Microphone unit

Abstract

A microphone unit including a tubular case having an opened top and an opened bottom, a waterproof film made of metal that has a thickness of 0.01 mm or more and 0.05 mm or less, a hardness of 100 HV or more, a proof stress of 70 N/mm.sup.2 or more, and a tensile strength of 350 N/mm.sup.2 or more, the waterproof film being fixed to the bottom of the case so as to block an opening part of the bottom of the case, a substrate arranged in the case, a microphone mounted on the substrate, and a sealing member that seals an opening part of the top of the case.

Claims

1. A microphone unit comprising: a tubular case having an opened top and an opened bottom; a waterproof film made of metal that has a thickness of 0.01 mm or more and 0.05 mm or less, a hardness of 100 HV or more, a proof stress of 70 N/mm.sup.2 or more, and a tensile strength of 350 N/mm.sup.2 or more, the waterproof film being fixed to the bottom of the case so as to block an opening part of the bottom of the case; a substrate arranged in the case; a microphone mounted on the substrate; and a sealing member that seals an opening part of the top of the case.

2. The microphone unit according to claim 1, wherein a gap is provided between the substrate and the waterproof film so that a distance between the substrate and the waterproof film is 0.01 mm or more and 0.5 mm or less.

3. The microphone unit according to claim 2, further comprising a spacer made of a conductive material which is pinched between the substrate and the waterproof film and connected to GND of the substrate.

4. The microphone unit according to claim 1, wherein the waterproof film is fixed to the bottom of the case by spot welding.

5. The microphone unit according to claim 2, wherein the waterproof film is fixed to the bottom of the case by spot welding.

6. The microphone unit according to claim 3, wherein the waterproof film is fixed to the bottom of the case by spot welding.

7. The microphone unit according to claim 1, wherein the waterproof film is fixed to the bottom of the case by seam welding.

8. The microphone unit according to claim 2, wherein the waterproof film is fixed to the bottom of the case by seam welding.

9. The microphone unit according to claim 3, wherein the waterproof film is fixed to the bottom of the case by seam welding.

10. The microphone unit according to claim 1, wherein the waterproof film is fixed by fitting the waterproof film into a groove provided on an inner circumference of a lower end of the case.

11. The microphone unit according to claim 2, wherein the waterproof film is fixed by fitting the waterproof film into a groove provided on an inner circumference of a lower end of the case.

12. The microphone unit according to claim 3, wherein the waterproof film is fixed by fitting the waterproof film into a groove provided on an inner circumference of a lower end of the case.

13. The microphone unit according to claim 1, wherein an amplifier circuit, a filter circuit, and an equalizer circuit are mounted on the substrate as electronic circuits.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a plan view of microphone units of a first embodiment and a first modification;

(2) FIG. 2 is a cross-sectional view of the microphone unit of the first embodiment based on a cutting line 2-2 and a projection direction indicated by arrows in FIG. 1;

(3) FIG. 3 is a bottom view of a substrate; and

(4) FIG. 4 is a cross-sectional view of the microphone unit of the first modification based on the cutting line 2-2 and the projection direction indicated by the arrows in FIG. 1.

DETAILED DESCRIPTION

(5) Hereinafter, an embodiment of the present invention will be described in detail. Components having the same functions are designated by the same reference numerals, and duplicate description thereof will be omitted.

First Embodiment

(6) Hereinafter, the structure of a microphone unit of a first embodiment will be described with reference to FIGS. 1 and 2. As shown in FIG. 2, the microphone unit 1 of the present embodiment comprises a tubular case 11 having an opened top and an opened bottom, a waterproof film 12 made of metal which is fixed to the bottom of the case 11 so as to block an opening part of the bottom of the case 11, a spacer 13 made of a conductive material which is pinched between the substrate 14 and the waterproof film 12, a substrate 14 arranged in the case 11, a microphone 15 mounted on the substrate 14, and a sealing member 16 for sealing an opening part of the top of the case 11. A hole 145 is formed in the substrate 14, and a hole 165 is formed in the sealing member 16. An amplifier circuit, a filter circuit, and an equalizer circuit are mounted on the substrate 14 as electronic circuits for adjusting characteristics. In the present embodiment, a MEMS microphone is assumed, but this can be replaced with an ECM or a dynamic microphone. When an ECM or dynamic microphone is used, the heat resisting temperature changes, so that it is necessary to pay attention to this point when designing.

(7) For the case 11 is selected a material that can withstand a high water pressure (for example, 10 MPa), and is compatible with the material of a vibrating film. For example, a SUS case may be used. The thickness of the case 11 (t.sub.1 in FIG. 2) is suitably set to about 0.2 mm to 3.0 mm.

