PCB-pinout based packaged module and method for preparing PCB-pinout based packaged module

Abstract

This application relates to the field of power supply packaging technologies, and in particular, to a PCB-pinout based packaged module, including a packaged module and a pin exposed outside the packaged module. The packaged module includes a PCB and a power component. The PCB has a first surface and a second surface that are disposed opposite to each other, and the power component is disposed on the first surface or the second surface of the PCB. The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB. The pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module.

Claims

1. A PCB-pinout based packaged module, comprising: a printed circuit board (PCB) having a first surface and a second surface disposed opposite the first surface; and a power component disposed on the first surface or the second surface of the PCB; wherein the power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB; and wherein the pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module; and wherein there are two or more pins, and the PCB between the two or more pins is provided with an opening to form at least one sprue.

2. The packaged module according to claim 1, wherein the packaged module consists of one sprue.

3. The packaged module according to claim 1, wherein the packaged module includes a plurality of left and right symmetric sprues.

4. The packaged module according to claim 1, wherein the surface-layer copper etching pattern of the pin is entirely exposed outside the packaged module.

5. The packaged module according to claim 4, wherein a heat-resistant film is disposed on the pin.

6. The packaged module according to claim 4, wherein the packaged module is a communications power supply packaged module.

7. The packaged module according to claim 4, wherein the packaged module is cut into at least two independent sub-packaged modules based on a function or a structure of the power component, and each of the at least two independent sub-packaged modules comprises at least one pin exposed outside the independent sub-packaged module.

8. A method for manufacturing a PCB-pinout based packaged module, comprising: etching surface-layer copper that is of a first surface or a second surface of a printed circuit board (PCB) and that is on an edge part of the PCB, to obtain more than two pins; performing, by a power component, communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through the surface-layer copper of the PCB; packaging the PCB and the power component, and exposing the more than two pins outside a packaged module; and before the packaging the PCB and the power component, and exposing the more than two pins outside the packaged module, the method further comprises: opening the PCB between the more than two pins, to dispose a sprue.

9. The method according to claim 8, wherein the packaging the PCB and the power component, and exposing the more than two pins outside the packaged module comprises: packaging the PCB and the power component, wherein the sprue is configured to connect a packaging material to two sides of the PCB in a packaging process, wherein the two sides of the PCB comprise one side on which the first surface is located and one side on which the second surface is located, and the more than two pins are exposed outside the packaged module.

10. The method according to claim 9, wherein before the packaging the PCB and the power component, and exposing the more than two pins outside the packaged module, the method further comprises: disposing a heat-resistant film on the pin.

11. The method according to claim 10, wherein after the packaging the PCB and the power component, and exposing the more than two pins outside the packaged module, the method further comprises: cutting the packaged module based on a function or a structure of the power component, and cutting, into at least two independent sub-packaged modules, the power component together with a pin electrically connected to the power device, wherein each of the at least two independent sub-packaged modules comprises at least one pin exposed outside the sub-packaged module.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1 is a schematic structural diagram of a packaged module in the conventional technology;

(2) FIG. 2 is a schematic structural diagram of a packaged module according to an embodiment of this application;

(3) FIG. 3 is a schematic diagram of a PCB-pinout based structure inside a packaged module according to an embodiment of this application;

(4) FIG. 4 is a schematic diagram of a PCB-pinout based structure inside a packaged module according to another embodiment of this application;

(5) FIG. 5 is a schematic diagram of a PCB-pinout based structure inside a packaged module according to another embodiment of this application;

(6) FIG. 6 is a schematic diagram of a PCB-pinout based structure inside a packaged module according to another embodiment of this application;

(7) FIG. 7 is a schematic diagram of a PCB-pinout based structure inside a packaged module according to another embodiment of this application;

(8) FIG. 8 is a schematic diagram of a PCB-pinout based structure inside a packaged module according to another embodiment of this application;

(9) FIG. 9 is a flowchart of a method for preparing a packaged module according to another embodiment of this application; and

(10) FIG. 10 is a flowchart of a method for preparing a packaged module according to another embodiment of this application.

DESCRIPTION OF EMBODIMENTS

(11) The following clearly describes technical solutions in embodiments of the present disclosure with reference to accompanying drawings in the embodiments of the present disclosure. It is clear that the described embodiments are merely some but not all of the embodiments of the present disclosure. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without creative efforts shall fall within the protection scope of the present disclosure.

(12) The embodiments of the present disclosure provide a packaged module and a method for preparing the packaged module. The packaged module and the method for preparing the packaged module are used in a scenario of a communications power supply. The packaged module resolves, according to the PCB-pinout based packaging method, a problem in the conventional technology that a volume of the packaged module is large and a pin soldering process of the packaged module is complex, so that the packaged module has a small volume, and a disposing process of a pin that is exposed outside the packaged module is simplified.

(13) FIG. 2 is a schematic structural diagram of a PCB-pinout based packaged module, including a packaged module 201 and a pin 202 that is exposed outside the packaged module.

