ZnTiN2 AS A CARRIER-SELECTIVE PROTECTIVE LAYER
20260125810 ยท 2026-05-07
Inventors
- Anna Csencsits KUNDMANN (Pleasanton, CA, US)
- Emily Lowell Warren (Golden, CO, US)
- Ann London GREENAWAY (Lakewood, CO, US)
Cpc classification
C25B11/091
CHEMISTRY; METALLURGY
C25B11/052
CHEMISTRY; METALLURGY
International classification
C25B11/052
CHEMISTRY; METALLURGY
C25B11/091
CHEMISTRY; METALLURGY
Abstract
The present disclosure relates to a composition that includes a silicon layer having a first surface and a ZnTiN.sub.2 layer having a second surface, where the first surface and the second surface are physically in contact, and the composition is capable of photovoltaic properties when irradiated with light having a wavelength less than 1200 nm.
Claims
1. A composition comprising: a silicon layer having a first surface; and a ZnTiN.sub.2 layer having a second surface, wherein: the first surface and the second surface are physically in contact, and the composition is capable of photovoltaic properties when irradiated with light having a wavelength less than 1200 nm.
2. The composition of claim 1, wherein there is no intervening layer between the first surface and the second surface.
3. The composition of claim 1, wherein the silicon layer is p-type.
4. The composition of claim 1, wherein the ZnTiN.sub.2 layer has the characteristics of an n-type material.
5. The composition of claim 1, wherein the ZnTiN.sub.2 layer has a thickness between 10 nm and 1000 nm.
6. The composition of claim 1, wherein the ZnTiN.sub.2 layer has a wurtzite crystal structure.
7. The composition of claim 1, wherein the ZnTiN.sub.2 layer has a ratio of Zn/(Zn+Ti) between 0.4 and 0.55.
8. The composition of claim 1, further comprising an oxide layer, wherein the ZnTiN.sub.2 layer is positioned between the oxide layer and the silicon layer.
9. The composition of claim 8, wherein the oxide layer comprises at least one of a zinc oxide, a titanium oxide, or a combination thereof.
10. The composition of claim 9, wherein the zinc oxide comprises ZnO.
11. The composition of claim 9, wherein the titanium oxide comprises TiO.sub.2.
12. The composition of claim 8, wherein the oxide layer has a thickness between 5 nm and 1000 nm.
13. The composition of claim 8, wherein the oxide layer has a root-mean-square surface roughness of less than 10 nm.
14. A device comprising: a composition comprising: a silicon layer having a first surface; an oxide layer; and a ZnTiN.sub.2 layer having a second surface; and an electrolyte, wherein: the device is at least partially immersed in an electrolyte, and the oxide layer is positioned such that the oxide layer can be irradiated with light.
15. The device of claim 14, further comprising: an anode and a circuit, wherein: the composition is configured to function as a cathode.
16. The device of claim 14, further comprising: an additional layer comprising a III-V alloy having a bandgap between 1.5 eV and 2.0 eV.
17. The device of claim 16, wherein the additional layer comprises at least one of gallium, indium, and at least one of nitrogen, phosphorus, or a combination thereof.
18. A method utilizing a device, the method comprising: contacting the device with an electrolyte having a pH between 2 and 12; irradiating the device with light; and generating a photovoltage that is substantially independent of the solution potential of a redox couple in the electrolyte.
19. The method of claim 18, wherein the device is configured as a photocathode for water splitting or CO.sub.2 reduction.
20. The method of claim 18, further comprising maintaining an applied potential between +0.5 V and 0.5 V versus RHE at the working electrode while performing a fuel-forming electrochemical reaction.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0009] Some embodiments are illustrated in referenced figures of the drawings. It is intended that the embodiments and figures disclosed herein are to be considered illustrative rather than limiting.
