FLATTENING TOOL THAT MANAGES DEBRIS AND METHOD OF MAKING THEREOF

Abstract

A flattening tool that manages debris and a method for making a flattening tool that manages debris. As non-limiting examples, various aspects of this disclosure provide various flattening tool structures, and methods for making thereof, that comprise a feature for managing debris, for example debris resulting from utilization of the flattening tool.

Claims

1. A flattening tool comprising: an upper side shaped to contact a workpiece, where: the upper side comprises a raised portion, such that when the raised portion is brought into contact with a reference plane, the raised portion contacts the reference plane along a first line segment of an oval; and the upper side comprises a first gap in the raised portion, where the first gap is positioned such that when the raised portion is brought into contact with the reference plane, the raised portion does not contact the reference plane along a second line segment of the oval.

2. The flattening tool of claim 1, wherein the oval is a circle.

3. The flattening tool of claim 1, wherein at least a portion of the flattening tool comprises a toroid shape.

4. The flattening tool of claim 1, wherein at least a portion of the flattening tool comprises a shape of a section of a toroid.

5. The flattening tool of claim 1, wherein when viewed from directly above the upper side, the first gap appears as a first straight line.

6. The flattening tool of claim 5, wherein when viewed from directly above the upper side, at least: the upper side comprises a circular shape; and first straight line is oriented along a radial line of the circular shape.

7. The flattening tool of claim 1, wherein when viewed from directly above the upper side, the first gap appears as a first curved line.

8. The flattening tool of claim 1, wherein the upper side comprises a second gap in the raised portion, such that, when the raised portion is brought into contact with the reference plane: the raised portion contacts the reference plane along a third line segment of the oval, where the second line segment is positioned between the first line segment and the third line segment; and the raised portion does not contact the reference plane along a fourth line segment of the oval.

9. The flattening tool of claim 1, wherein: an uppermost surface of the raised portion comprises mostly a first material; and a lowermost surface of the gap comprises mostly a second material different from the first material.

10. The flattening tool of claim 9, wherein: the first material is silicon carbide; and the second material is silicon.

11. The flattening tool of claim 9, wherein: the first material is diamond; and the second material is silicon.

12. The flattening tool of claim 9, wherein the second material is oxidized silicon.

13. The flattening tool of claim 1, wherein: the raised portion comprises a first material composition that attracts debris at a first level of attraction; and the first gap comprises a second material composition that attracts debris at a second level of attraction that is greater than the first level of attraction.

14. A flattening tool comprising: a first side facing a first direction and shaped to contact a workpiece, wherein the first side of the flattening tool comprises: a first surface that is shaped such that when the first surface is brought into contact with a reference plane, the first surface contacts the reference plane along a first line segment of a curve; and a first gap in the first surface, where the first gap is positioned such that when the first surface is brought into contact with the reference plane, the first surface does not contact the reference plane along a second line segment of the curve.

15. The flattening tool of claim 14, wherein the curve is an oval.

16. The flattening tool of claim 14, wherein the first gap comprises a material that attracts debris.

17. The flattening tool of claim 14, wherein: the first surface comprises a first material composition that attracts debris at a first level of attraction; and the first gap comprises a second material composition that attracts debris at a second level of attraction that is greater than the first level of attraction.

18. The flattening tool of claim 17, wherein: the first material composition comprises first silicon carbide and first silicon at a first ratio of first silicon carbide to first silicon; and the second material composition comprises second silicon carbide and second silicon at a second ratio of second silicon carbide to second silicon, where the second ratio is less than the first ratio.

19. A method of making a flattening tool, the method comprising: forming a first side of the flattening tool, where the first side faces a first direction and is shaped to contact a workpiece, wherein said forming the first side of the flattening tool comprises: forming a first surface that is shaped such that when the first surface is brought into contact with a reference plane, the first surface contacts the reference plane along a first line segment of a curve; and forming a first gap in the first surface, where the first gap is positioned such that when the first surface is brought into contact with the reference plane, the first surface does not contact the reference plane along a second line segment of the curve.

20. The method of claim 19, wherein the curve is an oval.

21. The method of claim 19, wherein said forming the first gap in the first surface comprises utilizing a laser to ablate at least a portion of the first surface.

22. The method of claim 19, wherein said forming the first gap comprises forming a surface of the first gap to comprise a material that attracts debris.

23. The method of claim 19, wherein: the first surface comprises a first material composition that attracts debris at a first level of attraction; and the first gap comprises a second material composition that attracts debris at a second level of attraction that is greater than the first level of attraction.

Description

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

[0003] FIG. 1A shows a top view of an example flattening tool, in accordance with various

[0004] aspects of the present disclosure.

[0005] FIG. 1B shows a perspective cutaway view of the example flattening tool of FIG. 1A, in accordance with various aspects of the present disclosure.

[0006] FIG. 2 shows a top view of an example flattening tool, in accordance with various aspects of the present disclosure.

[0007] FIG. 3 shows a top view of an example flattening tool, in accordance with various aspects of the present disclosure.

[0008] FIG. 4 shows a top view of an example flattening tool, in accordance with various aspects of the present disclosure.

[0009] FIG. 5A shows a cross-sectional view of an example flattening tool, in accordance with various aspects of the present disclosure.

[0010] FIG. 5B shows a cross-sectional view of an example flattening tool, in accordance with various aspects of the present disclosure.

[0011] FIG. 6 shows a flow diagram of an example method of making a flattening tool, in accordance with various aspects of the present disclosure.

SUMMARY

[0012] Various aspects of this disclosure provide a flattening tool that manages debris and a method for making a flattening tool that manages debris. As non-limiting examples, various aspects of this disclosure provide various flattening tool structures, and methods for making thereof, that comprise a feature for managing debris, for example debris resulting from utilization of the flattening tool.

DETAILED DESCRIPTION OF VARIOUS ASPECTS OF THE DISCLOSURE

[0013] The following discussion presents various aspects of the present disclosure by providing examples thereof. Such examples are non-limiting, and thus the scope of various aspects of the present disclosure should not necessarily be limited by any particular characteristics of the provided examples. In the following discussion, the phrases for example, e.g., and exemplary are non-limiting and are generally synonymous with by way of example and not limitation, for example and not limitation, and the like.

[0014] As utilized herein, and/or means any one or more of the items in the list joined by and/or. As an example, x and/or y means any element of the three-element set {(x), (y), (x, y)}. In other words, x and/or y means one or both of x and y. As another example, x, y, and/or z means any element of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, x, y and/or z means one or more of x, y, and z.

[0015] The terminology used herein is for the purpose of describing particular examples only and is not intended to be limiting of the disclosure. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms comprises, includes, comprising, including, has, have, having, and the like when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

[0016] It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Thus, for example, a first element, a first component or a first section discussed below could be termed a second element, a second component or a second section without departing from the teachings of the present disclosure. Similarly, various spatial terms, such as upper, lower, side, and the like, may be used in distinguishing one element from another element in a relative manner. It should be understood, however, that components may be oriented in different manners, for example a flattening tool may be turned sideways so that its top surface is facing horizontally and its side surface is facing vertically, without departing from the teachings of the present disclosure.

