SYSTEM AND METHOD FOR HYDRONIC DISTRIBUTION WITH SUBMERSIBLE PUMPS IN AN UNPRESSURIZED TANK
20260117988 ยท 2026-04-30
Assignee
Inventors
- Paul C. Hunt (Pine River, MN, US)
- Ryan P. Hunt (Pine River, MN, US)
- Simon H. Goble (Backus, MN, US)
- Jacob I. Brower (Pine River, MN, US)
Cpc classification
F24D3/1066
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F24D19/1012
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F24D3/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F24D3/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F24D19/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
A heat distribution system, method and computer program product, include an unpressurized tank holding a heat transfer fluid; and one or more submersible heat transfer fluid pumps pumping the heat transfer fluid to respective heat load loops connected to the heat transfer fluid pumps. The tank is partitioned with a first section for receiving return flow from the heat load loops, and a second section for transferring the return flow to the heat transfer fluid pumps. The partition includes a movable divider between the first and second sections and includes an opening to permit overflow of the heat transfer fluid therebetween. A first set of the submersible heat transfer fluid pumps is disposed within the first section, and a second set of the submersible heat transfer fluid pumps is disposed within the second section.
Claims
1. A heat distribution system, comprising: an unpressurized tank configured for holding a heat transfer fluid; and one or more submersible heat transfer fluid pumps configured to pump the heat transfer fluid to one or more heat load loops respectively connected to the one or more heat transfer fluid pumps, wherein the unpressurized tank is partitioned to have a first section for receiving return flow of the heat transfer fluid from the one or more heat load loops, and a second section for transferring the return flow of the heat transfer fluid to the one or more heat transfer fluid pumps, wherein the partition comprises a movable divider positioned within the unpressurized tank and configured to separate the unpressurized tank into the first section and the second section, the movable divider including an opening configured to permit overflow of the heat transfer fluid from the first section into the second section, and wherein a first set of the one or more submersible heat transfer fluid pumps is disposed within the first section and a second set of the one or more submersible heat transfer fluid pumps is disposed within the second section.
2. The system of claim 1, further comprising control logic configured to control the one or more heat transfer fluid pumps based on programmable parameters.
3. The system of claim 2, wherein the programmable parameters include at least one of speed control of the one or more heat transfer fluid pumps, on/off operation of the one or more heat transfer fluid pumps based on a temperature of the heat transfer fluid, and on/off operation of the one or more heat transfer fluid pumps based on respective thermostat input.
4. The system of claim 1, further comprising mechanisms to limit evaporation of the heat transfer fluid, including at least one of a tank lid, water tight gaskets and fittings, and a low vapor oil layer over the heat transfer fluid.
5. The system of claim 1, further comprising a submersible heating element or heat exchanger disposed within the unpressurized tank.
6. The system of claim 1, wherein the one or more heat transfer fluid pumps and the control logic are hand-replaceable.
7. A method for heat distribution, comprising: holding in an unpressurized tank a heat transfer fluid; and pumping with one or more submersible heat transfer fluid pumps the heat transfer fluid to one or more heat load loops respectively connected to the one or more heat transfer fluid pumps, wherein the unpressurized tank is partitioned to have a first section for receiving return flow of the heat transfer fluid from the one or more heat load loops, and a second section for transferring the return flow of the heat transfer fluid to the one or more heat transfer fluid pumps, wherein the partition comprises a movable divider positioned within the unpressurized tank and configured to separate the unpressurized tank into the first section and the second section, the movable divider including an opening configured to permit overflow of the heat transfer fluid from the first section into the second section, and wherein a first set of the one or more submersible heat transfer fluid pumps is disposed within the first section and a second set of the one or more submersible heat transfer fluid pumps is disposed within the second section.
8. The method of claim 7, further comprising controlling with control logic the one or more heat transfer fluid pumps based on programmable parameters.
9. The method of claim 8, wherein the programmable parameters include at least one of speed control of the one or more heat transfer fluid pumps, on/off operation of the one or more heat transfer fluid pumps based on a temperature of the heat transfer fluid, and on/off operation of the one or more heat transfer fluid pumps based on respective thermostat input.
10. The method of claim 7, further comprising limiting evaporation of the heat transfer fluid with at least one of a tank lid, water tight gaskets and fittings, and a low vapor oil layer over the heat transfer fluid.
11. The method of claim 7, further comprising using a submersible heating element or heat exchanger disposed within the unpressurized tank.
12. The method of claim 7, further comprising replacing the one or more heat transfer fluid pumps or control logic by hand without tools.
