Resonant Unit and Filter

Abstract

A resonant unit and a filter, where the resonant unit includes a dielectric substrate, a metal microstrip disposed on a plane of the dielectric substrate, where the metal microstrip is used as a signal input/output port, and a defected ground structure disposed on another plane opposite to the plane of the dielectric substrate, where the defected ground structure includes a ground loop and an interdigital structure located inside the ground loop, the interdigital structure includes multiple fingers, and the ground loop or at least one finger in the interdigital structure includes at least one embedded interdigital structure. Harmonic suppression capabilities of the resonant unit and the filter can be improved, and an area can be reduced.

Claims

1. A resonant unit, comprising: a dielectric substrate; a metal microstrip disposed on a plane of the dielectric substrate, wherein the metal microstrip is used as a signal input/output port; and a defected ground structure disposed on another plane opposite to the plane of the dielectric substrate, wherein the defected ground structure comprises a ground loop and an interdigital structure located inside the ground loop, wherein the interdigital structure comprises a plurality of fingers, and wherein the ground loop or at least one finger in the interdigital structure comprises at least one embedded interdigital structure.

2. The resonant unit according to claim 1, wherein each embedded interdigital structure in the at least one embedded interdigital structure introduces a resonant frequency of the resonant unit.

3. The resonant unit according to claim 2, wherein a value of the resonant frequency is determined by at least one of the following parameters: a quantity of fingers in the each embedded interdigital structure; a width of a finger in the each embedded interdigital structure; and a length of a finger in the each embedded interdigital structure.

4. The resonant unit according to claim 1, wherein the plurality of fingers are three fingers, and wherein at least a part of the at least one embedded interdigital structure is located on at least one finger in the three fingers.

5. The resonant unit according to claim 1, wherein the plurality of fingers are two fingers, and wherein at least a part of the at least one embedded interdigital structure is located on at least one finger in the two fingers.

6. The resonant unit according to claim 1, wherein the metal microstrip is a T-shaped microstrip, and wherein a T-shaped vertical end of the T-shaped microstrip is used as the input/output port.

7. The resonant unit according to claim 6, wherein a projection of a T-shaped horizontal end of the T-shaped microstrip on the plane of the dielectric substrate overlaps at least a part of the plurality of fingers, and wherein a projection of the T-shaped vertical end on the plane of the dielectric substrate overlaps one finger in the plurality of fingers.

8. The resonant unit according to claim 7, wherein the projection of the T-shaped horizontal end on the plane of the dielectric substrate overlaps all of the plurality of fingers.

9. A filter, comprising at least two cascaded resonant units, wherein each of the at least two resonant units comprises: a dielectric substrate; a metal microstrip disposed on a plane of the dielectric substrate, wherein the metal microstrip is used as a signal input/output port; and a defected ground structure disposed on another plane opposite to the plane of the dielectric substrate, wherein the defected ground structure comprises a ground loop and an interdigital structure located inside the ground loop, wherein the interdigital structure comprises a plurality of fingers, and wherein the ground loop or at least one finger in the interdigital structure comprises at least one embedded interdigital structure.

10. The filter according to claim 9, wherein the at least two resonant units are cascaded in at least one of the following manners: through-hole cascading; electric coupling cascading; and magnetic coupling cascading.

11. The filter according to claim 9, wherein structures of the at least two resonant units are the same.

12. The filter according to claim 9, wherein each embedded interdigital structure in the at least one embedded interdigital structure introduces a resonant frequency of the resonant unit.

13. The filter according to claim 12, wherein a value of the resonant frequency is determined by at least one of the following parameters: a quantity of fingers in the each embedded interdigital structure; a width of a finger in the each embedded interdigital structure; and a length of a finger in the each embedded interdigital structure.

14. The filter according to claim 9, wherein the plurality of fingers are three fingers, and wherein at least a part of the at least one embedded interdigital structure is located on at least one finger in the three fingers.

15. The filter according to claim 9, wherein the plurality of fingers are two fingers, and wherein at least a part of the at least one embedded interdigital structure is located on at least one finger in the two fingers.

16. The filter according to claim 9, wherein the metal microstrip is a T-shaped microstrip, and wherein a T-shaped vertical end of the T-shaped microstrip is used as the input/output port.

