Pin-Type Probes for Contacting Electronic Circuits and Methods for Making Such Probes

Abstract

Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

Claims

1-19. (canceled)

20. A pin probe for making electrical contact to an electronic circuit element, comprising: (A) a pin element, comprising: (1) a first contact tip portion; and (2) a compliant portion having a first end and a second end connected by an intermediate portion of the pin element comprising a serpentine structure having a plurality of turns comprising at least one layer of deposited metal, wherein the first end is functionally connected to the first contact tip portion; and (B) a rigid sheath comprising a plurality of planar layers of sheath material with at least one layer forming a lower part of the sheath, at least one layer forming an upper part of the sheath, and at least one layer forming an intermediate portion of the sheath between the lower and upper parts which provides side walls and an intermediate opening there between in which the compliant portion of the pin element is movably located to allow longitudinal compliant motion, and an end opening from which the first contact tip portion of the pin element extends.

21. The probe of claim 20 wherein the compliant portion of the pin element comprises two spaced compliant serpentine structures that operate in parallel.

22. The probe of claim 21 wherein the two spaced compliant serpentine structures have parallel configurations.

23. The probe of claim 20 wherein the serpentine structure comprises two serially located serpentine structures separated by a non-compliant element.

24. The probe of claim 20 wherein a feature extending from the intermediate portion of the pin element extends into an opening located in a longitudinally intermediate portion along a length of the sheath to inhibit the pin element from inadvertently being removed from the sheath.

25. The probe of claim 20 wherein a feature extending from the intermediate portion of the pin element is connected to a longitudinally intermediate portion along a length of the sheath to inhibit the pin element from inadvertently being removed from the sheath.

26. The probe of claim 20 wherein a first locking feature on the pin element engages a first locking feature on the sheath, wherein at least one of the first locking features is compliant and allows, or allowed, initial movement of the first contact tip portion closer to a first end of the sheath, to allow retention of the first contact tip portion within a compliant working range relative to an end of the sheath.

27. The probe of claim 20 wherein the pin element further comprises a second contact tip portion functionally connected to the second end of the compliant portion.

28. The probe of claim 27 wherein a second locking feature on the pin element engages a second locking feature on the sheath, wherein at least one of the second locking features is compliant and allows, or allowed, initial movement of the second contact tip portion closer to a second end of the sheath, to allow retention of the second contact tip portion within a compliant working range relative to an end of the sheath.

29. (canceled)

30. The probe of claim 20 wherein the pin element comprises a first material forming at least a portion of the serpentine structure and wherein the first contact tip portion comprises a second material, different from the first material.

31. (canceled)

32. The probe of claim 20 wherein the sheath includes at least one non-tip opening extending from an exterior to an interior of the sheath.

33. The probe of claim 20 wherein the serpentine structure has a length and an orientation that defines a plane and the first contact tip portion has a tapered configuration wherein the taper lies in a plane with a different orientation than the plane of the serpentine structure.

34. The probe of claim 20 wherein the serpentine structure has a length and an orientation of turning elements that define a plane and wherein a stacking direction of the plurality of layers lies parallel to a direction within the plane containing the turning elements of the serpentine structure.

35. The probe of claim 20 wherein the sheath contains at least one structure that is not attached to the pin element and that acts as a stop element that retains the pin element from leaving the sheath from at least one end of the sheath.

36. The probe of claim 20 additionally comprising a dielectric material.

37. The probe of claim 36 wherein the dielectric material is located on an outer surface of the sheath.

38. The probe of claim 20 wherein the serpentine structure comprises smooth changes in orientation along a length of the compliant portion.

39. The probe of claim 20 wherein the serpentine structure comprises angular changes in orientation along a length of the compliant portion.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0051] FIGS. 1A-1C schematically depict side views of various stages of a CC mask plating process, while FIGS. 1D-1G schematically depict a side views of various stages of a CC mask plating process using a different type of CC mask.

[0052] FIGS. 2A-2F schematically depict side views of various stages of an electrochemical fabrication process as applied to the formation of a particular structure where a sacrificial material is selectively deposited while a structural material is blanket deposited.

[0053] FIGS. 3A-3C schematically depict side views of various example subassemblies that may be used in manually implementing the electrochemical fabrication method depicted in FIGS. 2A-2F.

[0054] FIGS. 4A-4I schematically depict the formation of a first layer of a structure using adhered mask plating where the blanket deposition of a second material overlays both the openings between deposition locations of a first material and the first material itself.

[0055] FIG. 5A provides a probe configuration of a first embodiment of the invention.

[0056] FIGS. 5B and 5C depict top views of examples of probes formed from one-dimensional (FIG. 5B) and two-dimensional (FIG. 5C) arrays of compliant elements.

[0057] FIG. 5D provides an example of an alternative structural design for the compliant regions of the pin probe of FIG. 5A.

[0058] FIG. 5E provides an alternative design for the pin probe of FIG. 5A where the pin probe includes non-compliant regions as well as compliant regions.

[0059] FIG. 6A depicts a probe according to an alternative embodiment of the present invention where the contact and compliant portions of probe are located within a sheath.

[0060] FIG. 6B depicts a sectional view of the probe of FIG. 6A.

[0061] FIGS. 7A and 7B provide close up views of an end element of the probe structure of FIGS. 6A and 6B.

[0062] FIG. 8A depicts a partially transparent, perspective view of an end portion of a rectangular serpentine pin probe located within a sheath.

[0063] FIG. 8B depicts a partially transparent side view of the probe of FIG. 8A where the probe is to be built from a plurality of layers and where the compliant serpentine structure of the probe occurs in a direction perpendicular to the planes of layers from which the probe is formed.

[0064] FIG. 8C depicts a partially transparent side view of the probe of FIG. 8A where the probe is to be built from a plurality of layers and where the compliant serpentine structure lies in the planes of layers from which the probe is formed.

[0065] FIGS. 9A-9C depict views similar to those of FIGS. 8A-8C, respectively, for an alternative design of the probe.

[0066] FIG. 10A depicts a perspective view of another alternative design of an end portion of the pin portion of a probe where the compliance of the probe and its asymmetry is increased.

[0067] FIGS. 10B and 10C depict perspective views of other alternative designs of an end portion of the pin portion of a probe where the compliant portions of the pins are symmetric along their lengths.

[0068] FIG. 10D depicts a perspective view of another alternative design of the end portion of the pin portion of a probe where the compliant portion of the pin over its length has a balanced bending moment.

[0069] FIG. 11 depicts a partially transparent, perspective view of an end of a pin probe in a sheath where the pin probe has a compliant structure composed of two serpentine springs which are opposite each other so that the total sideways force is balanced.

[0070] FIG. 12A depicts a partially transparent, perspective view of an end of a pin probe in a sheath where the pin probe has a compliant structure composed of a spiral spring while FIG. 12B depicts the pin itself, without the sheath, rotated by 90° about its axis.

