HIGH-FREQUENCY HIGH-SPEED TRANSMISSION CABLE MODULE AND UPPER COVER OF THE COVER BODY THEREOF

Abstract

An upper cover of a cover body of a high-frequency high-speed transmission cable module is provided, including a main body and a heat dissipation block. Two ends in the length direction of the main body are respectively defined as a first end and a second end, and the first end is provided with a through hole. The heat dissipation block is embedded in the through hole and exposed on the top surface of the first end. As such, the present invention can use the heat dissipation block to directly transfer heat to the heat dissipation fins without indirectly passing through the main body, so the heat dissipation efficiency is greatly improved.

Claims

1. An upper cover of a cover body of a high-frequency high-speed transmission cable module, comprising: a main body, two ends in the length direction of the main body being respectively defined as a first end and a second end, and the first end of the main body being disposed with a through hole; and a heat dissipation block, embedded in the through hole and exposed to a top surface of the first end of the main body.

2. The upper cover of a cover body of a high-frequency high-speed transmission cable module according to claim 1, wherein the second end of the main body defines a plurality of grooves.

3. The upper cover of a cover body of a high-frequency high-speed transmission cable module according to claim 2, wherein the top surface of the second end of the main body is higher than the top surface of the first end of the main body.

4. The upper cover of a cover body of a high-frequency high-speed transmission cable module according to claim 3, wherein two sides along the length direction of the main body are respectively defined as a first side and a second side, the depth of the groove closest to the first side of the main body and the depth of the groove closest to the second side of the main body are both smaller than the depths of all the remaining grooves.

5. The upper cover of a cover body of a high-frequency high-speed transmission cable module according to claim 4, wherein the depth of the remaining grooves is 1.5 mm.

6. The upper cover of a cover body of a high-frequency high-speed transmission cable module according to claim 2, wherein a partition is disposed between two adjacent grooves, the partition has a plurality of protrusions, and the protrusions respectively protrude from both sides of the partition.

7. The upper cover of a cover body of a high-frequency high-speed transmission cable module according to claim 6, wherein the plurality of protrusions on two adjacent partitions are arranged in a staggered manner.

8. The upper cover of a cover body of a high-frequency high-speed transmission cable module according to claim 6, wherein the protrusions are arranged in pairs.

9. The upper cover of a cover body of a high-frequency high-speed transmission cable module according to claim 2, wherein the plurality of grooves are parallel to the length direction of the main body.

10. The upper cover of a cover body of a high-frequency high-speed transmission cable module according to claim 1, wherein inner wall of the through hole is disposed with a protruding support portion, and the support portion divides the through hole into a first passage and a second passage, the first passage runs through the top surface of the first end of the main body and the second passage runs through the bottom surface of the first end of the main body, and the support portion is disposed with a connecting passage for communicating between the first passage and the second passage; wherein, the heat dissipation block includes a top portion, a middle portion and a bottom portion, and the top portion of the heat dissipation block is located in the first passage, the top surface of the top portion of the heat dissipation block is exposed to the top surface of the first end of the main body, the outer side of the bottom surface of the top portion of the heat dissipation block abuts against the top surface of the support portion, and the middle portion of the heat dissipation block is disposed at the bottom surface of the top portion of the heat dissipation block and is located in the connecting passage; the bottom portion of the heat dissipation block is disposed on the bottom surface of the middle portion of the heat dissipation block and is located in the second passage, the diameter of the top portion of the heat dissipation block is greater than the diameter of the middle portion of the heat dissipation block, and the diameter of the middle portion of the heat dissipation block is greater than the diameter of the bottom portion of the heat dissipation.

11. A high-frequency high-speed transmission cable module, comprising: a cover body, comprising an upper cover and a lower cover, the upper cover further comprising a main body and a heat dissipation block, both ends of the length direction of the main body being respectively defined as a first end and a second end, and both ends of the bottom cover of the length direction being defined as a first end and a second end; the first end of the main body and the first end of the lower cover together forming a first end of the cover body, the second end of the main body and the second end of the lower cover together forming a second end of the cover body; the second end of the cover body being used for accommodating one end of a cable therein, the first end of the main body being disposed with a through hole, and the heat dissipation block being embedded in the through hole and exposed to top surface of the first end of the main body; and a control module, disposed inside the first end of the cover body and located under the heat dissipation block.

12. The high-frequency high-speed transmission cable module according to claim 11, wherein the second end of the main body defines a plurality of grooves.

13. The high-frequency high-speed transmission cable module according to claim 12, wherein the top surface of the second end of the main body is higher than the top surface of the first end of the main body.