17. The filter according to claim 16, wherein a projection of a T-shaped horizontal end of the T-shaped microstrip on the plane of the dielectric substrate overlaps at least a part of the plurality of fingers, and wherein a projection of the T-shaped vertical end on the plane of the dielectric substrate overlaps one finger in the plurality of fingers.

18. The filter according to claim 17, wherein the projection of the T-shaped horizontal end on the plane overlaps all of the plurality of fingers.

19. A communications system, comprising a filter comprising at least two cascaded resonant units, wherein each of the at least two cascaded resonant units comprises: a dielectric substrate; a metal microstrip disposed on a plane of the dielectric substrate, wherein the metal microstrip is used as a signal input/output port; and a defected ground structure disposed on another plane opposite to the plane of the dielectric substrate, wherein the defected ground structure comprises a ground loop and an interdigital structure located inside the ground loop, wherein the interdigital structure comprises a plurality of fingers, and wherein the ground loop or at least one finger in the interdigital structure comprises at least one embedded interdigital structure.

20. The communications system according to claim 19, wherein the at least two resonant units are cascaded in at least one of the following manners: through-hole cascading; electric coupling cascading; and magnetic coupling cascading.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0024] To describe the technical solutions in the embodiments of the present disclosure more clearly, the following briefly describes the accompanying drawings required for describing the embodiments. The accompanying drawings in the following description show merely some embodiments of the present disclosure, and a person of ordinary skill in the art may still derive other drawings from these accompanying drawings without creative efforts.

[0025] FIG. 1A is a schematic structural diagram of a resonant unit according to an embodiment of the present disclosure;

[0026] FIG. 1B is a schematic structural diagram of a resonant unit according to an embodiment of the present disclosure;

[0027] FIG. 2 is a schematic structural diagram of a resonant unit according to another embodiment of the present disclosure;

[0028] FIG. 3 is a schematic structural diagram of a resonant unit according to another embodiment of the present disclosure;

[0029] FIG. 4 is a schematic structural diagram of a resonant unit according to another embodiment of the present disclosure;

[0030] FIG. 5A is a schematic structural diagram of a resonant unit according to another embodiment of the present disclosure;

[0031] FIG. 5B is a schematic structural diagram of a resonant unit according to another embodiment of the present disclosure;

[0032] FIG. 6 is a schematic structural diagram of a filter according to an embodiment of the present disclosure;

[0033] FIG. 7 is a schematic structural diagram of a filter according to another embodiment of the present disclosure;

[0034] FIG. 8 is a schematic structural diagram of a filter according to another embodiment of the present disclosure;

[0035] FIG. 9 is a schematic structural diagram of a filter according to another embodiment of the present disclosure;

[0036] FIG. 10 is a schematic structural diagram of a filter according to another embodiment of the present disclosure;

[0037] FIG. 11 shows an emulation result of a filter according to an embodiment of the present disclosure;

[0038] FIG. 12 shows an emulation result of a filter according to another embodiment of the present disclosure; and

[0039] FIG. 13 shows an emulation result of a filter according to another embodiment of the present disclosure.

DESCRIPTION OF EMBODIMENTS

[0040] The following clearly describes the technical solutions in the embodiments of the present disclosure with reference to the accompanying drawings in the embodiments of the present disclosure. The described embodiments are a part rather than all of the embodiments of the present disclosure. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without creative efforts shall fall within the protection scope of the present disclosure.

[0041] It should be understood that, the technical solutions of the embodiments of the present disclosure may be applied to various communications systems, such as a Global System of Mobile Communications (GSM) system, a Code Division Multiple Access (CDMA) system, a Wideband Code Division Multiple Access (WCDMA) system, a general packet radio service (GPRS), a Long Term Evolution (LTE) system, an LTE frequency division duplex (FDD) system, an LTE time division duplex (TDD), a Universal Mobile Telecommunications System (UMTS), a Worldwide Interoperability for Microwave Access (WIMAX) communications system, a millimeter wave communications system, a terahertz (THz) communications field, or the like.

[0042] It should be understood that, a resonant unit in an embodiment of the present disclosure may be applied to various fields, for example, may be applied to components such as a filter, a duplexer, a power splitter, an antenna, a feeding network, a phase shifter, and an active circuit. This embodiment further provides a semiconductor chip, where the semiconductor chip is integrated with a semiconductor substrate, and includes the resonant unit or any one of the foregoing components. For example, the semiconductor chip may be implemented using a Complementary metal-oxide-semiconductor (CMOS) process.

[0043] As mentioned above, in a modern communications system, a filter having a desirable out-band suppression function is urgently required. A slow-wave effect is a physical characteristic. The slow-wave effect can push a high-order harmonic wave in a base frequency signal of a filter to a higher frequency such that a desirable harmonic suppression function and a wide stopband are implemented. In addition, the slow-wave effect can also reduce an area of the filter, and reduce filter costs while implementing miniaturization. A defected ground structure is a typical structure that has a slow-wave effect.

[0044] Based on this, an embodiment of the present disclosure provides a resonant unit and a filter. FIG. 1A and FIG. 1B show a schematic structure of a resonant unit 100 according to an embodiment of the present disclosure. As shown in FIG. 1A, the resonant unit 100 includes a dielectric substrate 110, as shown in a side view on a right side in FIG. 1A, a metal microstrip 120 disposed on a side of the dielectric substrate 110, and a defected ground structure 130 disposed on another side of the dielectric substrate 110, where the defected ground structure 130 includes a ground loop 140 and an interdigital structure 150 located inside the ground loop 140, the interdigital structure 150 includes multiple fingers, and the ground loop 140 and/or at least one finger in the interdigital structure 150 includes at least one embedded interdigital structure 160.

[0045] In this embodiment of the present disclosure, an embedded interdigital structure 160 is introduced in a defected ground structure 130 in a resonant unit 100. Therefore, a high-order harmonic wave in a base frequency signal is pushed to a higher frequency, a harmonic suppression capability of the resonant unit 100 is improved, the resonant unit 100 has a wide stopband with higher suppression, and an area of the resonant unit 100 is reduced.

[0046] A filter provided by an embodiment of the present disclosure includes at least two resonant units 100 described above. The filter including the resonant units 100 can improve an out-band suppression capability of the filter and reduce an area of the filter.

[0047] In addition, each embedded interdigital structure 160 in the at least one embedded interdigital structure 160 may introduce a resonant frequency of the resonant unit 100. Therefore, the embedded interdigital structure 160 disposed in the defected ground structure 130 of the resonant unit 100 introduces a new resonant frequency, and a resonant unit 100 having multiple resonant points is formed. The resonant unit 100 having multiple resonant points has an ultra wide out-band harmonic suppression capability. In addition, an area occupied by the resonant unit 100 is small.

[0048] Optionally, as shown in FIG. 1A and FIG. 1B, the metal microstrip 120 may be a T-shaped microstrip. A T-shaped vertical end of the T-shaped microstrip may be used as a signal input/output port. The metal microstrip 120 may also be in other shapes, and this is not limited in this embodiment of the present disclosure.

[0049] Optionally, a projection of a T-shaped horizontal end of the T-shaped microstrip on a plane of the dielectric substrate 110 may overlap at least a part of the multiple fingers of the interdigital structure 150, and a projection of the T-shaped vertical end on the plane overlaps one finger in the multiple fingers of the interdigital structure 150. For details, refer to FIG. 1A and FIG. 1B. The projection of the T-shaped horizontal end of the T-shaped microstrip on the plane may overlap all of the multiple fingers of the interdigital structure 150.

[0050] Optionally, a shape of the ground loop 140 in this embodiment of the present disclosure is not limited. For example, the ground loop 140 may be rectangular. As shown in FIG. 1A, the interdigital structure 150 may include multiple fingers, one end of any finger in the multiple fingers may be connected to the ground loop 140, and the other end of the any finger may be an open end. The open end is not connected to the ground loop 140. The at least one embedded interdigital structure 160 may be located on a finger of the interdigital structure 150, and/or located on the ground loop 140. In other words, the at least one embedded interdigital structure 160 may be located in any position in the defected ground structure 130.

