RF SWITCH STACK WITH CHARGE CONTROL ELEMENTS

Abstract

Methods and devices to address the undesired DC voltage distribution across switch stacks in OFF state are disclosed. The disclosed devices include charge control elements that sample the RF signal to generate superimposed voltages at specific points of the switch stack biasing circuit. The provided voltages help reducing the drooping voltages on drain/source/body terminals of the transistors within the stack by supplying the current drawn by drain/source terminals of the stacked transistors and/or by sinking the body leakage current exiting the body terminals of such transistors. Methods and techniques teaching how to provide proper tapping points in the biasing circuit to sample the RF signal are also disclosed.

Claims

1.-41. (canceled)

42. A FET switch stack comprising: a plurality of field effect transistors (FETs) connected in series; and a body resistive ladder comprising a plurality of body resistor networks connected in series, each body resistor network connected across body terminals of corresponding pair of adjacent transistors of the FET switch stack, wherein: the plurality of FETs comprises a first FET and a second FET, a source terminal of the first FET being connected to a drain terminal of the second FET; the plurality of FETs is connected at one end to a radio frequency (RF) terminal and at another end to a first reference voltage; the FET switch stack is configured to receive an RF signal at the RF terminal; the plurality of body resistor networks comprises a first body resistor network comprising two or more body resistors thereby providing a first tapping point of the first body resistor network; the plurality of body resistor networks comprises a second body resistor network comprising two or more body resistors thereby providing a second tapping point of the second body resistor network; the FET switch stack further comprising one or more body charge control elements including a first body charge control element connected to the first tapping point of the first body resistor network and the second tapping point of the second body resistor network, and wherein: the first body charge control element comprises a first terminal, a second terminal, and a third terminal; the first terminal is connected to the first tapping point of the body resistive ladder; the second terminal is connected to the second tapping point of the body resistive ladder; and the third terminal is coupled to a body terminal of the first FET.

43. The FET switch stack of claim 42, the first body charge control element further comprises a first diode and a first resistor, wherein: a cathode of the first diode is connected to the second terminal of the first body charge control element, and the first resistor is connected at one end to an anode of the first diode and at another end is connected to the third terminal of the first body charge control element.

44. The FET switch stack of claim 43, wherein: during the downswing of the RF signal the first diode is conducting, and during an upswing of the RF signal the first diode is not conducting.

45. The FET switch stack of claim 43, wherein the first body charge control element further comprises a second diode, and a second resistor, wherein: a cathode of the second diode is connected to the first terminal of the first body control element, and the second resistor is connected at one end to an anode of the second diode and at another end is connected to a fourth terminal of the first body charge control element.

46. The FET switch stack of claim 45, wherein the fourth terminal is connected to the third terminal.

47. The FET switch stack of claim 45, wherein during an upswing of the RF signal the second diode of the first body charge control element is conducting and the first diode is not conducting; and during a downswing of the RF signal the second diode of the first body charge control element is not conducting and the first diode is conducting.

48. The FET switch stack of claim 45, wherein the first diode and the second diode of the first body charge control element are each implemented using a combination of a diode-connected FET with one or more resistors.

49. The FET switch stack of claim 45, wherein the first body charge control element comprises a first capacitor.

50. The FET switch stack of claim 49, wherein the first capacitor is configured to be charged during a downswing of the RF signal.

51. The FET switch stack of claim 49, wherein the first capacitor is connected at one end to the first terminal of the first body control element and at another end to the anode of the first diode of the first body charge control element.

52. The FET switch stack of claim 51, further comprising a second capacitor connected at one end to the second terminal of the first body charge control element and at another end to the anode of the second diode of the first body charge control element.

53. The FET switch stack of claim 42, wherein the body resistive ladder is coupled at one end to the RF terminal through a body resistive ladder capacitance connected in series with the plurality of body resistors and is coupled at the other end to a second reference voltage.

