Electronic-grade glass fiber composition, and glass fiber and electronic fabric thereof

Abstract

An electronic-grade glass fiber composition includes the following components with corresponding amounts by weight percentages: 54.2-60% SiO.sub.2, 11-17.5% Al.sub.2O.sub.3, 0.7-4.5% B.sub.2O.sub.3, 18-23.8% CaO, 1-5.5% MgO, less than or equal to 24.8% CaO+MgO, less than 1% Na.sub.2O+K.sub.2O+Li.sub.2O, 0.05-0.8% TiO.sub.2, 0.05-0.7% Fe.sub.2O.sub.3, and 0.01-1.2% F.sub.2. The weight percentage ratio C1=SiO.sub.2/(RO+R.sub.2O) is greater than or equal to 2.20, and the total weight percentage of the above components is greater than or equal to 98.5%.

Claims

1. An electronic-grade glass fiber composition, comprising the following components with corresponding amounts by weight percentages: TABLE-US-00022 SiO.sub.2  54.2-60% Al.sub.2O.sub.3  11-17.5% B.sub.2O.sub.3  0.7-4.5% CaO  18-23.8% MgO   1-5.5% RO═CaO + MgO less than or equal to 24.8% R.sub.2O═Na.sub.2O + K.sub.2O + Li.sub.2O less than 1% TiO.sub.2 0.05-0.8% Fe.sub.2O.sub.3 0.05-0.7% F.sub.2 0.01-1.2% P.sub.2O.sub.5   0-0.03% wherein a weight percentage ratio C1=SiO.sub.2/(RO+R.sub.2O) is greater than or equal to 2.31, and a total weight percentage of the SiO.sub.2, Al.sub.2O.sub.3, B.sub.2O.sub.3, CaO, MgO, Na.sub.2O, K.sub.2O, Li.sub.2O, TiO.sub.2, Fe.sub.2O.sub.3 and F.sub.2 is greater than or equal to 99.5%; wherein the electronic-grade glass fiber composition further comprises one or more components selected from the group consisting of SO.sub.3, SrO, CeO.sub.2, La.sub.2O.sub.3, Y.sub.2O.sub.3, and ZrO.sub.2, with a combined weight percentage of the one or more components being less than 0.5%; and wherein the electronic-grade glass composition does not comprise ZnO.

2. The electronic-grade glass fiber composition of claim 1, wherein the weight percentage of F.sub.2 is 0.05-1.2%.

3. The electronic-grade glass fiber composition of claim 1, wherein the weight percentage of R.sub.2O is less than or equal to 0.8%.

4. The electronic-grade glass fiber composition of claim 1, wherein the weight percentage of RO is 20-24.4%.

5. The electronic-grade glass fiber composition of claim 1, wherein the combined weight percentage of RO+R.sub.2O is 20.5-25%.

6. The electronic-grade glass fiber composition of claim 1, wherein a combined weight percentage of Al.sub.2O.sub.3+MgO is 13-19.1%.

7. The electronic-grade glass fiber composition of claim 1, wherein a weight percentage ratio of K.sub.2O/Na.sub.2O is greater than 0.5.

8. The electronic-grade glass fiber composition of claim 1, wherein a weight percentage ratio C2=(SiO.sub.2+Al.sub.2O.sub.3—B.sub.2O.sub.3)/(RO+R.sub.2O) is greater than or equal to 2.73.

9. The electronic-grade glass fiber composition of claim 1, wherein a weight percentage ratio C3=(SiO.sub.2+Al.sub.2O.sub.3)/(RO+R.sub.2O+B.sub.2O.sub.3) is greater than or equal to 2.50.

10. The electronic-grade glass fiber composition of claim 1, wherein a weight percentage ratio C4=B.sub.2O.sub.3/R.sub.2O is greater than or equal to 1.