[0071] FIGS. 13A and 13B depict examples of flattened pogo pins (i.e. the sheath does not have equal width along two perpendicular directions that are also perpendicular to the axis of the probe) while FIG. 13C depicts a perspective view of a linear array of the probes similar to those of FIG. 13B with four shown in solid views and with a front probe shown in a transparent line view and FIG. 13D shows a top view of a 2×4, two-dimensional area of probes similar to those of FIG. 13A.

[0072] FIGS. 14A and 14B provide perspective views of a pin probe with a locking mechanism such that the pin may be formed in an unloaded and unlocked state (FIG. 14A) having an extended length and/or a narrow element located in the neck of a sheath and thereafter it may be loaded into the sheath and locked (FIG. 14B). FIG. 14C provides a top end view of a pin element with an alternative compliant lock configuration.

[0073] FIGS. 15A and 15B depict perspective views of another alternative lockable pin probe in an unloaded (FIG. 15A) and in a loaded (FIG. 15B) state.

[0074] FIGS. 16A-16C depict examples of some alternative single contact point probe tips that may be used in various embodiments of the invention.

[0075] FIGS. 17A-17D depict examples of some alternative multi-contact point probe tips that may be used in various embodiments of the invention.

[0076] FIGS. 18A-18D depict examples of some alternative probe tips which are of the self scrubbing type and which are of the single or multi-tip type.

[0077] FIG. 19 depicts a perspective view of a partially assembled array of probe elements assembled between an upper and lower plate.

[0078] FIG. 20 depicts a perspective view of a grouping of pin probe elements 200 which are separated by and held into position by dielectric sheaths.

[0079] FIGS. 21A-21C depict side views of various states of a process of loading groups of conductively bridged probes into retention plates and then removing the bridges.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS OF THE INVENTION

[0080] FIGS. 1A-1G, 2A-2F, and 3A-3C illustrate various features of one form of electrochemical fabrication that are known. Other electrochemical fabrication techniques are set forth in the '630 patent referenced above, in the various previously incorporated publications, in various other patents and patent applications incorporated herein by reference, still others may be derived from combinations of various approaches described in these publications, patents, and applications, or are otherwise known or ascertainable by those of skill in the art from the teachings set forth herein. All of these techniques may be combined with those of the various embodiments of various aspects of the invention to yield enhanced embodiments. Still other embodiments may be derived from combinations of the various embodiments explicitly set forth herein.

[0081] FIGS. 4A-4I illustrate various stages in the formation of a single layer of a multi-layer fabrication process where a second metal is deposited on a first metal as well as in openings in the first metal where its deposition forms part of the layer. In FIG. 4A, a side view of a substrate 82 is shown, onto which patternable photoresist 84 is cast as shown in FIG. 4B. In FIG. 4C, a pattern of resist is shown that results from the curing, exposing, and developing of the resist. The patterning of the photoresist 84 results in openings or apertures 92(a)-92(c) extending from a surface 86 of the photoresist through the thickness of the photoresist to surface 88 of the substrate 82. In FIG. 4D, a metal 94 (e.g. nickel) is shown as having been electroplated into the openings 92(a)-92(c). In FIG. 4E, the photoresist has been removed (i.e. chemically stripped) from the substrate to expose regions of the substrate 82 which are not covered with the first metal 94. In FIG. 4F, a second metal 96 (e.g., silver) is shown as having been blanket electroplated over the entire exposed portions of the substrate 82 (which is conductive) and over the first metal 94 (which is also conductive). FIG. 4G depicts the completed first layer of the structure which has resulted from the planarization of the first and second metals down to a height that exposes the first metal and sets a thickness for the first layer. In FIG. 4H the result of repeating the process steps shown in FIGS. 4B-4G several times to form a multi-layer structure are shown where each layer consists of two materials. For most applications, one of these materials is removed as shown in FIG. 4I to yield a desired 3-D structure 98 (e.g. component or device).

[0082] The various embodiments, alternatives, and techniques disclosed herein may be combined with or be implemented via electrochemical fabrication techniques. Such combinations or implementations may be used to form multi-layer structures using a single patterning technique on all layers or using different patterning techniques on different layers. For example, different types of patterning masks and masking techniques may be used or even techniques that perform direct selective depositions without the need for masking. For example, conformable contact masks may be used during the formation of some layers while non-conformable contact masks may be used in association with the formation of other layers. Proximity masks and masking operations (i.e. operations that use masks that at least partially selectively shield a substrate by their proximity to the substrate even if contact is not made) may be used, and adhered masks and masking operations (masks and operations that use masks that are adhered to a substrate onto which selective deposition or etching is to occur as opposed to only being contacted to it) may be used.

[0083] According to some embodiments of the invention, the above noted methods are used to fabricate pin probes of various design configurations either individually or in arrays. In other embodiments, pin probe devices of various designs may be fabricated individually or as arrays using other techniques and then assembled, as appropriate, into final arrays or on final substrates.

[0084] FIG. 5A provides a probe configuration of an embodiment of the invention where the probe 102 may be termed a “pin”, “pogo”, or “pogo pin” due to it small cross-sectional area and extended length. As indicated in FIG. 5A, the probe 102 may include a first compliant element 104, a second compliant element 114, bridging elements 108, end pieces 110 and 112, and tip 116. The first and second compliant elements are designed to be compressible along the Z-axis. Probes like those exemplified in FIG. 5A may be configured to fit into dual-plate probe package formats (presently used with bent wire, linear beam, or buckled beam probe elements. Such pin probes may be used as replacements for cobra pins. These probes may provide direct linear compression which eliminates primary packing restrictions associated with existing linear beam probes.

[0085] Such probes may be used to form temporary electrical contact between an electronic component like a space transformer and pads of a semiconductor die or device to be tested. Such probes may be used to make permanent or semi-permanent contact between a first electronic component (e.g. a printed circuit board, PCB, or the like) and a second electronic component (e.g. a space transformer or the like). In some embodiments, such probes may form part of an interposer or other electronic component. In some embodiments, contact tips may be located on both ends of the probes while in other embodiments, no special tip configurations or materials may be used.

[0086] The spring constant and over travel capability (i.e. the distance the spring is capable of compressing along the Z-axis and returning to its original uncompressed position) may be designed to customer specifications. In some embodiments, such design variations may include changes in the height or length of the compressible portion of the probe. In some embodiments, such design variations may involve changes to the width or thickness of the elongated elements as a whole or of a selected portion of an element. In some embodiments, such design variations may involve changing the number of oscillations or windings that make up the compressible portion of the pin element or varying the amplitude or period of the oscillations of the compressible portion. In some embodiments, such design variations may involve changing the pattern of the oscillations (e.g. from semi-sinusoidal to sinusoidal, to square or rectangular, symmetric saw tooth, asymmetric saw tooth, and the like). In other embodiments combination of these variations may be used to achieve a desired spring constant (e.g. compliance) and/or over travel.