14. The high-frequency high-speed transmission cable module according to claim 13, wherein two sides along the length direction of the main body are respectively defined as a first side and a second side, the depth of the groove closest to the first side of the main body and the depth of the groove closest to the second side of the main body are both smaller than the depths of all the remaining grooves.

15. The high-frequency high-speed transmission cable module according to claim 14, wherein the depth of the remaining grooves is 1.5 mm.

16. The high-frequency high-speed transmission cable module according to claim 12, wherein a partition is disposed between two adjacent grooves, the partition has a plurality of protrusions, and the protrusions respectively protrude from both sides of the partition.

17. The high-frequency high-speed transmission cable module according to claim 16, wherein the plurality of protrusions on two adjacent partitions are arranged in a staggered manner.

18. The high-frequency high-speed transmission cable module according to claim 16, wherein the protrusions are arranged in pairs.

19. The high-frequency high-speed transmission cable module according to claim 11, wherein inner wall of the through hole is disposed with a protruding support portion, and the support portion divides the through hole into a first passage and a second passage, the first passage runs through the top surface of the first end of the main body and the second passage runs through the bottom surface of the first end of the main body, and the support portion is disposed with a connecting passage for communicating between the first passage and the second passage; wherein, the heat dissipation block includes a top portion, a middle portion and a bottom portion, and the top portion of the heat dissipation block is located in the first passage, the top surface of the top portion of the heat dissipation block is exposed to the top surface of the first end of the main body, the outer side of the bottom surface of the top portion of the heat dissipation block abuts against the top surface of the support portion, and the middle portion of the heat dissipation block is disposed at the bottom surface of the top portion of the heat dissipation block and is located in the connecting passage; the bottom portion of the heat dissipation block is disposed on the bottom surface of the middle portion of the heat dissipation block and is located in the second passage, the diameter of the top portion of the heat dissipation block is greater than the diameter of the middle portion of the heat dissipation block, and the diameter of the middle portion of the heat dissipation block is greater than the diameter of the bottom portion of the heat dissipation; and wherein the control module is disposed under the bottom portion of the heat dissipation block.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be apparent to those skilled in the art by reading the following detailed description of a preferred embodiment thereof, with reference to the attached drawings, in which:

[0027] FIG. 1 is a perspective view of the high-frequency high-speed transmission cable module of the present invention;

[0028] FIG. 2 is an exploded view of the high-frequency high-speed transmission cable module of the present invention;

[0029] FIG. 3 is a cross-sectional view of the high-frequency high-speed transmission cable module of the present invention;

[0030] FIG. 4 is a perspective view of the upper cover of the cover body of the high-frequency high-speed transmission cable module of the present invention;

[0031] FIG. 5 is an exploded view of the upper cover of the cover body of the high-frequency high-speed transmission cable module of the present invention;

[0032] FIG. 6 is a top view of the upper cover of the cover body of the high-frequency high-speed transmission cable module of the present invention;

[0033] FIG. 7 is a side view of the upper cover of the cover body of the high-frequency high-speed transmission cable module of the present invention;

[0034] FIG. 8 is a comparison chart of the test results between the present invention and the conventional technology under the condition that the ambient temperature is 25° C. and the fan speed is 20 RPM; and

[0035] FIG. 9 is a comparison chart of the test results between the present invention and the conventional technology under the condition that the ambient temperature is 55° C. and the fan speed is 20 RPM.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0036] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0037] FIGS. 1-3 are respectively a perspective view, an exploded view and a cross-sectional view of the high-frequency high-speed transmission cable module of the present invention. As shown in FIGS. 1-3, the present invention provides a high-frequency high-speed transmission cable module, which includes a cover body 2 and a control module 3. The cover body 2 includes an upper cover 10 and a lower cover 20. The upper cover 10 includes a main body 11 and a heat dissipation block 12. The two ends of the length direction of the main body 11 respectively are defined as a first end 111 and a second end 112, the two ends of the length direction of the lower cover 20 are respectively defined as a first end 21 and a second end 22, the first end 111 of the main body 11 and the first end 21 of the lower cover 20 together form a first end 201 of the cover body 2, and the second end 112 of the main body 11 and the second end 22 of the lower cover 20 together form a second end 202 of the cover body 2. The second end 202 of the cover body 2 is used for accommodating an end of a cable (not shown) therein. The first end 111 of the main body 11 defines is disposed with a through hole 113, and the heat dissipation block 12 is embedded in the through hole 113 and exposed on the top surface of the first end 111 of the main body 11. The control module 3 is disposed inside the first end 201 of the cover body 2 and is located below the heat dissipation block 12.