11. The electronic-grade glass fiber composition of claim 1, comprising the following components with corresponding amounts by weight percentages: TABLE-US-00023 SiO.sub.2  54.2-60% Al.sub.2O.sub.3  11-17.5% B.sub.2O.sub.3  0.7-4.5% CaO  18-23.8% MgO   1-5.5% RO═CaO + MgO less than or equal to 24.8% R.sub.2O═Na.sub.2O + K.sub.2O + Li.sub.2O less than 1% RO + R.sub.2O less than or equal to 25.2% TiO.sub.2 0.05-0.8% Fe.sub.2O.sub.3 0.05-0.7% F.sub.2 0.01-1.2% wherein the weight percentage ratio C1=SiO.sub.2/(RO+R.sub.2O) is greater than or equal to 2.31, and a total weight percentage of the above components is greater than or equal to 99.5%.

12. The electronic-grade glass fiber composition of claim 1, comprising the following components with corresponding amounts by weight percentages: TABLE-US-00024 SiO.sub.2  54.2-60% Al.sub.2O.sub.3  11-17.5% B.sub.2O.sub.3  0.7-4.5% CaO  18-23.8% MgO   1-5.5% RO═CaO + MgO less than or equal to 24.8% R.sub.2O═Na.sub.2O + K.sub.2O + Li.sub.2O less than 1% TiO.sub.2 0.05-0.8% Fe.sub.2O.sub.3 0.05-0.7% F.sub.2 0.01-1.2% wherein the weight percentage ratio C1=SiO.sub.2/(RO+R.sub.2O) is greater than or equal to 2.31, a weight percentage ratio C2=(SiO.sub.2+Al.sub.2O.sub.3—B.sub.2O.sub.3)/(RO+R.sub.2O) is greater than or equal to 2.73, a weight percentage ratio C3=(SiO.sub.2+Al.sub.2O.sub.3)/(RO+R.sub.2O+B.sub.2O.sub.3) is greater than or equal to 2.50, and a total weight percentage of the above components is greater than or equal to 99.5%.

13. The electronic-grade glass fiber composition of claim 1, comprising the following components with corresponding amounts by weight percentages: TABLE-US-00025 SiO.sub.2  55-59.5% Al.sub.2O.sub.3 11.5-16.5%  B.sub.2O.sub.3  0.7-4.5% CaO  18-23.3% MgO   1-4.5% RO═CaO + MgO less than or equal to 24.4% R.sub.2O═Na.sub.2O + K.sub.2O + Li.sub.2O less than 1% RO + R.sub.2O  20.5-25% TiO.sub.2 0.05-0.8% Fe.sub.2O.sub.3 0.05-0.7% F.sub.2 0.05-1.2% wherein the weight percentage ratio C1=SiO.sub.2/(RO+R.sub.2O) is greater than or equal to 2.31, a weight percentage ratio C2=(SiO.sub.2+Al.sub.2O.sub.3—B.sub.2O.sub.3)/(RO+R.sub.2O) is greater than or equal to 2.73, and a total weight percentage of the above components is greater than or equal to 99.5%.

14. The electronic-grade glass fiber composition of claim 1, comprising the following components with corresponding amounts by weight percentages: TABLE-US-00026 SiO.sub.2 55-59.5% Al.sub.2O.sub.3 12-15.9% B.sub.2O.sub.3  1-3.5% CaO 18-23.3% MgO  1.1-4% RO═CaO + MgO less than or equal to 24.4% R.sub.2O═Na.sub.2O + K.sub.2O + Li.sub.2O less than or equal to 0.8% RO + R.sub.2O 20.5-25% TiO.sub.2 0.05-0.8%  Fe.sub.2O.sub.3 0.05-0.7%  F.sub.2 0.05-1.2%  wherein the weight percentage ratio C1=SiO.sub.2/(RO+R.sub.2O) is 2.31-2.75, a weight percentage ratio C2=(SiO.sub.2+Al.sub.2O.sub.3—B.sub.2O.sub.3)/(RO+R.sub.2O) is 2.75-3.35, a weight percentage ratio C3=(SiO.sub.2+Al.sub.2O.sub.3)/(RO+R.sub.2O+B.sub.2O.sub.3) is greater than or equal to 2.50, and a total weight percentage of the above components is greater than or equal to 99.5%.