[0017] Unless specified otherwise, the term coupled may be used to describe two elements directly contacting each other or describe two elements indirectly connected by one or more other elements. For example, if element A is coupled to element B, then element A can be directly contacting element B or indirectly connected to element B by an intervening element C. Similarly, the terms over or on may be used to describe two elements directly contacting each other or describe two elements indirectly connected by one or more other elements.

[0018] Various aspects of the present disclosure provide a flattening tool and a method of making (e.g., manufacturing, etc.) thereof, which can provide improved performance, increased life, increased reliability, and/or increase the manufacturability of the flattening tool.

[0019] The above and other aspects of the present disclosure will be described in or be apparent from the following description of various example implementations. Various aspects of the present disclosure will now be presented with reference to accompanying drawings, such that those skilled in the art may readily practice the various aspects.

[0020] It may be desired in various scenarios, for example production scenarios, to flatten or planarize one or more surfaces. In an example production scenario including the utilization of a chuck for holding a semiconductor wafer during processing, such a chuck may comprise a surface or a plurality of surfaces (e.g., pins, plateaus, etc.) that are ideally in a single plane. Also, such a surface or plurality of surfaces may ideally have a roughness that will provide some freedom of lateral movement, for example during the process of mounting the semiconductor wafer to the chuck and/or aligning the semiconductor wafer.

[0021] Tools and methods have been developed to perform such flattening, while preserving a desired amount of roughness. For example, U.S. Pat. No. 9,941,148, having common inventorship with the present application, provides examples of such tools and methods. U.S. Pat. No. 9,941,148 is hereby incorporated herein by reference in its entirety for all purposes.

[0022] FIG. 1A shows a top view 100 of an example flattening tool 105, in accordance with various aspects of the present disclosure. FIG. 1B shows a perspective cutaway view 190 of the example flattening tool 105 of FIG. 1A, in accordance with various aspects of the present disclosure.

[0023] The example flattening tool 105 may, for example, share any or all characteristics with any or all other flattening tools discussed herein (e.g., the flattening tool 205 of FIG. 2, the flattening tool 305 of FIG. 3, the flattening tool 405 of FIG. 4, the flattening tool 505 of FIG. 5, any flattening tools discussed herein with regard to the method of making a flattening tool of FIG. 6, etc.). The example flattening tool 105 may, for example, share any or all characteristics with the example tools (e.g., lapping tools, etc.) shown and described in U.S. Pat. No. 9,941,148. Note that the flattening tool 105 and/or any flattening tool discussed herein may also be referred to as a treatment tool, lapping tool, abrading tool, grinding tool, polishing tool, tool, etc.

[0024] The flattening tool 105 may, for example, be in the general shape of a disc (or puck), a cylinder, a saucer, a toroid, a toroid that has been elongated in one or more dimensions, a section of a toroid, a general three-dimensional shape, etc. For the sake of discussion only and not limitation, the flattening tool 105 will generally be presented herein in the shape of a toroid or a section of a toroid. For example, in the top view 100 of FIG. 1A, the toroid-shaped flattening tool 105 appears as a circle or concentric circles (e.g., a donut).

[0025] The flattening tool 105 may, for example, comprise a surface 110, which may also be referred to as a treatment surface 110 herein, where at least a portion of the treatment surface 110 is configured to physically contact and abrade one or more surfaces of a workpiece. The flattening tool 105 may also, for example, comprise an attachment structure utilized to attach the flattening tool 105 to a flattening machine (e.g., a grinding machine, a polishing machine, a lapping machine, etc.). Such an attachment structure may, for example, be positioned at a bottom and/or lateral side of the flattening tool 105. Such an attachment structure may, for example, comprise a bracket, a spindle, a ball joint, a registration feature, indentations and/or protrusions, etc.

[0026] Various example aspects of the flattening tool 105 may be considered in the context of a workpiece to be treated (e.g., flattened, lapped, grinded, polished, etc.). An example workpiece context may, for example, comprise a workpiece that comprises a pinned chuck for supporting and holding semiconductor wafers. It should be noted, however, that the flattening tool 105 may be utilized on non-pinned chucks, on chucks for holding or supporting components other than semiconductor wafers, on production machine surfaces, on product surfaces, on surfaces in general, etc.

[0027] In the example pinned-chuck workpiece context, the flattening tool 105 may be sufficiently large so that the flattening tool 105 can be moved over a workpiece surface generally defined by the pin tops with minimal constraint, for example unconstrained in the z-axis (or axis generally orthogonal to the workpiece surface), and not fall between adjacent pins. In an example implementation, the flattening tool 105 may comprise an overall length or diameter of about 18 to 38 mm. For example, in an example implementation, the flattening tool 105 may nominally comprise an overall length or diameter of 32 mm. The flattening tool 105 may, for example, be utilized to pass over the entire workpiece surface, contacting a respective terminal surface of each pin one or more times.

[0028] The flattening tool 105, or for example a treatment surface 110 thereof, may comprise at least the same hardness as the workpiece surface (e.g., the wafer support surface of the wafer chuck being flattened). Since a wafer chuck is often fabricated from a hard material such as a ceramic, the flattening tool 105 may generally be at least as hard as the ceramic or other hard material. Materials of this degree of hardness may, for example, abrade rather than polish the top of the workpiece surface (e.g., pin tops, etc.). With the flattening tool 105 (e.g., treatment surface 110 thereof, etc.) comprising a greater hardness than the workpiece surface, most of the wear due to abrasion will occur at the workpiece surface of the workpiece rather than at the treatment surface 110 of the flattening tool 105. An example manner of tuning the hardness of the flattening tool 105 (e.g., a treatment surface 110 thereof), comprises incorporating diamond into the flattening tool 105.

[0029] When the flattening tool 105 (e.g., a treatment surface 110 thereof) is formed to comprise about the same hardness as the workpiece surface (e.g., the wafer support surface of the wafer chuck), surface roughness may be enhanced. For example, in general, abrading materials of similar hardness to the workpiece hardness may lead to a relatively high degree of roughness (e.g., by galling, etc.). Thus, in this example implementation, the flattening tool 105 may be finished to optical-level smoothness, thus providing for flattening while still imparting roughness to the workpiece (e.g., a wafer support surface of a wafer chuck, etc.).

[0030] In an example scenario, a workpiece (e.g., a wafer chuck or wafer support structure, etc.) may comprise silicon carbide (SiC). For utilization in such an example scenario, the flattening tool 105 (e.g., a treatment surface 110 thereof) may be formed to comprise SiC. For example, silicon carbide-based bodies may be formed to net-shape or near-net-shape by a reactive infiltration process. In general, such a reactive infiltration process may comprise contacting molten silicon (Si) with a porous mass containing silicon carbide plus carbon in a vacuum or an inert atmosphere environment. A wetting condition may be created, resulting in the molten silicon being pulled by capillary action into the porous mass, where the molten silicon reacts with the carbon to form additional silicon carbide. This in-situ silicon carbide may generally be interconnected. When a dense body is desired, for example, the process may be performed in the presence of excess silicon. The resulting composite body may thus, for example, contain primarily silicon carbide, but also some unreacted silicon (which may also be interconnected). The resulting composite body may be referred to herein as Si/SiC. The process used to produce such composite bodies may, for example, be referred to as reactive infiltration, reaction forming, reaction bonding, self-bonding, etc.