[0038] As shown in FIGS. 1 to 3, in actual use, the first end 201 of the cover body 2 is disposed in a casing 1 such that the heat dissipation block 12 contacts a plurality of heat dissipation fins 101 of the casing 1.

[0039] The heat generated during the operation of the control module 3 will be transferred to the heat dissipation block 12, then the heat of the heat dissipation block 12 will be transferred to the heat dissipation fins 101, and finally the heat dissipation fins 101 will discharge the heat to achieve the effect of heat dissipation. Compared with the conventional technology, the present invention can use the heat dissipation block 12 to directly transfer heat to the heat dissipation fins 101 without transmission through the main body 11, so the heat dissipation efficiency is greatly improved. Whether it is a high-frequency high-speed transmission cable module with a total data rate of 200 G, 400 G, or 800 G, the heat dissipation means of the present invention is sufficient to maintain the control module 3 and one end of the cable at an appropriate temperature, preventing the IC chip of the control module 3 from reducing work efficiency, increasing the bit error rate and decreasing the transmission rate of the cable decreases.

[0040] FIGS. 4-7 are respectively a perspective view, an exploded view, a top view, and a side view of the upper cover 10 of the cover body of the high-frequency high-speed transmission cable module of the present invention. As shown in FIG. 3 and FIG. 5, in a preferred embodiment, a support portion 114 protrudes from the inner sidewall of the through hole 113, and the support portion 114 divides the through hole 113 into a first passage 1131 and a second passage 1132, the first passage 1131 runs through the top surface of the first end 111 of the main body 11, and the second passage 1132 runs through the bottom surface of the first end 111 of the main body 11. The support portion 114 is disposed with a connecting passage 1141, and the connecting passage 1141 communicates with the first passage 1131 and the second passage 1132. As shown in FIG. 3, FIG. 4 and FIG. 5, the heat dissipation block 12 includes a top portion 121, a middle portion 122 and a bottom portion 123, the top portion 121 of the heat dissipation block 12 is located in the first passage 1131, the top surface of the top portion 121 of the heat dissipation block 12 is exposed on the top surface of the first end 111 of the main body 11, the outer side of the bottom surface of the top portion 121 of the heat dissipation block 12 abuts against the top surface of the support portion 114, and the middle portion 122 of the heat dissipation block 12 is arranged on bottom surface of the top portion 121 of the heat dissipation block 12 and is also located in the connecting passage 1141. The bottom portion 123 of the heat dissipation block 12 is arranged on the bottom surface of the middle portion 122 of the heat dissipation block 12 and is located in the second passage 1132. The diameter of the top portion 121 of the heat dissipation block 12 is larger than the diameter of the middle portion 122 of the heat dissipation block 12, and the diameter of the middle portion 122 of the heat dissipation block 12 is greater than the diameter of the bottom portion 123 of the heat dissipation block 12. As shown in FIG. 3, the control module 3 is located under the bottom portion 123 of the heat dissipation block 12, and the top surface of the top portion 121 of the heat dissipation block 12 contacts the heat dissipation fins 101. Thereby, the support portion 114 can support the top portion 121 of the heat dissipation block 12, so that the heat dissipation block 12 an be easily installed in the through hole 113. Furthermore, the bottom portion 123 of the heat dissipation block 12 is aligned with the control module 3 and its diameter is smaller than the diameter of the top portion 121 and the diameter of the middle portion 122 of the heat dissipation block 12, so that it can quickly absorb the heat generated by the control module 3 during operation and improve the heat dissipation efficiency. In addition, the overall structure of the heat dissipation block 12 is in an inverted stepped shape, so that the heat can be evenly diffused from the bottom portion 123 of the heat dissipation block 12 to the top portion 121 of the heat dissipation block 12 through the middle portion 122 of the heat dissipation block 12, thereby improving heat dissipation efficiency. Moreover, the top surface of the top portion 121 of the heat dissipation block 12 has a larger contact area, so that the heat can be transferred to the heat dissipation fins 101 evenly and quickly, thereby improving heat dissipation efficiency.

[0041] As shown in FIGS. 4-7, in a preferred embodiment, the second end 112 of the main body 11 is disposed with a plurality of grooves 115. The heat generated during the operation of the control module 3 will also be absorbed by the first end 111 of the main body 11, and the first end 111 of the main body 11 will transfer the heat to the second end 112 of the main body 11. The grooves 115 provide a larger heat dissipation area, so that the airflow passing through the grooves 115 can carry more heat away and improve the heat dissipation efficiency.

