Carriage assembly with asymmetrical swage bosses and associated methods
11646055 · 2023-05-09
Assignee
Inventors
- Hiroyasu Tsuchida (Fujisawa, JP)
- Haruhide Takahashi (Yokohama, JP)
- Yoshinobu Noguchi (Fujisawa, JP)
- Takeji Sumiya (Fujisawa, JP)
Cpc classification
International classification
Abstract
A hard disk drive comprises a carriage assembly that comprises a carriage-arm tip with a swaging hole centered about a swaging axis. A first head-gimbal assembly comprises a tension baseplate on a first side of the carriage-arm tip with a tension swage boss located within the swaging hole. A second head-gimbal assembly comprises a compression baseplate on a second side of the carriage-arm tip with a compression swage boss located with the swaging hole. The tension swage boss comprises an uppercut that extends radially outward, away from the swaging axis, from a first backbore diameter to a second backbore diameter and a tension-boss undercut that extends radially outward, away from the swaging axis, from a tension-boss outer diameter to a first undercut diameter. The compression swage boss comprises a compression-boss undercut that extends radially outward, away from the swaging axis, from a compression-boss outer diameter to a second undercut diameter.
Claims
1. A baseplate configured to couple a head-gimbal assembly to a carriage arm, the baseplate comprising: a flange; a swaging hole, extending through the flange and coaxial with a swaging axis; and a swage boss, having an annular shape and coaxial with the swaging hole and the swaging axis, wherein the swage boss comprises: an inner diameter; an outer diameter; and an uppercut that extends radially outward, away from the swaging axis, from a first backbore diameter to a second backbore diameter and has an uppercut depth, in a direction parallel to the swaging axis.
2. The baseplate of claim 1, wherein the swage boss converges, in a force direction along the swaging axis, from the second backbore diameter to the first backbore diameter and to the inner diameter.
3. The baseplate of claim 1, wherein: the second backbore diameter of the swage boss is greater than the outer diameter; and the first backbore diameter of the swage boss is less than the outer diameter.
4. The baseplate of claim 1, wherein the swage boss further comprises an undercut that extends radially outward, away from the swaging axis, from the outer diameter to a first undercut diameter and has an undercut depth, in a direction parallel to the swaging axis.
5. The baseplate of claim 4, wherein the undercut depth and the uppercut depth are the same depth.
6. The baseplate of claim 4, wherein: the baseplate has a baseplate thickness; and the undercut depth is less than 24 percent of the baseplate thickness.
7. The baseplate of claim 1, wherein: the swage boss has a height; and the swage boss height is less than 0.2 mm.
8. The baseplate of claim 7, wherein the height of the swage boss is 0.19 mm.
9. A disk drive comprising the baseplate of claim 1, wherein the baseplate is configured to connect a carriage arm of the disk drive to a load beam of the disk drive.
10. A carriage assembly for a hard disk drive, the carriage assembly comprising: a head stack assembly comprising a carriage arm, the carriage arm comprising a carriage-arm tip that comprises a swaging hole centered about a swaging axis and passing through the carriage-arm tip from a first side of the carriage-arm tip to a second side of the carriage-arm tip that is opposite the first side; a first head-gimbal assembly, comprising a tension baseplate on the first side of the carriage-arm tip and comprising a tension swage boss located within the swaging hole, wherein the tension swage boss is annular, is centered about the swaging axis, has a tension-boss inner diameter, and has a tension-boss outer diameter; and a second head-gimbal assembly, comprising a compression baseplate on the second side of the carriage-arm tip and comprising a compression swage boss located within the swaging hole and spaced apart from the tension swage boss along the swaging axis, wherein the compression swage boss is annular, is centered about the swaging axis, has a compression-boss inner diameter, and has a compression-boss outer diameter; wherein: the tension swage boss comprises an uppercut that extends radially outward, away from the swage axis, from a first backbore diameter to a second backbore diameter and has an uppercut depth, in a direction parallel to the swaging axis; and the compression swage boss is asymmetrical relative to the tension swage boss.
11. The carriage assembly of claim 10, wherein a swaging ball is insertable through the swaging hole such that, as the swaging ball is inserted through the swaging hole, an interference fit is formed between an outer periphery of the tension swage boss and an inner periphery of the swaging hole and an outer periphery of the compression swage boss and the inner periphery of the swaging hole.