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[0033] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
TABLE-US-00001 REFERENCE NUMERALS 100 composition 110 silicon layer 115 first surface 120 ZnTiN.sub.2 layer 125 second surface 130 interface 140 oxide layer
DETAILED DESCRIPTION
[0034] The embodiments described herein should not necessarily be construed as limited to addressing any of the particular problems or deficiencies discussed herein. References in the specification to one embodiment, an embodiment, an example embodiment, some embodiments, etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
[0035] The present disclosure relates to a new type of passivating, protective layer for silicon, that can be used in photovoltaic or photoelectrochemical applications. As shown herein, ZnTiN.sub.2 can produce a heterojunction with p-Si (p-type silicon) that creates a photovoltage independent of the environment in contact with the ZnTiN.sub.2. As a material itself, ZnTiN.sub.2 is promising in that it can form a stable oxide at the surface exposed to the environment, e.g., a gaseous atmosphere or a liquid electrolyte, without the oxide hindering charge transfer.
[0036]
[0037] In some embodiments of the present disclosure, a silicon layer 110 may be p-type, due to the presence of a dopant. In some embodiments of the present disclosure, a silicon layer 110 may include a p-type dopant, with examples including at least one of gallium and/or boron. In some embodiments of the present disclosure, a ZnTiN.sub.2 layer 120 may have the characteristics of an n-type material. In some embodiments of the present disclosure, a p-type silicon layer 110 and an n-type ZnTiN.sub.2 layer 120 may form a heterojunction capable of creating a photovoltage. In some embodiments of the present disclosure, a silicon layer 110 may have a thickness between 10 m and 1000 m, or between 100 m and 1000 m, or between 150 m and 250 m. In some embodiments of the present disclosure, a ZnTiN.sub.2 120 layer may have a thickness between 10 nm and 1000 nm or between 50 nm and 100 nm.
[0038]
[0039] As described in more detail below, a composition 100 having a silicon layer 110 and a ZnTiN.sub.2 layer 120 may be incorporated into a photovoltaic device, i.e., a solar cell or solar module, and/or a photoelectrochemical device, e.g., a water-splitting device. For the example of photoelectrochemical devices, an oxide layer 140 may provide the benefit of providing a barrier between the oxide layer 140 and underlying device layers; e.g., a silicon layer 110 and a ZnTiN.sub.2 layer 120. Thus, in some embodiments of the present disclosure, an oxide layer 140 may prevent or minimize the chemical degradation of a device when the device is immersed in an electrolyte. As some electrolytes are acidic or basic, with pH values between 4 and 12, such barrier layers can be very advantageous and, as shown herein, by significantly increasing the operational life-span of photoelectrochemical devices that include an oxide layer 140 in their device stack architecture.
[0040] Devices as described above have been constructed and tested. ZnTiN.sub.2 layers 120 were deposited on p-type silicon layers 110 to form ZnTiN.sub.2/Si (120/110) compositions 100A by radio-frequency (RF) co-sputtering to assess the ability of the ZnTiN.sub.2 layers 120 to act as electron-selective and protective layers on silicon photocathodes. Regenerative photoelectrochemical cell (PEC) measurements in aqueous methyl viologen electrolytes of different pH and in non-aqueous ferrocene electrolyte revealed a constant open circuit voltage (V.sub.OC) of 400 mV versus the solution potential (E.sub.sol) for photocathodes having ZnTiN.sub.2/Si compositions (like 110A illustrated in
