Method For Recycling Waste Electrical And Electronic Equipment
20170362682 · 2017-12-21
Inventors
- Nour-Eddine Menad (Orleans, FR)
- Sylvain Guignot (Orleans, FR)
- Iskender Gokalp (Orleans, FR)
- Stéphane Bostyn (Lailly-en-Val, FR)
- Yann Graz (Orleans, FR)
- Jacques Poirier (Saint Privé-saint Mesmin, FR)
Cpc classification
Y02P70/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H05K2203/1105
ELECTRICITY
B09B5/00
PERFORMING OPERATIONS; TRANSPORTING
B09B3/00
PERFORMING OPERATIONS; TRANSPORTING
B09B3/40
PERFORMING OPERATIONS; TRANSPORTING
H05K2203/104
ELECTRICITY
H05K2203/178
ELECTRICITY
A62D3/20
HUMAN NECESSITIES
Y02W30/82
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
Abstract
The method for separation of metals from electronic cards includes a step of processing the electronic cards in an aqueous medium under supercritical conditions. The method also a later step of crushing solid materials coming from the treatment under supercritical conditions.
Claims
1. A process for separating metals from electronic boards, characterized in that it comprises: a) a step of treating electronic boards in an aqueous medium under supercritical conditions of said medium and b) a subsequent step of crushing the materials in the solid state that are derived from the step of treating under supercritical conditions.
2. The separation process as claimed in claim 1, wherein, in step a), the electronic boards are not fragmented.
3. The separation process as claimed in claim 1, wherein the electronic boards are subjected to a fragmentation step prior to the treatment under supercritical conditions and are reduced to fragments having a size greater than or equal to 1 cm and less than or equal to 5 cm.
4. The separation process as claimed in claim 1, wherein said medium contains oxygen or one or more oxygen-generating species.
5. The separation process as claimed in claim 1, wherein the temperature and pressure conditions applied to the medium range from 374° C. to 600° C. and from 22.1 MPa to 30 MPa.
6. The separation process as claimed in claim 1, wherein said supercritical conditions of the aqueous medium are maintained for a duration greater than or equal to 30 minutes.
7. The separation process as claimed in claim 1, wherein, for the step of treating under supercritical conditions, the temperature is above 500° C.
8. The separation process as claimed in claim 1, wherein the crushed materials are treated so as to separate the fragments having a size of less than 2 mm.
9. The separation process as claimed in claim 1, wherein step a) is carried out in an autoclave and the supercritical conditions are achieved by increasing the temperature.
10. The separation process as claimed in claim 1, wherein the crushed materials are subjected to a low-intensity magnetic separation.
11. (canceled)
12. The separation process as claimed in claim 4, wherein said medium contains hydrogen peroxide.
13. The separation process as claimed in claim 6, wherein said supercritical conditions of the aqueous medium are maintained for a duration ranging from 60 minutes to 180 minutes.
14. The separation process as claimed in claim 7, wherein, for the step of treating under supercritical conditions, the temperature is about 600 ° C.
15. The separation process as claimed in claim 10, wherein the crushed materials are subjected to a low-intensity magnetic separation under a magnetic field of 400 gauss.
16. An electronic board prepared by the process of claim 1.
17. A process for separating metals from electronic boards, characterized in that it comprises: a) fragmenting an electronic board into fragments having a size less than or equal to 5 cm; b) treating the fragmented boards in an aqueous medium under supercritical conditions of said medium to a temperature of 374° C. to 600° C. and from 22.1 MPa to 30 MPa in an autoclave; c) crushing in the solid state the treated materials derived from the step of treating under supercritical conditions; and d) subjecting the crushed material to a low-intensity magnetic separation.
18. The process of claim 17, wherein the crushed materials are separated into fragments having a size of less than 2 mm.
19. The process of claim 17, wherein the fragments obtained in the step of fragmenting have a size greater than or equal to 1 cm.
20. The process of claim 17, wherein said aqueous medium contains oxygen or one or more oxygen-generating species.
21. The process of claim 17, wherein said low-intensity magnetic separation involves subjecting the crushed material to a magnetic field of 400 gauss.