[0051] Optionally, the interdigital structure 150 may introduce a resonant frequency of the resonant unit 100, and this resonant frequency may be referred to as a first base frequency (f.sub.01). A value of the f.sub.01 may be determined by at least one of the parameters a length or a width of a finger included in the interdigital structure 150, or a distance between a finger and the ground loop 140. For example, as shown in FIG. 1B, the f.sub.01 may be reduced by increasing lengths of L.sub.1, L.sub.2, L.sub.3, W.sub.1, W.sub.2, and W.sub.3. The ground loop 140 in FIG. 1B is a rectangular ground loop, L.sub.1 indicates a length of a side of the rectangular ground loop 140, L.sub.2 and L.sub.3 indicate lengths of fingers included in the interdigital structure 150, and the finger of the length L.sub.2 and the finger of the length L.sub.3 are cross-arranged. W.sub.1 and W.sub.2 indicate distances between each finger and a side of the rectangular ground loop 140, and W.sub.3 indicates a width of a finger.

[0052] Optionally, each embedded interdigital structure 160 in the at least one embedded interdigital structure 160 may introduce a resonant frequency of the resonant unit 100 independently. This resonant frequency may also be referred to as a base frequency or a center frequency of the resonant unit 100. For example, the resonant frequency introduced by the embedded interdigital structure 160 may be referred to as a second base frequency (f.sub.02) or a third base frequency (f.sub.03).

[0053] Optionally, a value of the resonant frequency introduced by each embedded interdigital structure 160 may be determined by at least one of the parameters, a quantity of fingers in each embedded interdigital structure 160, a width of a finger in each embedded interdigital structure 160, or a length of a finger in each embedded interdigital structure 160. For example, as shown in FIG. 1A, the resonant frequency introduced by each embedded interdigital structure 160 may be reduced by increasing the quantity of fingers in each embedded interdigital structure 160, the width (W.sub.s) of a finger, or the length (L.sub.s) of a finger.

[0054] Optionally, as shown in FIG. 1B, values of resonant frequencies (for example, the f.sub.01 and/or the f.sub.02) may be trimmed by adjusting the width W.sub.t of the T-shaped horizontal end, the length L.sub.t1 of the T-shaped horizontal end, and the length L.sub.t2 of the T-shaped vertical end of the T-shaped microstrip. For example, values of base frequencies of the resonant unit 100 may be trimmed by adjusting lengths L.sub.t1, L.sub.t2, and W.sub.t of the T-shaped microstrip.

[0055] Optionally, the multiple embedded interdigital structures 160 in the resonant unit 100 may have different sizes. Therefore, multiple resonant points (namely, resonant frequencies) are introduced, and a slow-wave resonant unit 100 having multiple resonant points is formed. The resonant points introduced by the embedded interdigital structures 160 are independent of each other.

[0056] FIG. 2 to FIG. 4 show schematic structural diagrams of a resonant unit according to another embodiment of the present disclosure. A person skilled in the art can understand that, examples in FIG. 2 to FIG. 4 are merely intended to help a person skilled in the art understand this embodiment of the present disclosure, and this embodiment of the present disclosure is not limited to illustrated specific scenarios. Obviously, a person skilled in the art may make various equivalent modifications and variations according to the examples provided by the present disclosure. This embodiment of the present disclosure is intended to cover the modifications and variations.

[0057] As shown in FIG. 2 to FIG. 4, a quantity of fingers, and a quantity and locations of embedded interdigital structures in an interdigital structure in this embodiment of the present disclosure are not limited. An embedded interdigital structure may be located on each finger of the interdigital structure, or may be located on a finger of the interdigital structure, or may be located on a ground loop. For example, a resonant unit 200 shown in FIG. 2 includes four embedded interdigital structures, and the embedded interdigital structures may be located on a ground loop or two fingers in three fingers of an interdigital structure. A resonant unit 300 shown in FIG. 3 includes an embedded interdigital structure, and the embedded interdigital structure may be located on one finger in two fingers of an interdigital structure. Alternatively, as shown in FIG. 4, a resonant unit 400 includes two embedded interdigital structures, and the two embedded interdigital structures may be respectively located on two fingers included in the interdigital structure.

[0058] The foregoing describes resonant units according to the embodiments of the present disclosure with reference to FIG. 1A to FIG. 4. The following describes filters according to the embodiments of the present disclosure with reference to FIG. 5 to FIG. 10.