13. A computer program product for heat distribution, the computer program product including one or more computer readable instructions embedded on a tangible, non-transitory computer readable medium and configured to cause one or more computer processors to perform the steps of: holding in an unpressurized tank a heat transfer fluid; and pumping with one or more submersible heat transfer fluid pumps the heat transfer fluid to one or more heat load loops respectively connected to the one or more heat transfer fluid pumps, wherein the unpressurized tank is partitioned to have a first section for receiving return flow of the heat transfer fluid from the one or more heat load loops, and a second section for transferring the return flow of the heat transfer fluid to the one or more heat transfer fluid pumps, wherein the partition comprises a movable divider positioned within the unpressurized tank and configured to separate the unpressurized tank into the first section and the second section, the movable divider including an opening configured to permit overflow of the heat transfer fluid from the first section into the second section, and wherein a first set of the one or more submersible heat transfer fluid pumps is disposed within the first section and a second set of the one or more submersible heat transfer fluid pumps is disposed within the second section.
14. The computer program product of claim 13, further comprising controlling with control logic the one or more heat transfer fluid pumps based on programmable parameters.
15. The computer program product of claim 14, wherein the programmable parameters include at least one of speed control of the one or more heat transfer fluid pumps, on/off operation of the one or more heat transfer fluid pumps based on a temperature of the heat transfer fluid, and on/off operation of the one or more heat transfer fluid pumps based on respective thermostat input.
16. The computer program product of claim 13, further comprising limiting evaporation of the heat transfer fluid with at least one of a tank lid, water tight gaskets and fittings, and a low vapor oil layer over the heat transfer fluid.
17. The computer program product of claim 13, further comprising using a submersible heating element or heat exchanger disposed within the unpressurized tank.
18. The computer program product of claim 13, further comprising enabling replacement of the one or more heat transfer fluid pumps or control logic by hand without tools.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar elements and in which:
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0021] Referring now to the drawings, wherein like reference numerals designate identical or corresponding parts throughout the several views, and more particularly to
[0022] In buildings with radiant floor heating systems, the unpressurized water tank 118 that is open to the atmospheric pressure as the main hydronic reservoir is advantageously employed. The open tank 118, advantageously, serves as an expansion tank, bubble remover, pressure relief valve, and the like. Advantageously, filling is achieved simply by pouring any suitable heat transfer fluid (e.g., water, water with additives, water with an oil layer, etc.) into the top of the tank 118, the fluid can be easily drained through a drain valve (not shown), and the tank 118 is also inherently safe from building up steam pressure, and the like.
[0023] The present disclosure includes recognition that typical hydronic circulating pumps require several feet of head pressure for operation. Accordingly, a submersible pump that requires almost no head pressure can be advantageously employed for the relatively shallow, unpressurized reservoir tank 118. Thus, the technology available in inexpensive submersible pumps that can last a long time and handle boiling water temperature, and the like, are advantageously employed.
[0024] Heat is brought into the tank 118 when water from the tank 118 is pumped through the heat source 110 and returned to the tank 118 at a higher temperature. One or more the pumps 120 can be employed to make use of the multiple heat sources 110. Such hydronic system can, thus, advantageously, integrate heat from any suitable combination of electric water heaters, gas water heaters, wood boiler, solar panels, the cooling system for an internal combustion engine, any other suitable heat source that can heat water, and the like. Alternatively, the heat can be added into the tank 118 directly using a submersible electric heater or heat exchanger 300, as shown in
[0025] The pipe loops that transfer heat from the tank 118 to the building serve as heat loads or heat loops 116. Advantageously, one heat load 118 can be connected for each of the pumps 108 for maximum flexibility, redundancy, simplicity, and the like. Any other suitable pump and heat load configurations can be employed. The control system 102 receives signal inputs, such as from the thermostats 104 for various heating zones or functions, and the like, and maps them to the respective pumps 108 for operation based on the respective signals, advantageously, eliminating a need for zone valves, and the like, and makes it easy to add or modify zones, and the like, without a need for changing plumbing, and the like.
[0026] The pump 108 array, advantageously, for example, can be powered for safety reasons by a low voltage (e.g., 6-12 VDC or VAC, etc.), which is inherently safer than other systems with pumps running at mains power (e.g., 120 VAC in the US, and other high voltage regional mains voltages, etc.), and the like. Such safety measures are particularly advantageous when reaching into the tank 118 to replace or repair one of the pumps 108 and/or 120. While water is the working fluid for most hydronic systems, advantageously, any other suitable heat transfer fluids can be employed for a given a range of applicable temperatures, and the like. Similarly, the water can include advantageous additives, for example, such as antifreeze or conditioners for anti-corrosion, and the like.