15. An electronic-grade glass fiber comprising the composition of claim 1.

16. The electronic-grade glass fiber of claim 15, having a dielectric constant of 6.0-7.0 at 1 MHz at room temperature.

17. An electronic fabric, comprising the glass fiber of claim 15.

18. A printed circuit board, comprising a base material comprising the electronic fabric of claim 17.

Description

DETAILED DESCRIPTION OF THE EMBODIMENTS

(1) In order to better clarify the purposes, technical solutions and advantages of the examples of the present disclosure, the technical solutions in the examples of the present disclosure are clearly and completely described below. Obviously, the examples described herein are just part of the examples of the present disclosure and are not all the examples. All other exemplary embodiments obtained by one skilled in the art on the basis of the examples in the present disclosure without performing creative work shall all fall into the scope of the present disclosure. What needs to be made clear is that, as long as there is no conflict, the examples and the features of examples in the present application can be arbitrarily combined with each other.

(2) In the present disclosure, the components of the electronic-grade glass fiber composition expressed as percentage amounts by weight are: 54.2-60% SiO.sub.2, 11-17.5% Al.sub.2O.sub.3, 0.7-4.5% B.sub.2O.sub.3, 18-23.8% CaO, 1-5.5% MgO, ≤24.8% RO═CaO+MgO, <1% R.sub.2O═Na.sub.2O+K.sub.2O+Li.sub.2O, 0.05-0.8% TiO.sub.2, 0.05-0.7% Fe.sub.2O.sub.3 and 0.01-1.2% F.sub.2; wherein the weight percentage ratio C1=SiO.sub.2/(RO+R.sub.2O) is greater than or equal to 2.20, and the total weight percentage of the above components is greater than or equal to 98.5%. The composition has the advantage of low costs and high corrosion resistance. It can improve the electrical properties, especially dielectric properties, of the glass, and increase the mechanical properties, water resistance and acid resistance of the glass; it can also significantly reduce the cost of raw materials, significantly decrease the volatilization of raw materials, and minimize the corrosion of refractories. Thus, the composition is suitable for large-scale tank furnace production.

(3) The specific content values of SiO.sub.2, Al.sub.2O.sub.3, B.sub.2O.sub.3, CaO, MgO, Na.sub.2O, K.sub.2O, Li.sub.2O, TiO.sub.2, Fe.sub.2O.sub.3 and F.sub.2 in the electronic-grade glass fiber composition according to the present disclosure are selected to be used in the examples, which are compared with the properties of five comparative examples (numbered B1-B5) in terms of the following nine property parameters, with B1 being a conventional E-glass fiber composition for electronic applications, B2 being a conventional D-glass fiber composition and B3-B5 being general-purpose E-glass fiber compositions for reinforcement.

(4) (1) Forming temperature, the temperature at which the glass melt has a viscosity of 10.sup.3 poise.

(5) (2) Liquidus temperature, the temperature at which the crystal nucleuses begin to form when the glass melt cools off—i.e., the upper limit temperature for glass crystallization.

(6) (3) ΔT value, which is the difference between the forming temperature and the liquidus temperature and indicates the temperature range at which fiber drawing can be performed.

(7) (4) Tensile strength, the maximum tensile stress that the glass fiber can withstand, which can be measured on impregnated glass roving according to ASTM D2343.

(8) (5) Dielectric constant, to be determined in a procedure as follows: Mix the glass-making raw materials uniformly and then add them to a platinum crucible; hold the crucible in a high-temperature electric furnace at 1550±30° C. for 6 hours to obtain a well refined and homogenized glass liquid; pour the glass liquid into a preheated stainless steel mold to make glass blocks, hold these glass blocks in a muffle furnace for annealing, and then cut, sand and polish the annealed glass blocks to make rectangular glass pieces with a thickness of about 1.5 mm and a length and width both of about 30 mm; coat the glass pieces with silver to form electrodes and then test these pieces to obtain dielectric constant values. A smaller dielectric constant means a weaker polarization of the glass medium and a better insulation of the glass, and vice versa.