54. The FET switch stack of claim 42, further comprising a drain-source resistive ladder comprising a plurality of drain-source resistor networks connected in series, each drain-source resistor network connected across a drain and a source of a corresponding FET of the plurality of FETs;

55. The FET switch stack of claim 54, wherein the plurality of drain-source resistor networks comprises a first drain-source resistor network connected across a drain terminal and the source terminal of the first FET and a second drain-source resistor network connected across the drain terminal and a source terminal of the second FET.

56. The FET switch stack of claim 55, wherein: the first drain-source resistor network comprises two or more drain-source resistors, thereby providing a first tapping point of the first drain-source resistor network; and the second drain-source resistor network comprises two or more drain-source resistors, thereby providing a second tapping point of the second drain-source resistor network.

57. The FET switch stack of claim 56, further comprising: one or more drain-source charge control elements comprising a first drain-source charge control element connected to the first tapping point of the first drain-source resistor network and the second tapping point of the second drain-source resistor network and coupled to the source terminal of the first FET and the drain terminal of the second FET.

58. The FET switch stack of claim 57, wherein: the first drain-source charge control element comprises a first terminal, a second terminal, and a third terminal, wherein: the first terminal is connected to the first tapping point of the first drain-source resistor network; the second terminal is connected to the second tapping point of the second drain-source resistor network; and the third terminal is coupled to the source terminal of the first FET to supply the first current.

59. The FET switch stack of claim 58, wherein the first drain-source charge control element comprises a first diode and a first charge control resistor wherein: an anode of the first diode of the first drain-source charge control element is connected to the first terminal of the first drain-source charge control element; the first charge control resistor of the first drain-source charge control element is connected at one end to a cathode of the first diode and at another end is connected to the third terminal of the first drain-source charge control element.

60. The FET switch stack of claim 59, wherein: during an upswing of the RF signal the first diode of the first drain-source charge control is conducting; and during a downswing of the RF signal the first diode of the first drain-source charge control is not conducting.

61. The FET switch stack of claim 60, wherein the first drain-source charge control element further comprises a second diode and a second charge control resistor, wherein: an anode of the second diode of the first drain-source charge control element is connected to the second terminal of the first drain-source charge control element, and the second resistor of the first drain-source charge control element is connected at one end to a cathode of the second diode and at another end is connected to a fourth terminal of the first drain-source charge control element.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIGS. 1A, 1B, and 1C show prior art FET switch stacks.

[0025] FIG. 1A′ shows a prior art transistor with the leakage current flowing from the drain and the source terminals to the body terminal.

[0026] FIG. 2 shows prior art graphs illustrating variations of drain and body DC bias voltages vs. position in a FET switch stack in the OFF state and experiencing RF swing.

[0027] FIG. 3 shows an exemplary switch stack according to an embodiment of the present disclosure.

[0028] FIGS. 4A-4C show exemplary control elements according to embodiments of the present disclosure.

[0029] FIGS. 5A-5B shows voltage waveforms according to embodiments of the present disclosure.

[0030] FIGS. 6A-6C show exemplary control elements according to embodiments of the present disclosure.

[0031] FIGS. 7A-7B show portions of the switch stack of FIG. 3.

DETAILED DESCRIPTION

[0032] FIG. 3 shows a FET switch stack (300) in accordance with an embodiment of the present disclosure. The FET switch stack (300) comprises a plurality of transistors (T1, . . . , T4) connected in series, a gate resistive ladder including gate resistors (R.sub.G1, . . . , R.sub.G5), a body resistive ladder including body resistors (R.sub.B1, R.sub.B11, R.sub.B12, R.sub.6′, R.sub.6 . . . , R.sub.B31, R.sub.B32, R.sub.4′, R.sub.4, R.sub.B2) and a drain-source resistive ladder including drain-source resistors (R.sub.DS11, R.sub.DS12, R.sub.3′, R.sub.3, . . . , R.sub.DS41, R.sub.DS42). The resistive ladders are essentially used to bias the gate/source/drain/body terminals of each of the transistors in the FET switch stack. The FET switch stack (300) is coupled to an antenna or RF port (RF Path) on the top side to receive RF signals and connected to a reference voltage that may be ground, at another end. The gate resistive ladder is coupled to the antenna at one end and connected to reference voltage (VG) at another end. Similarly, the body resistive ladder is coupled to the antenna at one end and connected to reference voltage (VB) at another end.

