DYADIC RADIAL COUPLER
20230155270 · 2023-05-18
Inventors
Cpc classification
H01Q9/0407
ELECTRICITY
H05K1/0243
ELECTRICITY
International classification
Abstract
A two-port dyadic radial coupler for RF communications between PCB layers is disclosed. The coupler includes an input port, an impedance matching transformer, a coaxial conductor, and at least one coupled port. The input or coupled port has an at least partially annular conducting strip axially aligned with the coaxial conductor, causing radial coupling excitation by an RF signal to couple the signal between the input port and coupled port. The coupler is configured for coupling of RF signals within a select frequency range at 0 dB attenuation. In other embodiments, the coupler is configured for frequency-selective coupling to attenuate undesired frequencies. In various embodiments, the RF signal is parasitically coupled to a plurality of coupled ports on intermediate layers of the PCB. In additional embodiments, the coupled port may be left disconnected from additional circuit elements, causing the coupler to act as an antenna.
Claims
1. A dyadic radial coupler comprising: an input port comprising a transmission line on an input layer of a printed circuit board (PCB); a coaxial conductor, an end of the conductor operatively connected to the transmission line; and a coupled port located at an opposite end of the coaxial conductor, wherein: the dyadic radial coupler includes an at least partially annular conducting strip at one end of the coaxial conductor such that coaxial coupling of an RF signal is achieved between the input port and the coupled port.
2. The dyadic radial coupler of claim 1, further comprising an impedance transformer integrated within the transmission line of the input port or the transmission line of the coupled layer.
3. The dyadic radial coupler of claim 1, wherein the coupled port includes a transmission line on a coupled layer of the PCB and the coupled layer transmission line includes an at least partially annular conducting strip.
4. The dyadic radial coupler of claim 3, wherein the input layer transmission line or coupled layer transmission line is a stripline feed.
5. The dyadic radial coupler of claim 1, wherein the coupler has about 0 dB of loss for coupled RF signals in a frequency range of about 25 to about 31 GHz.
6. The dyadic radial coupler of claim 3, wherein the coupled layer at least partially annular conducting strip is a complete ring.
7. The dyadic radial coupler of claim 3, wherein the coupled layer at least partially annular conducting strip is a semicircle, circular sector, or a circular segment.
8. The dyadic radial coupler of claim 3, wherein the coupled layer at least partially annular conducting strip is parabolic, hyperbolic, or elliptical.
9. The dyadic radial coupler of claim 1, wherein the coupled port is disconnected from additional circuit elements to allow an RF signal to radiate into free space.
10. The dyadic radial coupler of claim 9, further comprising a microstrip patch and at least one ground plane.
11. The dyadic radial coupler of claim 10, wherein a plurality of conductors connect a first PCB layer and a second PCB layer, both PCB layers acting as ground planes.
12. The dyadic radial coupler of claim 10, wherein a plurality of couplers are connected together to form an antenna array having a common ground plane.
13. A dyadic radial coupler comprising: an input port including a transmission line on an input layer of a printed circuit board (PCB); a coaxial conductor, one end of the coaxial conductor operatively connected to the input layer transmission line; and a coupled port including a transmission line on a coupled layer of the PCB, the coupled layer transmission line operatively connected to an opposite end of the coaxial conductor, wherein the input layer transmission line includes a conducting strip on the input layer of the PCB and the coupled layer transmission line includes a conducting strip on the coupled layer of the PCB such that coaxial coupling of an RF signal is achieved between the input port and the coupled port.
14. The dyadic radial coupler of claim 13, further comprising a through port and a coupled port on an intermediate layer of the PCB, the through port operatively connected to the coaxial conductor and the coupled port operatively connected to a parasitic coupler such that parasitic coupling of an RF signal is achieved between the input port and the intermediate layer coupled port.
15. The dyadic radial coupler of claim 14, wherein the parasitic coupler includes a conducting strip adjacent to the coaxial conductor to achieve parasitic coupling of the RF signal.
16. The dyadic radial coupler of claim 15, wherein a nonlinear portion of an intermediate layer transmission line operatively connects the parasitic coupler to the coupled port.
17. The dyadic radial coupler of claim 15, wherein the dyadic radial coupler acts as a filter having a pass band range of about 37 to 42 GHz and a stop band range of about 26 to 30 GHz.