(9) (6) Amount of bubbles, to be determined in a procedure as follows: Use special molds to compress the glass batch materials in each example into samples of same dimension, which will then be placed on the sample platform of a high temperature microscope. Heat the samples according to standard procedures up to the pre-set spatial temperature 1500° C., and then the glass samples is directly cooled off with the cooling hearth to the ambient temperature without heat preservation. Finally, each of the glass samples is examined under a polarizing microscope to determine the amount of bubbles in the samples. Wherein, the amount of bubbles is identified according to a specific amplification of the microscope.

(10) (7) Water resistance, to be characterized in terms of weight loss rate. The test procedure is as follows: Put the glass powder with a particle size of 40-80 mesh into water at 95° C. for 24 hours, stir the mixture at regular intervals, and measure and determine the weight loss rate of the glass powder. A smaller weight loss rate means a better water resistance of the glass, and vice versa.

(11) (8) Acid resistance, to be characterized in terms of weight loss rate. The test procedure is as follows: Put the glass powder with a particle size of 40-80 mesh into 10% HCL solution at 23° C. for 48 hours, stir the mixture at regular intervals, and measure and determine the weight loss rate of the glass powder. A smaller weight loss rate means a better acid resistance of the glass, and vice versa.

(12) (9) Raw material cost coefficient. Set the cost of the conventional E-glass fiber composition B1 as the benchmark, its cost coefficient being 1.0. The costs of other compositions are calculated in comparison with the benchmark. A smaller cost coefficient of raw materials means a lower cost of the composition, and vice versa.

(13) The aforementioned nine parameters and the methods of measuring them are well-known to one skilled in the art. Therefore, these aforementioned parameters can be effectively used to explain the technical features and advantages of the electronic-grade glass fiber composition according to the present disclosure.

(14) The specific procedures for the experiments are as follows: Each component can be acquired from the appropriate raw materials. Mix the raw materials in the appropriate proportions so that each component reaches the final expected weight percentage. The mixed batch is melted and refined. Then the molten glass is drawn out through the tips of the bushings, thereby forming the glass fiber. The glass fiber is attenuated onto the rotary collet of a winder to form cakes or packages. Of course, conventional methods can be used to further process these glass fibers to meet the expected requirement.

(15) Comparisons of the property parameters of the examples of the electronic-grade glass fiber composition according to the present disclosure with those of the comparative examples are further made below by way of tables, wherein the component contents of the compositions for producing glass fiber are expressed as weight percentage. What needs to be made clear is that the total amount of the components in an example is slightly less than 100%, and it should be understood that the remaining amount is trace impurities or a small amount of components which cannot be analyzed.

(16) TABLE-US-00016 TABLE 1A A1 A2 A3 A4 A5 Component SiO.sub.2 58.10 58.10 58.10 58.10 58.10 Al.sub.2O.sub.3 14.80 14.50 14.20 15.20 13.90 CaO 21.10 21.10 21.10 21.10 21.10 MgO 1.90 1.90 1.90 1.50 1.90 B.sub.2O.sub.3 2.60 2.60 2.60 2.60 3.50 TiO.sub.2 0.30 0.30 0.30 0.30 0.30 Fe.sub.2O.sub.3 0.30 0.30 0.30 0.30 0.30 K.sub.2O 0.25 0.35 0.50 0.25 0.25 Na.sub.2O 0.10 0.30 0.45 0.10 0.10 F.sub.2 0.45 0.45 0.45 0.45 0.45 Ratio C1 2.49 2.46 2.43 2.53 2.49 C2 3.01 2.96 2.91 3.08 2.93 C3 2.81 2.77 2.72 2.87 2.68 C4 7.43 4.00 2.74 7.43 10.00 Parameter Forming 1242 1237 1230 1245 1236 temperature/ ° C. Liquidus 1137 1133 1127 1137 1130 temperature/ ° C. ΔT/° C. 105 104 103 108 106 Tensile 2250 2230 2180 2270 2220 strength/MPa Dielectric 6.55 6.65 6.80 6.45 6.35 constant Amount of 8 7 6 9 7 bubbles/pcs Water 0.35 0.45 0.55 0.30 0.40 resistance, in weight loss rate/% Acid 0.45 0.50 0.50 0.45 0.55 resistance, in weight loss rate/% Raw material 0.65 0.66 0.67 0.65 0.71 cost coefficient