12. The carriage assembly of claim 11, wherein the swaging ball is insertable through the swaging hole as a single pass through the swaging hole.
13. The carriage assembly of claim 10, wherein the tension swage boss further comprises a tension-boss undercut extending radially, away from the swaging axis, from the tension-boss outer diameter to a first undercut diameter and has a tension-boss undercut depth, in a direction parallel to the swaging axis.
14. The carriage assembly of claim 13, wherein the compression swage boss further comprises a compression-boss undercut extending radially outward, away from the compression-boss outer diameter to a second undercut diameter and has a compression-boss undercut depth, in a direction parallel to the swaging axis.
15. The carriage assembly of claim 14, wherein the compression-boss undercut depth is greater than the tension-boss undercut depth.
16. The carriage assembly of claim 14, wherein the second undercut diameter is greater than the first undercut diameter.
17. The carriage assembly of claim 10, wherein: the second backbore diameter is greater than the tension-boss outer diameter; and the first backbore diameter is less than the tension-boss outer diameter.
18. The carriage assembly of claim 10, wherein: the compression swage boss comprises a third backbore diameter; and the third backbore diameter is less than the second backbore diameter of the tension swage boss.
19. The carriage assembly of claim 10, wherein a minimum thickness of the tension baseplate is less than a minimum thickness of the compression baseplate.
20. A hard disk drive comprising the carriage assembly of claim 10, wherein the carriage assembly is configured to rotate relative to a housing of the hard disk drive.
21. A method of coupling a head-gimbal assembly to a carriage arm, the method comprising: positioning a tension baseplate of a first head-gimbal assembly on a carriage-arm tip of a carriage arm such that a tension swage boss is located within a swaging hole, on the carriage-arm tip and concentric with a swaging axis of the swaging hole; positioning a compression baseplate of a second head-gimbal assembly on a carriage arm tip of a carriage arm such that the carriage arm tip is sandwiched between the tension baseplate and the compression baseplate, a compression swage boss located within the swaging hole and concentric with the swaging axis of the swaging hole and the compression swage boss spaced apart from the tension swage boss along the swaging axis; and inserting a swaging ball axially through the swaging hole in an insertion direction and plastically deforming the tension swage boss and the compression swage boss to form an interference fit between an outer periphery of the tension swage boss against an inner periphery of the swaging hole and an interference fit between an outer periphery of the compression swage boss against the inner periphery of the swaging hole. wherein: the tension swage boss comprises an uppercut extending radially outward, away from the swaging axis, from a first backbore diameter to a second backbore diameter and has an uppercut depth, in a direction parallel to the swaging axis; and the compression swage boss is asymmetrical relative to the tension swage boss.
22. The method of claim 21, wherein the step of inserting a swaging ball axially through the swaging hole comprises inserting the swaging ball in a single pass axially through the swaging hole.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) In order that the advantages of the subject matter may be more readily understood, a more particular description of the subject matter briefly described above will be rendered by reference to specific examples that are illustrated in the appended drawings. Understanding that these drawings depict only typical examples of the subject matter, they are not therefore to be considered to be limiting of its scope. The subject matter will be described and explained with additional specificity and detail through the use of the drawings, in which:
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DETAILED DESCRIPTION
(11) Reference throughout this specification to “one example,” “an example,” or similar language means that a particular feature, structure, or characteristic described in connection with the example is included in at least one example of the present disclosure. Appearances of the phrases “in one example,” “in an example,” and similar language throughout this specification may, but do not necessarily, all refer to the same example. Similarly, the use of the term “implementation” means an implementation having a particular feature, structure, or characteristic described in connection with one or more examples of the present disclosure, however, absent an express correlation to indicate otherwise, an implementation may be associated with one or more examples.
