SOLDERING APPARATUS
20230142133 · 2023-05-11
Assignee
Inventors
- Michael Haas (Schollbrunn, DE)
- Benedict Fleischmann (Neubrunn, DE)
- Alexander Diehm (Wertheim, DE)
- Lukas Thanhäuser (Würzburg, DE)
Cpc classification
B23K1/0016
PERFORMING OPERATIONS; TRANSPORTING
B23K1/012
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
A soldering apparatus, in particular a reflow soldering apparatus, for continuous soldering of printed circuit boards along a transport direction, having a process channel including a preheating zone, a soldering zone and a cooling zone, having fan units for circulating process gas in the process channel, wherein the fan units each comprise an electric fan motor and a fan wheel, and having at least one apparatus element, wherein the soldering apparatus can be operated in an operating mode in which the fan motors are controlled in such a way that they are operated at a constant or largely constant rotational speed, as a result of which process gas is conducted through the at least one apparatus element and is then drawn in again by the respective fan units. At least one and preferably a plurality of current measuring units are provided that, in the operating mode, measure the current strength consumed by the relevant fan motor over time, and in that at least one evaluation unit is provided and configured such that a control signal is generated by the at least one evaluation unit if the relevant measured current strength falls below or exceeds a threshold value.
Claims
1. A soldering apparatus for continuous soldering of printed circuit boards along a transport direction, having a process channel comprising a preheating zone, a soldering zone and a cooling zone, having fan units for circulating process gas in the process channel, wherein the fan units each comprise an electric fan motor and a fan wheel, and having at least one apparatus element, wherein the soldering apparatus can be operated in an operating mode in which the fan motors are controlled in such a way that they are operated at a constant or largely constant rotational speed, as a result of which process gas is conducted through the at least one apparatus element and is then drawn in again by the respective fan units, characterized in that at least one and preferably a plurality of current measuring units are provided that, in the operating mode, measure the current strength consumed by the relevant fan motor over time, and in that at least one evaluation unit is provided and configured such that a control signal is generated by the at least one evaluation unit if the relevant measured current strength falls below or exceeds a threshold value.
2. The soldering apparatus according to claim 1, characterized in that the at least one evaluation unit is further configured in such a way that further control signals are generated by the at least one evaluation unit if the measured current strength falls below or exceeds further threshold values.
3. The soldering apparatus according to claim 1, characterized in that the relevant threshold value or the threshold values are proportional to a degree of contamination of the relevant apparatus element.
4. The soldering apparatus according to claim 1, characterized in that the relevant threshold value or the threshold values are proportional to a degree of contamination of a nozzle plate through which process gas is conducted before it flows onto the printed circuit board.
5. The soldering apparatus according to claim 1, characterized in that the at least one evaluation unit is further configured in such a way that, when the relevant control signal is generated, the relevant control signal is brought to the attention of an operator or a machine controller, and/or in that steps for cleaning or for exchanging the at least one apparatus element are initiated.
6. The soldering apparatus according to claim 1, characterized in that the apparatus element is designed as a filter element that in particular comprises a non-woven filter or a bed of granules, as a heat exchanger, as a channel and/or as a channel system.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Further details and advantageous embodiments of the invention can be found in the following description, on the basis of which an embodiment of the invention is described and explained in more detail.
[0016] In the drawings:
[0017]
[0018]
[0019]
DETAILED DESCRIPTION
[0020]
[0021] As is clear from
[0022] The soldered object, i.e., the printed circuit board provided with the solder paste and equipped with electronic components, is first heated in the preheating zone 20 to a temperature below the melting temperature of the solder paste. In the soldering zone 22, the printed circuit board is heated for a certain duration to a process temperature above the melting point of the solder paste, such that the solder paste melts in the soldering zone in order to solder the electronic components to the printed circuit board. In the cooling zone 24, the soldered object is cooled such that the liquid solder solidifies before the soldered object is removed at the outlet 14 of the reflow soldering apparatus 10.