18. A method of constructing a dyadic radial coupler on a printed circuit board (PCB), the method comprising: patterning an input layer of the PCB with an input transmission line including an input port and an at least partially annular conducting strip; and connecting an end of a coaxial conductor to the input layer of the PCB such that the end of the conductor is at least partially enveloped by the conducting strip and operatively connected to the input port by way of the input transmission line.
19. The method of claim 18, further comprising: patterning a coupled layer of the PCB with a coupled transmission line including a coupled port and an at least partially annular conducting strip; and connecting an opposite end of the coaxial conductor to the coupled layer of the PCB such that the opposite end of the conductor is at least partially enveloped by the coupled layer conducting strip and operatively connected to the coupled port by way of the coupled transmission line.
20. The method of claim 18, further comprising: patterning an intermediate layer of the PCB with a conductive substrate to form a ground plane; and repeating the steps of patterning the input layer and connecting a coaxial conductor to form an antenna array with a plurality of dyadic radial couplers having a shared ground plane.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0020] The following detailed description of certain embodiments presents various descriptions of specific embodiments. However, the innovations described herein can be embodied in a multitude of different ways, for example, as defined and covered by the claims. In this description, reference is made to the drawings where like reference numerals can indicate identical or functionally similar elements. It will be understood that elements illustrated in the figures are not necessarily drawn to scale. Moreover, it will be understood that certain embodiments can include more elements than illustrated in a drawing and/or a subset of the elements illustrated in a drawing. Further, some embodiments can incorporate any suitable combination of features from two or more drawings.
[0021] Referring initially to
[0022] An end of the matching transformer 150 opposite from the input port operably connects the matching transformer to a coaxial conductor 130. The coaxial conductor 130 couples RF signals between different layers of the PCB after impedance matching and signal conditioning is performed by the matching transformer 150. An at least partially annular conducting strip 155 surrounds the coaxial conductor 130 except where the conductor contacts the input layer stripline feed 105. A radius of the conducting strip 155 is selected to enhance coupling of the RF signal components at desired frequencies based upon the dimensions of the coaxial conductor 130 and impedance matching transformer 150. The at least partially annular conducting strip 155 can also serve to isolate the dyadic radial coupler 100 from RF emissions by nearby circuit components.
[0023]
[0024] The coupled layer stripline feed 106 further includes an impedance matching transformer 150, which in certain embodiments may be identical to the impedance matching transformer of the input layer stripline feed 105. In other embodiments, the dimensions of the matching transformer 150 may be selected to improve coupling of specific RF frequencies, or to reduce the surface area of the DRC 100 on the input PCB layer 110 or coupled PCB layer 140. The impedance matching transformer 150 is operatively connected to an output port 170, which is also included at least partially in the coupled layer stripline feed 106, for coupling the RF signal to another part of a circuit on the coupled PCB layer 140. In some embodiments, the stripline feed 106 can further include a tapered portion 151 located between the matching transformer 150 and the input port 170. The impedance matching transformer 150 and tapered portion 151 on the coupled layer 140 can be substantially the same as those on the input layer 110, or can be selected for improved signal conditioning on the coupled layer.
0 dB Coupling Embodiment
[0025] Referring now to
[0026] In one embodiment, the radius 210 is selected to match a maximum coupled length (La) 230 of the DRC 100 for coupling RF signals with approximately 0 dB of loss. In the 0 dB coupling embodiment, the DRC 100 is configured to couple RF signal components within a desired frequency range with minimal loss. To achieve 0 dB coupling, the radius (r) 210 is determined based on a coupled length (La) 230 selected to couple the desired frequencies, where (r) is given by Equation 1 and Equation 2 below and β.sub.even/β.sub.odd are the phase delays of even and odd components of the coupled RF signal.
[0027]
[0028] Return losses 320/330 measured from the input port 120 and coupled port 170 are also illustrated in
[0029] Although
Parasitic Coupling Embodiment
[0030] Referring now to
[0031] In
[0032] Adjacent to the coaxial conductor 130, a parasitic coupler 410 is provided on the coupled layer 140 to parasitically couple the RF signal as it passes between the coaxial conductor 130 and the through port 430. In the preferred embodiment, the parasitic coupler 410 is substantially a half-ring axially aligned with the coaxial coupler 130 and separated by a partially annular conducting strip in the via. In various embodiments, the parasitic coupler 410 can be substantially parabolic, hyperbolic, circular, or elliptical, the dimensions of the coupler determined by the desired level of coupling and chosen coupled frequencies. In certain embodiments, the parasitic coupler 410 can be substantially a straight microstrip or stripline segment that terminates at an edge of the via adjacent to the coaxial conductor 130. In the preferred embodiment, the parasitic coupler 410 attenuates the RF signal by approximately 7.5 dB as the signal is extracted from the coaxial conductor 130. To reduce the surface area of the DRC 100 on the PCB, the parasitic coupler 140 can be formed at a lesser angle relative to the central conductor at the expense of greater signal attenuation. Conversely, the parasitic coupler 140 can be made substantially a ring to envelop the conductor and increase the level of coupling.