(17) TABLE-US-00017 TABLE 1B A6 A7 A8 A9 A10 Component SiO.sub.2 60.00 60.00 58.00 56.60 56.60 Al.sub.2O.sub.3 12.00 13.10 14.50 15.90 15.00 CaO 20.50 21.90 21.90 21.90 21.90 MgO 1.00 1.80 1.80 1.80 1.80 B.sub.2O.sub.3 4.50 1.00 1.90 1.90 3.25 TiO.sub.2 0.05 0.30 0.30 0.30 0.60 Fe.sub.2O.sub.3 0.60 0.20 0.40 0.40 0.10 K.sub.2O 0.30 0.35 0.35 0.35 0.35 Na.sub.2O 0.20 0.25 0.25 0.25 0.25 F.sub.2 0.75 1.00 0.50 0.50 0.05 Ratio C1 2.73 2.47 2.39 2.33 2.33 C2 3.07 2.97 2.91 2.91 2.81 C3 2.72 2.89 2.77 2.77 2.60 C4 9.00 1.67 3.17 3.17 5.42 Parameter Forming 1244 1248 1236 1232 1240 temperature/ ° C. Liquidus 1134 1144 1134 1129 1134 temperature/ ° C. ΔT/° C. 110 104 102 103 106 Tensile 2150 2270 2260 2230 2180 strength/MPa Dielectric 6.50 6.85 6.70 6.75 6.65 constant Amount of 8 10 7 6 7 bubbles/pcs Water 0.45 0.40 0.40 0.35 0.35 resistance, in weight loss rate/% Acid 0.60 0.35 0.40 0.40 0.45 resistance, in weight loss rate/% Raw material 0.80 0.58 0.63 0.62 0.70 cost coefficient

(18) TABLE-US-00018 TABLE 1C A11 A12 A13 A14 A15 Component SiO.sub.2 54.20 55.00 56.50 56.50 59.50 Al.sub.2O.sub.3 17.50 16.50 15.10 15.10 13.00 CaO 21.00 22.80 22.40 23.30 19.00 MgO 2.00 1.70 1.10 1.00 4.00 B.sub.2O.sub.3 4.00 2.70 3.50 2.50 2.50 TiO.sub.2 0.45 0.30 0.25 0.30 0.25 Fe.sub.2O.sub.3 0.05 0.30 0.35 0.30 0.35 K.sub.2O 0.30 0.30 0.25 0.30 0.30 Na.sub.2O 0.20 0.20 0.10 0.20 0.35 F.sub.2 0.20 0.10 0.35 0.40 0.65 Ratio C1 2.31 2.20 2.37 2.28 2.52 C2 2.88 2.75 2.86 2.79 2.96 C3 2.61 2.58 2.62 2.62 2.77 C4 8.00 5.40 10.00 5.00 3.85 Parameter Forming 1227 1232 1222 1230 1236 temperature/ ° C. Liquidus 1124 1129 1116 1125 1130 temperature/ ° C. ΔT/° C. 103 103 106 105 106 Tensile 2210 2160 2180 2230 2260 strength/MPa Dielectric 6.55 6.75 6.50 6.70 6.65 constant Amount of 7 6 6 7 8 bubbles/pcs Water 0.35 0.35 0.45 0.40 0.45 resistance, in weight loss rate/% Acid 0.45 0.45 0.50 0.45 0.45 resistance, in weight loss rate/% Raw material 0.74 0.65 0.70 0.65 0.66 cost coefficient