[0059] As described above, an embodiment of the present disclosure provides a filter including the foregoing resonant unit 100, 200, 300, and 400. The filter may be a band-pass filter, or may be a band-stop filter. Further, the filter may be a multi-passband band-pass filter, or may be a multi-stopband band-stop filter. For example, an embedded interdigital structure is disposed directly below a metal microstrip, and a band-stop filter may be formed. Furthermore, being directly below the metal microstrip may mean that the embedded interdigital structure is disposed in an area using a central axis of a projection of the metal microstrip (namely, a projection of the metal microstrip on a plane in which the defected ground structure is located) as a symmetry axis. A transmission zero may be introduced for the filter, that is, a band-stop filter is formed. For example, FIG. 5A and FIG. 5B show two manners of introducing a transmission zero for a filter. An embedded interdigital structure in a resonant unit 510 and a resonant unit 520 in FIG. 5A and FIG. 5B is symmetric along a central axis in an area covered by a projection of a T-shaped microstrip. Therefore, a transmission zero is introduced for a filter to form a band-stop filter. Correspondingly, as shown in FIG. 1A to FIG. 4, an embedded interdigital structure is disposed in another area not directly below a metal microstrip, and a band-pass filter may be formed. Using a band-pass filter as an example, the following describes a filter provided by an embodiment of the present disclosure.

[0060] In an embodiment of the present disclosure, an embedded interdigital structure is introduced in a defected ground structure in a resonant unit included in a filter. Therefore, a high-order harmonic wave in a base frequency signal is pushed to a higher frequency, a harmonic suppression capability of the filter is improved, the filter has a wide stopband with higher suppression, and an area of the filter is reduced.

[0061] FIG. 6 is a schematic diagram of a band-pass filter 600 according to an embodiment of the present disclosure. As shown in FIG. 6, a band-pass filter 600 may be formed by cascading at least two resonant units. For example, either of two resonant units introduced in FIG. 6 includes two embedded interdigital structures, that is, either of the two resonant units includes three resonant frequencies. The two resonant units having three resonant frequencies are cascaded, and a second-order three-passband band-pass filter 600 may be obtained. A metal microstrip of a resonant unit may be used as an input/output port of the band-pass filter 600. Theoretically, any multi-passband band-pass filter may be implemented. That is, at least two resonant units having N resonant frequencies are cascaded, and an N-passband band-pass filter may be obtained, where N is an integer greater than or equal to 1.

[0062] Optionally, the resonant units included in the band-pass filter 600 may be extended by multi-level cascading such that an ultra wide stopband multi-order band-pass filter is obtained. By increasing a quantity of resonant units, stopband suppression performance of the filter is enhanced, and steepness of a passband is increased. For example, FIG. 7 shows a schematic diagram of a filter 700 according to another embodiment of the present disclosure. As shown in FIG. 7, three resonant units are cascaded, and a third-order band-pass filter (a third-order three-passband band-pass filter 700 shown in FIG. 7) may be obtained. Optionally, the cascading manner may be applied to cascading of any plurality of resonant units having any plurality of frequencies.

[0063] Optionally, the resonant units in the filter may be cascaded in a manner of magnetic coupling cascading, electric coupling cascading, or through-hole cascading. The magnetic coupling cascading manner is shown in a filter 800 in FIG. 8. Resonant units are cascaded by means of direct connection (as shown by a dashed line in FIG. 8). The electric coupling cascading manner is shown in a filter 900 in FIG. 9. That is, resonant units are not directly connected to each other. A broadside couple manner (as shown by a dashed line in the FIG. 9) is used instead. Alternatively, resonant units are cascaded by means of through-hole connection. As shown in a filter 1000 in FIG. 10, on a basis of broadside couple, a through-hole is added in an overlapping part of the resonant units (as shown by a dashed line in the FIG. 10), and coupling intensity is increased by means of mixed coupling. Optionally, the three cascading manners may be applicable to connecting any plurality of resonant units, and may be mixed in use.

[0064] Optionally, metal microstrips of multiple cascaded resonant units may be used as input/output ports of a filter, and may be located on a same side of the resonant units (as shown in FIG. 8), or may be located on different sides of the resonant units (as shown in FIG. 6). This is not limited in this embodiment of the present disclosure.