[0027] Water in the system will tend to evaporate over time if open to the atmosphere. Advantageously, the tank 118 can be covered with a suitable lid 122, and penetrations can be fitted with gaskets, seals, and the like, to retain the water vapor. Advantageously, such feature can also be accomplished or enhanced with any suitable low vapor heat transfer fluids, and the like or deploying oil on top of the water, and the like. Any suitable gaskets and seals can be employed that allow for the prevention of pressure build up in the tank for safety reasons, and the like.
[0028] Because the water will, inevitably, evaporate over time, or leaks may develop in the pipes outside the tank, the sensor 114 for sensing the water level is advantageously employed to protect the pumps 108 and 120 from running dry, and the like. The control system 102 then automatically turns off the pumps 108 and 120 if the water level gets too low, and can control pumping speed, and the like. The control system 102 also advantageously controls the maximum temperature of the working fluid in the tank 118 for various reasons, including, for example, the pumps 108 and 120 and tank 118 materials having a maximum temperature rating, in some heating applications, such as a radiant floor system, if the fluid is too hot, the floor may become uncomfortable in places, or possibly even dangerously hot before the thermostat 104 can control the temperature, for the safety of anyone opening the lid when the tank 118 is heated, and the like.
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[0036] The divider 810 includes an opening 806 near its upper region. The opening 806 permits overflow from the first section 802 into the second section 804, ensuring pressure relief, fluid balance, and safe operation when the pumps 808 are not active. The overflow mechanism also allows the system to maintain a temperature differential while still ensuring adequate mixing and circulation throughout the tank 118. The second section 804 includes one or more pumps 824, which withdraw comparatively cooler or mixed fluid and pump it to one or more heat loads 822. The separation between the first section 802 and the second section 804 thus advantageously allows the hydronic distribution system to supply different temperature levels to different heating zones within the same installation.
[0037] The heating element or heat exchanger 300, as illustrated in
[0038] Accordingly, the novel heat distribution system can include a tank containing heat transfer fluid, and one or more pumps inside the tank, connecting to one or more heat load loops. The loops return fluid to the tank. The system also includes one or more pumps connected to one or more heat source loops. The loops return fluid to the tank. The pumps can be submersible. The pumps are able to be replaced with bare hands and no tools. The employed electronics also are able to be replaced with bare hands and no tools. A device is provided to physically access the pumps with bare hands. A device to prevent or reduce evaporation of transfer fluid are also employed. The tank can operate at atmospheric pressure. Devices are provided to assure that a heat source pump intake comes substantially from a heat load return fluid. A device to disburse and mix the return flows from loops, such that the heat load pumps, and all intake fluid at similar temperatures are provided, as well as a devices to sense low fluid levels, tank fluid temperature, and to automatically disable the pumps if the fluid level is low. Electrical power to the pumps can be less than 20 volts DC or AC, as needed. A submersed heat source can be provided in the tank to heat transfer fluid. A heat exchanger can be submersed in the heat transfer fluid. Devices are provided to limit the tank fluid temperature, adjust the speed of the pumps, and to functionally assign specific pumps to specific temperature sensing or control inputs (e.g., heating zones, etc.).
[0039] Although the system and method are described in terms of employing submersible pumps, non-submersible pumps can also be employed, based on the teachings of the present disclosure, as would be appreciated by one of ordinary skill in the relevant art(s).
[0040] The above-described devices and subsystems of the illustrative embodiments can include, for example, any suitable circuits, servers, workstations, PCs, laptop computers, PDAs, Internet appliances, handheld devices, cellular telephones, wireless devices, other devices, and the like, capable of performing the processes of the illustrative embodiments. The devices and subsystems of the illustrative embodiments can communicate with each other using any suitable protocol and can be implemented using one or more programmed computer systems or devices.
[0041] One or more interface mechanisms can be used with the illustrative embodiments, including, for example, Internet access, telecommunications in any suitable form (e.g., voice, modem, and the like), wireless communications media, and the like. For example, employed communications networks or links can include one or more wireless communications networks, cellular communications networks, G3 communications networks, Public Switched Telephone Network (PSTNs), Packet Data Networks (PDNs), the Internet, intranets, a combination thereof, and the like.
[0042] It is to be understood that the devices and subsystems of the illustrative embodiments are for illustrative purposes, as many variations of the specific hardware used to implement the illustrative embodiments are possible, as will be appreciated by those skilled in the relevant art(s). For example, the functionality of one or more of the devices and subsystems of the illustrative embodiments can be implemented via one or more circuits and/or programmed computer systems or devices.