[0033] The gate resistive ladder may further comprise a series capacitor (Cg) coupling the top gate resistor (R.sub.G5) to the antenna. Similarly, the body resistive ladder further comprises series capacitor (Cb) coupling the top body resistor (R.sub.B2) to the antenna. Capacitor (Cb) is optional, meaning that embodiments in accordance with the present disclosure may also be envisaged, wherein capacitor (Cb) is not employed. However, the presence of capacitor (Cb) is beneficial to the overall performance of the FET switch stack (300). As described in detail in the above-incorporated U.S. Pat. No. 10,236,872 B1, this capacitor has the benefit of practically eliminating the RF load across the top transistor (T4) coupled to the antenna. This will allow a more uniform/balanced division of the voltage across the ladders and also a reduction of the negative impact of the parasitic capacitances (existing throughout the entire circuit) on uniform division of the RF voltage across the body resistive ladder.

[0034] As shown in FIG. 3, the drain-source and the body biasing resistors may each include a combination of resistors or alternatively be accessible at an intermediate point (e.g. a mid-point). As described later and more in detail, bias resistors used to provide bias voltages to drain/source/body of each transistor, may be split into two serially connected resistors to provide tapping points throughout the drain-source and the body resistive ladders, while maintaining the DC biasing functionality to the corresponding transistors. In accordance with the teachings of the present disclosure, the provided tapping points may be used to sample the RF signal to locally generate charges that may improve the distribution of the DC voltages across the switch stack.

[0035] To further clarify this point and as an example, the series combination of resistors (R.sub.DS21, R.sub.DS22) of FIG. 3 is used to DC bias the drain/source of transistor (T2) while providing tapping point (T.sub.pd2). In line with this and as shown in FIG. 3, the FET switch stack (300) further comprises tapping points (T.sub.pd1, T.sub.pd4) on the drain-source resistive ladder side and tapping points (T.sub.pb1, T.sub.pb4) on the body resistive ladder side.

[0036] With continued reference to FIG. 3, the FET switch stack (300) further comprises a first plurality of charge control elements (301, 302, 303) coupled with the drain-source resistive ladder and a second plurality of charge control elements (304, 305, 306) coupled with the body resistive ladder. Each charge control element comprises terminals (N, P, Ix, Ix′) that are used to couple the charge control element to the corresponding resistive ladder. For example, on the drain-source resistive ladder side, terminals (P, N) of charge control element (302) are connected to corresponding tapping points (T.sub.pd3, T.sub.pd2) respectively, terminal (Ix) is connected to the intermediate point of resistors (R.sub.DS31, R.sub.2) and terminal (Ix′) is connected to the intermediate point of resistors (R.sub.DS22, R.sub.2′). Additionally, the intermediate point of resistors (R.sub.2, R.sub.2′) is connected to the source and drain of corresponding transistors (T3, T2) respectively. As a further example, on the body resistive ladder side, terminals (P, N) of the charge control element (305) are connected to corresponding tapping points (T.sub.pb3, T.sub.pb2). Additionally, the intermediate point of resistors (R.sub.B31, R.sub.5) is connected to terminal (Ix) of element (305), the intermediate point of resistors (R.sub.B22, R.sub.5′) is connected to terminal (Ix′) of element (305), and the intermediate point of resistors (R.sub.5, R.sub.5′) is connected to the body terminal of the corresponding transistor (T3). When the FET switch stack (300) is in the OFF state, and as mentioned above, the main function of each charge control element is to sample the RF swing at the corresponding tapping points. Considering the example of the body leakage current previously described, the sampled voltage may be used, for example, to redistribute DC voltages with proper polarity to reduce the drooping of the drain and reduce the rising of the body terminals of the corresponding transistor within the stack. In accordance with embodiments of the present disclosure, the FET switch stack (300) may include only one of a) charge control elements (301, 302, 303) or b) charge control elements (304, 305, 306) or a combination of both. According to various embodiments of the present disclosure, some or all of resistors (R.sub.1, R.sub.1′, . . . , R.sub.6, R.sub.6′) may have zero resistance, i.e. they may be shorted.