(12) Referring to
(13) The magnetic storage device 100 includes various features located within the interior cavity 114 of the housing 102. In some examples, the magnetic storage device 100 includes a carriage assembly 103, disks 115, a spindle motor 121, and a voice coil motor (VCM) 125 within the interior cavity 114. The carriage assembly 103 includes a head stack assembly 107 that includes a plurality of carriage arms 105 and at least one head-gimbal assembly 109 (e.g., suspension) coupled to a carriage-arm tip 106 (e.g., distal tip) of each carriage arm 105 of the plurality of carriage arms 105. Each head-gimbal assembly 109 includes a suspension assembly 135 and a slider 142. The slider 142 includes at least one read-write head coupled to (e.g., embedded in) the slider 142. Although the magnetic storage device 100 in
(14) The spindle motor 121 is coupled to the base 130. Generally, the spindle motor 121 includes a stationary portion non-movably fixed relative to the base 130 and a spindle that is rotatable relative to the stationary portion and the base 130. Accordingly, the spindle of the spindle motor 121 can be considered to be part of or integral with the spindle motor. Generally, the spindle motor 121 is operable to rotate the spindle relative to the base 130. The disks 115, or platters, are co-rotatably fixed to the spindle of the spindle motor 121 via respective hubs 122, which are co-rotatably secured to respective disks 115 and the spindle. As the spindle of the spindle motor 121 rotates, the disks 115 correspondingly rotate. In this manner, the spindle of the spindle motor 121 defines a rotational axis of each disk 115. The spindle motor 121 can be operatively controlled to rotate the disks 115, in a rotational direction 190, a controlled amount at a controlled rate.
(15) Each of the disks 115 may be any of various types of magnetic recording media. Generally, in one example, each disk 115 includes a substrate and a magnetic material applied directly or indirectly onto the substrate. For example, the magnetic material of the disks 115 may be conventional granular magnetic recording disks or wafers that have magnetic layer bits with multiple magnetic grains on each bit. In granular magnetic media, all of the bits are co-planar and the surface 116 of the disk is substantially smooth and continuous. In one example, each bit has a magnetic dipole moment that can either have an in-plane (longitudinal) orientation or an out-of-plane (perpendicular) orientation.
(16) As the disks 115 rotate in a read-write mode, the VCM 125 electromagnetically engages voice coils of the carriage arms 105 to rotate the carriage arms 105, and the head-gimbal assemblies 109, which are coupled to the carriage arms 105, relative to the disks 115 in a rotational direction along a plane parallel to read-write surfaces 155 of the disks 115. The carriage arms 105 can be rotated to position the read-write head of the head-gimbal assemblies 109 over a specified radial area of the read-write surface 155 of a corresponding disk 115 for read and/or write operations. The VCM 125 is fixed to the base 130 in engagement with the voice coils of the carriage arms 105, which are rotatably coupled to the base 130 via a spindle 127 extending through the carriage assembly 103. Generally, the spindle 127 defines a rotational axis about which the carriage arms 105 rotate when actuated by the VCM 125.
(17) The carriage arms 105 are non-movably fixed to (e.g., integrally formed as a one-piece unitary monolithic body) and extend away from a base of the carriage assembly 103 in a spaced-apart manner relative to each other. In some examples, the carriage arms 105 are spaced an equi-distance apart from each other and extend parallel relative to each other. A respective one of the disks 115 is positioned between adjacent carriage arms 105. In an idle mode (e.g., when read-write operations are not being performed), the VCM 125 is actuated to rotate the carriage arms 105, in a radially outward direction relative to the disks 115, such that the head-gimbal assemblies 109 are parked or unloaded onto a ramp support 117 secured to the base 130.
(18) As shown in
(19) As shown in
(20) Each one of the head-gimbal assemblies 109 includes a baseplate 118, a load beam 123, and a flexure 141. The baseplate 118 is utilized to directly interconnect the carriage arm 105 and the load beam 123. More specifically, the baseplate 118 spans between and couples together the carriage-arm tip 106 of the carriage arm 105 and the load beam 123. The baseplate 118 has a flange 119 and a swage boss 124, protruding from the flange 119. The flange 119 is a relatively flat plate and the swage boss 124 has an annular shape. The slider 142, with at least one read-write head, is coupled to a distal end portion of the load beam 123 via a tip portion of the flexure 141.
(21) In one example, the baseplate 118 of the head-gimbal assembly 109 is a compression baseplate 118A and configured to be coupled to the second side 112 of a corresponding one of the carriage arms 105A-N. Accordingly, the swage boss 124 of the compression baseplate 118A is a compression swage boss 126 that is configured to protrude upwards into the swaging hole 108 from the second side 112 of the corresponding one of the carriage arms 105A-N. In another example, the head-gimbal assembly 109 has a tension baseplate 118B (see, e.g.,
(22) A side, elevation view of a portion of one example of the carriage assembly 103, after a swaging process, is shown in
(23) A respective one of the plurality of disks 115 is positioned between adjacent corresponding carriage arms 105A-N, such that ten disks 115 are shown positioned between the eleven carriage arms 105A-N. As shown in
(24) Referring to
(25) Additionally, the second head-gimbal assembly 109 has a compression baseplate 118A on the second side 112 of the carriage arm 105. The compression swage boss 126 is located within the swaging hole 108 on the carriage-arm tip 106 and extends from the second side 112 of the carriage-arm tip 106 into the swaging hole 108. The compression swage boss 126 is also annular about the swaging axis 110. The compression swage boss 126 has a compression-boss inner diameter ID.sub.C and a compression-boss outer diameter OD. In one example, the carriage-arm tip 106 has a thickness such that the tension swage boss 128 and the compression swage boss 126 are spaced apart from each other (i.e., not in contact with each other). The tension swage boss 128 and the compression swage boss 126 are made of stainless steel, in one example.
(26) In certain examples, the tension-boss inner diameter ID.sub.T and the compression-boss inner diameter ID.sub.C are equal. For example, the tension-boss inner diameter ID.sub.T and compression-boss inner diameter ID.sub.C can both be equal to or less than 1.51 mm. Alternatively, in some examples, the tension-boss inner diameter ID.sub.T and the compression-boss inner diameter ID.sub.C are not equal. For example, the tension-boss inner diameter ID.sub.T can be less than the compression-boss inner diameter ID.sub.C. In one example, the tension-boss inner diameter ID.sub.T is at least 0.02 mm less than the compression-boss inner diameter ID.sub.C. In yet another example, the tension-boss inner diameter ID.sub.T is equal to or less than 1.49 mm and the compression-boss inner diameter ID.sub.C is equal to or less than 1.51 mm. In some examples, the tension-boss outer diameter OD is equal to the compression-boss outer diameter OD.
(27) The tension swage boss 128 includes an uppercut 137 and a tension-boss undercut 138. The uppercut 137 extends radially outward, away from the swaging axis 110, from a first backbore diameter BB.sub.1 to a second backbore diameter BB.sub.2. In other words, the tension swage boss 128 converges, in the force direction 137 along the swaging axis 110, from the second backbore diameter BB.sub.2 to the first backbore diameter BB.sub.1 and to the tension-boss inner diameter ID.sub.T. In one example, the second backbore diameter BB.sub.2 of the tension baseplate 118B is greater than the inner periphery 154 of the swaging hole 108 and the first backbore diameter BB.sub.1 of the tension baseplate 118B is less than the inner periphery 154 of the swaging hole 108. In another example, the second backbore diameter BB.sub.2 of the tension baseplate 118B is greater than the tension-boss outer diameter OD and the first backbore diameter BB.sub.1 of the tension baseplate 118B is less than the tension-boss outer diameter OD. The uppercut 137 has an uppercut depth D.sub.1 in a direction parallel to the swaging axis 110.
(28) The tension-boss undercut 138 extends radially, away from the swaging axis 110, from the tension-boss outer diameter OD to a first undercut diameter TU.sub.D. The tension-boss undercut 138 has a tension-boss undercut depth D.sub.2 in a direction parallel to the swaging axis 110.
(29) The portion of the tension swage boss 128 between the first backbore BB.sub.1 and the tension-boss outer diameter OD defines a neck 129 of the tension swage boss 128. During swaging, the tension swage boss 128 can rotate at the neck 129 (see, e.g.,
(30) The compression swage boss 126 also includes a compression-boss undercut 140. The compression-boss undercut 140 extends radially outward, away from the swaging axis 110, from a compression-boss outer diameter OD to a second undercut diameter CU.sub.D . The compression-boss undercut 140 has a compression-boss undercut depth D.sub.3 in a direction parallel to the swaging axis 110. In one example, the compression undercut depth D.sub.3 is greater than the tension undercut depth D.sub.2.
(31) The tension baseplate 118B has a tension baseplate thickness T.sub.TB. In one example, the tension-boss undercut depth D.sub.2 is less than 50 percent of the tension baseplate thickness T.sub.TB. In another example, the tension-boss undercut depth D.sub.2 is less than 24 percent of the tension baseplate thickness T.sub.TB. In yet another example, the tension-boss undercut depth D.sub.2 is between 24 and 50 percent of the tension baseplate thickness T.sub.TB. The compression baseplate 118A has a compression baseplate thickness T.sub.CB. In another example, the compression-boss undercut depth D.sub.3 is greater than 50 percent of the compression baseplate thickness T.sub.CB. In yet another example, the compression-boss undercut depth D.sub.3 is greater than 24 percent of the compression baseplate thickness T.sub.CB. In yet another example, the compression-boss undercut depth D.sub.3 is between 24 and 50 percent of the compression baseplate thickness T.sub.CB. In some examples, the compression undercut depth D.sub.3 is at least 1.5 times larger than the tension undercut depth D.sub.2. In yet another example, the compression undercut diameter CU.sub.D is greater than the tension undercut diameter TU.sub.D.
(32) The compression swage boss 126 also includes a third backbore diameter BB.sub.3. The portion of the compression swage boss 126 between the third backbore BB.sub.3 and the compression-boss outer diameter OD defines a neck 131 of the compression swage boss 126. During swaging, the compression swage boss 126 can both rotate and expand at the neck 131 (see, e.g.,
(33) The tension baseplate 118B has a minimum thickness T.sub.1, that extends from the uppercut 137 to the tension-boss undercut 138. The compression baseplate 118A also has a minimum thickness T.sub.2, extending from an outer surface 144 of the compression baseplate 118A to the compression-boss undercut 140. In one example, the minimum thickness T.sub.1 of the tension baseplate 118B is less than the minimum thickness T.sub.2 of the compression baseplate 118A.
(34) The tension swage boss 128 has a first height H.sub.1 extending from an inner surface 145 of the tension baseplate 118B to a tension-boss inner surface 146. The compression swage boss 126 has a second height H.sub.2, extending from an inner surface 143 of the compression baseplate 118A to a compression-boss inner surface 147. In one example, the first height H.sub.1 and the second height H.sub.2 are equal. For example, the first height H.sub.1 and the second height H.sub.2 are less than 0.2 mm. In other examples, the first height H.sub.1 and the second height H.sub.2 are 0.19 mm. In yet other examples, the first height H.sub.1 and the second height H.sub.2 are not equal. The first height H.sub.1 and the second height H.sub.2 are a factor for determining how many disks 115 can fit within the magnetic storage device 100. Accordingly, the first height H.sub.1 and the second H.sub.2 are of sufficient height to avoid excessive buckling of the swage boss 124, resulting in a poor interference fit of the swage boss 124 and the carriage-arm tip 106, while allowing a greater number of disks 115 to fit within the magnetic storage device 100.
(35) A swaging ball 136 is insertable into the swaging hole 108. During the swaging process, the swaging ball 136 having a diameter D large enough to interfere with the tension-boss inner diameter ID.sub.T and the compression-boss inner diameter ID.sub.C, is forced through the tension swage boss 128 and the compression swage boss 126 located within the corresponding swaging hole 108. In one example, the tension-boss inner diameter ID.sub.T is between 4 percent to 15 percent smaller than the ball diameter D. Likewise, in some examples, the compression-boss inner diameter ID.sub.C is between 4 percent and 15 percent smaller than the ball diameter D. In another example, the tension-boss inner diameter ID.sub.T is between 5 percent to 8 percent smaller than the ball diameter D.
(36) During the swaging process, the swaging ball 136 is forced through the swaging hole 108 and an interference fit is formed between an outer periphery 150 of the tension swage boss 128 (e.g., the portion of the tension swage boss 128 defining the tension-boss outer diameter OD) and an inner periphery of the swaging hole 108. Additionally, an interference fit is formed between an outer periphery 152 of the compression swage boss 126 (e.g., the portion of the compression swage boss 126 defining the compression-boss outer diameter OD) and the inner periphery 154 of the swaging hole 108. In one example, the swaging ball 136 is forced in a force direction 137, parallel to the swaging axis 110, through the swaging hole 108. After swaging, the outer periphery 150 of the tension swage boss 128 and the outer periphery 152 of the compression swage boss 126 tightly engages and is radially preloaded against the inner periphery 154 of the corresponding swaging hole 108 in the carriage-arm tip 106.