(14) The packaged module includes a PCB and a power component, the PCB has a first surface and a second surface that are disposed opposite to each other, and the power component is disposed on the first surface or the second surface of the PCB.

(15) The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB.

(16) The pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module.

(17) FIG. 3 is a schematic diagram of a PCB-pinout based structure, including a PCB 301 and a plurality of pins 302. The entire PCB in the figure is a substrate, and the plurality of pins 302 are at least two pins. The plurality of pins 302 are obtained by etching a copper-plated layer on the PCB 301. Before plastic packaging is performed on the packaged module in FIG. 2, a structure of the plastic-packaged module in FIG. 2 is a structure of the pinouts 302 of the PCB 301 shown in FIG. 3. Optionally, various power components are disposed on the PCB 301. Power or signal lead-out points of the power components are connected to the pins 302, and power or signal transmission is performed with an external component of the plastic-packaged module by using the pins 302. An interval is disposed between the plurality of pins 302. When the PCB-pinout based structure is packaged, a part of the PCB 301 on which the plurality of pins 302 are disposed at intervals is entirely exposed outside the packaged module, so that an interval part between the PCB 301 on which the plurality of pins 302 are disposed and the plurality of pins 302 is entirely exposed outside the packaged module. Therefore, various power components disposed on the PCB 301 perform power or signal transmission with the external component of the plastic-packaged module by using the pins 302.

(18) FIG. 4 is a schematic diagram of another PCB-pinout based structure. On the basis of FIG. 3, a heat-resistant film 402 is added in FIG. 4. The heat-resistant film 402 is disposed on the interval part between the PCB 301 on which the plurality of pins 302 are disposed and the plurality of pins 302 shown in FIG. 3. The heat-resistant film 402 is disposed on the interval part between the PCB 301 on which the plurality of pins 302 are disposed and the plurality of pins 302, to prevent the pins 302 from being damaged in a process of packaging the 404.

(19) Further, as shown in FIG. 5, the PCB between two or more pins is provided with an opening to form at least one sprue 403.

(20) Further, as shown in FIG. 6, there are two or a plurality of left and right symmetric sprues, and a quantity of the plurality of left and right symmetric sprues are multiples of two. Further, as shown in FIG. 7, there are a plurality of asymmetrical sprues, and a quantity of the plurality of symmetrical and asymmetrical sprues is greater than or equal to two.

(21) Further, as shown in FIG. 8, the packaged module may be configured to be cut into at least two independent sub-packaged modules based on a function or a structure of the power component, and each of the at least two independent sub-packaged modules includes at least one pin exposed outside the packaged sub-module.

(22) This application provides the method for preparing the PCB-pinout based packaged module. The packaged module is disposed in a PCB-pinout manner, to resolve the problem in the conventional technology that the volume of the packaged module is large and the pin soldering process of the packaged module is complex, so that the packaged module has a small volume, and the pin disposing process is simple.

(23) Therefore, in a scenario in which the packaged module is applied in the communications power supply, a power module with the foregoing packaging structure has a small volume and is easy to be packaged. This meets a current requirement for miniaturization of a communications power supply packaged module, and improves power density of the communications power supply packaged module.

(24) FIG. 9 shows a method for preparing any packaged module in the foregoing embodiments according to an embodiment of this application. A method for manufacturing a PCB-pinout based packaged module includes the following steps.

(25) Step S901: Etch surface-layer copper that is of a first surface or a second surface of a PCB and that is on an edge part of the PCB, to obtain more than two pins.

(26) The first surface and the second surface of the PCB are disposed opposite to each other on the PCB. The PCB is of a plate structure. The first surface and the second surface are two opposite surfaces of the PCB and are two surfaces with a largest area in external surfaces of the PCB. The first surface or the second surface of the PCB is used to dispose a power component.

(27) Step S902: The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB, where the pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module.

(28) Specifically, the power component is disposed on the first surface or the second surface of the PCB, to transfer a signal or power of the power component to the pin. The signal or power is transferred to the pin through the surface-layer copper of the PCB. The pin is a pattern obtained by etching the surface-layer copper of the PCB, and the pin is configured to connect to a circuit or a component outside the packaged module to perform power or signal transmission.

(29) Step S903: Package the PCB and the power component, and expose the more than two pins outside the packaged module.

(30) In a packaging process, only the PCB and the components disposed on the PCB are packaged, and the pin is not packaged. In this way, a volume of the PCB packaged module may be reduced, and power density of the packaged module may be improved. In addition, the pin is also disposed for the packaged module. Therefore, there is no need to reserve or dispose, for the packaged module, a signal or power lead-out point of the power component on the PCB during packaging, there is no need to develop and manufacture an independent pin, and there is no need to solder the independent pin to the signal or power lead-out point of the power component. This not only simplifies the packaging process and reduces the volume of the packaged module, but also eliminates the need to develop and manufacture the independent pin and the need to solder the independent pin to the signal or power lead-out point of the power component.