[0037] In what follows, and using exemplary embodiments of the present disclosure, details of the functionality of the charge control elements are described. The following will also describe the application of charge control elements that utilize the RF voltage signal in one or more of the above mentioned resistive ladders to generate DC voltage differences that can be strategically superimposed on the existing voltage distribution along the ladder to which voltage is applied. By creating voltage differences between i) certain terminals within the ladder that are connected to the FET switch stack with respect to ii) certain terminals within the ladder that are not connected to the FET switch stack, it is possible to realize a more desirable voltage distribution for the terminals connected to the FET switch stack and therefore, achieve the desired DC voltage distribution across the FET switch stack.

[0038] FIG. 4A shows a charge control element (400A) which constitutes an exemplary implementation of any one of charge control elements (301, 302, 303) of FIG. 3), according to the teachings of the present disclosure. The charge control element of FIG. 4A comprises diodes (Dx, Dx′), resistors (Rx, Rx′) and capacitors (Cx, Cx′). In operative conditions, when the switch stack is in OFF state, diode (Dx) is in ON state during the positive half cycle of each RF swing and is OFF during the other (negative) half cycle of the same swing. On the other hand, diode (Dx′) is in ON state during the negative cycle of each RF swing and is OFF during the other (positive) half cycle of the same RF swing.

[0039] Reference will now be made to FIG. 5A, where curve (500A) represents the difference of the voltage of the drain terminal of for example, transistor (T3) of FIG. 3 with a charge control element as in FIG. 4A, between a state when the charge control element is applied to such drain terminal and a state when the charge control element is not applied thereto. Such a voltage difference has a DC average voltage (501), thus illustrating that the presence of the charge control element improves the voltage on the drain with respect to a realization without such element. The person skilled in the art will appreciate that, without distracting the functionality of the FET switch stack and by sampling the RF swing at the tapping points, the DC voltages of the drain terminals of the transistors are pulled higher to overcome the drooping issue or the undesired voltage distribution across the circuit, as previously described.

[0040] FIG. 4B shows a charge control element (400B) which constitutes another exemplary implementation of the charge control elements on the drain-source resistive ladder side, in accordance with an embodiment of the present disclosure. A combination of transistor (Tx) with resistors (R.sub.41, R.sub.42) functions as a diode with the same polarity of diode (Dx) of FIG. 4A. The resistance values of resistors (R.sub.41, R.sub.42) will indicate the location of the knee of the I-V curve of the diode and the general shape of such a curve. By way of example and not of limitation, R.sub.41 may be an open and R.sub.42 may be a short, although other resistance values may be envisaged for such resistors, and depending on the application. Similarly, a combination of transistor (Tx′) with resistors (R.sub.41′, R.sub.42′) functions as a diode with the same polarity of diode (Dx′) of FIG. 4A. Resistance values of resistors (R.sub.41′, R.sub.42′) will indicate the location of the knee of the I-V curve of such a diode and the general shape of its I-V curve. The principle of operation of the charge control element (400B) shown in FIG. 4B is similar to what was described with regards to the exemplary charge control element (400A) of FIG. 4A

[0041] FIG. 4C shows a charge control element (400C) which constitutes yet another exemplary implementation of the control elements (301, 302, 303) of FIG. 3. Charge control element (400C) comprises a diode (Dx) a capacitor (Cx) and a resistor (Rx). As shown in FIG. 4C, terminal (Ix′) is not internally connected. In operative conditions, when the switch stack is in OFF state, diode (Dx) is in ON state during the positive half cycle of each RF swing and is OFF during the other (negative) half cycle of the same swing.