(37) Referring to
(38) During the swaging process, the swaging ball 136 is forced axially through the plurality of swaging holes 108 in the force direction 137. In one example, the swaging ball 136 is forced in the force direction 137 by a tool, not shown, that forces the swaging ball 136 in the force direction 137 through the plurality of swaging holes 108. In some examples, additional tools may be used to help control the motion of the swaging ball 136 during the swaging process. Comb spacer tools 160 may be temporarily positioned between the carriage arm 105A, 105B, 105C, and 105D, respectively, to limit axial carriage arm deflection caused by the force applied in the force direction 137.
(39) The passing of the swaging ball 136 through the swaging hole 108 causes the tension swage boss 128 and/or compression swage boss 126 to plastically deform within the corresponding swaging hole 108 and cause an interference fit with the corresponding swaging hole 108. For example, the swaging ball 136 has been forced axially through the swaging hole 108 in carriage arm 105A and 105B, such that each of the swage bosses with the swaging holes 108 have formed an interference fit with the corresponding swaging hole 108. Accordingly, the compression swage boss 126 has formed an interference fit with the carriage arm 105A and the tension swage boss 128 and the compression swage boss 126 has formed an interference fit with the carriage arm 105B. By contrast, the swaging ball 136 has not yet been forced axially through the swaging hole 108 in carriage arms 105C and 105D. Therefore, a radial clearance C exists between the inner periphery 154 of the swaging hole 108 and the corresponding swage bosses in carriage arms 105C and 105D.
(40) In some examples, the swaging process is performed with a single swaging ball 136 and a single pass through the carriage assembly. Multi-pass swaging, where the necessary total radial plastic deformation is created by swaging more than one time with progressively larger swage balls and/or by forcing the swage ball(s) through the swage holes in alternative directions, can be a time consuming and an expensive process. Accordingly, obtaining a good interference fit using a single swage boss and a single pass is preferred in some instances.
(41) Referring to
(42) During the swaging process, the tension swage boss 128 rotates, along a rotation axis 162 at the neck 129 of the tension swage boss 128. The rotation of the neck 129 causes the outer periphery 150 of the tension swage boss 128 to tightly engage (i.e., clamp) with the inner periphery 154 of the swaging hole 108. The rotation along the rotation axis 162 causes the tension swage boss 128 to deform at an angle and downward, in a direction towards the axis 170, to a maximum deformation height H.sub.D. In one example, the maximum deformation height H.sub.D does not extend past the axis 170. Additionally, a tensile force 163 is generated in the tension baseplate 118B, during swaging. Due to the uppercut 137 in the tension swage boss 128, the tensile force 163 is perpendicular to the swaging axis 110 and located adjacent the inner surface 145 of the tension baseplate 118B, such that the tension baseplate 118B is pushed tightly into the carriage-arm tip 106 to minimize tension baseplate 118B deformation and carriage-arm tip 106 deformation.
(43) Additionally, during the swaging process, the compression swage boss 126 experiences multiple forces, including a clamping force 166, compression force 164, and a buckling force 168. The clamping force 166 forces the outer periphery 152 of the compression swage boss 126 against the inner periphery 154 of the swaging hole 108. The compression force 164 forces the compression swage boss 126 at an angle away from the swaging axis 110 towards the outer surface 144 of the compression baseplate 118A. The buckling force forces the compression swage boss 126 downward, parallel to the swaging axis 110 in the force direction 137. Together, the clamping force 166, the compression force 164, and the buckling force 168 cause the outer periphery 152 of the compression swage boss 126 to tightly engage (i.e., clamp) with the inner periphery 154 of the swaging hole 108. Additionally, a push force 169 is generated in the compression baseplate 118A during swaging. The push force 169 is perpendicular to the force direction 137 in the compression baseplate 118A and located adjacent the outer surface 144 of the compression baseplate.
(44) Now referring to
(45) The tension swage boss 128 includes an uppercut 137 and a tension-boss undercut 138. The uppercut 137 extends radially outward, away from the swaging axis 110, from a first backbore diameter BB.sub.1 to a second backbore diameter BB.sub.2 and has an uppercut depth D.sub.1, in a direction parallel to the swaging axis 110. The tension-boss undercut 138 extends radially, away from the swaging axis 110, from the tension-boss outer diameter OD to a first undercut diameter TU.sub.D and has a tension-boss undercut depth D.sub.2, in a direction parallel to the swaging axis 110. The compression swage boss 126 comprises a compression-boss undercut 140. The compression-boss undercut 140 extends radially outward, away from the swaging axis 110 from a compression-boss outer diameter OD to a second undercut diameter CU.sub.D and has a compression-boss undercut depth D.sub.3, in a direction parallel to the swaging axis 110.