[0023] A transport system 34 is provided inside the reflow soldering apparatus 10 for transporting the printed circuit boards along the transport direction 18.
[0024] As is clear from
[0025] As is clear from the section according to
[0026] As is also clear from the section according to
[0027] The fan units 50 or 100 each have a fan motor 51 or 102, a rotor shaft 104 driven by the relevant fan motor 51, 102 and a fan wheel 106 provided on the rotor shaft 104. The relevant fan wheel 106 is a radial fan wheel that, in the case of the fan motors 102 in
[0028] During operation of the ventilator units 100, process gas 110 is blown into a guide channel 114 that extends substantially horizontally and that, following the fan wheel 106, in a transverse direction extending transversely to the transport direction 18, initially extends laterally next to and subsequently vertically below the process channel 16. Via the guide channel 114, the process gas is then blown vertically upward through a cooling element in the form of a heat exchanger 116, in which the process gas is further cooled, and blown into the process channel 16 from below through a lower nozzle plate 118. Consequently, the soldered object to be cooled is blown on from below inside the cooling zone 24.
[0029] The blown-in process gas 120 is guided toward the front longitudinal side on the soldered object provided in the process channel 14. There, the process gas 124 enters a lead-in channel 122 and is conducted vertically downward. In the region 123, the lead-in channel 122, which is provided on the main body 60, merges into an inlet channel 125. In the region of the bottom 128, the inlet channel 125 deflects process gas toward a cooling device 136 designed as a cooling plate 134.
[0030] As is clear from
[0031] The inlet channel 125 opens on the rear side into a filter region 140. A apparatus element in the form of a filter element 142 is provided in the filter region 140. The filter element 142, which can provide a filter grid with a non-woven filter, for example, extends obliquely to the horizontal and is designed to slope backward. Overall, the plane in which the cooling plate 134 is located and the plane formed by the filter element 142 include an acute angle 144.
[0032] A shielding plate 146 is provided between the intake region 109 of the fan wheel 106 and the filter element 142 and shields the intake region 109 of the fan wheel 106. In order to cause the process gas that passes through the filter element 142 to be conducted toward the intake region of the relevant fan unit 100, a guide plate 148 is provided on the main body 60.
[0033] In order to determine a degree of contamination of the soldering apparatus 10 and, in particular, to determine a degree of contamination of the filter element 142 and or of the nozzle plate 118 or 40, current measuring units 200 are provided on the fan motors 51, 102, which current measuring units, in the operating mode in which the fan motors 102 are controlled in such a way that they are operated at a constant or largely constant rotational speed, measure the current strength consumed by the relevant fan motor 102 over time.
[0034] Furthermore, an evaluation unit 202 is provided that is configured in such a way that a control signal is generated by the at least one evaluation unit 202 if the relevant current strength measured by the current measuring units 200 falls below a predefinable threshold value. The evaluation unit 202 can communicate with the current measuring units 200 via connection cables (not shown) or via a radio connection.
[0035] Due to a clogging of the filter element 142 with residues and condensate, the flow resistance of the filter element 142 increases. At a constant rotational speed of the fan motors 51, 102, the current strength consumed by the fan motors 51, 102 decreases as the flow resistance increases. If the current strength falls below a first predefinable threshold value, this is detected by the evaluation unit 202 and a control signal is sent. The sending of the control signal can, for example, result in the detected degree of contamination being brought to the attention of an operator on the communication unit 36 or in it being signaled to the machine controller that measures for cleaning the soldering apparatus 10 and/or the filter element 142 are to be initiated.
[0036] In addition to the first threshold value, it is conceivable to provide further threshold values that are then each assigned to a further progressive degree of contamination. When the relevant further threshold value is fallen below, the relevant degree of contamination is then detected and indicated to the operator or the machine controller via corresponding control signals.