[0042] As shown in FIG. 4, in a preferred embodiment, the top surface of the second end 112 of the main body 11 is higher than the top surface of the first end 111 of the main body 11. Therefore, the second end 112 of the main body 11 has sufficient thickness to form the grooves 115, and the second end 112 of the main body 11 can provide a sufficient internal space for accommodating one end of the cable.

[0043] As shown in FIG. 4 and FIG. 7, in a preferred embodiment, the two sides along the length direction of the main body 11 are respectively defined as a first side 1101 and a second side 1102. The groove 1151 closest to the first side 1101 of the main body 11 has a depth D1 and the groove 1151 closest to the second side 1102 of the main body 11 also has a depth D1, and D1 is smaller than the depth D2 of the remaining grooves 1152. More specifically, the depth D1 of the groove 1151 closest to the first side 1101 of the main body 11 and the depth D1 of the groove 1151 closest to the second side 1102 of the main body 11 must not be too deep, otherwise the thickness of the first side 1101 of the main body 11 and the thickness of the second side 1102 will not be enough to combine with the first side and the second side of the lower cover 20 respectively. Therefore, the depth D1 of the groove 1151 closest to the first side 1101 of the main body 11 and the depth D1 of the groove 1151 closest to the second side 1102 of the main body needs to be made shallow so that the first side 1101 and the second side 1102 of the main body 11 have enough thickness to combine with the first side and the second side of the lower cover 20 respectively.

[0044] Since the depth D2 of the remaining grooves 1152 will affect the heat dissipation efficiency and the internal space of the second end 112 of the main body 11, the present invention conducted a test for heat dissipation efficiency, and the test results are described as follows.

[0045] Test condition I: the depth D2 of the remaining grooves 1152 is less than 1.5 mm. Pros: the depth D2 allows the internal space of the second end 112 of the main body 11 to have sufficient height, without causing internal interference, and without excessive pressure on one end of the cable. Cons: The depth D2 will cause insufficient heat dissipation area, reduce heat dissipation efficiency, increase the risk of lower working efficiency of the IC chip of the control module 3, increase bit error rate, and decrease the transmission rate of the cable.

[0046] Test condition II: the depth D2 of the remaining grooves 1152 is greater than 1.5 mm. Pros: The depth D2 can increase the heat dissipation area and improve the heat dissipation efficiency. Cons: the depth D2 will compress the height of the internal space of the second end 112 of the main body 11, causing internal interference, and even over-pressing one end of the cable.

[0047] Test condition III: the depth D2 of the remaining grooves 1152 is 1.5 mm. Pros: the depth D2 allows the internal space of the second end 112 of the main body 11 to have a sufficient height, without causing internal interference, and without excessive pressure on one end of the cable; and the depth D2 can increase the heat dissipation area and improve the heat dissipation efficiency. In other words, the test condition III can have the advantages of the test condition I and the test condition II at the same time without the disadvantages of the test condition I and the test condition II, and the efficacy is good.

[0048] As shown in FIG. 4 and FIG. 6, in a preferred embodiment, a partition 116 is disposed between two adjacent grooves 115, and the partition 116 has a plurality of protrusions 1161. These protrusions 1161 respectively protrude from both sides of the partition 116. Thereby, the protrusions 1161 can increase the heat dissipation area of the partition 116 and improve the heat dissipation efficiency. Preferably, the positions of the plurality of protrusions 1161 of the two adjacent partitions 116 are staggered, so as to prevent the plurality of protrusions 1161 of the two adjacent partitions 116 from being too close to hinder the airflow, thereby affecting the heat dissipation efficiency. Preferably, the protrusions 1161 are arranged in pairs, for easy manufacturing.

[0049] As shown in FIG. 1, in a preferred embodiment, the grooves 115 are parallel to the length direction of the main body 11 and the length direction of the heat dissipation fins 101. Accordingly, the airflow can flow along the grooves 115 and a plurality of channels 1011 of the heat dissipation fins 101 to improve heat dissipation efficiency.

[0050] In a preferred embodiment, the heat dissipation block 12 is made of copper. However, it is not limited thereto, and the material of the heat dissipation block can be any material with high thermal conductivity.

