A NOVEL PROCESS FOR THE PREPARATION OF CONSIDERABLY PURE SILODOSIN
20170362174 · 2017-12-21
Inventors
Cpc classification
H01R13/5202
ELECTRICITY
H01R12/777
ELECTRICITY
H01R24/62
ELECTRICITY
C07D209/08
CHEMISTRY; METALLURGY
International classification
Abstract
The present invention relates to a connector tongue element (1) for an electrical connector plug receptacle (4), the connector tongue element comprising: a flexible printed circuit (10) having an attachment portion (11); connector pins (12) attached and electrically connected to the flexible printed circuit at the attachment portion; and a first body (13) of polymeric material molded around at least a part of the attachment portion to form a connector base portion (14), the first body mechanically secures the attachment of the connector pins to the flexible printed circuit, wherein the connector pins extend from the connector base portion in a withdrawal direction along which an electrical connector plug is adapted to be withdrawn from the electrical connector plug receptacle; wherein the connector pins form a connector tongue portion (16) extending from the connector base portion in the withdrawal direction; and wherein the first body allow the connector pins to present connecting surfaces for connecting the electrical connector plug receptacle to the electrical connector plug.
Claims
1. A process for the preparation of Silodosin represented by Formula 1; ##STR00001## wherein the process comprises the steps of: a) condensing chiral compound represented by Formula (III) ##STR00002## wherein, Bz represents to Benzoyl group with compound represented by Formula (IV) ##STR00003## wherein, Ms represents to Methanesulfonyl group in presence of a base and a phase transfer catalyst: in an organicsolvent to give intermediate represented by Formula (V) ##STR00004## wherein, n is an integer of 1 and 2; b) optionally isolating compound of Formula (V); c) without purification converting compound of Formula (V) to de-protected compound represented by Formula (IX) in an organic solvent; ##STR00005## wherein, n is as defined above; d) optionally isolating compound of Formula (IX); e) without purification converting compound of Formula (IX) to a compound represented by Formula (X) ##STR00006## wherein n is as defined above; f) subjecting compound of Formula (X) to purification by converting to an acid salt for removal of N,N-dialkyl impurity represented by Formula (IIc); ##STR00007## g) hydrolysis of the acid salt formed in step f) to obtain Silodosin of Formula (I).
2. The process according to claim 1, wherein in step a) the organic solvent is selected from the group comprising of benzene, toluene, o-xylene, m-xylene, p-xylene, acetonitrile, dimethyl sulfoxide, methyl isobutyl ketones, dioxane, dimethyl formamide, dimethyl acetamide, N-methyl pyrrolidone and/or mixture thereof, preferably the organic solvent is selected from toluene, dimethyl sulfoxide and mixture thereof.
3. The process according to claim 1, wherein the base is selected from the group comprising of hydroxides, carbonates, alkoxides, phosphates, or mixture thereof.
4. The process according to claim 3, wherein the base is selected from the group comprising of sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, potassium carbonate, potassium bicarbonate, potassium dihydrogen phosphate, dipotassium hydrogen phosphate, potassium tert-butoxide, sodium tert-butoxide, sodium methoxide, cesium carbonate, or mixture thereof; preferably the base is dipotassium hydrogen phosphate.
5. The process according to claim 1, wherein the phase transfer catalyst is selected from the group comprising of crown ether, triglyme, tetrabutyl ammonium bromide, tetrabutyl ammonium chloride, tetrabutyl ammonium iodide and potassium fluoride; preferably the phase transfer catalyst is tetrabutyl ammonium iodide
6. The process according to claim 1, wherein the condensation step a carried at a temperature ranging from 85-90° C.
7. The process as claimed in claim 1, wherein in step a) the compound of Formula (V) having n=2 is formed in an amount of less than 5%.
8. The process according to claim 1, wherein in step 1, the said acid salt is oxalic acid salt.
9. The process according to claim 1, wherein the compound of Formula (I) obtained in step (g) is isolated with purity≧99.5%.
10. The process according to claim 1, wherein the compound of Formula (I) obtained in step (g) have N,N-dialkyl impurity of Formula (IIc) in an amount of less than0.03% and other individual impurities below 0.1%.
11. A process for purification of crude Silodosin of Formula (X); ##STR00008## wherein, n is an integer of 1 and 2; comprising the steps of; a) coverting crude Silodosin of Formula (X) to its oxalate salt for removal of N,N-dialkyl impurity of Formula (IIc); ##STR00009## b) hydrolysis of the said oxalate salt to get pure Silodosin of Formula (I). ##STR00010##
12. The process according to claim 11, wherein the pure Silodosin of Formula (I) have N,N-dialkyl impurity in an amount less than 0.03% and other individual impurities below 0.1%.
13. The process according to claim 11, wherein the compound of Formula (I) obtained in step (b) is isolated with purity≧99.5%.
Description
BRIEF DESCRIPTION OF DRAWINGS
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DESCRIPTION OF EMBODIMENTS
[0031] The above and other aspects of the present invention will now be described in more detail, with reference to appended drawings showing embodiments of the invention. The figures should not be considered limiting the invention to the specific embodiment; instead they are used for explaining and understanding the invention.
[0032] As illustrated in the figures, the sizes of layers and regions are exaggerated for illustrative purposes and, thus, are provided to illustrate the general structures of embodiments of the present invention. Like reference numerals refer to like elements throughout.
[0033] The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which currently preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for thoroughness and completeness, and to fully convey the scope of the invention to the skilled person.
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[0038] It has been found that there might be a problem with foreign materials, such as water, dust etc., getting into the electrical connector plug receptacle 4. This might create a short circuit within the electrical connector plug receptacle 4. Such short circuits leads to increased temperatures within the electronic device comprising the electrical connector plug receptacle 4 with a potential hazard of fire. The above embodiment embedding electronic circuitry 18 within the connector base portion 14 allow for temperature sensing of the electrical connector plug receptacle 4. By embedding electronic circuitry 18 for sensing the temperature of the electrical connector plug receptacle 4 within the connector base portion 14 otherwise useless space of the flexible printed circuit may be used saving the space on the flexible printed circuit outside the connector base portion 14 for other kind of electronic circuitry. There is also a benefit locating the temperature sensing electronic circuitry in close proximity of the electrical connector plug receptacle 4.
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[0040] The person skilled in the art realizes that the present invention by no means is limited to the preferred embodiments described above. On the contrary, many modifications and variations are possible within the scope of the appended claims.
[0041] For example, first and second bodies 15, 17 may be formed as separate bodies.
[0042] Moreover, the electronic circuitry 18 embedded in the first body 15 of polymeric material, i.e. the connector base portion 14, may have other functions as well.
[0043] Additionally, variations to the disclosed embodiments can be understood and effected by the skilled person in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims.