, as shown in FIG. 4A or FIG. 4C, the first damper structure M1 and the second damper structure M2 may be positioned. When the distance between the first damper structure M1 and the second damper structure M2 increases due to the expansion of the variable portion 130, the first damper structure M1 and the second damper structure M2 may be fixed in place between the perimeter 200T of the spindle 200 and the inner perimeter 300N of the housing 300. In this state, if vibration occurs due to, for example, performing of a polishing process of the spindle 200, the vibration in the direction extending from the first damper structure M1 and the second damper structure M2 may be primarily damped.

[0084] For example, in the case of FIG. 4A, among the vibrations of the spindle 200, the vibration component having a direction in which the first angle AG1 is 45 from the first virtual axis VLX based on the first center C1 may be primarily damped. As can be seen in FIG. 4A, the direction in which the first angle AG1 is 45 from the first virtual axis VLX based on the first center C1 is the same as the direction in which the first damper structure M1 and the second damper structure M2 extend. For example, the first damper structure M1 and the second damper structure M2 may be positioned such that the variable portion 130 of each is expandable in the direction in which the first angle AG1 is 45 from the first virtual axis VLX based on the first center C1.

[0085] As in the example described above, the spindle 200 may perform the polishing process with a polishing process recipe for the substrate W. By analyzing the vibration of the spindle 200 observed while performing the polishing process according to the polishing process recipe described above, a user may input to the controller 410 a position of the movable damper 100 in which the vibration of the spindle 200 is minimized as the polishing process recipe progresses. The controller 410 may control the movable damper 100 according to an execution operation of the polishing process recipe of the spindle 200 to damp the vibration of the spindle 200.

[0086] Alternatively, as described below with reference to FIG. 7, a polishing apparatus 1C including a movable damper 100C may include vibration sensors VS1 and VS2 that measure vibration in real time on the inner perimeter 300N or outer wall 510 of the housing 300. The controller 410 measures the vibration of the spindle 200 in real time through the vibration sensors VS1 and VS2 and controls the movable damper 100C in real time to minimize the vibration of the spindle 200, thereby damping the vibration of the spindle 200. A more detailed description is given below with reference to FIG. 7.

[0087] The controller 410 may control the polishing apparatus 1 includbing the spindle 200, the housing 300, and the movable damper 100. For example, the controller 410 may be implemented as a computer device, such as a personal computer or server that executes a control program. For example, the controller 410 may include a memory device, such as read only memory (ROM), random access memory (RAM), and/or a processor configured to perform certain operations and algorithms, such as a microprocessor, a central processing unit (CPU), a graphics processing unit (GPU), etc. In addition, the controller 410 may include a receiver and a transmitter for receiving and transmitting electrical signals.

[0088] The inner plate 110N and the outer plate 110T of the first damper structure M1 are connected to each other by the elastic portion 120 and the variable portion 130, and the movement of the inner plate 110N and the outer plate 110T is limited by the upper linear moving device 140U or the lower linear moving device 140B. Accordingly, the inner plate 110N and the outer plate 110T of the first damper structure M1 are controlled to move toward or away from each other. As shown in FIGS. 2A and 2B or other drawings, the direction in which the inner plate 110N and the outer plate 110T of the first damper structure M1 move toward or away from each other is a direction including components of the first direction and the second direction. Therefore, the polishing apparatus 1 including a movable damper according to embodiments may more effectively damp the vibration of the spindle 200 including components of the first direction and second direction, i.e., the vibration component on the X-Y plane among the vibrations of the spindle 200.

[0089] The polishing apparatus 1 including a movable damper according to embodiments may effectively damp relative vibration occurring between the spindle 200 and the housing 300. In particular, due to the structural characteristics of the movable damper 100, vibration having components of first direction (the X-axis direction) and second direction (the Y-axis direction) among the relative vibration components occurring between the spindle 200 and the housing 300 may be more effectively damped. Of course, a component in the third direction (the Z-axis direction) may also be damped to a certain level. Similarly, the vibration component in the third direction of a certain level may also be damped by the elastic portion 120 and the variable portion 130 because external force may be applied to the elastic portion 120 and the variable portion 130.

[0090] As the operation of the polishing process of the substrate W by the spindle 200 progresses, the first damper structure M1 and the second damper structure M2 of the movable damper 100 may be contracted by the controller 410, and the positions of the first damper structure M1 and the second damper structure M2 may be changed. In the changed positions of the changed first damper structure M1 and second damper structure M2, the first damper structure M1 and second damper structure M2 may expand again. In addition, although the polishing process is performed continuously, it is of course possible for the first damper structure M1 and the second damper structure M2 of the movable damper 100 to contract, move, and then expand again by the controller 410. By continuously performing the vibration damping of the spindle 200 described above, the vibration of the spindle 200 that occurs according to the stage of the polishing process of the substrate by the spindle 200 may be effectively damped.

[0091] Through the polishing apparatus 1 including a movable damper according to embodiments, the vibration of the spindle 200 performing the polishing process is damped, so that the polishing quality of the substrate may be improved through the polishing apparatus 1 including a movable damper.

[0092] FIGS. 4A to 4C are cross-sectional views illustrating the operation of the polishing apparatus 1 including a movable damper according to embodiments. Anything not described below may be substantially identical to what is described above.

[0093] Referring to FIG. 4A, the first damper structure M1 and the second damper structure M2 may be moved so that the first angle AG1 becomes 45 from the first virtual axis VLX that extends in the X direction and passes through the first center C1 by the controller 410 of FIGS. 2A to 3B described above. When arranged in this manner, the movable damper 100 may primarily damp the vibration component of the spindle 200 in the direction corresponding to 45 counterclockwise from the first virtual axis VLX, among the vibration components of the spindle 200.

[0094] Referring to FIG. 4B, the first damper structure M1 and the second damper structure M2 may be moved by the controller 410 so that the first angle AG1 becomes 90 from the first virtual axis VLX with respect to the first center C1. When arranged in this manner, the movable damper 100 may primarily damp the vibration component of the spindle 200 in the direction corresponding to 90 counterclockwise from the first virtual axis VLX, among the vibration components of the spindle 200.

[0095] Referring to FIG. 4C, the first damper structure M1 and the second damper structure M2 may be moved by the controller 410 so that the first angle AG1 becomes 135 from the first virtual axis VLX with respect to the first center C1. When arranged in this manner, the movable damper 100 may primarily damp the vibration component of the spindle 200 in the direction corresponding to 135 counterclockwise from the first virtual axis VLX, among the vibration components of the spindle 200. FIGS. 4A to 4C illustrate a case in which the variable portion 130 does not expand (e.g., is not in an expanded state). A case in which the variable portion 130 expands in FIGS. 4A to 4C may be understood with reference to FIGS. 3A and 3B.

[0096] FIG. 5 is a cross-sectional view taken along line A-A of a polishing apparatus 1A including a movable damper of FIG. 2A according to embodiments. Anything not described may be substantially identical to what is described above.

[0097] The polishing apparatus 1A including a movable damper may include the spindle 200, the housing 300 surrounding the spindle 200, and a movable damper 100A partially inserted between the spindle 200 and the housing 300.

[0098] The movable damper 100A may include the first damper structure M1, the second damper structure M2, a third damper structure M3, and the lower bracket 160, and the movable damper 100A may include the upper bracket 170, the controller 410, and the fluid supply device 420 described above with respect to FIGS. 2A and 2B.

[0099] The third damper structure M3 may have the same structure as the first damper structure M1. Accordingly, the movable damper 100A may include three damper structures, including the first damper structure M1, the second damper structure M2, and the third damper structure M3. For example, the first to third damper structures M1, M2, and M3 may be arranged such that the angles between the lines extending from the first center C1 of the spindle 200 to each of the first to third damper structures M1, M2, and M3 are equal. That is, the angles between the lines extending from the first center C1 of the spindle 200 to each of the first to third damper structures M1, M2, and M3 may be 120. For example, an angle between the line extending from the first center C1 to the first damper structure M1 and the line extending from the first center C1 to the second damper structure M2 may be 120, an angle between the line extending from the first center C1 to the second damper structure M2 and the line extending from the first center C1 to the third damper structure M3 may be 120, and an angle between the line extending from the first center C1 to the third damper structure M3 and the line extending from the first center C1 to the first damper structure M1 may be 120.

[0100] Because the first to third damper structures M1, M2, and M3 are arranged at equal intervals around the first center C1 of the spindle 200, the polishing apparatus 1A including the movable damper may overall damp the X-Y components of the vibration of the spindle 200. Alternatively, similarly to the description of FIGS. 2A to 3B, the controller 410 may control the driving device 182 to rotate the movable damper 100A including the first to third damper structures M1, M2, and M3 to more effectively damp the vibration of the spindle 200.

[0101] FIG. 6A is a cross-sectional view illustrating a polishing apparatus 1B including a movable damper according to embodiments. FIG. 6B is a top plan view of the polishing apparatus 1B including a movable damper according to embodiments. FIG. 6C is a plan view illustrating an operation of the polishing apparatus 1B including a movable damper according to embodiments. Anything not described below may be substantially identical to what is described above.

[0102] Referring to FIGS. 6A to 6C, the polishing apparatus 1B including a movable damper may include the spindle 200, the housing 300 surrounding the spindle 200, and a movable damper 100B partially inserted between the spindle 200 and the housing 300.

[0103] The movable damper 100B may include the first damper structure M1, the second damper structure M2, the first lower bracket 160, a first upper bracket 170A, a second upper bracket 190, the controller 410, and the fluid supply device 420.

[0104] The first damper structure M1 may include an inner plate 110N, an outer plate 110T, an elastic portion 120 and a variable portion 130 provided between the inner plate 110N and the outer plate 110T, an upper linear moving device 140U provided above the inner plate 110N and the outer plate 110T, a lower linear moving device 140B provided below the inner plate 110N and the outer plate 110T, and a guide rail 150 provided between the lower bracket 160 and the lower linear moving device 140B. The structures of the second damper structure M2, the third damper structure M3, and the fourth damper structure M4 may be the same as that of the first damper structure M1.

[0105] The first damper structure M1 and the second damper structure M2 may be connected to the first upper bracket 170A. That is, the first damper structure M1 and the second damper structure M2 may be respectively provided below opposing ends of the first upper bracket 170A.

[0106] The third damper structure M3 and the fourth damper structure M4 may be connected to the second upper bracket 190. That is, the first damper structure M1 and the second damper structure M2 may be respectively provided below opposing ends of the second upper bracket 190. The second upper bracket 190 may include a second horizontal upper bracket 190A and a second vertical upper bracket 190B. The second upper bracket 190 may be positioned above the first upper bracket 170A not to overlap the first upper bracket 170A. That is, the third damper structure M3 and the fourth damper structure M4 may be connected to opposite ends of the second horizontal upper bracket 190A, respectively, and the second horizontal upper bracket 190A may be connected to a lower end of the second vertical upper bracket 190B.

[0107] As described above, the first damper structure M1 and the second damper structure M2 may each be connected to the first fluid line 172A and may expand or contract. Fluid may flow to the first fluid line 172A from the fluid supply device 420 through the first external fluid line 171A and the first rotary joint 181A. The first fluid line 172A may be connected to the variable portion 130 provided in each of the first damper structure M1 and the second damper structure M2 via the first upper bracket 170A.

[0108] The third damper structure M3 and the fourth damper structure M4 may each be connected to the second fluid line 172B and may expand or contract. Fluid may flow to the second fluid line 172B from the fluid supply device 420 through the second external fluid line 171B and the second rotary joint 181B. The second fluid line 172B may be connected to the variable portion 130 provided in each of the third damper structure M3 and the fourth damper structure M4 via the second upper bracket 190.