(19) TABLE-US-00019 TABLE 1D A16 A17 A18 A19 A20 Component SiO.sub.2 57.60 57.60 56.50 57.60 58.10 Al.sub.2O.sub.3 14.70 14.70 14.70 14.70 14.70 CaO 22.15 21.65 21.65 20.55 20.55 MgO 2.15 2.15 2.15 2.15 1.65 B.sub.2O.sub.3 1.50 2.00 3.10 3.10 3.10 TiO.sub.2 0.35 0.35 0.35 0.35 0.35 Fe.sub.2O.sub.3 0.35 0.35 0.35 0.35 0.35 K.sub.2O 0.35 0.35 0.35 0.35 0.35 Na.sub.2O 0.30 0.30 0.30 0.30 0.30 F.sub.2 0.45 0.45 0.45 0.45 0.45 Ratio C1 2.31 2.36 2.31 2.47 2.54 C2 2.84 2.88 2.79 2.96 3.05 C3 2.73 2.73 2.58 2.73 2.81 C4 2.31 3.08 4.77 4.77 4.77 Parameter Forming 1230 1231 1224 1233 1239 temperature/ ° C. Liquidus 1129 1126 1119 1124 1133 temperature/ ° C. ΔT/° C. 101 105 105 109 106 Tensile 2270 2240 2140 2170 2230 strength/MPa Dielectric 6.80 6.75 6.70 6.60 6.55 constant Amount of 6 7 5 7 8 bubbles/pcs Water 0.40 0.45 0.50 0.45 0.40 resistance, in weight loss rate/% Acid 0.40 0.45 0.55 0.50 0.50 resistance, in weight loss rate/% Raw material 0.61 0.63 0.69 0.70 0.70 cost coefficient

(20) TABLE-US-00020 TABLE 1E A21 A22 A23 A23 A25 Component SiO.sub.2 57.50 57.50 58.10 58.10 58.10 Al.sub.2O.sub.3 15.00 15.00 14.70 14.70 14.70 CaO 20.80 20.80 20.05 20.05 20.05 MgO 3.00 3.00 1.65 1.65 1.65 B.sub.2O.sub.3 1.95 1.95 3.10 3.10 3.10 TiO.sub.2 0.35 0.35 0.35 0.35 0.35 Fe.sub.2O.sub.3 0.35 0.35 0.35 0.35 0.35 Li.sub.2O — 0.20 — — — SrO — — 0.50 — — ZrO.sub.2 — — — 0.50 — La.sub.2O.sub.3 — — — — 0.50 K.sub.2O 0.25 0.25 0.35 0.35 0.35 Na.sub.2O 0.25 0.05 0.30 0.30 0.30 F.sub.2 0.45 0.45 0.45 0.45 0.45 Ratio C1 2.37 2.37 2.60 2.60 2.60 C2 2.90 2.90 3.12 3.12 3.12 C3 2.76 2.76 2.86 2.86 2.86 C4 3.90 3.90 4.77 4.77 4.77 Parameter Forming 1233 1227 1237 1245 1235 temperature/ ° C. Liquidus 1131 1126 1129 1131 1124 temperature/ ° C. ΔT/° C. 102 101 108 114 111 Tensile 2240 2300 2250 2270 2270 strength/MPa Dielectric 6.70 6.65 6.50 6.40 6.35 constant Amount of 7 5 8 10 7 bubbles/pcs Water 0.35 0.30 0.40 0.35 0.40 resistance, in weight loss rate/% Acid 0.45 0.40 0.45 0.45 0.45 resistance, in weight loss rate/% Raw material 0.62 0.76 0.71 0.73 0.73 cost coefficient

(21) TABLE-US-00021 TABLE 1F B1 B2 B3 B4 B5 Component SiO.sub.2 54.16 73.00 59.05 56.50 54.00 Al.sub.2O.sub.3 14.32 1.00 13.08 14.70 15.20 CaO 22.12 0.60 24.29 22.50 24.00 MgO 0.41 0.50 2.83 4.00 2.10 B.sub.2O.sub.3 7.26 22.00 0 0.50 2.50 TiO.sub.2 0.34 0 0.04 0.25 0.25 Fe.sub.2O.sub.3 0.39 0 0.36 0.30 0.30 K.sub.2O 0.25 2.90 0.23 0.35 0.40 Na.sub.2O 0.45 0.03 0.55 0.90 F.sub.2 0.29 0 0.04 0.25 0.25 Ratio C1 2.33 18.25 2.16 2.06 1.97 C2 2.64 13.00 2.63 2.58 2.43 C3 2.25 2.85 2.63 2.55 2.31 C4 10.37 7.59 0 0.56 1.92 Parameter Forming 1175 1410 1248 1240 1215 temperature/ ° C. Liquidus 1075 1250 1169 1190 1185 temperature/ ° C. ΔT/° C. 100 160 79 50 30 Tensile 1982 1870 2290 2180 2050 strength/MPa Dielectric 6.80 4.20 7.25 7.30 7.40 constant Amount of 10 20 18 10 7 bubbles/pcs Water 0.80 1.80 0.35 0.55 0.80 resistance, in weight loss rate/% Acid 4.05 9.30 0.30 0.50 0.95 resistance, in weight loss rate/% Raw material 1.00 2.00 0.51 0.56 0.70 cost coefficient