[0033] A parasitic stripline 440 operatively connects the parasitic coupler 410 to a matching transformer 150 for filtering and signal conditioning of the parasitically coupled RF signal. In the preferred embodiment, the parasitic stripline 440 forms a curve to reduce the length of the DRC 100 on the coupled layer 140 of the PCB. The curvature of the parasitic stripline 440 is selected to mitigate reflections or attenuation of the coupled RF signal. In alternate embodiments, the parasitic stripline 440 can be either substantially straight or otherwise nonlinear to accommodate nearby components on the coupled layer 140 of the PCB. The matching transformer 150 performs additional signal conditioning and filtering before the RF signal is coupled to the coupled port 170. The parasitic coupler 410, parasitic stripline 440, impedance matching transformer 150, and coupled port 170 can be duplicated on a plurality of coupled layers 140 of the PCB to parasitically couple the RF signal from the coaxial conductor 130. This parallelization allows the RF signal to propagate simultaneously across intermediate layers of the PCB between the input layer 110 and a final coupled layer 140 without sacrificing performance of the DRC 100.
[0034]
[0035] Attenuation of a through signal 520, measured at a through port 430, and return loss 530 are also illustrated in
[0036] Although
[0037]
Antenna Embodiment
[0038] Referring now to
[0039] In an exemplary DRC 100 constructed according to the antenna embodiment, a first conductive ground layer 710 of the PCB acts as a ground plane for the antenna. The first ground layer 710 can further include a ground layer stripline feed 740 for coupling an input RF signal to the coaxial conductor 130 at one end of the conductor. Vertically above the first ground layer 610, a microstrip patch 720 exists on a separate layer of the PCB where the opposite end of the coaxial conductor 130 connects to a coaxial via feed 730 on the patch 720 which is included in an at least partially annular narrow empty region 750. The narrow empty region 750 between the coaxial via feed 730 and the rest of the microstrip patch 720 results in radial coupling excitation of the RF signal and causes the coupled signal to radiate into free space.
[0040]
[0041] In the exemplary antenna array, this structure is duplicated with two antennas connecting to two stripline feeds 740 oriented approximately 90 degrees from each other. Preferably, one of the stripline feeds 740 is provided for horizontal polarization of the antenna and the other stripline feed is provided for vertical polarization of the antenna. However, an antenna array can be constructed with the antenna elements arranged in any configuration known to one skilled in the art.
Applications
[0042] Devices employing the above-described schemes can be implemented into various electronic devices and multimedia communication systems. Examples of the electronic devices can include, but are not limited to, consumer electronic products, parts of the consumer electronic products, electronic test equipment, communication infrastructure applications, etc. Further, the electronic device can include unfinished products, including those for communication, industrial, medical and automotive applications.
CONCLUSION
[0043] The foregoing description may refer to elements or features as being “connected” or “coupled” together. As used herein, unless expressly stated otherwise, “connected” means that one element/feature is directly or indirectly connected to another element/feature, and not necessarily mechanically. Likewise, unless expressly stated otherwise, “coupled” means that one element/feature is directly or indirectly coupled to another element/feature, and not necessarily mechanically. Thus, although the various schematics shown in the figures depict example arrangements of elements and components, additional intervening elements, devices, features, or components may be present in an actual embodiment (assuming that the functionality of the depicted circuits is not adversely affected).
[0044] While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the disclosure. Indeed, the novel apparatus, methods, and systems described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the disclosure. For example, while the disclosed embodiments are presented in a given arrangement, alternative embodiments may perform similar functionalities with different components and/or circuit topologies, and some elements may be deleted, moved, added, subdivided, combined, and/or modified. Each of these elements may be implemented in a variety of different ways. Any suitable combination of the elements and acts of the various embodiments described above can be combined to provide further embodiments.