[0051] The high-frequency high-speed transmission cable module shown in the aforementioned figures is a quad small form-factor pluggable-double density (QSFP-DD) transceiver. However, it is not limited thereto. In some embodiments, the high-frequency high-speed transmission cable module may also be a small form-factor pluggable (SFP) transceiver, a quad small form-factor pluggable, (QSFP) transceiver, or an octal small form-factor pluggable (OSFP) transceiver. The above-mentioned high-frequency high-speed transmission cable modules are all hot-swappable high-frequency high-speed transmission cable modules.

[0052] FIG. 8 is a comparison chart of the test results between the present invention and the conventional technology under the condition that the ambient temperature is 25° C. and the fan speed is 20 RPM. Tj1 is the core temperature of the IC chip of the control module of a conventional high-frequency high-speed transmission cable module, Tj2 is the core temperature of the IC chip of the control module 3 of the high-frequency high-speed transmission cable module of the present invention, Tb1 is the temperature of a measurement point P1 of the heat dissipation block of the upper cover of the high-frequency high-speed transmission cable module of the present invention, Tb2 is the temperature of the first end of the main body of the upper cover of the conventional high-frequency high-speed transmission cable module, and Tb3, is the temperature at a measuring point P2 at the first end of the main body of the upper cover of the high-frequency high-speed transmission cable module of the present invention. As shown in FIG. 8, Tj1>Tj2, and Tb1>Tb2>Tb3. The above results show that under the conditions of an ambient temperature of 25° C. and a fan speed of 20 RPM, the heat dissipation efficiency of the present invention is significantly better than that of the conventional technology.

[0053] More specifically, as shown in FIG. 8, during the start-up period (i.e., before 2 minutes and 53 seconds), the core temperature of the IC chip is still rising because the heat generated by the control module is still accumulating. At this time, Tj1-Tj2≥2° C., the difference between Tb1 and Tb2 is larger, and the difference between Tb2 and Tb3 is smaller. As shown in FIG. 8, during the equilibrium period (i.e., after 14 minutes and 24 seconds), the core temperature of the IC chip will not rise again because the heat generated during the operation of the control module reaches the equilibrium state. At this time, Tj1-Tj2≥4° C., the difference between Tb1 and Tb2 is smaller (Tb1-Tb2≥1° C.), and the difference between Tb2 and Tb3 is larger.

[0054] FIG. 9 is a comparison chart of the test results between the present invention and the conventional technology under the condition that the ambient temperature is 55° C. and the fan speed is 20 RPM. Tj1 is the core temperature of the IC chip of the control module of the conventional high-frequency high-speed transmission cable module, Tj2 is the core temperature of the IC chip of the control module 3 of the high-frequency high-speed transmission cable module of the present invention, Tb1 is the temperature of the measurement point P1 of the heat dissipation block of the upper cover of the high-frequency high-speed transmission cable module of the present invention, Tb2 is the temperature of the first end of the main body of the upper cover of the conventional high-frequency high-speed transmission cable module, and Tb3 is the temperature at the measuring point P2 at the first end of the main body of the upper cover of the high-frequency high-speed transmission cable module of the present invention. As shown in FIG. 9, Tj1>Tj2, and Tb1>Tb2>Tb3. The above results show that under the conditions of an ambient temperature of 55° C. and a fan speed of 20 RPM, the heat dissipation efficiency of the present invention is significantly better than that of the conventional technology.

[0055] More specifically, as shown in FIG. 9, during the start-up period (i.e., before 7 minutes and 12 seconds), the core temperature of the IC chip is still rising because the heat generated by the control module is still accumulating. At this time, Tj1-Tj2≥2° C., the difference between Tb1 and Tb2 is larger, and the difference between Tb2 and Tb3 is smaller. As shown in FIG. 9, during the equilibrium period (i.e., after 21 minutes and 36 seconds), since the heat generated during the operation of the control module reaches an equilibrium state, the core temperature of the IC chip will not rise again. At this time, Tj1-Tj2≥3.5° C., the difference between Tb1 and Tb2 is smaller (Tb1-Tb2≥1° C.), and the difference between Tb2 and Tb3 is larger.

[0056] In addition, when Tb2 is fixed at 70° C. and the fan speed is 24 RPM, Tj1 is 98° C.; when Tb1 is fixed at 70° C. and the fan speed is 30 RPM, Tj2 is 92° C. At this time, Tj1>Tj2. The above results show that the heat dissipation efficiency of the present invention is clearly better than that of the conventional technology under the condition that the temperature of the measurement point is fixed at 70° C.

[0057] Although the present invention has been described with reference to the preferred embodiments thereof, it is apparent to those skilled in the art that a variety of modifications and changes may be made without departing from the scope of the present invention which is intended to be defined by the appended claims.