[0041] ZnTiN.sub.2 layers were synthesized for PEC testing using a previously demonstrated synthetic method, described in the following journal article, which is incorporated herein by reference in its entirety: J. Am. Chem. Soc. 2022, 144 (30), 13673-13687. ZnTiN.sub.2 layers 120 were deposited by radiofrequency (RF) co-sputtering onto the polished side of (100)-oriented p-type Si substrates (i.e., silicon layers 110) after removal of surface oxide with dilute HF. The cation ratio (Zn/(Zn+Ti)) across ZnTiN.sub.2 layers 120 was measured by X-ray fluorescence spectroscopy (XRF). Areas of layers chosen as samples for PEC testing were nominally stoichiometric, having a cation ratio of Zn/(Zn+Ti)=(491) %. X-ray diffraction (XRD) patterns were nominally identical across the deposited layers of ZnTiN.sub.2, with a representative pattern illustrated in
[0042] Regenerative PEC measurements were performed to study the photocurrent and photovoltage characteristics of unprotected p-type Si photocathodes (i.e., unprotected silicon layers 110, hereafter, Si) and Si photocathodes with a ZnTiN.sub.2 surface layer (i.e., compositions 100A, hereafter, ZnTiN.sub.2/Si). In regenerative photoelectrochemistry, a semiconductor photoelectrode is placed in contact with a solution that contains an outer-sphere, single-electron redox couple to easily create a charge carrier-separating junction without the kinetic complications of multi-electron reactions. For the data reported herein, all working electrode potentials are referenced to E.sub.sol set by the concentrations of the reduced and oxidized species of the redox couple. The V.sub.OC for test photoelectrodes is quoted in mV as shorthand for mV vs E.sub.sol. The ferrocenium/ferrocene redox couple (Fc.sup.+/0, simply referred to as Fc) was prepared by dissolving the reduced and oxidized forms in acetonitrile (0.5 mM Fc.sup.+, 10 mM Fc.sup.0). The methyl viologen couple (MV.sup.2+/+, simply referred to as MV) was prepared in situ by pre-electrolysis of MV.sup.2+ in water to reach approximate concentrations of 49.75 mM and 0.25 mM of MV.sup.2+ and MV, respectively (calculated from the electrochemical potential of 0.507 V vs Ag/AgCl of the resulting electrolyte). Under regenerative conditions such as these with a well-defined solution potential, the V.sub.OC of the illuminated semiconductor electrode is taken to be its photovoltage.
[0043] Cyclic voltammetry scans (CVs) of ZnTiN.sub.2/Si and bare Si in aqueous MV and non-aqueous Fc solution are illustrated in
[0044] The three electrolyte conditions chosen here help characterize the nature of the carrier-separating junction (solid-liquid vs solid-solid) for each electrode type. For a solid-liquid junction with MV, the V.sub.OC of Si varies with pH because the energy band positions of Si depend on the pH, while the electrochemical potential of MV is independent of the pH, as no protons or hydroxide ions are involved in the redox reaction. This leads to a larger difference between the Fermi level of p-type Si and the electrochemical potential of MV at low pH compared to high pH, leading to more band bending and a larger photovoltage at low pH. This pH dependence was observed for the bare Si photocathode. The V.sub.OC of ZnTiN.sub.2/Si did not change with pH, which indicates the presence of a solid-state heterojunction. In non-aqueous Fc, a small photovoltage from the bare Si photocathode was observed because Fc makes a poorly rectifying junction with p-type Si. This is again a result of the difference between the Fermi level of the photoelectrode and the electrochemical potential of the redox couple. ZnTiN.sub.2/Si preserved its V.sub.OC in these conditions, further supporting the interpretation that a solid-state heterojunction has formed.
[0045]
[0046] As seen in the absorption spectrum in
[0047] The ability of ZnTiN.sub.2 to act as a protective coating as well as an electron-selective contact layer for Si was assessed through comparative PEC durability studies with unprotected Si. Photoelectrode performance was assessed by periodically taking CVs over a 72-hour period in a regenerative pH 9 MV PEC cell. In between CVs, the photoelectrodes were stressed by placing them in a 0.1 M KHCO.sub.3 electrolyte at pH 10.5 without N.sub.2 purging, and without electrical connection to the potentiostat (an ungrounded condition). This stress solution was chosen to have a bicarbonate concentration and pH relevant to CO.sub.2 reduction reaction (CO.sub.2RR) conditions during operation, where the H concentration can significantly decrease at the electrode surface. The CVs taken at each time point for each electrode are illustrated in