[0042] Similarly to what shown in FIG. 5A, FIG. 5B shows a curve (500B) representing a voltage difference at the drain terminal of for example, transistor (T3) of FIG. 3 with a charge control element as in FIG. 4C, between a state when the charge control element is applied to such drain terminal and a state when the charge control element is not applied to the same. Such voltage difference has an average DC voltage (502), meaning that similarly to the case of charge control elements (400A, 400B), the drain terminals of the transistors are pulled higher to counteract the undesired voltage distribution through the circuit, as described before.

[0043] FIGS. 6A-6C show exemplary implementations of the charge control elements (304, 305, 306) of FIG. 3. As described before, due to impairments such as body leakage current, the DC voltage levels of the body terminals of the transistors of FIG. 3 may be higher than expected, causing an undesired distribution of DC voltages throughout the circuit.

[0044] The principle of operation of charge control element (600A) of FIG. 6A is similar to that of its counterpart, i.e. charge control element (400A) of FIG. 4A, except that the diodes of FIG. 6A have opposite polarities of their counterparts of FIG. 4A. Given such opposite polarities, the voltage difference between body terminals of the transistors of FIG. 3 and their corresponding tapping points has this time a negative DC value and as a result, the body terminals of the transistors are pulled lower to overcome the undesired DC voltage distribution across the circuit and as described above.

[0045] The principle of operation of charge control element (600B) of FIG. 6B is similar to that of its counterpart, i.e. charge control element (400B) of FIG. 4B, except that the transistors used in charge control element (600B) are NMOS transistors, differently from their counterparts in FIG. 4B, which are PMOS transistors. As a result of such a difference, the voltage difference between body terminals of the transistors of FIG. 3 and their corresponding tapping points has a negative DC value. As a result, the base terminals of the transistors are pulled lower to overcome the undesired DC voltage distribution across the circuit, as described above.

[0046] The principle of operation of charge control element (600C) of FIG. 6C is similar to that of its counterpart, i.e. charge control element (400C) of FIG. 4C, except that the diode of FIG. 6C has the opposite polarity of its FIG. 4C counterpart. Given such difference, the voltage difference between body terminals of the transistors of FIG. 3 and their corresponding tapping points will this time have a negative DC value, As a result, the body terminals of the transistors are pulled lower to overcome the undesired DC voltage distribution across the circuit, as described above.

[0047] With reference to FIGS. 4A-4C and 6A-6C, according the teachings of the present disclosure, capacitor (Cx) is optional, which means that the charge control elements may be implemented without using any capacitor.

[0048] With further reference to FIGS. 4A-4C and 6A-6C, in a typical operating condition, capacitor (Cx) may charge and discharge during a full RF swing without storing charges. In certain applications, for example where the body leakage current is not an issue, larger drain-source resistors may be implemented such that during a full RF swing, capacitor (Cx) is not fully discharged and as a result, stores charges thus functioning as a battery. In this case, in operative conditions, when the switch stack is in OFF state, Diode (Dx) is in ON state during a half cycle of each RF swing and is OFF during the other half cycle of the same swing. During the half cycle when diode (Dx) is ON, capacitor (Cx) charges, maintaining its charge during the other half cycle when the Diode (Dx) is OFF. In other words, capacitor (Cx) may function essentially as a battery feeding the corresponding tapping point with charge, thereby reducing the voltage droop of the drain/body of the corresponding transistor. According to an embodiment of the present disclosure, Diode (Dx) may be implemented using a FET transistor.