[0031] As mentioned above, the reactive infiltration process may, for example, leave a small amount of residual elemental silicon in the formed composite body, so the resulting product may, for example, comprise a composite of SiC and Si, often denoted Si/SiC. Some of the SiC may, for example, be provided as a reinforcement filler, for example, as particulate. In an example implementation, some of all of this SiC filler may be replaced with other reinforcement materials (e.g., boron carbide, diamond, etc.), thereby engineering different properties of the flattening tool 105. In an example implementation, the Si content (e.g., of the flattening tool 105 and/or treatment surface 110 thereof) may comprise between about 5% by volume and about 45%, the boron carbide content may comprise between about 10% by volume and about 65%, and/or the diamond content may comprise between about 0.1% by volume and about 60 %.

[0032] Additionally for example, the hardness and/or roughness of the surface may be achieved by adding a coating to the surface, for example boron nitride (BN), diamond, etc., by coating, chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), a general technique or mechanism to promote adhesion, etc.

[0033] As shown in FIGS. 1A and 1B, the upper side (or first side) of the flattening tool 105 may be formed to contact a workpiece. For example, the upper side of the example flattening tool 105 may comprise a treatment surface 110, where the treatment surface 110 comprises a raised portion 115, for example a portion of the treatment surface 110 along and/or near the contact line 120. The raised portion 115 along the contact line 120 may, for example, be coplanar. For example, when the raised portion 115 is brought into contact with a reference plane 118, the raised portion 115 may generally contact the reference plane 118 along the contact line 120.

[0034] The example flattening tool 105 may, for example, comprise a plurality of gaps (e.g., a first gap 131, a second gap 132, a third gap 133, a fourth gap 134, a fifth gap 135, a sixth gap 136, etc.) in the upper side of the flattening tool 105, the upper side for example being shown in the top view 100 of FIG. 1A. The gaps 131-136 may, for example, interrupt the continuity of the treatment surface 110 (e.g., the raised portion 115 thereof, etc.) along the contact line 120. Thus, when the raised portion 115 is brought into contact with a reference plane 118, the raised portion 115 may generally contact the reference plane 118 along a plurality of line segments of the contact line 120, but not at respective line segments on the contact line 120 that span the gaps 131-136. For example, a first surface portion 110a of the treatment surface 110 comprises a first raised portion 115a that contacts the reference plane 118 along a first line segment 120a, a second surface portion 110b of the treatment surface 110 comprises a second raised portion 115b that contacts the reference plane 118 along the second line segment 120b, a third surface portion 110c of the treatment surface 110 comprises a third raised portion 115c that contacts the reference plane 118 along a third line segment 120c, a fourth surface portion 110d of the treatment surface 110 comprises a fourth raised portion 115d that contacts the reference plane 118 along a fourth line segment 120d, a fifth surface portion 110e of the treatment surface 110 comprises a fifth raised portion 115e that contacts the reference plane 118 along a fifth line segment 120e, and a sixth surface portion 110f of the treatment surface 110 comprises a sixth raised portion 115f that contacts the reference plane 118 along a sixth line segment 120f. Also for example, at the first gap 131, the treatment surface 110 does not contact the reference plane 118 along the contact line 120, for example between the first line segment 120a and the second line segment 120b; at the second gap 132, the treatment surface 110 does not contact the reference plane 118 along the contact line 120, for example between the second line segment 120b and the third line segment 120c; at the third gap 133, the treatment surface 110 does not contact the reference plane 118 along the contact line 120, for example between the third line segment 120c and the fourth line segment 120d; at the fourth gap 134, the treatment surface 110 does not contact the reference plane 118 along the contact line 120, for example between the fourth line segment 120d and the fifth line segment 120e; at the fifth gap 135, the treatment surface 110 does not contact the reference plane 118 along the contact line 120, for example between the fifth line segment 120e and the sixth line segment 120f; and at the sixth gap 136, the treatment surface 110 does not contact the reference plane 118 along the contact line 120, for example between the sixth line segment 120f and the first line segment 120a.

[0035] As mentioned previously, the examples discussed herein generally comprise the flattening tool 105 (and other flattening tools discussed herein) in the form of a toroid or a section of a toroid. In such example, the shape of the contact line 120 may be a circle in the reference plane 118. Such a circular shape, however, is not required. For example, the shape of the contact line 120 in the reference plane 118 may be an oval, an eclipse, a general closed loop, etc.

[0036] The gaps 131-136 may also be referred to herein as recesses, grooves, trenches, indentations, divots, cuts, debris management features, etc. The gaps 131-136 may comprise any of a variety of characteristics.

[0037] For example, as shown in the top view of FIG. 1A, the gaps 131-136 may appear straight in the top view. The gaps 131-136 may, however, curve to follow the contour of the treatment surface 110. For example, one or more of the gaps 131-136 may descend a generally consistent depth below the treatment surface 110. Such depth, however, need not be consistent within a gap and/or between different gaps.

[0038] The gaps 131-136 may be formed to comprise any of a variety of lengths, which may or may not be consistent between all gaps. For example, though the gaps 131-136 are shown in the top view 100 of FIG. 1A as spanning entirely laterally across the upper side of the flattening tool 105, for example between the radially outer edge of the flattening tool 105 and the radially inner edge of the flattening tool 105, any one or more of the gaps 131-136 may be formed to span only partially laterally across the upper side of the flattening tool 105. For example, any one or more or all of the gaps 131-136 need not be formed to extend laterally all of the way to the radially outer edge and/or radially inner edge of the flattening tool 105.

[0039] In general, the gaps 131-136 may be formed to traverse any of a variety of pathways in the treatment surface. For example, a gap may be formed in a straight or curved line (e.g., in a top view or viewed from any angle). Also for example, as shown in FIG. 1A, a gap may be oriented in a radial direction (e.g., along a direction along a radial line of a toroid or projection of the toroid on a plane). A gap may be curved in any one or more planes (e.g., a horizontal plane, a vertical plane, or any plane). A gap may, for example in a top view, appear to spiral outward from a center of the flattening tool 105. Also for example, a gap may intersect with (or cross) one or more other gaps. Example illustrations of various gap configurations will be shown in FIGS. 2-4.

[0040] The gaps 131-136 may be formed to comprise any of a variety of widths, which may or may not be consistent between all gaps and/or within a single gap. In an example implementation in which the flattening tool 105 is utilized to planarize pins of a workpiece, the gaps 131-136 may be formed to comprise a width that is less than (e.g., at least 5% less than, at least 10% less than, at least 20% less than, at least 25% less than, at least 50% less than, etc.) a width of the pins (e.g., a minimum width, etc.) of the workpiece. For example, in an example implementation where a diameter (or minimum length or width) of a top of a pin (or a burl, etc.) is about 350 microns, the width of a gap may be 325 microns, 300 microns, 275 microns, etc.