[0048] The stability of ZnTiN.sub.2/Si and Si was further compared under active MV reduction conditions. Chronoamperometry was performed at +0.1 V vs E.sub.sol under AM1.5G illumination for 21 hours in pH 3.5 MV solution; the normalized photocurrent over time is illustrated
[0049] The ZnTiN.sub.2/Si PEC results presented here (see
[0050] The bulk elemental abundance of Zn, Ti, N, and O (normalized to the sum of those elements) of ZnTiN.sub.2/Si exposed to pH 3.5 and pH 9 electrolyte was measured by EDS (see
[0051] EDS was performed at accelerating voltages of 3 kV and 10 kV for increased surface sensitivity and improved quantitative certainty, respectively. The same trends in elemental composition were observed for both accelerating voltages, and values obtained at 10 kV are illustrated in
TABLE-US-00002 TABLE 1 EDS elemental composition of all observed elements in ZnTiN.sub.2/Si samples in areas unexposed and exposed to electrolyte (All values 5%) Zn/(Zn + Ti) Zn Ti N O C Si 3 kV pH 3.5 Unexposed 0.49 17.89 18.91 36.26 9.88 16.25 0.81 Exposed 0.38 12.30 19.73 33.01 13.81 20.24 0.90 pH 9 Unexposed 0.49 17.98 18.45 34.27 10.31 18.49 0.50 Exposed 0.51 18.36 17.68 33.51 16.44 12.71 1.30 10 kV pH 3.5 Unexposed 0.49 7.95 8.22 25.70 5.63 23.02 29.48 Exposed 0.36 4.29 7.71 23.87 6.84 21.65 35.64 pH 9 Unexposed 0.51 9.33 9.10 27.97 5.82 19.93 27.85 Exposed 0.48 8.69 9.43 27.26 8.21 15.85 30.56
[0052] Surface elemental composition data from XPS are illustrated
TABLE-US-00003 TABLE 2 XPS elemental composition of all observed elements in ZnTiN.sub.2/Si samples (All values 5%) Zn/(Zn + Ti) Zn Ti N O C Si Cl NO 0.763 8.55 2.65 4.97 32.34 50.02 n.d. 1.47 ELECTROLYTE PH 3.5 0.289 1.99 4.90 6.05 25.99 55.92 4.62 0.52 PH 9 0.837 6.64 1.29 4.11 23.04 54.98 3.95 5.99
[0053] These data indicate that surface oxides form on ZnTiN.sub.2, but as shown in the PEC data, they do not appear detrimental to charge transfer, unlike what would be expected for highly insulating SiO.sub.x. While the durability data support the formation of protective surface oxides (e.g., ZnO.sub.x and/or TiO.sub.y where 0<x2 and 0<y2 independently of each other), the small cathodic current seen before the onset of MV reduction in the CVs also suggests that slow reactions may be taking place that could be causing long-term corrosion of the layer. The EDS data possibly indicate some thinning of the layer in areas exposed to electrolyte compared to areas not exposed to electrolyte, as the Si abundance appears higher in the electrolyte-exposed areas (see Table 3). However, atomic force microscopy (AFM) does not show a significant change in roughness for ZnTiN.sub.2/Si exposed to electrolyte compared to an as-grown ZnTiN.sub.2/Si layer and overall, the layers remain rather smooth, with post-PEC roughness less than 10 nm.
TABLE-US-00004 TABLE 3 EDS atomic percent of Si in ZnTiN.sub.2/Si samples (All values 5%) 3 kV 10 kV TREATMENT Unexposed Exposed Unexposed Exposed PH 3.5 0.81 0.90 29.48 35.64 PH 9 0.50 1.30 27.85 30.56 AIR EXPOSED 0.32 0.11 23.61 25.40
[0054] Physical and Optoelectronic Characterization: The single XRD peak at 2=36 in
[0055] Current-Voltage Behavior of ZnTiN.sub.2 Grown on n-GaN: ZnTiN.sub.2 layers were grown by radio-frequency co-sputtering on GaN substrates (GaN layer grown by MBE on sapphire). To prepare samples as photoelectrodes, an ohmic back contact to GaN was made using electron beam deposition of Ti/Al/Ni/Au, and conductive contacts and wire were electrically insulated from the electrolyte solution using epoxy and a glass tube. A bare n-type GaN substrate was used as a comparison photoelectrode. Current-voltage sweeps for GaN, a conductive carbon electrode, and ZnTiN.sub.2/GaN in non-aqueous Fc were evaluated. These showed that bare GaN acts as a photoanode, passing oxidizing current upon illumination. ZnTiN.sub.2/GaN appears similar to the carbon electrode, with reducing and oxidizing current flowing regardless of illumination. This shows that ZnTiN.sub.2 acts more like a conductor than a semiconductor, a result of its high dopant density.