[0109] A first rotary joint 181A and a first driving device 182A may be provided vertically above the center of the first upper bracket 170A, that is, at a point at which the first center C1 of the spindle 200 and the first upper bracket 170A meet. The first driving device 182A may transmit rotational power to the first rotary joint 181A through the first driving shaft 183A. The rotational power by the first driving device 182A may rotate the first upper bracket 170A to move the positions of the first damper structure M1 and the second damper structure M2 connected to the first upper bracket 170A.

[0110] A second rotary joint 181B and a second driving device 182B may be provided vertically above the center of the second upper bracket 190, that is, a point at which the first center C1 of the spindle 200 and the second upper bracket 190 meet. The second driving device 182B may transmit rotational power to the second rotary joint 181B through the second driving shaft 183B. The rotational power by the second driving device 182B may rotate the second upper bracket 190 to move the positions of the third damper structure M3 and the fourth damper structure M4 connected to the second upper bracket 190.

[0111] The first rotary joint 181A, the first drive shaft 183A, the second rotary joint 181B, and the second drive shaft 183B may all be positioned at the first center C1 of the spindle 200. The second rotary joint 181B, the second driving shaft 183B, and the second driving device 182B may be positioned above the first rotary joint 181A, the first driving shaft 183A, and the first driving device 182A.

[0112] The second rotary joint 181B may be configured so that other components are not affected by the rotational movement of the components that are rotated by the second driving device 182B. At the same time, the second rotary joint 181B may be configured to transfer fluid between a rotating component and a fixed component. For example, the second rotary joint 181B may be configured such that the second external fluid line 171B connected to the second rotary joint 181B is not affected by the rotational movement of the second upper bracket 190 caused by the second driving device 182B. Accordingly, the fluid may be transmitted between the non-rotating second external fluid line 171B and the second upper bracket 190, the third damper structure M3, and the fourth damper structure M4 configured to rotate using the second driving device 182B through the second rotary joint 181B.

[0113] The first virtual axis VLX is a virtual line extending in the first direction (the X-axis direction) passing through the first center C1 of the spindle 200 for describing the rotation of the movable damper 100B, and a second virtual axis VLY is a virtual line extending in the second direction (the Y-axis direction) passing through the first center C1 of the spindle 200 for describing the rotation of the movable damper 100B. The first angle AG1 refers to an angle formed by the first virtual axis VLX and the line extending from the center of the first damper structure M1 through the center of the second damper structure M2 on a plane (e.g., the X-Y plane) based on the first center C1. A second angle AG2 refers to an angle formed by the second virtual axis VLY and a line extending from the center of the third damper structure M3 through the center of the fourth damper structure M4 on a plane (e.g., the X-Y plane) based on the first center C1.

[0114] By the controller 410, the first driving device 182A and the second driving device 182B may operate to rotate the first upper bracket 170A and the second upper bracket 190, respectively, so that the first to fourth damper structures M1, M2, M3, and M4 may be arranged as shown in FIG. 6C. For example, the first angle AG1 may form 15 clockwise from the first virtual axis VLX, and the second angle AG2 may form 15 counterclockwise from the second virtual axis VLY. That is, in a plane (e.g., the X-Y plane of FIG. 6C) with the first virtual axis VLX and the second virtual axis VLY as coordinate axes, the second damper structure M2 and the third damper structure M3 may be positioned at the upper left with respect to the first center C1 of the spindle 200, and the first damper structure M1 and the fourth damper structure M4 may be positioned at the lower right with respect to the first center C1 of the spindle 200.

[0115] With the first damper structure M1, the second damper structure M2, the third damper structure M3, and the fourth damper structure M4 arranged at the intended positions, the controller 410 may control the fluid supply device 420 to apply the fluid to each of the variable portions 130 through the first external fluid line 171A, the second external fluid line 171B, the first fluid line 172A, and the second fluid line 172B. By the applied fluid, the first damper structure M1, the second damper structure M2, the third damper structure M3, and the fourth damper structure M4 may each expand. The first to fourth damper structures M1, M2, M3, and M4 may expand and come into contact with each of the perimeter 200T of the spindle 200 and the inner perimeter 300N of the housing 300, so that the vibration of the spindle 200 may be damped.

