FLEXIBLE PHOTONIC CRYSTAL PANEL
20260140310 ยท 2026-05-21
Inventors
Cpc classification
G02B6/1225
PHYSICS
B82Y20/00
PERFORMING OPERATIONS; TRANSPORTING
G02B6/13
PHYSICS
International classification
B82Y20/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A stretchable photonic crystal panel, wherein the panel exhibits a percentage change of the optical resonance wave of less than 0.2%, standardized to the percentage stretch. The stretchable photonic crystal panel includes a stretchable substrate layer (1) and a nanostructured waveguide layer (2), wherein the waveguide layer (2) has polygonal portions (3), which are delimited by stretch channels (4), and wherein the polygonal portions (3) have a size between 2 m and 1 mm.
Claims
1. A flexible photonic crystal slab, wherein said slab has an optical resonance wavelength change of less than 0.2%, normalized to the percentage strain, wherein the flexible photonic crystal slab comprises a flexible substrate layer (1) and a nanostructured waveguide layer (2), wherein the waveguide layer (2) comprises portions (3) which are bounded by strain grooves (4), and wherein the portions (3) have a size between 2 m and 1 mm.
2. The flexible photonic crystal slab according to claim 1, wherein the nanostructured waveguide layer (2) is formed from at least one material selected from the group consisting of titanium dioxide (TiO.sub.2), niobium pentoxide (Nb.sub.2O.sub.5) and tantalum pentoxide (Ta.sub.2O.sub.5).
3. The flexible photonic crystal slab according to claim 1, wherein the stretchable substrate layer (1) also has a nanostructure.
4. The flexible photonic crystal slab according to claim 1, wherein the flexible photonic crystal slab has at least one sublayer (5) in addition to the stretchable substrate layer (1) and the nanostructured waveguide layer (2).
5. The flexible photonic crystal slab according to claim 4, wherein the at least one sublayer (5) is a low-index layer.
6. The flexible photonic crystal slab according to claim 4, wherein the sublayer (5) is formed from the material silicon dioxide (SiO.sub.2).
7. The flexible photonic crystal slab according to claim 1, wherein the flexible photonic crystal slab has at least one superlayer (6).
8. The flexible photonic crystal slab according to claim 7, wherein the material for the superlayer is selected from the group consisting of gold (Au) and silicon dioxide (SiO.sub.2).
9. A method for producing the flexible photonic crystal slab according to claim 1, comprising the following steps: i. forming the flexible substrate layer by: a. casting a master mold, b. degassing and c. then allowing to harden; ii. optionally, depositing a sub-layer on the flexible substrate layer formed in step i by the method of cathode sputtering; iii. depositing a high-index waveguide layer on the flexible substrate layer produced in step i or in step ii by the method of cathode sputtering; iv. producing the strain grooves in the waveguide layer by a. mechanical loading or b. lithographic methods or c. with the aid of masks, whereby strain grooves in the range of 0.5 m to 1 mm are specifically set in the lithographic method (iv. b.) or the use of masks (iv. c.).
Description
DESCRIPTION OF FIGURES
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[0050] Without restricting the general nature of the teaching, examples are described below.
[0051] The f-PCS without a sublayer are produced as follows. Polydimethylsiloxane (PDMS, manufacturer Dow Chemical, product name Sylgard 184) is stirred in a ratio of eight to one (elastomer to hardener) for twenty minutes. The ULTRA_TURRAX Tube Drive mixer from IKA is used for mixing. After twenty minutes of stirring, the PDMS is degassed. To do this, the PDMS is exposed to a vacuum for twenty minutes until no more bubbles form and a clear liquid is visible. This liquid is now placed on a nanostructured master. The master was produced by AMO GmbH using interference lithography. The nanostructure of the master has a period of 370 nm and a lattice depth of 30 nm, 45 nm or 60 nm. This master is placed in a basin so that the nanostructure is facing upwards. The PDMS is tilted onto the master until it is completely covered. The master and the PDMS are then baked at 130 C. for 30 minutes. The T6060 oven from Heraeus is used for this purpose. After baking, the now hardened PDMS is cooled for one hour. After cooling, the master and the PDMS are cut out of the basin with a scalpel and carefully separated from each other. The PDMS is now embossed with the negative form of the nanostructure. In the next step, the nanostructured PDMS is attached to a holder for the sputter system using Kapton tape and installed in the sputter system. The sputter system is the model nano36 from the company Kurt J. Lesker. It can be equipped with up to three targets. After evacuating the sputter system, a high-index layer of Nb.sub.2O.sub.5 (company: Kurt J. Lesker, EJUNBOX353TK 4) or TiO.sub.2 (company: Kurt J. Lesker, EJUTIO2403TK4) is applied to the PDMS by RF sputtering. The layer thickness is between 60 nm and 100 nm. After the sputtering process, the PDMS substrates are removed from the sputtering system. Subsequently, the portions are generated by breaking the high-index layer under mechanical stress.