[0087] Probe elements like those of FIG. 5A may be formed in various orientations. For example, they may be formed from a plurality of stacked layers laying on their sides with layer stacking occurring in the X-direction or Y-direction. If stacking occurs in the Y-direction, the amplitude of oscillations in the compliant elements and the size of stair steps (i.e. resolution) in forming the oscillating elements will dictate the number of layers that must be formed. If stacking occurs in the X-direction, the structure or a plurality of such side by side structures may be formed using as few as two masks and three layers. For example, a first compliant element 104 may be formed on a first layer; the tip 116 and intermediate region between first and second compliant elements, including elements 108 that couple the first and second compliant elements, may be formed on a second layer; and the second compliant element 114 may be formed on a third layer. In a given build area (e.g. four inch circular build area) thousands to tens of thousands of these elements may be formed simultaneously and simply released after formation and then gathered for use. In other embodiments, probes may be formed above one another by adding extra layers to the build.

[0088] In still other embodiments, additional compliant probe elements may be used in forming each probe. These additional elements may be added in a linear fashion or in a two-dimensional array pattern. FIG. 5B depicts a top view of an example of a linearly arrayed probe 122 formed of three compliant elements 124-1, 124-2, and 124-3 connected by bridging elements 126-1 and 126-2. FIG. 5C depicts a top view of an example of a two-dimensionally arrayed probe 132 formed of four compliant elements 134-1, 134-2, 134-3, and 134-4 connected by bridging elements 136-1,136-2, 136-3, and 136-4.

[0089] In still other embodiments, the compliant elements forming a probe may be reduced to a single element and in some such embodiments, the masks (e.g. photo masks and/or contact masks) used in producing the probes may be reduced to a single mask.

[0090] FIG. 5D shows an example of an alternative structural design for the compliant regions of the pin probe of FIG. 5A. In the example of FIG. 5D, the bridging elements 108 of FIG. 5A have been removed and the symmetric compliant elements 104 and 114 of FIG. 5A have been replaced by asymmetric elements 144-1 and 144-2 having different curvatures between successive bends along the length of the compliant elements. In other embodiments, different symmetric or asymmetric patterns may be designed and fabricated. For example, in some embodiments, the starting and ending points of compliant elements 144-1 and 144-2 may be diagonally opposed on end elements 146 and 148.

[0091] FIG. 5E provides a perspective view of an alternative design for the pin probe of FIG. 5A as well as a support structure for the pin probe. The probe 152 shown in FIG. 5C includes non-end regions of solid rod 146-1 and 146-2. The pin is also located in guide plates 148-1 and 148-2 to add stability to the probes. In one approach, the solid sections (e.g. solid rod sections) of the probe 152 may be located in the guide plates, as shown on the upper portion of the figure by 146-1 and 148-1, which reduces risks of wear and provides some enhanced stability. In another approach, the spring or compliant portion of the probe elements may be placed in the guide plates as shown by element 148-2 overlying compliant portion 154 with solid sections located adjacent thereto. This second approach offers enhanced constraining of the probes (i.e. stability) of the probes to a vertical compliance only (i.e. Z-direction compliance) but may raise issues concerning frictional wear and binding between the spring elements and the guide plates.

[0092] FIG. 6A depicts a pin probe according to an alternative embodiment of the present invention. In this embodiment a compliant pin probe 200 has contact elements 202B and 202T which extend from the bottom and top of a sheath 204 which surrounds the compliant probe. The sheath is provided to allow the probe to have maximal deflection in the Z direction while limiting deflection in the X and Y dimensions to a minimal amount. The sheath also provides a shorting path along which a signal may be carried such that parasitics are reduced by removing any inductive effects that may be associated with transmitting signals along a curved structure.

[0093] FIG. 6B depicts a sectional view of the probe where the front of sheath element 204 is removed and the compliant or pin portion of probe 200 may be seen. As can be seen, the compliant structure consists of a plurality of “S” shaped elements 206. As depicted in FIG. 6B, the compliant structure also includes stop elements 208B and 208T which minimize risk of unintended displacements between the compliant structure 202 and sheath 204. Similarly, sheath 204 includes end elements 212B and 212C which allow seating between the sheath and top and bottom plates in a probe package.

[0094] FIGS. 7A and 7B provide close up views of end elements of probe structure 200 wherein a portion of the sheath 204 is removed in the view of FIG. 7B so that pin 202 may be seen.

[0095] In fabricating the probe of FIGS. 6A, 6B, 7A, and 7B the pin itself and the sheath may be formed simultaneously. If the probe is formed by building up layers from deposited structural and sacrificial metals and by stacking layers in the Y-direction, the formation of the probe may be reduced to the forming of five layers: (1) a lower flat side (i.e. back) of the sheath, (2) sidewalls of the sheath and a gap of sacrificial material which will separate the pin itself from the lower flat, (3) sidewalls of the sheath and the pin itself, (4) sidewalls of the sheath and a gap of sacrificial material which will separate the pin itself from the upper flat side (i.e. front) of the sheath that will be formed as part of the next layer, and (5) an upper flat side of the sheath. To aid in releasing sacrificial material trapped between the pin and the inside of the sheath, etching holes may be included in the design of the sheath which may allow an etchant to have enhanced access to the inside of the sheath. These etching holes may be included in the sidewalls of the sheath on any or all of the second to fourth layers but it may be more preferable to locate them on the flat surfaces of the sheath on the first and fifth layers so as to minimize risk of the spring protrusions catching on the openings.

[0096] Of course, in other embodiments more than five layers may be used in forming a sheathed probe. In still other embodiments, instead of, or in addition to, forming probes with end stops 208B, the pin and the sheath may be attached to one another by a bridging element which is located in the central portion of the length of the probe. The location of the bridging element may be centered relative to the sheath or it may be located off center, for example, to allow greater over travel in one direction or the other. In still other embodiments, the pin need not be permanently located in the sheath but may be removable from one or both ends of the sheath by removing one or both end stops 208B or 208T and/or one or both end elements of the sheath 212B or 212T. In still other embodiments, the pins may take on multi-element forms as discussed in association with FIGS. 5A-5E.

[0097] FIGS. 8A-8C depict another example of a sheathed pin probe. In this embodiment, the pin probe is formed from a plurality of rectangular elements. FIG. 8A depicts a partially transparent, perspective view of an end portion of a probe 230 with the pin element 234 located within a sheath 236. The pin element 234 includes a compliant section 242, an end section 244 which in turn includes end stop 246 and tip 248 (as can be seen in FIG. 8B).

