PRIMARY OPTICS LIGHT SOURCE WITH RECTANGULAR LIGHT PATTERN
20170370544 ยท 2017-12-28
Inventors
- CHING-HUEI WU (NEW TAIPEI CITY, TW)
- YUNG-CHING HU (NEW TAIPEI CITY, TW)
- CHENG-CHIEN OU (NEW TAIPEI CITY, TW)
- WEI-CHUNG LIN (NEW TAIPEI CITY, TW)
Cpc classification
F21S41/29
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21S41/143
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
Abstract
Disclosed is a primary optics light source with a rectangular light pattern including a substrate, an LED chip and an encapsulated package. The LED chip is installed on the substrate, and the encapsulated package covers the LED chip to fix the LED chip. A light of the LED chip is emitted to the outside through the encapsulated package to form a rectangular light pattern, so that when the light source is lit, a specific rectangular illumination light pattern is formed.
Claims
1. A primary optics light source with a rectangular light pattern, having a substrate, an LED chip and an encapsulated package, and the LED chip being installed on the substrate, and the encapsulated package covering the LED chip to fix the LED chip to the substrate, characterized in that a pair of first bent sections, a pair of second bent sections and a top section are sequentially arranged from the substrate and on the cross-section of the encapsulated package in the x-axis, and the first bent sections are disposed opposite to each other and extended from the substrate to couple with the second bent section, and the second bent sections are also disposed opposite to each other and coupled to an end of the top section, and the pair of first bent sections, the pair of second bent sections and the top section are all arc shaped, and the cross-section of the encapsulated package in the y-axis is arc shaped, thereby a light of the LED chip is emitted to the outside through the encapsulated package to form a rectangular light pattern; wherein the x-axis and the y-axis are perpendicular to each other, and a plane included between the x-axis and the y-axis is parallel to a plane of the substrate provided for installing the LED chip.
2. The primary optics light source with a rectangular light pattern according to claim 1, wherein when the LED chip has a size of 55 mil, the rectangular light pattern has an aspect ratio falling within a range of 3.6:1-3.9:1.
3. The primary optics light source with a rectangular light pattern according to claim 1, wherein when the LED chip has a size of 38 mil, the rectangular light pattern has an aspect ratio falling within a range of 5.45:1-5.75:1.
4. The primary optics light source with a rectangular light pattern according to claim 1, wherein before the encapsulated package is combined with the substrate, the substrate includes an adhesive for improving the bonding strength between the encapsulated package and the substrate.
5. The primary optics light source with a rectangular light pattern according to claim 1, wherein the encapsulated package is made of silicone.
6. A primary optics light source with a rectangular light pattern, having a substrate, an LED chip and an encapsulated package, and the LED chip being installed on the substrate, and the encapsulated package covering the LED chip to fix the LED chip to the substrate, characterized in that a pair of first bent sections, a pair of second bent sections and a top section are sequentially arranged from the substrate and on the cross-section of the encapsulated package in the x-axis, and the first bent sections are disposed opposite to each other and extended form the substrate to couple with the second bent section, and the second bent sections are also disposed opposite to each other and coupled to an end of the top section, and the pair of first bent sections, the pair of second bent sections and the top section are all arc shaped, and a pair of third bent sections and an arc section are disposed on the cross-section of the encapsulated package in the y-axis, and the pair of third bent sections are disposed opposite to each other and extended from the substrate to coupled with both ends of the arc section respectively, and the pair of third bent sections are perpendicular to the substrate, thereby a light of the LED chip is emitted to the outside through the encapsulated package to form a rectangular light pattern; wherein the x-axis and the y-axis are perpendicular to each other, and a plane included between the x-axis and the y-axis is parallel to a plane of the substrate provided for installing the LED.
7. The primary optics light source with a rectangular light pattern according to claim 6, wherein when the LED chip has a size of 55 mil, the rectangular light pattern has an aspect ratio falling within a range of 2.25:1-2.55:1.
8. The primary optics light source with a rectangular light pattern according to claim 6, wherein when the LED chip has a size of 38 mil, the rectangular light pattern has an aspect ratio falling within a range of 3.5:1-3.8:1.
9. The primary optics light source with a rectangular light pattern according to claim 6, wherein before the encapsulated package is combined with the substrate, the substrate includes an adhesive for improving the bonding strength between the encapsulated package and the substrate.