[0065] FIG. 11 to FIG. 13 show emulation results of filters according to the embodiments of the present disclosure. A person skilled in the art can understand that, in FIG. 11 to FIG. 13, S21 and S11 indicate S parameters, S21 indicates a transmission factor from a port 2 (output port) to a port 1 (input port), and S11 indicates a reflection factor seen from the port 1. The two parameters are both greater than 0 but are not greater than 1, and are generally measured in decibel (dB). Greater S21 indicates that more energy is transmitted from the port 1 to the port 2. Greater S11 indicates that most of energy input from the port 1 is reflected back and does not arrive at the port 2. Therefore, for a passband of a filter, S21 is great, but S11 is small, and if S21 is closer to 0 dB, it indicates that an energy loss in a transmission process is smaller. For a stopband of a filter, S21 is small, but S11 is great, and if S21 is smaller, it indicates that stopband suppression is better.

[0066] FIG. 11 shows an emulation result of a second-order dual-passband band-pass filter. This filter is formed by cascading two resonant units having two resonant frequencies. As can be known from FIG. 11, the resonant frequencies of the filter are respectively 2.21 gigahertz (GHz) and 2.47 GHz, a spacing between resonant frequencies of passbands is 260 megahertz (MHz), a stopband may be extended to 19.7 times that of an f.sub.01 (2.21 GHz) or 17.6 times that of an f02 (2.47 GHz), and suppression reaches −26.3 dB. FIG. 12 shows an emulation result of a second-order three-passband band-pass filter. This filter is formed by cascading two resonant units having three resonant frequencies. As can be known from FIG. 12, the resonant frequencies of the filter are respectively 2.24 GHz, 2.44 GHz, and 2.69 GHz, spacings between resonant frequencies of adjacent channels are respectively 200 MHz and 250 MHz, a stopband may be extended to 20.7 times that of an f.sub.01 (2.24 GHz), 19.1 times that of an f.sub.02 (2.44 GHz), or 17.3 times that of a f.sub.03 (2.69 GHz), and suppression reaches −28.6 dB. As can be known from the emulation results shown in FIG. 11 and FIG. 12, the filters provided by the embodiments of the present disclosure have high out-band suppression capabilities and small spacings between resonant frequencies, and may be applicable to more scenarios.

[0067] FIG. 13 shows an emulation result of a third-order dual-passband band-pass filter. This filter is formed by cascading three resonant units having two resonant frequencies. As can be known from FIG. 13, the resonant frequencies of the filter are respectively 2.16 GHz and 2.52 GHz, a spacing between resonant frequencies of passbands is 360 MHz, a stopband may be extended to 18.5 times that of an f.sub.01 (2.16 GHz) or 15.9 times that of an f.sub.02 (2.52 GHz), and suppression reaches −31.5 dB. It can be seen that, in comparison with the second-order dual-passband band-pass filter in FIG. 12, due to an increase of cascaded resonant units, the third-order dual-passband band-pass filter has higher suppression.

[0068] It can be known from FIG. 11 to FIG. 13 that, the filters in the embodiments of the present disclosure can improve filter out-band suppression capabilities.

[0069] In addition, the terms “system” and “network” may be used interchangeably in this specification. The term “and/or” in this specification describes only an association relationship for describing associated objects and represents that three relationships may exist. For example, A and/or B may represent the following three cases. Only A exists, both A and B exist, and only B exists. In addition, the character “/” in this specification generally indicates an “or” relationship between the associated objects. The input/output port may be used as an input port or an output port, or may be simultaneously used as an input and output port. In the filters 600, 700, 800, 900, 1000 in FIG. 5 to FIG. 10, when multiple resonant units are cascaded, an input/output port of any resonant unit may be used as a signal input port, and an input/output port of another resonant unit may be used as a signal output port.

[0070] To make the application document brief and clear, the foregoing technical features and descriptions in an embodiment may be understood as applicable to other embodiments, and details are not described again in the other embodiments. The foregoing descriptions are merely specific embodiments of the present disclosure, but are not intended to limit the protection scope of the present disclosure. Any modification or replacement readily figured out by a person skilled in the art within the technical scope disclosed in the present disclosure shall fall within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.