[0098] FIG. 8B depicts a partially transparent bottom view of the probe of FIG. 8A where the probe is to be built from a plurality of layers 251-262 and where the compliant structure of the pin has elements that extend up and down in a direction (X-direction) perpendicular to the planes of layers (Y-Z planes) from which the probe is formed. As indicated, the probe may be formed from twelve layers of deposited material. If the fabrication occurs with masks having vertical walls, the sloped side surfaces of the probe tip will actually be formed as a series of stair steps 264. As illustrated, the central four layers of the structure may be formed with a smaller layer thickness than that used for the first four layers and the last four layers so that a closer approximation 264 of the sloped tip may be obtained. In other embodiments, a larger layer thickness may be used along with discontinuity reduction operations to smooth the stair steps. Such operations are set forth in U.S. patent application Ser. No. 10/830,262, filed Apr. 21, 2004, by Lockard, and entitled “Methods of Reducing Interlayer Discontinuities in Electrochemically Fabricated Three-Dimensional Structures” which is incorporated herein by this reference as if set forth in full. In still other embodiments, thinner layers may be used to obtain an even more precise rendering of the sloped features. In still other embodiments, different numbers of layers, different thicknesses of layers, different probe tip configurations, and different compliant element configurations may be used in forming a desired structure. FIG. 8C depicts a partially transparent side view of the probe along the X-axis.

[0099] In other embodiments, the probe of FIGS. 8A-8C may be fabricated from layers that stack along the Y-direction instead of the X-direction. If the layers are stacked along the Y-direction, the structure may be formed using fewer layers and the tip may be formed with side walls having any desired slope. If formed with layers stacked in the X-direction as shown in FIG. 8B, a larger number of layers are needed. When the fabrication process chosen has a minimum feature size in the plane of building, e.g. due to mask formation limitations (e.g. exposure, development, or the like), it may be possible to build narrower probes by stacking layers in the direction of compliant element oscillation than would be possible by having the compliant element oscillation lay in the plane of the layers. Worded in another way, as (1) the dimension of oscillation of a compliant element may inherently be larger than in the direction which is perpendicular to both it and the axis of the pin and (2) as a minimum dimension of one of the axis of the stacking of layers or of a minimum in-layer feature size will be larger, it may be possible to reduce the overall size (width and thickness) of a probe by building the probe with a compliant member oscillation perpendicular to the larger or the minimum layer thickness or minimum in-layer feature thickness.

[0100] FIGS. 9A-9C depict views similar to those of FIGS. 8A-8C, respectively, for an alternative design of the probe. The probe 272 of FIGS. 9A-9C is similar to that of FIGS. 8A-8C with the following exceptions: (1) the orientation of tapered part 276 of the tip is parallel to the direction (y-direction) of the oscillating of the compliant portion 278 of the pin, (2) the end piece extends to the turn of the first compliant element, and (3) the elements 274-1 of the compliant structure that run in the Z-direction, i.e. direction of the length of the probe, i.e. axis of the pin, are thinner or narrower than the elements 274-2 that extend perpendicular to the axis of the pin.

[0101] The probe of FIGS. 9A-9C may be built in any desired orientation (e.g. with the X-direction or Y-direction being the axis of layer stacking). If built using the Y-direction as the stacking direction for layers, the structure may be formed using eleven layers or more while if built with the X-direction as the stacking direction for layers, four layers are needed to form the structure along with one or more intermediate layers for forming the pin and the tip (more than one layer may be needed to form a tip of desired slope). If it is assumed that the minimum feature size is 20 microns, the minimum layer thickness is 2 microns, and that the layers are stacked along the Y-axis, as can be seen in FIG. 9A, the structure can have a width as small as 100 microns in the X-direction and as small as 22 microns in the Y-direction though more width in the X-direction may be desired to allow larger clearances and thicknesses of structural elements and the like. Alternatively, if the structure were formed with the X-direction as the stacking direction the minimum width of the probe would be 220 microns and it is likely that the compliance (e.g. inverse of the spring constant) of the structure would be too small). As such it is believed that a less rectangular probe configurations may be obtained by choosing the building axis (i.e. layer stacking direction) and compliant element oscillation direction (i.e. the part that is perpendicular to the axis of the probe) to be parallel. Furthermore, if the minimum layer thickness is less than the minimum feature thickness it is believed that more compliant probes may be formed by having the compliant element oscillation occur in a direction that is parallel to the layer stacking direction (i.e. the normal to the planes of the layers).

[0102] FIG. 10A depicts another alternative design of the pin portion 282 of a probe where the compliance of the probe and its asymmetry is increased. The compliance of the probe is increased by weakening the longitudinal components 284 of the compliant elements (i.e. portions of the compliant region of the pin that extend parallel to the axis of the pin) by making them not only thin, T, but by also effectively narrowing their width to be less than a minimum feature size by using offset elements 286 which have only small overlaps with non-offset portions 288. These offset elements may tend to make the pin not only more compliant along its length but may also make the pin twist. The asymmetry of this design may cause the pin to rub against the side walls and to get stuck. In an alternative embodiment, pairs of offset elements (not shown) may be made to exist with one on each side of non-offset portions 284. Such pairs would still allow increased compliance (at a cost of widening the structure) while removing the asymmetric that could lead to twisting.

[0103] FIGS. 10B and 10C depict perspective views of other alternative designs of an end portion of the pin portion 292′ and 292″ of a probe where the compliant portions of the pins are symmetric along their lengths.

[0104] FIG. 10D depicts a perspective view of another alternative design of the of an end portion of the pin portion 292′″ of a probe where the compliant portion of the pin over its length has a balanced bending moment.

[0105] FIG. 11 depicts a partially transparent, perspective view of an end of a pin probe including a sheath where the pin probe has a compliant structure composed of two serpentine springs which are opposite each other so that the total sideways force is balanced. The probe 302 includes a pin element 304, which includes two compliant elements 314-1 and 314-2 that in extend in parallel with each other and with each of these compliant elements including a plurality of C-shaped or S-shaped compliant elements connected in series with one another. The two elements 314-1 and 314-2 are connected to each other at end stops 316 (the right end stop is shown but not the left). The end stops in turn connect to pin ends 318 (only the right is shown). The tips of end pins 318 may have a desired contact shape which may or may not be different from their cross-sectional shape, they may have contacts elements mounted on them, and/or they may be coated with a special contact material.

[0106] In various alternative embodiments, additional compliant elements may added in parallel, multiple tips may exist that the end of each pin end, periodic bridging elements may connect the compliant elements that are located in parallel, the pins may be insertable and/or removable from the sheaths from one or both ends, a central position of the pin may be attached to the sheath, widths and thicknesses of individual compliant elements that are located in series may be varied to achieved different compliances and/or over travel limits, amplitudes and lengths of individual C-shape or S-shape elements may be varied, and the like.

[0107] In some embodiments, probes may be formed from a plurality of adhered layers via an electrochemical process. In some embodiments, probes may be formed with the individual C-shaped or S-shaped compliant elements oriented so that their amplitudes extend (oscillate) perpendicular to the planes of the layers or so that they are parallel to the planes of the layers.