[0041] The gaps 131-136 may be formed in any of a variety of manners. For example, the gaps 131-136 may be formed by ablating (or removing) material from the treatment surface 110. For example, a laser may be utilized to ablate (or remove) material from the treatment surface 110 and/or from the bulk of the upper side of the flattening tool 105. Laser ablation may, for example, leave a signature in the gap (e.g., pits, chemical transformations, a particular amount of roughness, etc.). Also for example, other directed energy ablation methods (e.g., plasma etching, etc.) may be utilized. Additionally for example, a mechanical ablation tool may be utilized to form the gaps 131-136 (e.g., a diamond-cutting tool, etc.). Mechanical ablation may, for example, leave a signature in a gap (e.g., microscopic scratches, fractured material, etc.). Further for example, an etching process (e.g., chemical etching, plasma etching, etc.) may be utilized to form the gaps 131-136. Still further for example, the gaps 131-136 may be formed simultaneously with the treatment surface 110. For example, regions of the upper side of the flattening tool 105 may be masked during a build-up formation of the treatment surface 110 such that the gaps 131-136 form while material around the gaps 131-136 grows.

[0042] In general, the gaps 131-136 may be formed in any of a variety of manners, and thus the scope of this disclosure should have be limited by any particular characteristics of the gaps 131-136 or by any particular manner of forming a gap. Additional characteristics of the gaps 131-136, and/or any of the gaps discussed herein, are discussed throughout this disclosure (e.g., with regard to FIGS. 2-6, etc.).

[0043] As discussed herein, a flattening tool (e.g., the flattening tool 105, etc.) may comprise any of a variety of characteristics, and the gap(s) (e.g., the gaps 131-136, etc.) may comprise any of a variety of characteristics. FIGS. 2-4 show additional examples of flattening tools and/or gaps.

[0044] Turning next to FIG. 2, such figure shows a top view 200 of an example flattening tool 205, in accordance with various aspects of the present disclosure. The example flattening tool 205 may, for example, share any or all characteristics with any or all other flattening tools discussed herein (e.g., the example flattening tool 105 of FIGS. 1A and 1B, the example flattening tool 305 of FIG. 3, the example flattening tool 405 of FIG. 4, the example flattening tool 505 of FIG. 5, any flattening tools discussed herein with regard to the method 600 of making a flattening tool of FIG. 6, etc.).

[0045] The flattening tool 205 may, for example, comprise a surface 210, which may also be referred herein to as a treatment surface 210. The example treatment surface 210 may, for example, comprise a first surface portion 210a, a second surface portion 210b, a third surface portion 210c, a fourth surface portion 210d, a fifth surface portion 210e, a sixth surface portion 210f, etc. The treatment surface 210 and surface portions 210a-210f thereof may, for example, share any or all characteristics with the treatment surface 110 and surface portions 110a-110f thereof shown and discussed herein with regard to FIGS. 1A and 1B.

[0046] As shown in FIG. 2, the upper side (or first side) of the flattening tool 205 (e.g., as shown in the top view 200 of FIG. 2) may be formed to contact a workpiece. For example, the upper side of the example flattening tool 205 may comprise a treatment surface 210, where the treatment surface 210 comprises a raised portion 215, for example a portion of the treatment surface 210 along and/or near the contact line 220. The raised portion 215 along the contact line 220 may, for example, be coplanar. For example, when the raised portion 215 is brought into contact with a reference plane (e.g., like the reference plane 118, etc.), the raised portion 215 and/or portions 215a-215f thereof may generally contact the reference plane along the contact line 220. The raised portion 215 and/or portions 215a-215f thereof may, for example, share any or all characteristics with the raised portion 115 and/or portions 115a-115f thereof discussed herein with regard to FIGS. 1A and 1B, etc. Also, the contact line 220 and/or segments 220 a-220f thereof may, for example, share any or all characteristics with the contact line 120 and/or segments 120a-120f thereof shown and discussed herein with regard to FIGS. 1A and 1B, etc.

[0047] The flattening tool 205 may, for example, comprise a plurality of gaps (e.g., a first gap 231, a second gap 232, a third gap 233, a fourth gap 234, a fifth gap 235, a sixth gap 236, etc.) in the upper side of the flattening tool 205. The gaps 231-236 may, for example, share any or all aspects with the example gaps 131-136 shown and discussed herein with regard to FIGS. 1A and 1B, etc.

[0048] For example, the gaps 231-236 may interrupt the continuity of the treatment surface 210 (e.g., the raised portion 215 thereof, etc.) along the contact line 220. Thus, when the raised portion 215 is brought into contact with a reference plane (e.g., like the reference plane 118, etc.), the raised portion 215 generally contacts the reference plane along a plurality of line segments of the contact line 220, but not at respective line segments on the contact line 220 that span the gaps 231-236. For example, a first surface portion 210a of the treatment surface 210 comprises a first raised portion 215a that contacts the reference plane along a first line segment 220a, a second surface portion 210b of the treatment surface 210 comprises a second raised portion 215b that contacts the reference plane along the second line segment 220b, a third surface portion 210c of the treatment surface 210 comprises a third raised portion 215c that contacts the reference plane along a third line segment 220c, a fourth surface portion 210d of the treatment surface 210 comprises a fourth raised portion 215d that contacts the reference plane along a fourth line segment 220d, a fifth surface portion 210e of the treatment surface 210 comprises a fifth raised portion 215e that contacts the reference plane along a fifth line segment 220e, and a sixth surface portion 210f of the treatment surface 210 comprises a sixth raised portion 215f that contacts the reference plane along a sixth line segment 220f. Also for example, at the first gap 231, the treatment surface 210 does not contact the reference plane along the contact line 220, for example between the first line segment 220a and the second line segment 220b; at the second gap 232, the treatment surface 210 does not contact the reference plane along the contact line 220, for example between the second line segment 220b and the third line segment 220c; at the third gap 233, the treatment surface 210 does not contact the reference plane along the contact line 220, for example between the third line segment 220c and the fourth line segment 220d; at the fourth gap 234, the treatment surface 210 does not contact the reference plane along the contact line 220, for example between the fourth line segment 220d and the fifth line segment 220e; at the fifth gap 235, the treatment surface 210 does not contact the reference plane along the contact line 220, for example between the fifth line segment 220e and the sixth line segment 220f; and at the sixth gap 236, the treatment surface 210 does not contact the reference plane along the contact line 220, for example between the sixth line segment 220f and the first line segment 220a.

[0049] As discussed herein (e.g., with regard to the example gaps 131-136 of FIGS. 1A and 1B), gaps may comprise any of a variety of characteristics, for example top view, spiraling outward from a center of a flattening tool. As shown in the top view 200 of FIG. 2, the gaps 231-236 are shown curved and/or spiraling outward from a center of the flattening tool 205.