10. The primary optics light source with a rectangular light pattern according to claim 6, wherein the encapsulated package is made of silicone.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0014]
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DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0023] The above and other objects, features and advantages of this disclosure will become apparent from the following detailed description taken with the accompanying drawings.
[0024] To simplify the structural design of the automotive lamp effectively, the inventor of the present invention applied the concept of the optical design of the LED light source to form a rectangular illumination light pattern when the LED light source is lit. With reference to
[0025] The primary optics light source 1 is characterized in that a pair of first bent sections 121, a pair of second bent sections 122 and a top section 123 are sequentially arranged from the substrate 10 and on a cross-section of the encapsulated package 12 in the x-axis, and the first bent sections 121 are disposed opposite to each other and extended from the substrate 10 to couple the second bent section 122, and the second bent sections 122 are also disposed opposite to each other and coupled to an end of the top section 123, and the pair of first bent sections 121, the pair of second bent sections 122 and the top section 123 are all arc shaped as shown in
[0026] Preferably, the encapsulated package 12 is made of silicone to achieve the effects of packaging the LED chip 11 conveniently, outputting a light, and adjusting the light pattern of the outputted light effectively. To provide a better bonding strength between the encapsulated package 12 and the substrate 10, an adhesive is coated onto the substrate 10 before the encapsulated package 12 is combined with the substrate 10, and the adhesive is provided for enhancing the fixing force between the encapsulated package 12 and the substrate 10.
[0027] In
[0028] Since the practical applications of the primary optics light source 1 are limited by special optical requirements or the requirements for applying the automotive lamp, therefore the specification of the LED chip 11 is also limited or specified by the foregoing contents. Even if the specification of the LED chip 11 is changed, the encapsulated package 12 is capable of maintaining the rectangular shape of the light pattern projected from the primary optics light source 1 to comply with the application requirements, so as to achieve the effect of providing simpler and easier elements for the lamp design. In addition, the size of the encapsulated package 12 may be increased or decrease in equal proportions according to the aforementioned shape in order to maintain the light pattern projected from the primary optics light source 1 in the rectangular shape. Obviously, the primary optics light source 1 of the present invention has excellent adjustability. After the size of the encapsulated package 12 is changed in equal proportions the rectangular light pattern still can be provided.
[0029] With reference to
[0030] Similarly, when an LED chip 11 with a size of 55 mil is used, the measured rectangular light pattern of the primary optics light source 1 has an aspect ratio falling within a range of 2.25:1-2.55:1. When an LED chip 11 with a size of 38 mil is used, the measured rectangular light pattern of the primary optics light source 1 has an aspect ratio falling within a range of 3.5:1-3.8:1. Therefore, the size of encapsulated package 12 of the primary optics light source 1 may be increased or decreased in equal proportions according to the previous preferred embodiment, or the length of the encapsulated package 12 in the y-axis may be changed to comply with the different specifications and requirements of various automotive lamps, and maintained the projected light pattern in a rectangular shape effectively. In addition, the fixing force between the encapsulated package 12 and the substrate 10 may be enhanced. Before the encapsulated package 12 is combined with the substrate 10, an adhesive is coated onto the substrate 10 to improve the bonding strength between the encapsulated package 12 and the substrate 10, and the encapsulated package 12 may be made of silicone to achieve the effects of light transmission and package protection.
[0031] In summation of the description above, the primary optics light source 1 of the present invention is capable of directly forming a rectangular light pattern projected from a primary optics light source without requiring a further secondary optics design to achieve the effects of improving the application performance of the light source, skipping the complicated structure design of the automotive lamp, and reducing the using quantity of other optical elements to reduce the total volume of the lamp. With the special stylish appearance of the encapsulated package 12, the light emitted from the LED chip 11 can be adjusted effectively to form the rectangular light pattern A directly and maintain an excellent light output quality. To cope with the installation environment of the primary optics light source 1, the shape of the rectangular light pattern A of the primary optics light source 1 and the same aspect ratio of the rectangular light pattern A can still be maintained when the size of the encapsulated package 12 is increased or decreased, or the specification of the LED chip 11 is changed. In a special automotive lamp installation environment, such as a very narrow space for installing an automotive lamp of the primary optics light source 1, the length of the encapsulated package 12 in the y-axis may be reduced, so that the shape of the rectangular light pattern A projected from the primary optics light source 1 will not be changed or affected. Therefore, the present invention improves the inconvenience of the conventional automotive lamp that requires a secondary optics design to form the specific light pattern and the invention has the effect of lowering the design and development costs of the automotive lamp.