[0108] Pogo pins with very small cross sections may be stiffer than desired. This may lead to a desire to increase the pin length which in turn can introduce problems such as buckling. Longer springs can be made without increasing the overall length of the probe by increasing the length of the individual compliant elements whose repetition (e.g. C shape or S shaped repeating portions) forms a spring. For example, for a given height of a spring, a spiral of given radius may be longer than an S-shaped element having an amplitude similar to the radius. Such designs can lead to more compliant structures at the cost of increased width. FIG. 12A depicts a partially transparent, perspective view of an end of a pin probe 322 including a compliant pin 344 and a sheath 346 where the pin is in the form of a spiral spring. FIG. 12B depicts the spiral pin 344 without the sheath. In FIG. 12B the pin is rotated by 90° about its axis relative to that of FIG. 12A.

[0109] As with the other probe designs set forth herein, in some alternative embodiments the spiral spring probes may be formed from a plurality of adhered layers via an electrochemical fabrication process. As with other probe designs set forth herein, in some alternative embodiments, the probe may be fabricated with the pin in the shield or alternatively the pin and shield may be fabricated separately and then assembled. As with other probe designs set forth herein, in some alternative embodiments, the sheath may be fabricated as two or more separate pieces which are assembled after insertion of a pin. In some alternative embodiments, the spirals may have square or rectangular configurations while in other embodiments they may have oval or circular configurations, in some embodiments the probes may be formed from a plurality of spiraling elements connected serially by central rods, while in still other embodiments the pins may be in the form of double or higher order spirals.

[0110] FIGS. 13A and 13B depict perspective sectional views, examples of flattened or rectangular probes 352 and 362 respectively. As with spiral probes, these probes have long length pins but instead of having an ability to form arrays of equal spacing in, for example, the X-direction and Y-direction (assuming the length of the probe extends in the Z-direction), these probes may form tight arrays in, for example, the Y-direction but require larger spacing (i.e. offsets from probe tip to probe tip in the X-direction. To help ensure proper placement of probes in array guides, and the like, the probes may include alignment features such as features 358TR, 358TL, 358BR, and 358BL of probe 352 where the T designation indicates top, the B designation indicates bottom, and the L and R designations indicate left and right respectively.

[0111] In the actual probes of this embodiment, the sheaths extend over the exposed spring elements but in alternative embodiments, part of one or both of the front and back of the sheaths may be removed (the remaining portions may be considered front and/or back retention elements). For example, in some embodiments, the front or back of the sheath may consist of one or more relatively narrow beam like retention elements that extend in the Z-direction. In fact, in some embodiments, tighter arrays may be achieved by locating retention elements of adjacent sheaths in different positions so that some overlapping of probe foot prints can occur without the probes touching one another.

[0112] The probe 352 of FIG. 13A has both the top and bottom ends 354T and 354B, respectively, of pin 354 extending from the left most side of the sheath while the probe of FIG. 13B has both its top and bottom ends 364T and 364B, respectively, of pin 364 extending from the center of the sheath. In other alternative embodiments, pin tips may extend from different parts of the tops and bottoms of the sheaths. For example, in some embodiments, the top or bottom pin end may extend from the right side of the sheath while the other of the top or bottom pin end may extend from the center of the sheath or from the left side of the sheath.

[0113] FIG. 13C depicts an example linear array of probe elements. Of course, other one-dimensional and two-dimensional arrays are possible particularly when different top and bottom sheath exit locations are used. For example, two closely spaced lines of probes are possible by using left or right exit locations for pin ends. An example of such an arrangement is shown in FIG. 13D which provides a bottom view of a four-by-two array of rectangular probes 372A-372D and 382A-382D, with tips 384A-384D forming the left line 388 of the array, and tips 374A-374D forming the right line 374 of the array. The probes having openings 376A-376D and 386A-386D in their respective sheaths, from which pins 374A-374D and 384A-384D protrude forming lines 378 and 388 with a spacing of 390.

[0114] After fabricating a pogo pin, with the pin located in the sheath, there may be extra movement or “slack” between the end stops of the pins and the sheath or outer sleeve. This slack may result in negative performance issues during use. Also, the spring may plastically deform under the first few cycles, therefore making the “slack” even larger. In such cases, it may be advantageous to have a probe design that allows post formation compressive working of the spring prior to setting the pin's position relative to the sheath. Such probes may include a compliant pin with at least one end tip which may be formed outside the sheath by a greater distance than will exist when the probe is ready for use. The pin may be worked (e.g. compressed) so that it slides into a desired position within the sheath and becomes locked in the sheath with a maximal extension defined by the locking position but with a continued ability to be compliantly compressed.

[0115] FIGS. 14A and 14B provide perspective sectional views of an example pin probe 402 that includes a compliant pin 404 and a sheath 406. The pin has a tip 408 with a deflectable locking mechanism 414 that can be pushed through an opening 416 in the end of the sheath 406. As indicated in FIG. 14A, the pin may be formed in an unloaded and unlocked state (i.e. with the right tip and locking mechanism located to the right outside the sheath) with a potentially thinner neck portion 410 of the probe located within the opening 416 (e.g. to ensure that minimum feature size limitations are not violated). After formation (e.g. from a plurality of adhered layers built up on a layer-by-layer basis via electrochemical fabrication operations and after removal of any sacrificial material), the compliant pin may be compressed to slide the tip and locking mechanism through the opening 416 as indicated by arrow 412 to lock the pin into the sheath as indicated in FIG. 14B.

[0116] Various alternative embodiments are possible. For example, (1) different compliant structures may be used, (2) protruding tips may extend from one or both ends of the sheath, (3) during formation, one or both ends of the pin may be unloaded, (4) locking mechanisms may take on the same configuration on each end of a probe or may take alternative configurations on opposite ends. Different locking mechanisms may be used. For example, locking mechanisms may have back curving features as indicated in FIG. 14C which may reduce any tendency for the locking mechanism to bind or hang up against a sidewall of the sheath. In some embodiments, it may be advantageous to have the locking mechanism on both ends so that the pin is symmetrical. In such embodiments, pins may be compressed into arrays and then locked into their sheaths. This may occur, for example, by pressing one side into locking position and then pressing the other side into locking position.

[0117] FIGS. 15A and 15B depict perspective views of an alternative lockable pin probe in an unloaded (FIG. 15A) and in a loaded (FIG. 15B) state. A characteristic of this alternative embodiment is that the compliant portion of the locking or latching mechanism is attached to the sheath instead of the pin.

[0118] With a multi layer electrochemical fabrication process like that disclosed herein, it is possible to make many different types of pins, sheaths, and tips. These tips may be made from the same material as the rest of a pin or they may be made from different materials. These tips may have a single contact point or multiple contact points. Multiple contact points may be beneficial in some embodiments as they may result in better contact between the pin and the surface that is being probed. Some multi point tips will also be formed to only probe on outside edges of a target such as a solder bump.