[0056] Determining the V.sub.OC from Current-Voltage Curves of Si and ZnTiN.sub.2/Si Samples: The open circuit voltage (V.sub.OC) is typically taken as the onset of the photocurrent. For the Fc data, this was determined as the point where the photocurrent crosses the x-axis. In the MV solutions, the oxidative (positive) current was nearly zero at applied potentials positive of the oxidation potential of MV, such that searching for the point where current equals zero does not necessarily yield an accurate result. Additionally, ZnTiN.sub.2/Si displayed a very small (<0.25 mA/cm.sup.2) cathodic current before the onset of MV reduction, so the point where the current crosses the x-axis in the CV does not correspond to the V.sub.OC. This was confirmed by measuring the potential at open circuit under illumination (see
[0057] Cross-sectional SEM to Corroborate Layer Thickness: ZnTiN.sub.2 layer thickness on Si was found to be 190 nm by modeling of spectroscopic ellipsometry data. Cross-sectional SEM imaging corroborated this result, showing a layer thickness of 180 nm (see
[0058] Incident Photon-to-Current Efficiency (IPCE) Measurement: ZnTiN.sub.2/Si samples exhibited lower photocurrent densities compared to bare Si photocathodes, so IPCE was performed to assess the contribution of parasitic light absorption by the ZnTiN.sub.2 layer. As seen in
[0059] Deconstructable Photoelectrode Preparation: To more easily characterize ZnTiN.sub.2/Si samples after photoelectrochemical (PEC) treatment, a so-called deconstructable photoelectrode design was developed. As illustrated in
[0060] Energy Dispersive X-Ray Spectroscopy (EDS) of deconstructable electrodes: EDS was used to measure the elemental abundance of Zn, Ti, N, and O in areas of the same electrode that were either unexposed or exposed to electrolyte due to masking with electrodeposition tape. Deconstructable electrodes (fabrication scheme illustrated in
[0061] Note on EDS quantification of Si on ZnTiN.sub.2/Si electrodes in unexposed vs exposed areas: a slight tendency was observed for the exposed areas of samples to have a higher atomic percentage of Si by EDS (Table 3). This included a ZnTiN.sub.2/Si electrode that was prepared with a tape mask but not exposed to electrolyte (air exposed), but the difference was slightly larger in samples exposed to electrolyte. This higher Si signal might suggest that the ZnTiN.sub.2 layer was thinning. Measurements after more prolonged PEC operation would be needed to increase the certainty of this interpretation.
[0062] XPS Characterization of ZnTiN.sub.2/Si: XPS was performed on the same ZnTiN.sub.2/Si photoelectrodes as measured by EDS. XPS was also performed on a control ZnTiN.sub.2/Si layer that was not made into an electrode or exposed to electrolyte for comparison. The elemental composition data is provided in Table 2. XPS indicated that without electrolyte exposure, the ZnTiN.sub.2 layer surface was Zn-rich, while EDS and XRF showed that the bulk cation ratio was near 50:50. After photoelectrochemical testing in pH 3.5 MV, the cation ratio (Zn/(Zn+Ti)) was lower compared to the control sample, consistent with the EDS data. After PEC testing in pH 9 MV, the cation ratio was similar compared to the control sample due to the high starting concentration of Zn in the control. O content was not higher in the samples exposed to electrolyte, likely because the control sample was exposed to air for long periods of time (days), resulting in a high surface O content.