[0050] As with the example gaps 131-136 of FIGS. 1A and 1B, the example gaps 231-236 may comprise any of a variety of widths, depths, and/or lengths.

[0051] Turning next to FIG. 3, such figure shows a top view 300 of an example flattening tool 305, in accordance with various aspects of the present disclosure. The example flattening tool 305 may, for example, share any or all characteristics with any or all other flattening tools discussed herein (e.g., the example flattening tool 105 of FIGS. 1A and 1B, the example flattening tool 205 of FIG. 2, the example flattening tool 405 of FIG. 4, the example flattening tool 505 of FIG. 5, any flattening tools discussed herein with regard to the method 600 of making a flattening tool of FIG. 6, etc.).

[0052] The flattening tool 305 may, for example, comprise a surface 310, which may also be referred to herein as a treatment surface 310. The example treatment surface 310 may, for example, comprise a first surface portion 310a, a second surface portion 310b, a third surface portion 310c, a fourth surface portion 310d, a fifth surface portion 310e, a sixth surface portion 310f, etc. The treatment surface 310 and portions thereof (e.g., surface portions 310a-310f, etc.) may, for example, share any or all characteristics with the surface 110 and surface portions 110a-110f thereof shown and discussed herein with regard to FIGS. 1A and 1B, with the surface 210 and surface portions 210a-210f thereof shown and discussed herein with regard to FIG. 2, etc.

[0053] As shown in FIG. 3, the upper side (or first side) of the flattening tool 305 (e.g., as shown in the top view 300 of FIG. 3) may be formed to contact a workpiece. For example, the upper side of the example flattening tool 305 may comprise a treatment surface 310, where the treatment surface 310 comprises a raised portion 315, for example a portion of the treatment surface 310 along and/or near the contact line 320. The raised portion 315 along the contact line 320 may, for example, be coplanar. For example, when the raised portion 315 is brought into contact with a reference plane (e.g., like the reference plane 118, etc.), the raised portion 315 and/or portions 315a-315h thereof may generally contact the reference plane along the contact line 320. The raised portion 315 and/or portions 315a-315h thereof may, for example, share any or all characteristics with the raised portion 115 and/or portions 115a-115f thereof discussed herein with regard to FIGS. 1A and 1B, with the raised portion 215 and/or portions 215a-215f thereof discussed herein with regard to FIG. 2, etc. Also, the contact line 320 and/or segments 320a-320h thereof may, for example, share any or all characteristics with the contact line 120 and/or segments 120a-120f thereof shown and discussed herein with regard to FIGS. 1A and 1B, with the contact line 220 and/or segments 220a-220f thereof shown and discussed herein with regard to FIG. 2, etc.

[0054] The flattening tool 305 may, for example, comprise a plurality of gaps (e.g., a first gap 331, a second gap 332, a third gap 333, a fourth gap 334, a fifth gap 335, a sixth gap 336, a seventh gap 337, an eighth gap 338, etc.) in the upper side of the flattening tool 305. The gaps 331-338 may, for example, share any or all aspects with the example gaps 131-136 shown and discussed herein with regard to FIGS. 1A and 1B, with the example gaps 231-236 shown and discussed herein with regard to FIG. 2, etc.

[0055] For example, the gaps 331-338 may interrupt the continuity of the treatment surface 310 (e.g., the raised portion 315 thereof, etc.) along the contact line 320. Thus, when the raised portion 315 is brought into contact with a reference plane (e.g., like the reference plane 118, etc.), the raised portion 315 generally contacts the reference plane along a plurality of line segments of the contact line 320, but not at respective line segments on the contact line 320 that span the gaps 331-338. For example, a first surface portion 310a of the treatment surface 310 comprises a first raised portion 315a that contacts the reference plane along a first line segment 320a, a second surface portion 310b of the treatment surface 310 comprises a second raised portion 315b that contacts the reference plane along the second line segment 320b, a third surface portion 310c of the treatment surface 310 comprises a third raised portion 315c that contacts the reference plane along a third line segment 320c, a fourth surface portion 310d of the treatment surface 310 comprises a fourth raised portion 315d that contacts the reference plane along a fourth line segment 320d, a fifth surface portion 310e of the treatment surface 310 comprises a fifth raised portion 315e that contacts the reference plane along a fifth line segment 320e, a sixth surface portion 310f of the treatment surface 310 comprises a sixth raised portion 315f that contacts the reference plane along a sixth line segment 320f, a seventh surface portion 310g of the treatment surface 310 comprises a seventh raised portion 315g that contacts the reference plane along a seventh line segment 320g, an eighth surface portion 310 h of the treatment surface 310 comprises an eighth raised portion 315h that contacts the reference plane along an eighth line segment 320h, etc. Also for example, at the first gap 331, the second gap 332, the third gap 333, the fourth gap 334, the fifth gap 335, the sixth gap 336, the seventh gap 337, and the eighth gap 338, the treatment surface 310 does not contact the reference plane along the contact line 320.

[0056] As discussed herein (e.g., with regard to the example gaps 131-136 of FIGS. 1A and 1B, with regard to the example gaps 231-236 of FIG. 2, etc.), gaps may comprise any of a variety of characteristics, for example in a top view, intersecting with (or crossing) other gaps of a flattening tool. As shown in the top view 300 of FIG. 3, the gaps 331-338 are shown intersecting and/or crossing each other (e.g., crossing at acute angles, obtuse angles, etc.).

[0057] As with the example gaps 131-136 of FIGS. 1A and 1B, the example gaps 231-236 of FIG. 2, etc., the example gaps 331-338 may comprise any of a variety of widths, depths, and/or lengths.

[0058] Turning next to FIG. 4, such figure shows a top view 400 of an example flattening tool 405, in accordance with various aspects of the present disclosure. The example flattening tool 405 may, for example, share any or all characteristics with any or all other flattening tools discussed herein (e.g., the example flattening tool 105 of FIGS. 1A and 1B, the example flattening tool 205 of FIG. 2, the example flattening tool 305 of FIG. 3, the example flattening tool 505 of FIG. 5, any flattening tools discussed herein with regard to the method 600 of making a flattening tool of FIG. 6, etc.).

[0059] The flattening tool 405 may, for example, comprise a surface 410, which may also be referred to herein as a treatment surface 410. The example treatment surface 410 may, for example, comprise a first surface portion 410a, a second surface portion 410b, a third surface portion 410c, a fourth surface portion 410d, a fifth surface portion 410e, a sixth surface portion 410f, etc. The treatment surface 410 and portions thereof (e.g., surface portions 410a-410f, etc.) may, for example, share any or all characteristics with the treatment surface 110 and treatment surface portions 110a-110f thereof shown and discussed herein with regard to FIGS. 1A and 1B, with the treatment surface 210 and treatment surface portions 210a-210f thereof shown and discussed herein with regard to FIG. 2, with the treatment surface 310 and treatment surface portions 310a-310h thereof shown and discussed herein with regard to FIG. 3, etc.