(46) Although described in a depicted order, the method may proceed in any of a number of ordered combinations.
(47) In the above description, certain terms may be used such as “up,” “down,” “upper,” “lower,” “horizontal,” “vertical,” “left,” “right,” “over,” “under” and the like. These terms are used, where applicable, to provide some clarity of description when dealing with relative relationships. But, these terms are not intended to imply absolute relationships, positions, and/or orientations. For example, with respect to an object, an “upper” surface can become a “lower” surface simply by turning the object over. Nevertheless, it is still the same object. Further, the terms “including,” “comprising,” “having,” and variations thereof mean “including but not limited to” unless expressly specified otherwise. An enumerated listing of items does not imply that any or all of the items are mutually exclusive and/or mutually inclusive, unless expressly specified otherwise. The terms “a,” “an,” and “the” also refer to “one or more” unless expressly specified otherwise. Further, the term “plurality” can be defined as “at least two.”
(48) Additionally, instances in this specification where one element is “coupled” to another element can include direct and indirect coupling. Direct coupling can be defined as one element coupled to and in some contact with another element. Indirect coupling can be defined as coupling between two elements not in direct contact with each other, but having one or more additional elements between the coupled elements. Further, as used herein, securing one element to another element can include direct securing and indirect securing. Additionally, as used herein, “adjacent” does not necessarily denote contact. For example, one element can be adjacent another element without being in contact with that element.
(49) As used herein, the phrase “at least one of”, when used with a list of items, means different combinations of one or more of the listed items may be used and only one of the items in the list may be needed. The item may be a particular object, thing, or category. In other words, “at least one of” means any combination of items or number of items may be used from the list, but not all of the items in the list may be required. For example, “at least one of item A, item B, and item C” may mean item A; item A and item B; item B; item A, item B, and item C; or item B and item C. In some cases, “at least one of item A, item B, and item C” may mean, for example, without limitation, two of item A, one of item B, and ten of item C; four of item B and seven of item C; or some other suitable combination.
(50) Unless otherwise indicated, the terms “first,” “second,” etc. are used herein merely as labels, and are not intended to impose ordinal, positional, or hierarchical requirements on the items to which these terms refer. Moreover, reference to, e.g., a “second” item does not require or preclude the existence of, e.g., a “first” or lower-numbered item, and/or, e.g., a “third” or higher-numbered item.
(51) As used herein, a system, apparatus, structure, article, element, component, or hardware “configured to” perform a specified function is indeed capable of performing the specified function without any alteration, rather than merely having potential to perform the specified function after further modification. In other words, the system, apparatus, structure, article, element, component, or hardware “configured to” perform a specified function is specifically selected, created, implemented, utilized, programmed, and/or designed for the purpose of performing the specified function. As used herein, “configured to” denotes existing characteristics of a system, apparatus, structure, article, element, component, or hardware which enable the system, apparatus, structure, article, element, component, or hardware to perform the specified function without further modification. For purposes of this disclosure, a system, apparatus, structure, article, element, component, or hardware described as being “configured to” perform a particular function may additionally or alternatively be described as being “adapted to” and/or as being “operative to” perform that function.
(52) The schematic flow chart diagrams included herein are generally set forth as logical flow chart diagrams. As such, the depicted order and labeled steps are indicative of one example of the presented method. Other steps and methods may be conceived that are equivalent in function, logic, or effect to one or more steps, or portions thereof, of the illustrated method. Additionally, the format and symbols employed are provided to explain the logical steps of the method and are understood not to limit the scope of the method. Although various arrow types and line types may be employed in the flow chart diagrams, they are understood not to limit the scope of the corresponding method. Indeed, some arrows or other connectors may be used to indicate only the logical flow of the method. For instance, an arrow may indicate a waiting or monitoring period of unspecified duration between enumerated steps of the depicted method. Additionally, the order in which a particular method occurs may or may not strictly adhere to the order of the corresponding steps shown.
(53) The present subject matter may be embodied in other specific forms without departing from its spirit or essential characteristics. The described examples are to be considered in all respects only as illustrative and not restrictive. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.