[0119] Each layer of a probe tip may have one or more contact points. FIGS. 16A-16C depict examples of some alternative single contact point probe tips that may be used in various embodiments of the invention. These tips can be shaped in many ways. The tip can be symmetrical along a bisecting plane, or it can have different slopes on the two sides. Tips may be formed with smooth slopes as indicated or they may be approximated by stair steps associated with a layer by layer formation process.

[0120] FIGS. 17A-17D depict examples of some alternative multi-contact point probe tips that may be used in various embodiments of the invention. Each tip shape on each layer can have a single tip or a plurality of tips that are symmetric with respect to a bisecting plane or can be different. The tips can also be sharp or not sharp depending on the application. Each tip may be formed from one layer or several layers. If the tip is made from several layers, each layer can have a different shape.

[0121] FIGS. 18A-18D depict examples of further alternative probe tips that may be used in various embodiments of the invention. These probe tips are of a self scrubbing type (e.g. as vertical compression of the tip into a target occurs, a horizontal force is developed which can lead to a horizontal displacement of the tip relative to the target resulting in a scrapping or scrubbing action which can help penetrate oxides or other contaminates on the surface of a target or on the tip itself) and they each include one or more contact tips. For example, the tip of FIG. 18A has two tips that scrub in opposite directions as the tip is pressed to a target surface while the tip of FIG. 18C has three tips that scrub in two different directions. The tip of FIG. 18B is a simpler version with a single contact point but which will still tend to have a horizontal deflection as vertical contact is made between the probe and a target surface. The tip of FIG. 18D is also a single tip that will tend to develop a horizontal force as vertical driving of the probe relative to the target occurs.

[0122] Various alternative tip embodiments are possible. Some alternative embodiments may include a larger number of contact tips per probe and may include different mechanisms for providing horizontal force or movement. In some embodiments, the tips themselves may not provide a horizontal scrubbing force but instead an entire probe array may undergo a horizontal displacement.

[0123] FIG. 19 depicts a plurality of probe elements 200 which have been assembled between plates 222B and 222T which form part of a probe package. FIG. 19 also depicts a probe element 200 which has not yet been inserted into its intended position between plates 222B and 222T.

[0124] In some embodiments, it may be possible that the spacing between individual pin probe assemblies 200 when placed in their desired positions between plates 222B and 222T may result in shorting between adjacent pin probes or at least result in an unacceptable risk of shorting between pin probe elements. In such embodiments, it may be desirable to form or locate dielectric elements around individual pin probe sheaths. These dielectric elements may be formed during a layer-by-layer buildup of an electrochemical fabrication process that is used to form the pin probes or alternatively they may be added after layer formation is completed. Dielectric separators may be formed individually around pin probes 200 or may alternatively be used to locate and space apart groups of pin probes.

[0125] Dielectric spacing elements may extend over only a portion of the length of sheath elements, such as for example, around central portions of the sheath elements where deflection of sheath elements may be greatest as a result of stress induced by the compliant portions of the pin probes when compressed or by non-uniformities or excess forces involved in plates 222B and 222T holding the probe elements in place.

[0126] FIG. 20 depicts a grouping of pin probe elements 200 which are separated by and held into position by dielectric sheaths 232A and 232B.

[0127] In some situations, it may be advantageous to form pin probes in linear or two-dimensional arrays of desired spacing so as to make transfer of probes from a build environment to a use environment simpler and more straight forward. For example, it may be much simpler to load ten groups of one hundred probes each into a guide plate than to load one thousand probes individually into such a plate.

[0128] FIGS. 21A-21C depict side views of various states of a process for loading groups into a guide. In this embodiment, the probes are joined to one another by conductive bridges which must be removed prior to use. Instead of assembling pin probes one by one, large groups of pins are fabricated at once according to this embodiment, assembled, and then detached using a laser or any other method that cuts material. In this embodiment, pin probes (including pins and sheaths) are fabricated lying down with small bridges connecting the probes together. The groups of pins can be in 1D rows or in 2D arrays. The lines/arrays of pins are assembled in guide plates and are later detached with a laser or any other cutting method.

[0129] FIG. 21A depicts the state of the process after probes 502A-502E have been fabricated with attached bridges 504 that space the probes at a desired pitch and after top and bottom guide plates 512 and 514 have been positioned in proximity to the probe ends. The guide plates have an array of holes of similar pitch to that of the probes and having a second array of holes that allow access to bridge elements once the probes have been located relative to the plates. The secondary array of holes allows a laser beam to strike and break the bridging elements. FIG. 21B depicts the state of the process after pin probes and the guide plates have been assembled together. FIG. 21C depicts the state of the process after a laser beam has been used to break the bridges.

[0130] In alternative embodiments, the bridging elements may be formed from a dielectric material and thus may remain in place after assembly of the guide plates and the probes, thereby eliminating the need for the second array of holes and the need for a laser ablation operation. In still other embodiments, the bridge elements may be made from a high resistance material or materials and a high current may be passed between probe sheaths to cause heating and destruction of the bridging elements.

[0131] The various embodiments discussed hereinafter concerning incorporation of dielectric materials into electrochemical fabrication processes may be used to locate the dielectric materials in desired locations. Alternatively, back filling of dielectric material into partially released or fully released probe arrays (which are held in appropriate positions) may be used.

[0132] In still other alternative embodiments, it may be possible to locate dielectric material onto the probe elements or at least selected portions of probe elements by a sputtering process or other PVD or CVD process.

[0133] In still other alternative embodiments the compliant portions of the probe structures may take on other configurations than those set forth in the above described embodiments. For example, the structures need not be substantially planar structures as shown. They may be formed from multiple layers of structural material. The multiple layers of material may have similar patterning and may be formed simply to increase the spring constant of the compliant structure or they may have different patterns which may tend to increase spring constant, or not, and which may tend to balance compressional forces to minimize unintended X and Y direction deflections during compression.

[0134] In still other embodiments, the entire length of the probe structure within the sheath need not be of a compliant design but instead may have portions which are non-compliant similar to the non-compliant portions discussed in association with FIG. 5C. In some embodiments, one or both stop elements 208B and 208T may be removed. In some embodiments, a structure may firmly attach the compliant portion of the probe element to the sheath (e.g. a central portion of the compliant element).

[0135] In still other embodiments, the sheath may include one or more slots or other openings in it (for example, on the front or back surfaces) which may enhance the ability to remove a sacrificial material from the region between an enclosed compliant element and the sheath. In some embodiments, a structure may be affixed to the compliant element (e.g. in a central portion) which fits into one or more slots in the sheath and allows the compliant element to move vertically in the sheath a predefined amount.

[0136] In still other embodiments, depending on the desired compressibility of the compliant element and the spacing between adjacent repeating features of the compliant structure, it may be possible to mount stop elements on the inside walls of the sheath which allow some vertical movement of the compliant member while still retaining it within a desired position.