[0063] XPS spectra for Zn, Ti, N, and O are provided in
[0064] Atomic force microscopy (AFM) roughness of ZnTiN.sub.2/Si after exposure to electrolyte: AFM was performed on ZnTiN.sub.2/Si electrodes that were operated in pH 3.5 and pH 9 MV (described previously) and on a ZnTiN.sub.2/Si layer that was not made into an electrode or exposed to electrolyte as a control. Table 4 provides the average root mean squared (RMS) roughness. There was no significant change in the RMS roughness after operation in pH 3.5 or pH 9 MV for 1 hour in the dark at open circuit and 1 hour under illumination at short circuit. This either indicates that the layers were robust to degradation during PEC operation or that layer degradation occurred uniformly across the surface topography, leaving surface features intact.
TABLE-US-00005 TABLE 4 AFM RMS roughness of ZnTiN.sub.2/Si samples without and with electrolyte exposure TREATMENT Roughness (nm) NO ELECTROLYTE 5.32 PH 3.5 6.07 PH 9 5.14
EXAMPLES
[0065] Example 1. A composition comprising: a silicon layer having a first surface; and a ZnTiN.sub.2 layer having a second surface, wherein: the first surface and the second surface are physically in contact, and the composition is capable of photovoltaic properties when irradiated with light having a wavelength less than 1200 nm or between 300 nm and 1200 nm or between the optical band gap of ZnTiN.sub.2 and 1200 nm.
[0066] Example 2. The composition of Example 1, wherein the optical band gap is between 1.8 eV and 2.0 eV.
[0067] Example 3. The composition of either Example 1 or Example 2, wherein there is no intervening layer between the first surface and the second surface.
[0068] Example 4. The composition of any one of Examples 1-3, wherein the silicon layer is p-type.
[0069] Example 5. The composition of any one of Examples 1-4, wherein the silicon layer comprises at least one of gallium, boron, or a combination thereof.
[0070] Example 6. The composition of any one of Examples 1-1, wherein the silicon layer has a thickness between 10 m and 1000 m, or between 100 m and 1000 m, or between 150 m and 250 m.
[0071] Example 7. The composition of any one of Examples 1-1, wherein the ZnTiN.sub.2 layer has the characteristics of an n-type material.
[0072] Example 8. The composition of any one of Examples 1-1, wherein the ZnTiN.sub.2 layer has a thickness between 10 nm or 1000 nm, or between 100 nm and 300 nm, or between 180 nm and 190 nm, or between 50 nm and 100 nm.
[0073] Example 9. The composition of any one of Examples 1-1, wherein the ZnTiN.sub.2 layer has a wurtzite crystal structure.
[0074] Example 10. The composition of any one of Examples 1-9, wherein the ZnTiN.sub.2 layer has a nanocolumnar morphology.
[0075] Example 11. The composition of any one of Examples 1-10, wherein the nanocolumnar morphology comprises triangular faceting.
[0076] Example 12. The composition of any one of Examples 1-1, wherein the ZnTiN.sub.2 layer has a ratio of Zn/(Zn+Ti) between 0.4 and 0.55 or between 0.48 and 0.52 or between 0.49 and 0.51.
[0077] Example 13. The composition of any one of Examples 1-1, further comprising an oxide layer, wherein the ZnTiN.sub.2 layer is positioned between the oxide layer and the silicon layer.
[0078] Example 14. The composition of any one of Examples 1-13, wherein the oxide layer comprises at least one of a zinc oxide, a titanium oxide, or a combination thereof.
[0079] Example 15. The composition of any one of Examples 1-14, wherein the zinc oxide comprises ZnO.
[0080] Example 16. The composition of any one of Examples 1-14, wherein the titanium oxide comprises TiO.sub.2.
[0081] Example 17. The composition of any one of Examples 1-1, wherein the oxide layer has a thickness between 5 nm and 1000 nm, or between 5 nm and 25 nm.
[0082] Example 18. The composition of any one of Examples 1-13, wherein the oxide layer has a root-mean-square surface roughness of less than 10 nm.
[0083] Example 19. The composition of any one of Examples 1-1, wherein the composition is resistant to chemical degradation when immersed in an electrolyte.
[0084] Example 20. A device comprising: the composition as recited in any one of Examples 1-19, and an electrolyte, wherein: the device is at least partially immersed in an electrolyte, and the oxide layer is positioned such that the oxide layer can be irradiated with light.