Description
BRIEF DESCRIPTION OF THE FIGURES
[0042]
[0043]
[0044]
[0045]
[0046]
[0047]
[0048]
DETAILED DESCRIPTION OF THE INVENTION
EXAMPLES 1 AND 2
[0049] In a first example, laptop computer electronic boards were subjected to a fragmentation using a knife mill equipped with a screen having a 5 cm mesh. This is the (“shredding”) step 1 of the process depicted in
[0050] The solid phase was then separated from the liquid phase by filtration on filter paper having a porosity of 2.5 μm, so as to recover all of the solid phase (step 4 of the process depicted in
[0051] The solid phase was then passed through a crusher represented in
[0052]
[0053] The metals thus separated from the resin may then be subjected to a low-intensity magnetic separation, under a magnetic field of 400 gauss. The non-ferrous metals, including the precious metals, were thus separated from the scrap iron.
[0054] The process described in example 1 was repeated in another example, example 2, but the duration during which the fragments of electronic boards were maintained under supercritical conditions is 2 hours once the pressure and temperature rise is achieved, and not 30 minutes as in example 1. The crushing time was around 1 minute 30 seconds, at the end of which time there were no longer, visually, any particles exiting the screen.
[0055]
[0056] Table 3 indicates the weights of fines and solids obtained respectively in examples 1 and 2.
TABLE-US-00002 TABLE 3 Supercritical oxidation 2 h Supercritical oxidation 30 min Fines 3.91 g 43.9% 5.95 g 51.0% Solids 5.00 g 56.1% 5.72 g 49.0% TOTAL 8.91 g 100% 11.67 g 100%
[0057] The appearance of the products before they pass through the bar crusher suggests a better degradation of the resin after two hours of treatment. The smaller percentage of fines for the product obtained after a supercritical oxidation of two hours confirms this observation. Furthermore, the duration of the crushing is also two times shorter.
EXAMPLE 3
[0058] In a third example, a laptop computer electronic board was subjected, as in examples 1 and 2, to shredding using a knife mill equipped with a screen having a 5 cm mesh. The fragments obtained have a mean size of 5 cm.
[0059] 30 g of the fragments thus prepared were then introduced into an autoclave having a volume of 300 ml in which they were bought into contact with 30 g of water. The temperature in the autoclave was raised to 600° C. which made it possible to achieve a pressure of 250 bar. These pressure and temperature conditions were achieved in around 30 minutes. The fragments were then maintained under these conditions for 60 minutes, then the autoclave was depressurized.
[0060] The solid phase was then separated from the liquid phase by filtration on filter paper having a porosity of 2.5 μm, so as to recover all of the solid phase.
[0061] The solid phase was then passed through the crusher described in
[0062] The metals thus separated from the resin may be subjected to a low-intensity magnetic separation, under a magnetic field of 400 gauss. The non-ferrous metals, including the precious metals, were thus separated from the scrap iron.
[0063]
[0064] A determination of the local chemical composition was carried out by SEM-EDS in different zones of the board seen in
[0065] In the SEM-EDS analysis, a stream of electrons bombards the sample and gives rise to an emission of x-ray photons, the energy spectrum of which characterizes the constituent elements of the material to be analyzed. This spectrum is analyzed by a semiconductor detector which produces voltage peaks proportional to the energy of the photons received (principle of Energy Dispersive Spectroscopy, EDS). The voltage peaks obtained make it possible to quantify the elements emitting at a given energy, expressed in kiloelectron volts (keV). By way of example,
[0066] Thus,
[0067] A similar characterization to that carried out for the pure solids was performed on the fines recovered after crushing and constituted of the fibers of the reinforcement of the board. The SEM image (
[0068] This is confirmed by the results of analysis of the local chemical composition by SEM-EDS (
[0069] Table 4 presents the chemical composition data of the liquid phase at the outlet of the step of attack by supercritical water, after the filtration (step 4 of
TABLE-US-00003 TABLE 4 Elements Ag Al As Ba Be Cd Co Cr Content 0.44 0.22 0.07 420.95 0.00 0.22 0.01 0.00 ppm Elements Cu Li Mn Ni Pb Sn Sr Zn Content 81.55 1.49 1.40 2.34 0.32 0.00 13.69 0.27 ppm
[0070] It appears that the liquid phase contains very few metal elements, in particular very little Ag and Cu. Almost all of the metals are thus recovered in the solid phase of the treatment by supercritical water. The chemical analysis of the fraction of fines obtained after crushing (