[0043] To implement such variations as well as other variations, a single computer system can be programmed to perform the special purpose functions of one or more of the devices and subsystems of the illustrative embodiments. On the other hand, two or more programmed computer systems or devices can be substituted for any one of the devices and subsystems of the illustrative embodiments. Accordingly, principles and advantages of distributed processing, such as redundancy, replication, and the like, also can be implemented, as desired, to increase the robustness and performance of the devices and subsystems of the illustrative embodiments.
[0044] The devices and subsystems of the illustrative embodiments can store information relating to various processes described herein. This information can be stored in one or more memories, such as a hard disk, optical disk, magneto-optical disk, RAM, and the like, of the devices and subsystems of the illustrative embodiments. One or more databases of the devices and subsystems of the illustrative embodiments can store the information used to implement the illustrative embodiments of the present disclosures. The databases can be organized using data structures (e.g., records, tables, arrays, fields, graphs, trees, lists, and the like) included in one or more memories or storage devices listed herein. The processes described with respect to the illustrative embodiments can include appropriate data structures for storing data collected and/or generated by the processes of the devices and subsystems of the illustrative embodiments in one or more databases thereof.
[0045] All or a portion of the devices and subsystems of the illustrative embodiments can be conveniently implemented using one or more general purpose computer systems, microprocessors, digital signal processors, micro-controllers, and the like, programmed according to the teachings of the illustrative embodiments of the present disclosures, as will be appreciated by those skilled in the computer and software arts. Appropriate software can be readily prepared by programmers of ordinary skill based on the teachings of the illustrative embodiments, as will be appreciated by those skilled in the software art. Further, the devices and subsystems of the illustrative embodiments can be implemented on the World Wide Web. In addition, the devices and subsystems of the illustrative embodiments can be implemented by the preparation of application-specific integrated circuits or by interconnecting an appropriate network of conventional component circuits, as will be appreciated by those skilled in the electrical art(s). Thus, the illustrative embodiments are not limited to any specific combination of hardware circuitry and/or software.
[0046] Stored on any one or on a combination of computer readable media, the illustrative embodiments of the present disclosures can include software for controlling the devices and subsystems of the illustrative embodiments, for driving the devices and subsystems of the illustrative embodiments, for enabling the devices and subsystems of the illustrative embodiments to interact with a human user, and the like. Such software can include, but is not limited to, device drivers, firmware, operating systems, development tools, applications software, and the like. Such computer readable media further can include the computer program product of an embodiment of the present disclosures for performing all or a portion (if processing is distributed) of the processing performed in implementing the disclosures. Computer code devices of the illustrative embodiments of the present disclosures can include any suitable interpretable or executable code mechanism, including but not limited to scripts, interpretable programs, dynamic link libraries (DLLs), Java classes and applets, complete executable programs, Common Object Request Broker Architecture (CORBA) objects, and the like. Moreover, parts of the processing of the illustrative embodiments of the present disclosures can be distributed for better performance, reliability, cost, and the like.
[0047] As stated above, the devices and subsystems of the illustrative embodiments can include computer readable medium or memories for holding instructions programmed according to the teachings of the present disclosures and for holding data structures, tables, records, and/or other data described herein. Computer readable medium can include any suitable medium that participates in providing instructions to a processor for execution. Such a medium can take many forms, including but not limited to, non-volatile media, volatile media, transmission media, and the like. Non-volatile media can include, for example, optical or magnetic disks, magneto-optical disks, and the like. Volatile media can include dynamic memories, and the like. Transmission media can include coaxial cables, copper wire, fiber optics, and the like. Transmission media also can take the form of acoustic, optical, electromagnetic waves, and the like, such as those generated during radio frequency (RF) communications, infrared (IR) data communications, and the like. Common forms of computer-readable media can include, for example, a floppy disk, a flexible disk, hard disk, magnetic tape, any other suitable magnetic medium, a CD-ROM, CDRW, DVD, any other suitable optical medium, punch cards, paper tape, optical mark sheets, any other suitable physical medium with patterns of holes or other optically recognizable indicia, a RAM, a PROM, an EPROM, a FLASH-EPROM, any other suitable memory chip or cartridge, a carrier wave or any other suitable medium from which a computer can read.
[0048] While the present disclosures have been described in connection with a number of illustrative embodiments, and implementations, the present disclosures are not so limited, but rather cover various modifications, and equivalent arrangements, which fall within the purview of appended claims.