[0049] Continuing with the same application mentioned in the previous paragraph, in order to further clarify the details of operation of the control elements, reference is made to FIG. 7A showing a portion of the FET switch stack (300) of FIG. 3, on the drain-source resistive ladder side, wherein the control element (302) is implemented using the embodiment of FIG. 4C. Without loss of generality, for the sake of simplicity, resistors (R.sub.2, R.sub.2′) are assumed here to be shorted. Diode (Dx) of FIG. 7A is ON during the upswing of the RF swing and is OFF during the downswing. Capacitor (Cx) is charged when diode (Dx) is conducting, and with the polarity as shown in FIG. 5A. Arrow (501) shows the direction of the current charging capacitor (Cx). Capacitor (Cx) functions similarly to a battery generating positive voltage to overcome undesired voltage distributions across the circuit, and as described previously. As a result, for example, the low drooping of the drain/source terminals of transistors (T2, T3) respectively is reduced.

[0050] The person skilled in the art will appreciate that in order to provide the charges required to counteract the drain terminal drooping, the RF swing is sampled at the tapping point (T.sub.pd3) independently, and without distracting the operations of transistor (T3). The person skilled in art will also appreciate that by virtue of the control elements, the undesired drain terminals voltage distribution is migrated, at least partially, from the drain-source terminals to the tapping points that have virtually no direct impact on the general functionality of the switch stack.

[0051] FIG. 7B shows a portion of the FET switch stack (300) of FIG. 3, on the body resistive ladder side, wherein the control element (305) is implemented using the embodiment of FIG. 6C. Without loss of generality and for the sake of simplicity, resistors (R.sub.5, R.sub.5′, R.sub.6, R.sub.6′) are assumed here to be all shorted. In operative conditions, when the switch stack is in the OFF state, capacitor (Cx) drives the RF swing. Diode (Dx) of FIG. 7B is ON during the upswing of each RF swing and is OFF during the downswing. Capacitor (Cx) of FIG. 7B is charged during the upswing with the polarity shown. Arrow (502) shows the direction of the flowing current charging capacitor (Cx). Capacitor (Cx) functions similarly to a battery generating negative voltage within the body resistive ladder, resulting in a reduction of the high voltage droop of the body terminal of the corresponding transistor (T3).

[0052] All of the previous descriptions and drawings related to voltage generation for the body resistive ladder are identically applicable to the gate resistive ladder. The same addition of tapping points and charge control elements used for the body resistor ladder can be applied to the gate resistor ladder, with the same polarity. Thus, application of tapping points and charge control elements can generate a more negative voltage at the points in the resistive ladder that are connected to the transistor gates than would be present in the absence of said charge control elements.

[0053] For many applications, having a more negative voltage on the gates of the transistors in a switch stack improves the power handling of the switch stack in the OFF or non-conducting state. This can include applying a negative voltage to the gates of the transistors in a switch stack. There are applications where no negative voltage is available and it would be costly to generate negative voltage. For those applications, application of charge control elements on the gate resistor ladder can generate negative voltages applied to the gates of the transistors without the need or cost of separately generating a negative voltage supply.

[0054] Switch stacks designed in accordance with embodiments of the present disclosure may be implemented as part of an integrated circuit chip or an electronic module, wherein the integrated circuit chip or the electronic module are part of a communication device. Further embodiments according to the present disclosure may also be envisaged, wherein the switch stacks as disclosed is part of the RF front-end of an electronic circuit or an electronic module or a communication device.

[0055] In accordance with further embodiments of the present disclosure: [0056] The FET switch stack (300) of FIG. 3 may include two or more transistors. [0057] The FET switch stack (300) of FIG. 3 may include one or more charge control elements implemented either on the drain-source resistive ladder side and/or on the body resistive ladder side. In other words, the number of one or more charge control elements on each side may be greater or equal to one and less than the number of transistors. The one or more charge control elements may be implemented at any location of the corresponding resistive ladders. For example, the charge control elements may be implemented closer to the top, to the bottom, or to the middle of the resistive ladders or a combination thereof. [0058] Charge control elements with the same or different constituents or a combination thereof may be employed to design switch stacks. [0059] Reference voltages (VB, VG) may supply negative voltages. [0060] Reference voltages (VB, VG) may supply the same or different voltage values. [0061] Reference voltages (VB, VG) may be controlled by one or more bias control circuits to provide proper voltage values during the OFF and ON states of the FET switch stack.