[0060] As shown in FIG. 4, the upper side (or first side) of the flattening tool 405 (e.g., as shown in the top view 400 of FIG. 4) may be formed to contact a workpiece. For example, the upper side of the example flattening tool 405 may comprise a treatment surface 410, where the treatment surface 410 comprises a raised portion 415, for example a portion of the treatment surface 410 along the contact line 420. The raised portion 415 along the contact line 420 may, for example, be coplanar. For example, when the raised portion 415 is brought into contact with a reference plane (e.g., like the reference plane 118, etc.), the raised portion 415 and/or portions 415a-415h thereof may generally contact the reference plane along the contact line 420. The raised portion 415 and/or portions 415a-415f thereof may, for example, share any or all characteristics with the raised portion 115 and/or portions 115a-115f thereof discussed herein with regard to FIGS. 1A and 1B, with the raised portion 215 and/or portions 215a-215f thereof discussed herein with regard to FIG. 2, with the raised portion 315 and/or portions 315a-315h thereof discussed herein with regard to FIG. 3, etc. Also, the contact line 420 and/or segments 420a-420f thereof may, for example, share any or all characteristics with the contact line 120 and/or segments 120a-120f thereof shown and discussed herein with regard to FIGS. 1A and 1B, with the contact line 220 and/or segments 220a-220f thereof shown and discussed herein with regard to FIG. 2, with the contact line 320 and/or segments 320a-320h thereof shown and discussed herein with regard to FIG. 3, etc.

[0061] The flattening tool 405 may, for example, comprise a plurality of gaps (e.g., a first gap 431, a second gap 432, a third gap 433, a fourth gap 434, a fifth gap 435, a sixth gap 436, etc.) in the upper side of the flattening tool 405. The gaps 431-436 may, for example, share any or all aspects with the example gaps 131-136 shown and discussed herein with regard to FIGS. 1A and 1B, with the example gaps 231-236 shown and discussed herein with regard to FIG. 2, with the example gaps 331-338 shown and discussed herein with regard to FIG. 3, etc.

[0062] For example, the gaps 431-436 may interrupt the continuity of the treatment surface 410 (e.g., the raised portion 415 thereof, etc.) along the contact line 420. Thus, when the raised portion 415 is brought into contact with a reference plane (e.g., like the reference plane 118, etc.), the raised portion 415 generally contacts the reference plane along a plurality of line segments of the contact line 420, but not at respective line segments on the contact line 420 that span the gaps 431-436 (and many other gaps of FIG. 4). For example, a first surface portion 410a of the treatment surface 410 comprises a first raised portion 415a that contacts the reference plane along a first line segment 420a, a second surface portion 410b of the treatment surface 410 comprises a second raised portion 415b that contacts the reference plane along the second line segment 420b, a third surface portion 410c of the treatment surface 410 comprises a third raised portion 415c that contacts the reference plane along a third line segment 420c, a fourth surface portion 410d of the treatment surface 410 comprises a fourth raised portion 415d that contacts the reference plane along a fourth line segment 420d, a fifth surface portion 410e of the treatment surface 410 comprises a fifth raised portion 415e that contacts the reference plane along a fifth line segment 420e, a sixth surface portion 410f of the treatment surface 410 comprises a sixth raised portion 415f that contacts the reference plane along a sixth line segment 420f, etc. Also for example, at the first gap 431, the second gap 432, the third gap 433, the fourth gap 434, the fifth gap 435, the sixth gap 436, the seventh gap 437, and the eighth gap 438 (and many other gaps), the treatment surface 410 does not contact the reference plane along the contact line 420.

[0063] As discussed herein (e.g., with regard to the example gaps 131-136 of FIGS. 1A and 1B, with regard to the example gaps 231-236 of FIG. 2, with regard to the example gaps 331-338 of FIG. 3, etc.), gaps may comprise any of a variety of characteristics, for example in a top view, intersecting with (or crossing) other gaps of the flattening tool 405. As shown in the top view 400 of FIG. 4, the gaps 431-438 are shown intersecting and/or crossing each other (e.g., crossing at a right angle, etc.).

[0064] As with the example gaps 131-136 of FIGS. 1A and 1B, the example gaps 231-236 of FIG. 2, the example gaps 331-338 of FIG. 3, etc., the example gaps 431-438 et al. may comprise any of a variety of widths, depths, and/or lengths.

[0065] FIG. 5A shows a cross-sectional view 500 of an example flattening tool 505, in accordance with various aspects of the present disclosure. The cross-sectional view 500 may, for example, be taken along 190 of the example flattening tool 105 shown in FIG. 1. The example flattening tool 505 may, for example, share any or all characteristics with any or all other flattening tools discussed herein (e.g., the example flattening tool 105 of FIGS. 1A and 1B, the example flattening tool 205 of FIG. 2, the example flattening tool 305 of FIG. 3, the example flattening tool 405 of FIG. 4, any flattening tools discussed herein with regard to the method 600 of making a flattening tool of FIG. 6, etc.).

[0066] The flattening tool 505 may, for example, comprise a surface 510, which may also be referred to herein as a treatment surface 510. The example treatment surface 510 may, for example, comprise a first surface portion 510a, a second surface portion 510b, etc. The treatment surface 510 and portions thereof (e.g., surface portions 510a, 510b, etc.) may, for example, share any or all characteristics with the treatment surface 110 and surface portions 110a-110f thereof shown and discussed herein with regard to FIGS. 1A and 1B, with the treatment surface 210 and surface portions 210a-210f thereof shown and discussed herein with regard to FIG. 2, with the treatment surface 310 and surface portions 310a-310h thereof shown and discussed herein with regard to FIG. 3, with the treatment surface 410 and surface portions 410a-410f thereof shown and discussed herein with regard to FIG. 4, etc.

[0067] As shown in FIG. 5, the upper side (or first side) of the flattening tool 505 may be formed to contact a workpiece. For example, the upper side of the example flattening tool 505 may comprise a treatment surface 510, where the treatment surface 510 comprises a raised portion 515, for example a portion of the treatment surface 510 along and/or near the contact line 520. The raised portion 515 along the contact line 520 may, for example, be coplanar. For example, when the raised portion 515 is brought into contact with a reference plane (e.g., oriented into the page of FIG. 5, oriented directly into the page of FIG. 5, etc.), the raised portion 515 may generally contact the reference plane along the contact line 520. The raised portion 515 and/or portions 515a-515b thereof may, for example, share any or all characteristics with the raised portion 115 and/or portions 115a-115f thereof discussed herein with regard to FIGS. 1A and 1B, with the raised portion 215 and/or portions 215a-215f thereof discussed herein with regard to FIG. 2, with the raised portion 315 and/or portions 315a-315h thereof discussed herein with regard to FIG. 3, with the raised portion 415 and/or portions 415a-415f thereof discussed herein with regard to FIG. 4, etc. Also, the contact line 520 and/or segments 520a-520b thereof may, for example, share any or all characteristics with the contact line 120 and/or segments 120a-120f thereof shown and discussed herein with regard to FIGS. 1A and 1B, with the contact line 220 and/or segments 220a-220f thereof shown and discussed herein with regard to FIG. 2, with the contact line 320 and/or segments 320a-320h thereof shown and discussed herein with regard to FIG. 3, with the contact line 420 and/or segments 420a-420f thereof shown and discussed herein with regard to FIG. 4, etc.