(31) This application provides the method for preparing the PCB-pinout based packaged module. The packaged module is disposed in a PCB-pinout manner, to resolve a problem in the conventional technology that the volume of the packaged module is large and the pin soldering process of the packaged module is complex, so that the packaged module has a small volume, and a pin disposing process is simple.

(32) FIG. 10 shows a method for preparing any packaged module in the foregoing embodiments according to an embodiment of this application. A method for manufacturing a PCB-pinout based packaged module includes the following steps.

(33) Step S1001: Etch surface-layer copper that is of a first surface or a second surface of a PCB and that is on an edge part of the PCB, to obtain more than two pins.

(34) The first surface and the second surface of the PCB are disposed opposite to each other on the PCB. The PCB is of a plate structure. The first surface and the second surface are two opposite surfaces of the PCB and are two surfaces with a largest area in external surfaces of the PCB. The first surface or the second surface of the PCB is used to dispose a power component.

(35) S1002: The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB, where the pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module.

(36) Specifically, the power component is disposed on the first surface or the second surface of the PCB, to transfer a signal or power of the power component to the pin. The signal or power is transferred to the pin through the surface-layer copper of the PCB. The pin is a pattern obtained by etching the surface-layer copper of the PCB, and the pin is configured to connect to a circuit or a component outside the packaged module to perform power or signal transmission.

(37) Step S1003: Package the PCB and the power component, and expose the more than two pins outside the packaged module.

(38) In a packaging process, only the PCB and the components disposed on the PCB are packaged, and the pin is not packaged. In this way, a volume of the PCB packaged module may be reduced, and power density of the packaged module may be improved. In addition, the pin is also disposed for the packaged module. Therefore, there is no need to reserve or dispose, for the packaged module, a signal or power lead-out point of the power component on the PCB during packaging, there is no need to develop and manufacture an independent pin, and there is no need to solder the independent pin to the signal or power lead-out point of the power component. This not only simplifies the packaging process and reduces the volume of the packaged module, but also eliminates the need to develop and manufacture the independent pin and the need to solder the independent pin to the signal or power lead-out point of the power component.

(39) Further, in step S1004, before the packaging the PCB and the power component, and exposing the more than two pins outside the packaged module, the method further includes:

(40) opening the PCB between the more than two pins, to dispose a sprue.

(41) Further, in step S1005, before the packaging the PCB and the power component, and exposing the more than two pins outside the packaged module, the method further includes:

(42) disposing a heat-resistant film on the pin, to prevent the pin from being damaged in the packaging process. Specifically, in the apparatus in FIG. 3 and the apparatus in FIG. 4 that correspond to the methods, the heat-resistant film 402 is added. In FIG. 3, the heat-resistant film 402 is disposed on the interval part between the PCB 301 on which the plurality of pins 302 are disposed and the plurality of pins 302. The heat-resistant film 402 is disposed on the interval part between the PCB 301 on which the plurality of pins 302 are disposed and the plurality of pins 302, to prevent the pins 302 from being damaged in a process of packaging the 404.

(43) Further, the packaging the PCB and the power component, and exposing the more than two pins outside the packaged module specifically includes:

(44) packaging the PCB and the power component, and exposing, entirely outside the packaged module, the surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module, where the surface-layer copper etching pattern that is exposed outside the packaged module is more than two pins of the packaged module.

(45) Further, the opening the PCB between the more than two pins, to dispose a sprue includes: disposing one sprue, or disposing a plurality of left and right symmetric/asymmetric sprues.

(46) Further, before the packaging the PCB and the power component, and exposing the more than two pins outside the packaged module, the method further includes:

(47) disposing a heat-resistant film on the pin, to prevent the pin from being damaged in the packaging process. Specifically, the heat-resistant film 402 is added. In FIG. 3, the heat-resistant film 402 is disposed on the interval part between the PCB 301 on which the plurality of pins 302 are disposed and the plurality of pins 302. The heat-resistant film 402 is disposed on the interval part between the PCB 301 on which the plurality of pins 302 are disposed and the plurality of pins 302, to prevent the pins 302 from being damaged in a process of packaging the 404.

(48) Further, after the packaging the PCB and the power component, and exposing the more than two pins outside the packaged module, the method further includes: cutting the packaged module based on a function or a structure of the power component, and cutting, into at least two independent sub-packaged modules, the power component together with a pin electrically connected to the power unit, where each of the at least two independent sub-packaged modules includes at least one pin exposed outside the packaged sub-module.

(49) The method for preparing the PCB-pinout based packaged module is used. The packaged module is disposed in a PCB-pinout manner, to resolve a problem in the conventional technology that the volume of the packaged module is large and a pin soldering process of the packaged module is complex, so that the packaged module has a small volume, and a pin disposing process is simple.

(50) Obviously, a person of ordinary skill in the art can make various modifications and variations to the embodiments of the present disclosure without departing from the spirit and scope of the present disclosure. The present disclosure is intended to cover these modifications and variations provided that these modifications and variations fall within the scope of protection defined by the following claims and their equivalent technologies.