[0137] In still other embodiments, pin probe structures may provide a compliant tip at only one end of a sheath while electrical contact to a non-compliant end may be made by solder bonding, wire bonding, diffusion bonding, ultrasonic welding, brazing, or the like. Alternatively bonding to the noncompliant end may simply occur as a result of pressure from mating the compliant end to a contact location.

[0138] Still other embodiments may be created by combining the various embodiments and their alternatives which have been set forth herein with other embodiments and their alternatives which have been set forth herein.

[0139] Some embodiments may employ diffusion bonding or the like to enhance adhesion between successive layers of material. Various teachings concerning the use of diffusion bonding in electrochemical fabrication processes are set forth in U.S. patent application Ser. No. 10/841,384 which was filed May 7, 2004 by Cohen et al. which is entitled “Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion” and which is hereby incorporated herein by reference as if set forth in full.

[0140] Further teachings about microprobes and electrochemical fabrication techniques are set forth in a number of US patent applications: (1) U.S. Patent Application No. 60/533,975 by Kim et al., which was filed on Dec. 31, 2003, and which is entitled “Microprobe Tips and Methods for Making”; (2) U.S. Patent Application No. 60/533,947 by Kumar et al., which was filed on Dec. 31, 2003, and which is entitled “Probe Arrays and Method for Making”; (3) U.S. Patent Application No. 60/574,737 by Cohen et al., which was filed May 26, 2004, and which is entitled “Electrochemical Fabrication Method for Fabricating Space Transformers or Co-Fabricating Probes and Space Transformers”; (4) U.S. Patent Application No. 60/533,897 by Cohen et al. which was filed on Dec. 31, 2003, and which is entitled “Electrochemical Fabrication Process for Forming Multilayer Multimaterial Microprobe structures”; (5) U.S. Patent Application No. 60/540,511 by Kruglick et al, which was filed on Jan. 29, 2004, and which is entitled “Electrochemically Fabricated Microprobes”, (6) U.S. patent application Ser. No. 10/772,943, by Arat et al., which was filed Feb. 4, 2004, and which is entitled “Electrochemically Fabricated Microprobes”; (7) U.S. Patent Application No. 60/582,690, filed Jun. 23, 2004, by Kruglick, and which is entitled “Cantilever Microprobes with Base Structures Configured for Mechanical Interlocking to a Substrate”; and (8) U.S. Patent Application No. 60/582,689, filed Jun. 23, 2004 by Kruglick, and which is entitled “Cantilever Microprobes with Improved Base Structures and Methods for Making the Same”. These patent filings are each hereby incorporated herein by reference as if set forth in full herein.

[0141] The techniques disclosed explicitly herein may benefit by combining them with the techniques disclosed in U.S. patent application Ser. No. 11/028,960 filed Jan. 3, 2005 by Chen et al. and entitled “Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes” (Corresponding to Microfabrica Docket No. P-US140-A-MF); U.S. Patent Application No. 60/641,341 filed Jan. 3, 2005 by Chen et al. and entitled “Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes” Ser. No. 11/029,217 filed Jan. 3, 2005 by Kim et al. and entitled “Microprobe Tips and Methods For Making” (Corresponding to Microfabrica Docket No. P-US122-A-MF); U.S. patent application Ser. No. 11/028,958 filed Jan. 3, 2005 by Kumar et al. and entitled “Probe Arrays and Methods for Making” (corresponding to Microfabrica Docket No. P-US123-A-MF); and U.S. patent application Ser. No. 11/029,221 filed Jan. 3, 2005 by Cohen et al. and entitled “Electrochemical Fabrication Process for Forming Multilayer Multimaterial Microprobe Structures” (corresponding to Microfabrica Docket No. P-US138-A-MF).

[0142] Further teachings about planarizing layers and setting layers thicknesses and the like are set forth in the following US patent applications which were filed Dec. 31, 2003: (1) U.S. Patent Application No. 60/534,159 by Cohen et al. and which is entitled “Electrochemical Fabrication Methods for Producing Multilayer Structures Including the use of Diamond Machining in the Planarization of Deposits of Material” and (2) U.S. Patent Application No. 60/534,183 by Cohen et al. and which is entitled “Method and Apparatus for Maintaining Parallelism of Layers and/or Achieving Desired Thicknesses of Layers During the Electrochemical Fabrication of Structures”. These patent filings are each hereby incorporated herein by reference as if set forth in full herein.

[0143] The techniques disclosed explicitly herein may benefit by combining them with the techniques disclosed in U.S. patent application Ser. No. 11/029,220 filed Jan. 3, 2005 by Frodis et al. and entitled “Method and Apparatus for Maintaining Parallelism of Layers and/or Achieving Desired Thicknesses of Layers During the Electrochemical Fabrication of Structures” (corresponding to Microfabrica Docket No. P-US132-A-MF).

[0144] Additional teachings concerning the formation of structures on dielectric substrates and/or the formation of structures that incorporate dielectric materials into the formation process and possibility into the final structures as formed are set forth in a number of patent applications: (1) U.S. Patent Application No. 60/534,184, by Cohen, which was filed on Dec. 31, 2003, and which is entitled “Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates”; (2) U.S. Patent Application No. 60/533,932, by Cohen, which was filed on Dec. 31, 2003, and which is entitled “Electrochemical Fabrication Methods Using Dielectric Substrates”; (3) U.S. Patent Application No. 60/534,157, by Lockard et al., which was filed on Dec. 31, 2004, and which is entitled “Electrochemical Fabrication Methods Incorporating Dielectric Materials”; (4) U.S. Patent Application No. 60/574,733, by Lockard et al., which was filed on May 26, 2004, and which is entitled “Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed Layers that are Partially Removed Via Planarization”; and U.S. Patent Application No. 60/533,895, by Lembrikov et al., which was filed on Dec. 31, 2003, and which is entitled “Electrochemical Fabrication Method for Producing Multi-layer Three-Dimensional Structures on a Porous Dielectric”. These patent filings are each hereby incorporated herein by reference as if set forth in full herein.

[0145] The techniques disclosed explicitly herein may benefit by combining them with the techniques disclosed in U.S. patent application Ser. No. 11/029,216 filed Jan. 3, 2005 by Cohen et al. and entitled “Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates” (corresponding to Microfabrica Docket No. P-US128-A-MF) and U.S. Patent Application No. 60/641,292 filed Jan. 3, 2005 herewith by Dennis R. Smalley and entitled “Method of Forming Electrically Isolated Structures Using Thin Dielectric Coatings” (corresponding to Microfabrica Docket No. P-US121-A-MF).

[0146] The patent applications and patents set forth below are hereby incorporated by reference herein as if set forth in full. The teachings in these incorporated applications can be combined with the teachings of the instant application in many ways: For example, enhanced methods of producing structures may be derived from some combinations of teachings, enhanced structures may be obtainable, enhanced apparatus may be derived, and the like.