[0085] Example 21. The device of 20, wherein the electrolyte has a pH between 2 and 12.
[0086] Example 22. The device of either Example 20 or Example 21, further comprising: an anode and a circuit, wherein: the composition is configured to function as a cathode.
[0087] Example 23. The device of any one of Examples 20-22, further comprising: an additional layer comprising a III-V alloy having a bandgap between 1.5 eV and 2.0 eV or between 1.7 eV and 1.8 eV.
[0088] Example 24. The device of any one of Examples 20-23, wherein the additional layer comprises at least one of gallium, indium, and at least one of nitrogen, phosphorus, or a combination thereof.
[0089] Example 25. The device of any one of Examples 20-24, wherein the additional layer comprises at least one of GaInN, GaInP, or a combination thereof.
[0090] Example 26. A method utilizing a device as recited in any one of Examples 20-25, the method comprising: contacting the device with an electrolyte having a pH between 2 and 12; irradiating the device with light; and generating a photovoltage that is substantially independent of the solution potential of a redox couple in the electrolyte.
[0091] Example 27. The method of Example 26, wherein the device is configured as a photocathode for water splitting or CO.sub.2 reduction.
[0092] Example 28. The method of either Example 26 or Example 27, wherein the oxide layer comprises TiO.sub.2 after operation in an aqueous solution.
[0093] Example 29. The method of any one of Examples 26-28, further comprising maintaining an applied potential between +0.5 V and 0.5 V versus RHE at the working electrode while performing a fuel-forming electrochemical reaction.
[0094] As used herein the term substantially is used to indicate that exact values are not necessarily attainable. By way of example, one of ordinary skill in the art will understand that in some chemical reactions 100% conversion of a reactant is possible, yet unlikely. Most of a reactant may be converted to a product and conversion of the reactant may asymptotically approach 100% conversion. So, although from a practical perspective 100% of the reactant is converted, from a technical perspective, a small and sometimes difficult to define amount remains. For this example of a chemical reactant, that amount may be relatively easily defined by the detection limits of the instrument used to test for it. However, in many cases, this amount may not be easily defined, hence the use of the term substantially. In some embodiments of the present invention, the term substantially is defined as approaching a specific numeric value or target to within 20%, 15%, 10%, 5%, or within 1% of the value or target. In further embodiments of the present invention, the term substantially is defined as approaching a specific numeric value or target to within 1%, 0.9%, 0.8%, 0.7%, 0.6%, 0.5%, 0.4%, 0.3%, 0.2%, or 0.1% of the value or target.
[0095] As used herein, the term about is used to indicate that exact values are not necessarily attainable. Therefore, the term about is used to indicate this uncertainty limit. In some embodiments of the present invention, the term about is used to indicate an uncertainty limit of less than or equal to 20%, 15%, 10%, 5%, or 1% of a specific numeric value or target. In some embodiments of the present invention, the term about is used to indicate an uncertainty limit of less than or equal to 1%, 0.9%, 0.8%, 0.7%, 0.6%, 0.5%, 0.4%, 0.3%, 0.2%, or 0.1% of a specific numeric value or target.
[0096] The foregoing discussion and examples have been presented for purposes of illustration and description. The foregoing is not intended to limit the aspects, embodiments, or configurations to the form or forms disclosed herein. In the foregoing Detailed Description for example, various features of the aspects, embodiments, or configurations are grouped together in one or more embodiments, configurations, or aspects for the purpose of streamlining the disclosure. The features of the aspects, embodiments, or configurations, may be combined in alternate aspects, embodiments, or configurations other than those discussed above. This method of disclosure is not to be interpreted as reflecting an intention that the aspects, embodiments, or configurations require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment, configuration, or aspect. While certain aspects of conventional technology have been discussed to facilitate disclosure of some embodiments of the present invention, the Applicants in no way disclaim these technical aspects, and it is contemplated that the claimed invention may encompass one or more of the conventional technical aspects discussed herein. Thus, the following claims are hereby incorporated into this Detailed Description, with each claim standing on its own as a separate aspect, embodiment, or configuration.