[0062] Throughout the disclosure, for the purpose of describing the invention, the exemplary FET switch stacks were presented in a shunt configuration wherein the FET switch stacks are implemented between an antenna or RF port (RF path) and a reference voltage (e.g. ground). Embodiments in accordance with the present disclosure may also be envisaged wherein the FET switch stack may be implemented between any two points of an electronic circuit, in series configuration, or in any configuration other than shunt configuration.

[0063] The term “MOSFET”, as used in this disclosure, means any field effect transistor (FET) with an insulated gate and comprising a metal or metal-like, insulator, and semiconductor structure. The terms “metal” or “metal-like” include at least one electrically conductive material (such as aluminum, copper, or other metal, or highly doped polysilicon, graphene, or other electrical conductor), “insulator” includes at least one insulating material (such as silicon oxide or other dielectric material), and “semiconductor” includes at least one semiconductor material.

[0064] As should be readily apparent to one of ordinary skill in the art, various embodiments of the invention can be implemented to meet a wide variety of specifications. Unless otherwise noted above, selection of suitable component values is a matter of design choice and various embodiments of the invention may be implemented in any suitable IC technology (including but not limited to MOSFET structures), or in hybrid or discrete circuit forms. Integrated circuit embodiments may be fabricated using any suitable substrates and processes, including but not limited to standard bulk silicon, silicon-on-insulator (SOI), and silicon-on-sapphire (SOS). Unless otherwise noted above, the invention may be implemented in other transistor technologies such as bipolar, GaAs HBT, GaN HEMT, GaAs pHEMT, and MESFET technologies. However, the inventive concepts described above are particularly useful with an SOI-based fabrication process (including SOS), and with fabrication processes having similar characteristics. Fabrication in CMOS on SOI or SOS processes enables circuits with low power consumption, the ability to withstand high power signals during operation due to FET stacking, good linearity, and high frequency operation (i.e., radio frequencies up to and exceeding 50 GHz). Monolithic IC implementation is particularly useful since parasitic capacitances generally can be kept low (or at a minimum, kept uniform across all units, permitting them to be compensated) by careful design.

[0065] Voltage levels may be adjusted or voltage and/or logic signal polarities reversed depending on a particular specification and/or implementing technology (e.g., NMOS, PMOS, or CMOS, and enhancement mode or depletion mode transistor devices). Component voltage, current, and power handling capabilities may be adapted as needed, for example, by adjusting device sizes, serially “stacking” components (particularly FETs) to withstand greater voltages, and/or using multiple components in parallel to handle greater currents. Additional circuit components may be added to enhance the capabilities of the disclosed circuits and/or to provide additional functional without significantly altering the functionality of the disclosed circuits.

[0066] A number of embodiments of the invention have been described. It is to be understood that various modifications may be made without departing from the spirit and scope of the invention. For example, some of the steps described above may be order independent, and thus can be performed in an order different from that described. Further, some of the steps described above may be optional. Various activities described with respect to the methods identified above can be executed in repetitive, serial, or parallel fashion.

[0067] It is to be understood that the foregoing description is intended to illustrate and not to limit the scope of the invention, which is defined by the scope of the following claims, and that other embodiments are within the scope of the claims. (Note that the parenthetical labels for claim elements are for ease of referring to such elements, and do not in themselves indicate a particular required ordering or enumeration of elements; further, such labels may be reused in dependent claims as references to additional elements without being regarded as starting a conflicting labeling sequence).