(8) For the material of the waterproof film 12 is suitable a material that has no air permeability, has springiness, and returns to its original shape even when it is pressed and deformed, and a metal thin film that is not easily corroded, for example, a SUS film may be used, which improves water resistance and waterproofness. Similar performance can be achieved by using a thin film of resin as the waterproof film 12.

(9) Further, the waterproof film 12 is configured to have a thickness (t.sub.2 in FIG. 2) of 0.01 mm or more and 0.05 mm or less, a hardness of 100 HV or more, a proof stress of 70 N/mm.sup.2 or more, and a tensile strength of 350 N/mm.sup.2 or more, whereby it is possible to achieve a waterproof structure that meets the highest level of IPX9K in the in-vehicle IP (K) test. Elongation of 10% or more may be set as an additional condition. As a result, the microphone unit 1 of the present embodiment can be used as an external microphone because it can achieve a waterproof structure that can withstand high-pressure washing.

(10) The waterproof film 12 may be fixed to the bottom of the case 11 by spot welding or seam welding. Further, the waterproof film 12 may be bonded to the bottom of the case 11 with an adhesive or a strong double-sided adhesive tape. By firmly bonding the waterproof film 12 and the case 11, the bonded part will not be damaged even under high water pressure (for example, 10 MPa).

(11) The distance between the substrate 14 and the waterproof film 12 is a parameter for adjusting the sensitivity, and the optimum value thereof also varies depending on the structure and the vibration diameter. For example, when the film thickness of the waterproof film 12 (SUS film) is set to 30 μm and the outer diameter thereof is set to ϕ14 (vibration diameter: ϕ12), the distance between the substrate 14 and the waterproof film 12 is suitably set to 0.01 mm to 0.5 mm. In the present embodiment, the height of the spacer 13 (t.sub.3 in FIG. 2) is set to 0.1 mm or more and 0.5 mm or less to provide a gap between the substrate 14 and the waterproof film 12, whereby the distance between the substrate 14 and the waterproof film 12 is set to 0.1 mm or more and 0.5 mm or less.

(12) Further, by adjusting the distance between the substrate 14 and the waterproof film 12, the microphone unit is structured such that the substrate 14 supports the waterproof film 12 even under high water pressure (for example, 10 MPa), so that the limit of the proof stress of the waterproof film 12 is hardly exceeded and the restoration time of the waterproof film 12 can be shortened.

(13) It is also possible to further miniaturize the microphone unit 1 by reducing the diameter of the microphone unit 1 and making the film thickness of the waterproof film 12 smaller.

(14) When the substrate 14 and the case 11 are joined to each other, the substrate 14 and the case 11 may be joined to each other by pressing from above with a highly elastic adhesive or a structure such as a cap. It is possible to cope with atmospheric pressure fluctuation occurring at a temperature of 105° C. to −40° C. by the springiness of the waterproof film 12 and the fixing method of the substrate 14 (a method using a highly elastic adhesive).

(15) As shown in FIG. 3, a GND pattern 147 is provided on the outer edge of the bottom surface of the substrate 14, and the GND pattern 147 and the spacer 13 (conductive material) are brought into contact with (connected to) each other, whereby the case 11 and the waterproof film 12 can be used as a shield, so that resistance to static electricity and electromagnetic noise is improved. When the spacer 13 is made of a non-conductive material, it can be replaced by forming a GND pattern on the surface of the substrate 14 and connecting the GND pattern to the case 11 with a conductive material.

(16) First Modification

(17) As shown in FIG. 4, the waterproof film 12 may be fixed to the lower end of the case 11 by press-fitting the waterproof film 12 and a washer 17 into a groove 111 provided on the inner circumference of the lower end of the case 11 so that the waterproof film 12 and the washer 17 are fitted (clamped) to each other. The waterproof film 12 is fixed by spot welding or seam welding as in the case of the first embodiment, or the waterproof film 12 is clamped together with the washer 17 as in the case of the first modification, whereby the structure can withstand a pressure of 10 MPa and a water pressure under water.

(18) <Usage of the Microphone Units of the First Embodiment and the First Modification>

(19) The microphone units of the first embodiment and the first modification can be used for the following articles, for example.

(20) 1) Waterproof microphone, outdoor microphone, external microphone

(21) 2) Vending machine (voice recognition microphone)

(22) 3) Security camera

(23) 4) Entrance door (voice recognition microphone, intercom, etc.)

(24) 5) Vehicle backward warning buzzer control microphone

(25) 6) Keyless unlocking/locking answerback sound control microphone

(26) 7) Failure detection of heavy machinery and robots