[0052] The f-PCS with a sublayer are produced as follows. Polydimethylsiloxan (PDMS, manufacturer Dow Chemical, product name Sylgard 184) is mixed in a ratio of eight to one (elastomer to hardener) for twenty minutes. The mixer ULTRA_TURRAX Tube Drive from IKA is used for mixing. After twenty minutes of stirring, the PDMS is degassed. To do this, the PDMS is exposed to a vacuum for twenty minutes until no more bubbles form and a clear liquid is visible. This liquid is now placed on a nanostructured master. The master was produced by AMO GmbH using interference lithography. The nanostructure of the master has a period of 370 nm and a lattice depth of 30 nm, 45 nm or 60 nm. This master is placed in a basin with the nanostructure facing upwards. The PDMS is tipped onto the master until it is completely covered. The master and the PDMS are then baked at 130 C. for 30 minutes. The T6060 oven from Heraeus is used for this. After baking, the now hardened PDMS is cooled for one hour. After cooling, the master and the PDMS are cut out of the basin with a scalpel and carefully separated from each other. The PDMS is now embossed with the negative form of the nanostructure. In the next step, the nanostructured PDMS is attached to a holder for the sputter system using Kapton adhesive tape and installed in the sputter system. The sputter system is the model nano36 from the company Kurt J. Lesker. It can be equipped with up to three targets. After evacuating the sputter system, a low-index layer of SiO.sub.2 (company: Kurt J. Lesker, EJUSIO2453TK4) is first applied by means of RF sputtering. After that, the high-index layer Nb.sub.2O.sub.5 (company: Kurt J. Lesker, EJUNBOX353TK 4) or TiO.sub.2 (company: Kurt J. Lesker, EJUTIO2403TK4) is applied to the low-index layer by RF sputtering. The layer thickness is between 60 nm and 100 nm. After the sputtering process, the PDMS substrates are removed from the sputtering system. Subsequently, the portions are generated by breaking the high-index layer under mechanical stress.
[0053] The samples are measured in the same way for both f-PCS variants. The f-PCS is attached to a strain holder between two clamping jaws. One of the clamping jaws is movable and can be moved by a micrometer screw (Mitutoyo, 102-301). The holder is positioned on a transmitted light microscope (Nikon Eclipse Ti-U) and illuminated with white light (Nikon D-LH/LC). The strain holder is located between two linear polarizing filters that suppress the excitation light and only transmit the f-PCS resonance. The f-PCS resonance is then directed either to a spectrometer or to a Nikon camera (Nikon Digital Camera D5100). Now the f-PCS is stretched in defined steps by turning the micrometer screw further (e.g. in 100 m steps). After each step, a spectrum and an image are recorded. The spectra are evaluated retrospectively by tracking the change in the peak position of the resonance compared to the strain using fitting algorithms. The images provide information about the extent of the lateral displacement of the portions caused by the strain.
LIST OF FIGURES
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LIST OF REFERENCE SYMBOLS
[0064] 1 substrate layer [0065] 2 nanostructured waveguide layer [0066] 3 waveguide layer portions [0067] 4 stretch channels [0068] 5 sublayer [0069] 6 superlayer