[0068] The flattening tool 505 may, for example, comprise a gap 531 in the upper side of the flattening tool 505. The gap 531 may, for example, share any or all aspects with the example gaps 131-136 shown and discussed herein with regard to FIGS. 1A and 1B, with the example gaps 231-236 shown and discussed herein with regard to FIG. 2, with the example gaps 331-338 shown and discussed herein with regard to FIG. 3, with the example gaps 431-436 shown and discussed herein with regard to FIG. 4, etc.

[0069] As discussed herein (e.g., with regard to the example gaps 131-136 of FIGS. 1A and 1B, with regard to the example gaps 231-236 of FIG. 2, with regard to the example gaps 331-338 of FIG. 3, with regard to the example gaps 431-436 of FIG. 4, etc.), gaps may comprise any of a variety of characteristics (e.g., dimensional characteristics, material characteristics, etc.).

[0070] As discussed herein (e.g., with regard to FIGS. 1A and 1B, etc.), the flattening tool 505 (e.g., a treatment surface 510 thereof, etc.) may be formed from SiC and Si in a reactive infiltration process. The treatment surface 510 may thus, for example, comprise primarily an Si/SiC composite material.

[0071] The gap 531 may, for example, be formed by ablating the treatment surface 510, for example utilizing a laser or other directed energy ablation process, mechanical ablation, plasma and/or chemical etching etc. Such ablation of the treatment surface 510 (e.g., utilizing laser ablation, etc.) may, for example, result in a structure in which the treatment surface 510 is primarily made up of a Si/SiC composite material, and the surface of the gap 531 is relatively rich in elemental silicon with some SiC grains and/or portions thereof exposed. In other words, the treatment surface 510 (e.g., a raised portion 515 thereof, etc.) may comprise a composite material of Si and SiC with a first ratio of SiC to Si, and a surface (e.g., a lowermost surface, side surface, etc.) of the gap 531 may comprise a composite material of Si and SiC with a second ratio of SiC to Si, where the second ratio is less than the first ratio. In an example implementation, a surface (e.g., a lowermost surface, a lateral side surface, etc.) of the gap 531 may comprise a greater density of elemental Si than the raised portion 515 of the treatment surface 510. In more general terms the treatment surface 510 and/or raised portion 515 thereof may comprise mostly a first material, and the gap 531 or surface thereof (e.g., a lowermost surface, a lateral surface, etc.) may comprise mostly a second material different from the first material.

[0072] In an example implementation, the gap 531 may be formed to attract and/or hold particles resulting from utilization of the flattening tool (e.g., electrostatic attraction, chemical attraction, electromagnetic attraction, etc.). For example, the gap 531 may be formed to be hydrophilic. In an example implementation, for example, where there is a substantial portion of silicon in the gap 531, a native oxide may be formed on the silicon to attract and hold particles in the gap 531. In an example scenario in which SiO.sub.2 particles result from utilization of the flattening tool 505, the SiO.sub.2 particles may stick to the silicon of the gap 531. In an example implementation, the treatment surface 510 (e.g., a raised portion 515 thereof, etc.) may generally comprise SiC and/or diamond, while the surfaces of the gap 531 (e.g., a lowermost surface, a lateral surface, etc.) generally comprise silicon. Note that even in an implementation in which some silicon is at the treatment surface 510, the majority of the particles (e.g., debris, waste particles, etc.) resulting from utilization of the flattening tool 505 will be captured in the gap 531. The particles resulting from utilization of the flatting tool 505 (e.g., to abrade, lap, etc.) may also be referred to herein as swarf. An example of swarf capture is shown in FIG. 5B.

[0073] The raised portion 515 (e.g., the treatment surface 510 thereof) may, for example, comprise a first material composition that attracts debris particles (or swarf) at a first level (e.g., degree, amount, magnitude, etc.) of attraction, and the gap 531 may comprise a second material composition that attracts debris particles (or swarf) at a second level of attraction that is greater than the first level of attraction. For example, the first material composition may comprise silicon carbide and silicon at a first ratio of silicon carbide to silicon, and the second material composition may comprise silicon carbide and silicon at a second ratio of silicon carbide to silicon, where the second ratio is less than the first ratio.

[0074] FIG. 5B shows a cross-sectional view of an example flattening tool 506, in accordance with various aspects of the present disclosure. For example, the flattening tool 506 may be the same as the flattening tool 505 after having been utilized for performing a flattening operation.

[0075] As mentioned herein, a gap (e.g., the gap 531) may be formed to attract and/or hold swarf (e.g., debris particles, etc.). Examples of such swarf 580 (e.g., debris particles of different shapes and sizes, etc.) are shown in FIG. 5B attracted to and held by the surface material of the gap 531. Such attraction, for example, advantageously keeps the swarf away from the surface of the workpiece being flattened.

[0076] In general, the gaps discussed herein (e.g., gaps 131-136, gaps 231-236, gaps 331-338, gaps 431-436, gap 531, etc.) may comprise any of a variety of characteristics. Accordingly, the scope of various aspects of this disclosure should not be limited by characteristics of any particular gap or of any manner of making a gap.

[0077] Turning next to FIG. 6, such figure shows a flow diagram of an example method 600 of making a flattening tool, in accordance with various aspects of the present disclosure. The example method of FIG. 6 (e.g., any step thereof) may share any or all aspects with the flattening tools 105, 205, 305, 405, and 505 discussed herein and/or with the making thereof.

[0078] The example method 600 may, for example, start at block 605. The example method 600 may, for example, begin execution in response to any of a variety of causes or conditions. For example, the example method 600 may begin executing in response to an automation signal, a manual command to begin, arrival of one or more raw materials for the flattening tool, arrival of a partially completed flattening tool at a workstation implementing the method 600, return of execution flow of the method 600 from a later step of the method 600, etc.

[0079] The example method 600 may, for example at block 610, comprise forming the flattening tool and/or treatment surface thereof. Block 610 may, for example, comprise performing any of the surface processes discussed herein. For example, block 610 may comprise performing the reactive infiltration process discussed herein (e.g., with regard to FIGS. 1A and 1B, etc.). Also for example, block 610 may comprise incorporating boron carbide and/or diamond into or by coating onto the flattening tool (e.g., at the surface thereof), for example as discussed herein with regard to FIGS. 1A and 1B, etc.

[0080] Block 610 may, for example, forming the flattening tool utilizing any or all of the processing discussed in U.S. patent application Ser. No. 15/062,168, filed Mar. 6, 2016, and titled WAFER PIN CHUCK FABRICATION AND REPAIR, now U.S. Pat. No. 9,941,148, which is hereby incorporated herein by reference in its entirety.

[0081] The flattening tool and/or treatment surface thereof formed by block 610 may, for example, comprise any of the characteristics of the flattening tools (e.g., flattening tool 105, flattening tool 205, flattening tool 305, flattening tool 405, flattening tool 505, etc.) and/or treatment surfaces thereof (e.g., treatment surface 110, treatment surface 210, treatment surface 310, treatment surface 410, treatment surface 510, etc.).