TABLE-US-00002 U.S. Pat. Application No., Filing Date U.S. Application Pub No., Pub Date U.S. Pat. No., Pub Date First Named Inventor, Title 09/493,496-Jan. 28, 2000 Cohen, “Method For Electrochemical Fabrication” — 6,790,377-Sep. 14, 2004 10/677,556-Oct. 1, 2003 Cohen, “Monolithic Structures Including Alignment 2004-0134772-Jul. 15, 2004 and/or Retention Fixtures for Accepting Components” — 10/830,262-Apr. 21,2004 Cohen, “Methods of Reducing Interlayer 2004-0251142-Dec. 16, 2004 Discontinuities in Electrochemically Fabricated Three- 7,198,704-Apr. 3, 2007 Dimensional Structures” 10/271,574 -Oct. 15, 2002 Cohen, “Methods of and Apparatus for Making High 2003-0127336-Jul. 10, 2003 Aspect Ratio Microelectromechanical Structures” 7,288,178-Oct. 30, 2007 10/697,597-Dec. 20, 2002 Lockard, “EFAB Methods and Apparatus Including 2004-0146650-Jul. 29, 2004 Spray Metal or Powder Coating Processes” — 10/677,498-Oct. 1, 2003 Cohen, “Multi-cell Masks and Methods and Apparatus 2004-0134788-Jul. 15, 2004 for Using Such Masks To Form Three-Dimensional 7,235,166-Jun. 26, 2007 Structures” 10/724,513-Nov. 26, 2003 Cohen, “Non-Conformable Masks and Methods and 2004-0147124-Jul. 29, 2004 Apparatus for Forming Three-Dimensional Structures” 7,368,044-May 6, 2008 10/607,931-Jun. 27, 2003 Brown, “Miniature RF and Microwave Components and 2004-0140862-Jul. 22, 2004 Methods for Fabricating Such Components” 7,239,219 -Jul. 3, 2007 10/841,100-May 7, 2004 Cohen, “Electrochemical Fabrication Methods 2005-0032362-Feb. 10, 2005 Including Use of Surface Treatments to Reduce 7,109,118-Sep. 19, 2006 Overplating and/or Planarization During Formation of Multi-layer Three-Dimensional Structures” 10/387,958-Mar. 13, 2003 Cohen, “Electrochemical Fabrication Method and 2003-022168-Dec. 4, 2003 Application for Producing Three-Dimensional — Structures Having Improved Surface Finish “ 10/434,494-May 7, 2003 Zhang, “Methods and Apparatus for Monitoring 2004-0000489-Jan. 1,2004 Deposition Quality During Conformable Contact Mask — Plating Operations” 10/434,289-May 7, 2003 Zhang, “Conformable Contact Masking Methods and 20040065555-Apr. 8, 2004 Apparatus Utilizing In Situ Cathodic Activation of a — Substrate” 10/434,294-May 7, 2003 Zhang, “Electrochemical Fabrication Methods With 2004-0065550-Apr. 8, 2004 Enhanced Post Deposition Processing” — 10/434,295-May 7, 2003 Cohen, “Method of and Apparatus for Forming Three- 2004-0004001-Jan. 8, 2004 Dimensional Structures Integral With Semiconductor — Based Circuitry” 10/434,315-May 7, 2003 Bang, “Methods of and Apparatus for Molding 2003-0234179-Dec. 25, 2003 Structures Using Sacrificial Metal Patterns” 7,229,542-Jun. 12, 2007 10/434,103-May 7, 2004 Cohen, “Electrochemically Fabricated Hermetically 2004-0020782-Feb. 5, 2004 Sealed Microstructures and Methods of and Apparatus 7,160,429-Jan. 9, 2007 for Producing Such Structures” 10/841,006-May 7, 2004 Thompson, “Electrochemically Fabricated Structures 2005-0067292-May 31, 2005 Having Dielectric or Active Bases and Methods of and — Apparatus for Producing Such Structures” 10/434,519-May 7, 2003 Smalley, “Methods of and Apparatus for 2004-0007470-Jan. 15, 2004 Electrochemically Fabricating Structures Via Interlaced 7,252,861-Aug. 7, 2007 Layers or Via Selective Etching and Filling of Voids” 10/724,515- Nov. 26, 2003 Cohen, “Method for Electrochemically Forming 2004-0182716-Sep. 23, 2004 Structures Including Non-Parallel Mating of Contact 7,291,254- Nov. 6, 2007 Masks and Substrates” 10/841,347-May 7, 2004 Cohen, “Multi-step Release Method for 2005-0072681-Apr. 7, 2005 Electrochemically Fabricated Structures” — 10/841,300-May 7, 2004 Cohen, “Methods for Electrochemically Fabricating 2005 0032375-Feb. 10, 2005 Structures Using Adhered Masks, Incorporating — Dielectric Sheets, and/or Seed layers That Are Partially Removed Via Planarization” 60/603,030-Aug. 19, 2004 Cohen, “Integrated Circuit Packaging Using — Electrochemically Fabricated Structures” — 60/641,341-Jan. 3, 2005 Chen, “Electrochemically Fabricated Microprobes” — —

[0147] Various other embodiments of the present invention exist. Some of these embodiments may be based on a combination of the teachings herein with various teachings incorporated herein by reference. Some embodiments may not use any blanket deposition process and/or they may not use a planarization process. Some embodiments may use selective deposition processes or blanket deposition processes on some layers that are not electrodeposition processes. Some embodiments, for example, may use nickel, nickel-phosphorous, nickel-cobalt, gold, copper, tin, silver, zinc, solder, rhodium, rhenium as structural materials while other embodiments may use different materials. Some embodiments, for example, may use copper, tin, zinc, solder or other materials as sacrificial materials. Some embodiments may use different structural materials on different layers or on different portions of single layers. Some embodiments may remove a sacrificial material while other embodiments may not. Some embodiments may use photoresist, polyimide, glass, ceramics, other polymers, and the like as dielectric structural materials.

[0148] It will be understood by those of skill in the art that additional operations may be used in variations of the above presented embodiments. These additional operations may, for example, perform cleaning functions (e.g. between the primary operations discussed above), they may perform activation functions and monitoring functions.

[0149] It will also be understood that the probe elements of some aspects of the invention may be formed with processes which are very different from the processes set forth herein and it is not intended that structural aspects of the invention need to be formed by only those processes taught herein or by processes made obvious by those taught herein.

[0150] Many other alternative embodiments will be apparent to those of skill in the art upon reviewing the teachings herein. Further embodiments may be formed from a combination of the various teachings explicitly set forth in the body of this application. Even further embodiments may be formed by combining the teachings set forth explicitly herein with teachings set forth in the various applications and patents referenced herein, each of which is incorporated herein by reference.

[0151] In view of the teachings herein, many further embodiments, alternatives in design and uses of the instant invention will be apparent to those of skill in the art. As such, it is not intended that the invention be limited to the particular illustrative embodiments, alternatives, and uses described above but instead that it be solely limited by the claims presented hereafter.