(22) It can be seen from the values in the above tables that, compared with the compositions of general-purpose E-glass fiber for reinforcement, the electronic-grade glass fiber composition according to the present disclosure have the following advantages: (1) lower dielectric constant; (2) lower liquidus temperature; and (3) wider temperature range for fiber formation.

(23) Compared with the composition of the conventional E-glass fiber, the electronic-grade glass fiber composition according to the present disclosure has the following advantages: (1) lower raw material cost; (2) higher tensile strength; (3) better water and acid resistance; and (4) improved dielectric constant levels.

(24) Compared with the composition of the conventional D-glass fiber, the electronic-grade glass fiber composition according to the present disclosure have the following advantages: (1) much lower raw material cost; (2) much higher tensile strength; (3) much better water and acid resistance; and (4) smaller amount of bubbles.

(25) Therefore, it can be seen from the above that, compared with the compositions of general-purpose E-glass fiber for reinforcement, conventional E-glass fiber and conventional D-glass fiber, the electronic-grade glass fiber composition according to the present disclosure has made a breakthrough in terms of cost performance of products, raw material cost, dielectric constant, tensile strength, liquidus temperature, temperature range for fiber formation, water resistance and acid resistance. With unexpected technical effects, the composition enables an easy achievement of large-scale tank furnace production.

(26) The electronic-grade glass fiber composition according to the present disclosure can be used for making glass fibers for electronic applications having the aforementioned properties. The glass fibers can then be used for making electronic fabrics.

(27) The electronic-grade glass fiber composition according to the present disclosure in combination with one or more organic and/or inorganic materials can be used for preparing composite materials having excellent performance, such as glass fiber reinforced base materials.

(28) It is to be noted that, in this text, the terms “comprise/comprising”, “contain/containing” and any other variants thereof are non-exclusive, so that any process, method, object or device containing a series of elements contains not only such factors, but also other factors not listed clearly, or further contains inherent factors of the process, method, object or device. Without further restrictions, a factor defined by the statement “comprises/comprising an/a . . . ”, “contain/containing an/a . . . ” or any other variants thereof does not exclude other identical factors in the process, method, object or device including said factors.

(29) The foregoing embodiments are provided only for describing instead of limiting the technical solutions of the present disclosure. While particular embodiments of the disclosure have been shown and described, it will be obvious to one skilled in the art that modifications can be made to the technical solutions embodied by all the aforementioned embodiments, or that equivalent replacements can be made to some of the technical features embodied by all the aforementioned embodiments, without departing from the spirit and scope of the technical solutions of the present disclosure.

INDUSTRIAL APPLICABILITY

(30) The electronic-grade glass fiber composition according to the present disclosure can improve the dielectric properties of glass, and increase the mechanical properties, water resistance and acid resistance of glass fiber; it can also significantly reduce the cost of raw materials, significantly decrease the volatilization of raw materials, and minimize the corrosion of refractories. Thus, the composition is suitable for large-scale tank furnace production.

(31) Compared with conventional glass fiber compositions, the electronic-grade glass fiber composition according to the present disclosure has made a breakthrough in terms of cost performance of products, raw material cost, dielectric constant, tensile strength, liquidus temperature, temperature range for fiber formation, and water and acid resistance.

(32) Therefore, the present disclosure has good industrial applicability.