[0082] In general, block 610 may comprise forming the flattening tool and/or treatment surface thereof. Accordingly, the scope of various aspects of this disclosure should not be limited by characteristics of any particular manner of forming the flattening tool and/or treatment surface thereof.

[0083] The example method 600 may, for example at block 620, comprise forming one or more gaps in the tool treatment surface. Block 620 may, for example, comprise performing any of the gap-forming processes discussed herein. For example, block 620 may comprise ablating the gap(s) in the treatment surface formed at block 610. Such ablating may, for example, comprise laser ablating, general focused-energy ablating, mechanical ablating, chemical etching, etc.

[0084] Also for example, block 620 may comprise forming the gap(s) while performing a treatment surface building process (e.g., at block 610, etc.)

[0085] The flattening tool and/or treatment surface thereof formed by block 610 may, for example, comprise any of the characteristics of the flattening tools discussed herein (e.g., flattening tool 105, flattening tool 205, flattening tool 305, flattening tool 405, flattening tool 505, etc.) and/or treatment surfaces thereof (e.g., treatment surface 110, treatment surface 210, treatment surface 310, treatment surface 410, treatment surface 510, etc.)

[0086] The gap(s) formed by block 620 may, for example, comprise any or all characteristics of any or all of the example gaps discussed herein (e.g., gaps 131-136, gaps 231-236, gaps 331-338, gaps 431-436, gap 531, etc.).

[0087] The example method 600 may, for example at block 695, comprise continuing execution of the example method 600. For example, block 695 may comprise looping execution of the example method 600 back to any previous block (e.g., block 605, block 610, block 620, etc.). Block 695 may also, for example, comprise testing, shipping, selling, etc. a flattening tool formed by the method 600.

[0088] In general, various aspects discussed herein have been presented in the contact of a flattening tool and/or a method of making a flattening tool. Note, however, that the scope of this disclosure applies to tools in general and/or the production thereof (e.g., abrading tools, lapping tools, polishing tools, etc.).

[0089] Many example aspects of a flattening tool and/or a method for making a flattening tool have been presented herein. For example, various aspects disclosed herein provide a flattening tool including an upper side shaped to contact a workpiece. The upper side may, for example, comprise a raised portion, such that when the raised portion is brought into contact with a reference plane, the raised portion contacts the reference plane along a first line segment of an oval. The upper side may, for example, comprise a first gap in the raised portion, where the first gap is positioned such that when the raised portion is brought into contact with the reference plane, the raised portion does not contact the reference plane along a second line segment of the oval. The oval may, for example, be or comprise an ellipse and/or a circle.

[0090] The flattening tool and/or a portion thereof may, for example, comprise a toroid shape. The flattening tool and/or a portion thereof may, for example, comprise a shape of a section of a toroid. When viewed from directly above the upper side (e.g., in a top-down view), the first gap may, for example, appear as a first straight line. In an example implementation, when viewed from directly above the upper side (e.g., in a top-down view), the upper side may comprise a circular shape, and the first straight line may be oriented along a radial line of the circular shape. In an example implementation, when viewed from directly above the upper side (e.g., in a top-down view), the first gap may appear as a first curved line.

[0091] In an example implementation, the upper side of the flattening tool may comprise a second gap in the raised portion, such that, when the raised portion is brought into contact with the reference plane, the raised portion contacts the reference plane along a third line segment of the oval, where the second line segment is positioned between the first line segment and the third line segment, and the raised portion does not contact the reference plane along a fourth line segment of the oval.

[0092] As discussed herein, the surfaces of the flattening tool may comprise any of a variety of material characteristics. For example, in an example implementation, an uppermost surface of the raised portion may comprise mostly a first material, a lowermost surface of the gap and/or lateral surfaces of the gap may comprise mostly a second material different from the first material. In an example implementation, the first material is silicon carbide, and the second material is silicon. In an example implementation, the first material is diamond, and the second material is silicon. In an example implementation, the second material is oxidized silicon, for example silicon dioxide.

[0093] Also for example, the raised portion of the flattening tool may comprise a first material composition that attracts debris at a first level of attraction, and the first gap may comprise a second material composition that attracts debris at a second level of attraction that is greater than the first level of attraction.

[0094] Various aspects of this disclosure provide a flattening tool that comprises a first side facing a first direction and shaped to contact a workpiece. The first side of the flattening tool may, for example, comprise a first surface that is shaped such that when the first surface is brought into contact with a reference plane, the first surface contacts the reference plane along a first line segment of a curve. Also for example, the first side of the flattening tool may comprise a first gap in the first surface, where the first gap is positioned such that when the first surface is brought into contact with the reference plane, the first surface does not contact the reference plane along a second line segment of the curve. The curve may, for example, be or comprise an oval.

[0095] In an example implementation, the first gap may comprise a material that attracts debris. In an example implementation, the first surface may comprise a first material composition that attracts debris at a first level of attraction, and the first gap may comprise a second material composition that attracts debris at a second level of attraction that is greater than the first level of attraction. Also for example, the first material composition may comprise first silicon carbide and first silicon at a first ratio of first silicon carbide to first silicon, and the second material composition may comprise second silicon carbide and second silicon at a second ratio of second silicon carbide to second silicon, where the second ratio is less than the first ratio.

[0096] Various aspects of this disclosure provide various methods of making a flattening tool. An example method may, for example, comprise forming a first side of the flattening tool, where the first side faces a first direction and is shaped to contact a workpiece. The forming of the first side of the flattening tool may, for example, comprise forming a first surface that is shaped such that when the first surface is brought into contact with a reference plane, the first surface contacts the reference plane along a first line segment of a curve. The forming of the first side of the flattening tool may, for example, comprise forming a first gap in the first surface, where the first gap is positioned such that when the first surface is brought into contact with the reference plane, the first surface does not contact the reference plane along a second line segment of the curve. The curve may, for example, be or comprise an oval (or ellipse, circle, etc.).

[0097] In an example implementation, forming the first gap in the first surface may comprise utilizing a laser to ablate at least a portion of the first surface.

[0098] In an example implementation, forming the first gap in the first surface may comprise forming a surface of the first gap to comprise a material that attracts debris. In an example implementation, the first surface may comprise a first material composition that attracts debris at a first level of attraction, and the first gap may comprise a second material composition that attracts debris at a second level of attraction that is greater than the first level of attraction.

[0099] In summary, various aspects of this disclosure provide a flattening tool that manages debris and a method for making a flattening tool that manages debris. As non-limiting examples, various aspects of this disclosure provide various flattening tool structures, and methods for making thereof, that comprise a feature for managing debris, for example debris resulting from utilization of the flattening tool. While the foregoing has been described with reference to certain aspects and examples, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the disclosure without departing from its scope. Therefore, it is intended that the disclosure not be limited to the particular example(s) disclosed, but that the disclosure will include all examples falling within the scope of the appended claims.