[0116] By arranging the first to fourth damper structures M1, M2, M3, and M4 as in FIG. 6C, both vibration components of the spindle 200 in the first direction (the X-axis direction) and second direction (the Y-axis direction) may be damped. In particular, the vibration components of the spindle 200 having a negative first direction (X-axis direction) component and a positive second direction (+Y-axis direction) component in a generally similar ratio may be most effectively damped.

[0117] In a case in which it is desired to damp the largest vibration component among the vibration components of the spindle 200 and in a case in which it is desired to damp the vibration component of the spindle 200 that is determined to have the most significant influence on the polishing of the substrate during the polishing process of the substrate, the first to fourth damper structures M1, M2, M3, and M4 may be moved to positions in which damping according to the vibration component of the spindle 200 is most effective. Accordingly, because the vibration of the spindle 200 performing the polishing process is damped through the polishing apparatus 1B including a movable damper according to embodiments, the polishing quality of the substrate through the polishing apparatus 1B including a movable damper may be improved.

[0118] FIG. 7 is a cross-sectional view illustrating a polishing apparatus 1C including a movable damper according to embodiments. Anything not described below may be substantially identical to what is described above.

[0119] The polishing apparatus 1C including a movable damper 100C may include a first vibration sensor VS1 and a second vibration sensor VS2. The first vibration sensor VS1 is provided between the spindle 200 and the housing 300 and may measure a relative vibration of the spindle 200 with respect to the housing 300. In FIG. 7, one first vibration sensor VS1 is illustrated, but a plurality of first vibration sensors VS1 may be installed at various locations and oriented in various directions.

[0120] A second vibration sensor VS2 may be positioned to be oriented toward the spindle 200 on an outer wall 510, and a first opening H1 may be provided between the spindle 200 and the second vibration sensor VS2. The first opening H1 is a hole penetrating a portion of the housing 300 and corresponds to a path of a signal for measuring the vibration of the spindle 200 of the second vibration sensor VS2. The second vibration sensor VS2 may measure the vibration of the spindle 200 with respect to the outside. In FIG. 7, one second vibration sensor VS2 is illustrated, but a plurality of second vibration sensors VS2 may be installed at various locations and oriented in various directions.

[0121] The first vibration sensor VS1 and the second vibration sensor VS2 may be, for example, laser displacement sensors. However, this is an example, and the inventive concept is not limited by the types of the first vibration sensor VS1 and the second vibration sensor VS2.

[0122] The controller 410 may receive vibration measurement values from the first vibration sensor VS1 and the second vibration sensor VS2. The controller 410 may determine a vibration component of the spindle 200 with the greatest vibration intensity or a vibration component of the spindle 200 having the greatest influence on the polishing process of the substrate and move the first damper structure M1 and the second damper structure M2 in a corresponding vibration direction.

[0123] In addition, vibration measurements received through the first vibration sensor VS1 and the second vibration sensor VS2 may be measured in real time while the substrate polishing process by the spindle 200 is in progress. The controller 410 may operate the driving device 182 to move the first damper structure M1 and the second damper structure M2 using vibration component data measured in real time.

[0124] The polishing apparatus 1C including the movable damper 100C according to embodiments may include the vibration sensors VS1 and VS2 that measure vibration in real time on the inner perimeter 300N or the outer wall 510 of the housing 300. The controller 410 may measure the vibration of the spindle 200 in real time through the vibration sensors VS1 and VS2 and may control the movable damper 100C in real time to reduce the vibration of the spindle 200 and thereby damp the vibration of the spindle 200. Therefore, because the vibration of the spindle 200 performing the polishing process is damped through the polishing apparatus 1C including the movable damper according to embodiments, the polishing quality of the substrate may be improved through the polishing apparatus 1C including the movable damper.

[0125] While the inventive concept has been particularly shown and described with reference to embodiments thereof, it will be understood that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure.